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International Conference on Extreme Ultraviolet Lithography 2022最新文献

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High-NA EUV imaging: the quest for resolution, depth-of-focus, and productivity 高na EUV成像:对分辨率,聚焦深度和生产力的追求
Pub Date : 2022-11-11 DOI: 10.1117/12.2645000
E. van Setten, S. Leitão, C. van Lare, J. van Schoot, J. Finders, K. Bhattacharyya
{"title":"High-NA EUV imaging: the quest for resolution, depth-of-focus, and productivity","authors":"E. van Setten, S. Leitão, C. van Lare, J. van Schoot, J. Finders, K. Bhattacharyya","doi":"10.1117/12.2645000","DOIUrl":"https://doi.org/10.1117/12.2645000","url":null,"abstract":"","PeriodicalId":374992,"journal":{"name":"International Conference on Extreme Ultraviolet Lithography 2022","volume":"112 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-11-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127128558","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Ruthenium attenuated phase-shifting structure fabrication for contact-hole applications 用于接触孔应用的钌衰减相移结构制造
Pub Date : 2022-10-31 DOI: 10.1117/12.2645263
W. Chao, Dongseok Nam, Sharon R Oh, Sarath Samdurala, E. Gullikson, F. Salmassi, A. Yen, P. Naulleau
{"title":"Ruthenium attenuated phase-shifting structure fabrication for contact-hole applications","authors":"W. Chao, Dongseok Nam, Sharon R Oh, Sarath Samdurala, E. Gullikson, F. Salmassi, A. Yen, P. Naulleau","doi":"10.1117/12.2645263","DOIUrl":"https://doi.org/10.1117/12.2645263","url":null,"abstract":"","PeriodicalId":374992,"journal":{"name":"International Conference on Extreme Ultraviolet Lithography 2022","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116733257","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Alternative EUV mask with platinum-tungsten alloy for high-NA EUV lithography 用于高na极紫外光刻的铂钨合金替代极紫外光掩模
Pub Date : 2022-10-31 DOI: 10.1117/12.2641805
Yunsoo Kim, Dong-Joo Jeong, Min-Su Cho, Jinho Ahn
{"title":"Alternative EUV mask with platinum-tungsten alloy for high-NA EUV lithography","authors":"Yunsoo Kim, Dong-Joo Jeong, Min-Su Cho, Jinho Ahn","doi":"10.1117/12.2641805","DOIUrl":"https://doi.org/10.1117/12.2641805","url":null,"abstract":"","PeriodicalId":374992,"journal":{"name":"International Conference on Extreme Ultraviolet Lithography 2022","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127044046","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
EUV lithography using colloidal nanoparticles 使用胶体纳米颗粒的EUV光刻技术
Pub Date : 2022-10-31 DOI: 10.1117/12.2641139
Saurav Mohanty, Kun-Chieh Chien, V. Premnath, Chih-Hao Chang
{"title":"EUV lithography using colloidal nanoparticles","authors":"Saurav Mohanty, Kun-Chieh Chien, V. Premnath, Chih-Hao Chang","doi":"10.1117/12.2641139","DOIUrl":"https://doi.org/10.1117/12.2641139","url":null,"abstract":"","PeriodicalId":374992,"journal":{"name":"International Conference on Extreme Ultraviolet Lithography 2022","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115235651","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Advancements in Mo/Si deposition techniques for high volume manufacturing of EUV mask blanks 用于大批量制造EUV掩模坯的Mo/Si沉积技术的进展
Pub Date : 2022-10-31 DOI: 10.1117/12.2641798
K. Rook, A. Kulkarni, A. Checco, Kenji Yamamoto, Russell Luberoff, Mario Roque, Stephen Lozowski, Joel A. Bahena, Marjorie Chee, Meng H. Lee
{"title":"Advancements in Mo/Si deposition techniques for high volume manufacturing of EUV mask blanks","authors":"K. Rook, A. Kulkarni, A. Checco, Kenji Yamamoto, Russell Luberoff, Mario Roque, Stephen Lozowski, Joel A. Bahena, Marjorie Chee, Meng H. Lee","doi":"10.1117/12.2641798","DOIUrl":"https://doi.org/10.1117/12.2641798","url":null,"abstract":"","PeriodicalId":374992,"journal":{"name":"International Conference on Extreme Ultraviolet Lithography 2022","volume":"72 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115021054","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Deep-learning denoiser-assisted framework for robust SEM contour extraction and analysis for advanced semiconductor node 基于深度学习去噪辅助的先进半导体节点扫描电镜轮廓提取与分析框架
Pub Date : 2022-10-31 DOI: 10.1117/12.2645403
Bappaditya Dey, S. Halder, Argho Das, Sayantan Das, Stewart Wu, G. Fenger
{"title":"Deep-learning denoiser-assisted framework for robust SEM contour extraction and analysis for advanced semiconductor node","authors":"Bappaditya Dey, S. Halder, Argho Das, Sayantan Das, Stewart Wu, G. Fenger","doi":"10.1117/12.2645403","DOIUrl":"https://doi.org/10.1117/12.2645403","url":null,"abstract":"","PeriodicalId":374992,"journal":{"name":"International Conference on Extreme Ultraviolet Lithography 2022","volume":"105 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134562733","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
SCREEN's DT-3000 track-booster system: how can hardware improve EUV performance? SCREEN的DT-3000轨道助力系统:硬件如何提高EUV性能?
