Pub Date : 2012-12-31DOI: 10.1109/EMCEUROPE.2012.6396769
A. Domurat-Linde, K. Lang, E. Hoene
The presented paper investigates the relationship between high frequency oscillations created in power modules and their radio frequency noise emission. It is shown that high frequency oscillations with slew rates comparable or higher than the ones generated by the used semiconductors leads to significant higher noise emission in the radio frequency range. During turn on of the IGBT a high frequency oscillation is created between the stray inductances of the DC-Link and the reverse capacitances of the blocking freewheeling diodes. The DC-Link stray inductances are charged by the reverse recovery current of the freewheeling diode. When the reverse recovery current peak is passed the diode begins to block and the energy stored in the inductances oscillates to the reverse capacitance of the diode. The quality of the oscillation is mainly influenced by the tailing of the diodes reverse recovery current. At the investigated three phase, 600V, 200A power module the observed turn on resonance frequency is 33MHz. The crucial characteristic of this phenomenon is that the noise emission is not only higher at the resonance but for all frequency above, too. By reducing the module inductances the resonances are shifted to higher frequencies but measurements show that the emitted spectrum stays the same. To reduce the module inductances do not solve the problem. The results of the investigation enable the design of power modules with reduced radiated emissions.
{"title":"Influence of IGBT-module switching characteristics to radio frequency noise","authors":"A. Domurat-Linde, K. Lang, E. Hoene","doi":"10.1109/EMCEUROPE.2012.6396769","DOIUrl":"https://doi.org/10.1109/EMCEUROPE.2012.6396769","url":null,"abstract":"The presented paper investigates the relationship between high frequency oscillations created in power modules and their radio frequency noise emission. It is shown that high frequency oscillations with slew rates comparable or higher than the ones generated by the used semiconductors leads to significant higher noise emission in the radio frequency range. During turn on of the IGBT a high frequency oscillation is created between the stray inductances of the DC-Link and the reverse capacitances of the blocking freewheeling diodes. The DC-Link stray inductances are charged by the reverse recovery current of the freewheeling diode. When the reverse recovery current peak is passed the diode begins to block and the energy stored in the inductances oscillates to the reverse capacitance of the diode. The quality of the oscillation is mainly influenced by the tailing of the diodes reverse recovery current. At the investigated three phase, 600V, 200A power module the observed turn on resonance frequency is 33MHz. The crucial characteristic of this phenomenon is that the noise emission is not only higher at the resonance but for all frequency above, too. By reducing the module inductances the resonances are shifted to higher frequencies but measurements show that the emitted spectrum stays the same. To reduce the module inductances do not solve the problem. The results of the investigation enable the design of power modules with reduced radiated emissions.","PeriodicalId":377100,"journal":{"name":"International Symposium on Electromagnetic Compatibility - EMC EUROPE","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124013682","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-12-31DOI: 10.1109/EMCEUROPE.2012.6396930
O. Oz, C. Guérin, E. Vialardi, S. Benhassine
This paper deals with the EMC topic of the grounding systems that ensure the current return to its source in modern cars. Such vehicles are increasingly equipped by electric cables and their chassis is used as reference conductor. The 3D modeling analysis is accomplished thanks to a specific Finite Element formulation: the thin conducting shells coupled with an external circuit. The developed numerical method and several significant simulation results obtained on an automotive test case are presented in this paper. The analysis of the paths followed by the current and of the magnetic fields radiated around the car body and on the areas occupied by passengers are shown and discussed.
{"title":"Analysis of grounding performances of car body by means of FEM shell elements","authors":"O. Oz, C. Guérin, E. Vialardi, S. Benhassine","doi":"10.1109/EMCEUROPE.2012.6396930","DOIUrl":"https://doi.org/10.1109/EMCEUROPE.2012.6396930","url":null,"abstract":"This paper deals with the EMC topic of the grounding systems that ensure the current return to its source in modern cars. Such vehicles are increasingly equipped by electric cables and their chassis is used as reference conductor. The 3D modeling analysis is accomplished thanks to a specific Finite Element formulation: the thin conducting shells coupled with an external circuit. The developed numerical method and several significant simulation results obtained on an automotive test case are presented in this paper. The analysis of the paths followed by the current and of the magnetic fields radiated around the car body and on the areas occupied by passengers are shown and discussed.","PeriodicalId":377100,"journal":{"name":"International Symposium on Electromagnetic Compatibility - EMC EUROPE","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124023615","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-12-31DOI: 10.1109/EMCEUROPE.2012.6396908
R. Ikeuchi, A. Hirata
The present study investigates the performance of a dipole antenna above different electromagnetic band-gap (EBG) substrate for realizing a low specific absorption rate (SAR) antenna. We then investigate the effect of the number of unit cell of the EBG substrate on the antenna performance. The substrate with 24(4×6) EBG patches is considered as a reference. The dipole antenna above a substrate with sixteen EBG unit cells was shown to provide comparable SAR reduction and improved radiation efficiency as compared with the reference structure. A dielectric substrate with further reduced number of EBG patches did not provide sufficient SAR reduction and behave properly as a periodic structure.
{"title":"SAR and radiation characteristics of dipole antenna above finite EBG substrate in presence of cubic head model","authors":"R. Ikeuchi, A. Hirata","doi":"10.1109/EMCEUROPE.2012.6396908","DOIUrl":"https://doi.org/10.1109/EMCEUROPE.2012.6396908","url":null,"abstract":"The present study investigates the performance of a dipole antenna above different electromagnetic band-gap (EBG) substrate for realizing a low specific absorption rate (SAR) antenna. We then investigate the effect of the number of unit cell of the EBG substrate on the antenna performance. The substrate with 24(4×6) EBG patches is considered as a reference. The dipole antenna above a substrate with sixteen EBG unit cells was shown to provide comparable SAR reduction and improved radiation efficiency as compared with the reference structure. A dielectric substrate with further reduced number of EBG patches did not provide sufficient SAR reduction and behave properly as a periodic structure.","PeriodicalId":377100,"journal":{"name":"International Symposium on Electromagnetic Compatibility - EMC EUROPE","volume":"102 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124204687","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-12-31DOI: 10.1109/EMCEUROPE.2012.6396724
M. Brignone, F. Delfino, R. Procopio, M. Rossi, F. Rachidi, S. Tkachenko
In this paper, an effective approach to analyze the coupling between high-frequency electromagnetic fields and transmission lines is presented. The algorithm, implemented in the frequency domain, consists of solving the integro-differential equation that relates the incident electric field with the current induced into the line. The unknown current is expressed by means of a Fourier series whose coefficients are calculated applying the Landweber method. The use of such method makes it possible to face both measurement and parametric uncertainties, since it has been developed and is widely used to solve inverse problems that are typically ill-posed. The obtained results are compared with the ones provided by the Numerical Electromagnetics Code (NEC) and an excellent agreement is obtained.
{"title":"The use of the regularization theory for the analysis of the field-to-line coupling problem","authors":"M. Brignone, F. Delfino, R. Procopio, M. Rossi, F. Rachidi, S. Tkachenko","doi":"10.1109/EMCEUROPE.2012.6396724","DOIUrl":"https://doi.org/10.1109/EMCEUROPE.2012.6396724","url":null,"abstract":"In this paper, an effective approach to analyze the coupling between high-frequency electromagnetic fields and transmission lines is presented. The algorithm, implemented in the frequency domain, consists of solving the integro-differential equation that relates the incident electric field with the current induced into the line. The unknown current is expressed by means of a Fourier series whose coefficients are calculated applying the Landweber method. The use of such method makes it possible to face both measurement and parametric uncertainties, since it has been developed and is widely used to solve inverse problems that are typically ill-posed. The obtained results are compared with the ones provided by the Numerical Electromagnetics Code (NEC) and an excellent agreement is obtained.","PeriodicalId":377100,"journal":{"name":"International Symposium on Electromagnetic Compatibility - EMC EUROPE","volume":"69 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127466739","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-12-31DOI: 10.1109/EMCEUROPE.2012.6396869
I. Gil, R. Fernández-García
In this paper an alternative method for characterizing and modelling the EMI susceptibility in integrated circuits at frequencies above 1 GHz is presented. The PCB layout design is focused on the optimization of the impedance mismatch losses on the radio frequency interference injection path. The PCB has been tested with several commercial operational amplifiers and the methodology is validated through both electrical transmission line simulations and electromagnetic cosimulations.