Pub Date : 2022-10-31 DOI: 10.1117/12.2643150
Andreia Santos, Yuji Tanaka, M. Asai, M. Harumoto, Wesley Zanders, J. Vandereyken, L. Verstraete, Ashish Rathore, Hyo Seon Suh
{"title":"SCREEN's DT-3000 track-booster system: how can hardware improve EUV performance?","authors":"Andreia Santos, Yuji Tanaka, M. Asai, M. Harumoto, Wesley Zanders, J. Vandereyken, L. Verstraete, Ashish Rathore, Hyo Seon Suh","doi":"10.1117/12.2643150","DOIUrl":"https://doi.org/10.1117/12.2643150","url":null,"abstract":"","PeriodicalId":374992,"journal":{"name":"International Conference on Extreme Ultraviolet Lithography 2022","volume":"136 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123214469","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Stitching for High NA: new insights and path forward 为高NA拼接:新的见解和前进的道路
Pub Date : 2022-10-31 DOI: 10.1117/12.2653388
N. Davydova, V. Wiaux, J. Bekaert, F. Timmermans, Bram Slachter, T. Kovalevich, E. van Setten, Marcel Beckers, Simon van Gorp, Rong-Bing Zhao, Dezheng Sun, Ming-Chun Tien, Hoon Ser, Diederik de Bruin, Stephen D. Hsu, R. Carpaij
{"title":"Stitching for High NA: new insights and path forward","authors":"N. Davydova, V. Wiaux, J. Bekaert, F. Timmermans, Bram Slachter, T. Kovalevich, E. van Setten, Marcel Beckers, Simon van Gorp, Rong-Bing Zhao, Dezheng Sun, Ming-Chun Tien, Hoon Ser, Diederik de Bruin, Stephen D. Hsu, R. Carpaij","doi":"10.1117/12.2653388","DOIUrl":"https://doi.org/10.1117/12.2653388","url":null,"abstract":"","PeriodicalId":374992,"journal":{"name":"International Conference on Extreme Ultraviolet Lithography 2022","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126965692","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Possible underlayer dependent CD and overlay variation due to different heat absorption with EUV exposure 由于EUV照射下不同的吸热,可能导致下层依赖CD和覆盖层的变化
Pub Date : 2022-10-31 DOI: 10.1117/12.2643047
Wonyoung Choi, Heechang Ko, Jiwon Kang, Janggun Park, Min-Woo Kim, Junhyeong Lee, Hye-Ceol Oh
{"title":"Possible underlayer dependent CD and overlay variation due to different heat absorption with EUV exposure","authors":"Wonyoung Choi, Heechang Ko, Jiwon Kang, Janggun Park, Min-Woo Kim, Junhyeong Lee, Hye-Ceol Oh","doi":"10.1117/12.2643047","DOIUrl":"https://doi.org/10.1117/12.2643047","url":null,"abstract":"","PeriodicalId":374992,"journal":{"name":"International Conference on Extreme Ultraviolet Lithography 2022","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122006435","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
期刊
International Conference on Extreme Ultraviolet Lithography 2022
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