{"title":"Characterization and modelling of EMI susceptibility in integrated circuits at high frequency","authors":"I. Gil, R. Fernández-García","doi":"10.1109/EMCEUROPE.2012.6396869","DOIUrl":"https://doi.org/10.1109/EMCEUROPE.2012.6396869","url":null,"abstract":"In this paper an alternative method for characterizing and modelling the EMI susceptibility in integrated circuits at frequencies above 1 GHz is presented. The PCB layout design is focused on the optimization of the impedance mismatch losses on the radio frequency interference injection path. The PCB has been tested with several commercial operational amplifiers and the methodology is validated through both electrical transmission line simulations and electromagnetic cosimulations.","PeriodicalId":377100,"journal":{"name":"International Symposium on Electromagnetic Compatibility - EMC EUROPE","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116849422","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-12-31DOI: 10.1109/EMCEUROPE.2012.6396886
D. Assante, A. Andreotti, L. Verolino
The paper deals with the evaluation of the characteristic impedance of a multiconductor transmission line with one conductor periodically grounded. The topic, even if not adequately discussed in literature, has a relevant application in the analysis of the role of the shield wire in power lines, in order to quantify the mitigation of induced overvoltages. The problem is here modelled, leading to a nonsymmetric algebraic Riccati equation, that is solved with both a factorization and an iterative method. The solution is presented in a practical case and the efficiency of the methods are discussed.
{"title":"Considerations on the characteristic impedance of periodically grounded multiconductor transmission lines","authors":"D. Assante, A. Andreotti, L. Verolino","doi":"10.1109/EMCEUROPE.2012.6396886","DOIUrl":"https://doi.org/10.1109/EMCEUROPE.2012.6396886","url":null,"abstract":"The paper deals with the evaluation of the characteristic impedance of a multiconductor transmission line with one conductor periodically grounded. The topic, even if not adequately discussed in literature, has a relevant application in the analysis of the role of the shield wire in power lines, in order to quantify the mitigation of induced overvoltages. The problem is here modelled, leading to a nonsymmetric algebraic Riccati equation, that is solved with both a factorization and an iterative method. The solution is presented in a practical case and the efficiency of the methods are discussed.","PeriodicalId":377100,"journal":{"name":"International Symposium on Electromagnetic Compatibility - EMC EUROPE","volume":"194 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131181617","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-12-31DOI: 10.1109/EMCEUROPE.2012.6396880
A. De Sabata, L. Matekovits, M. Silaghi, U. Rohde
A metamaterial based solution for parallel-plate noise reduction in power planes of digital and mixed-signal fast circuits is presented. The solution consists of embedding a periodic patterned surface between two dielectric layers and two metal planes. The novelty stems from the shape of the metal motif of the patterned surface of the unit cell. In each unit cell nine vias connect the metal patch to the ground; other four posts are posed on the metal patch in order to slow down the electromagnetic waves. The filtering properties of the device are assessed by numerically calculating the dispersion diagrams. Starting from small dimensions (2.5 mm), the device has been sequentially up-scaled until its selective properties met the requirements of the application, i.e. reduction of noise up to 6 GHz. Limits of the electromagnetic band-gaps are reported for various scales.
{"title":"Investigation on the scaling properties of a novel electromagnetic band-gap structure for application to parallel-plate noise suppression","authors":"A. De Sabata, L. Matekovits, M. Silaghi, U. Rohde","doi":"10.1109/EMCEUROPE.2012.6396880","DOIUrl":"https://doi.org/10.1109/EMCEUROPE.2012.6396880","url":null,"abstract":"A metamaterial based solution for parallel-plate noise reduction in power planes of digital and mixed-signal fast circuits is presented. The solution consists of embedding a periodic patterned surface between two dielectric layers and two metal planes. The novelty stems from the shape of the metal motif of the patterned surface of the unit cell. In each unit cell nine vias connect the metal patch to the ground; other four posts are posed on the metal patch in order to slow down the electromagnetic waves. The filtering properties of the device are assessed by numerically calculating the dispersion diagrams. Starting from small dimensions (2.5 mm), the device has been sequentially up-scaled until its selective properties met the requirements of the application, i.e. reduction of noise up to 6 GHz. Limits of the electromagnetic band-gaps are reported for various scales.","PeriodicalId":377100,"journal":{"name":"International Symposium on Electromagnetic Compatibility - EMC EUROPE","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132862147","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-12-31DOI: 10.1109/EMCEUROPE.2012.6396846
S. Bonisch, A. Neumann, D. Bucke
The characterization of passive component properties over a wide frequency range is usually done using scattering parameters. This paper presents the measurement and modeling approach for two typical three-phase mains chokes (3×100μH, 230V, 60A and 3×2.3mH, 230V, 65A) based on six-port scattering parameters using a common two-port vector network analyzer. The model allows to reproduce consistently common-mode and differential-mode response of a passive six-port device, covering a frequency range from 10Hz to 300MHz.
{"title":"Six-port scattering parameters of a three-phase mains choke for consistent modelling of common-mode and differential-mode response","authors":"S. Bonisch, A. Neumann, D. Bucke","doi":"10.1109/EMCEUROPE.2012.6396846","DOIUrl":"https://doi.org/10.1109/EMCEUROPE.2012.6396846","url":null,"abstract":"The characterization of passive component properties over a wide frequency range is usually done using scattering parameters. This paper presents the measurement and modeling approach for two typical three-phase mains chokes (3×100μH, 230V, 60A and 3×2.3mH, 230V, 65A) based on six-port scattering parameters using a common two-port vector network analyzer. The model allows to reproduce consistently common-mode and differential-mode response of a passive six-port device, covering a frequency range from 10Hz to 300MHz.","PeriodicalId":377100,"journal":{"name":"International Symposium on Electromagnetic Compatibility - EMC EUROPE","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128134872","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-12-31DOI: 10.1109/EMCEUROPE.2012.6396686
Grzegorz Lubkowski, Zainul Ihsan, C. Adami, Michael Suhrke
In this work we show some numerical aspects related to the full-wave 3D simulations of absorber wall properties. Two problems are discussed: (i) characterization of the dielectric properties of the absorber medium and (ii) modelling of the absorber wall geometry terminating the EMC facility. It is shown that approximation of the constitutive properties of the absorber medium by Debye models with several relaxation terms can lead to a better accuracy than for a single term based Debye formula description. Regarding absorber wall geometry: multilayer models characterized by anisotropic permittivity distribution offer better approximation properties than isotropic multilayer models.
{"title":"Modelling of pyramid absorbers used in EMC facilities","authors":"Grzegorz Lubkowski, Zainul Ihsan, C. Adami, Michael Suhrke","doi":"10.1109/EMCEUROPE.2012.6396686","DOIUrl":"https://doi.org/10.1109/EMCEUROPE.2012.6396686","url":null,"abstract":"In this work we show some numerical aspects related to the full-wave 3D simulations of absorber wall properties. Two problems are discussed: (i) characterization of the dielectric properties of the absorber medium and (ii) modelling of the absorber wall geometry terminating the EMC facility. It is shown that approximation of the constitutive properties of the absorber medium by Debye models with several relaxation terms can lead to a better accuracy than for a single term based Debye formula description. Regarding absorber wall geometry: multilayer models characterized by anisotropic permittivity distribution offer better approximation properties than isotropic multilayer models.","PeriodicalId":377100,"journal":{"name":"International Symposium on Electromagnetic Compatibility - EMC EUROPE","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128317810","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-12-31DOI: 10.1109/EMCEUROPE.2012.6396736
Xian-Ke Gao, H. Yik, Boon-Hui Lim, Huapeng Zhao, Binfang Wang, E. Li
This paper presents a system-level modeling method by integrating analytical and numerical methods to analyze conducted and radiated electromagnetic immunity of electronic systems. Through extracting the intrinsic behavioural characteristics from cables, PCBA (board, traces, vias, connectors and components) and enclosure by using the semi-analytical method, one equivalent circuit model is built which is capable of simulating the transient/AC responses and crosstalk under conducted and/or radiated electromagnetic interference. A computer aided modelling system is developed to help industry engineers utilize the proposed methodology for their EMC design.
{"title":"Integrated analytical and numerical modeling for system level conducted/radiated immunity analysis","authors":"Xian-Ke Gao, H. Yik, Boon-Hui Lim, Huapeng Zhao, Binfang Wang, E. Li","doi":"10.1109/EMCEUROPE.2012.6396736","DOIUrl":"https://doi.org/10.1109/EMCEUROPE.2012.6396736","url":null,"abstract":"This paper presents a system-level modeling method by integrating analytical and numerical methods to analyze conducted and radiated electromagnetic immunity of electronic systems. Through extracting the intrinsic behavioural characteristics from cables, PCBA (board, traces, vias, connectors and components) and enclosure by using the semi-analytical method, one equivalent circuit model is built which is capable of simulating the transient/AC responses and crosstalk under conducted and/or radiated electromagnetic interference. A computer aided modelling system is developed to help industry engineers utilize the proposed methodology for their EMC design.","PeriodicalId":377100,"journal":{"name":"International Symposium on Electromagnetic Compatibility - EMC EUROPE","volume":"101 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134462038","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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