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Technology Impacts on Sub-90nm CMOS Circuit Design and Design Methodologies 技术对Sub-90nm CMOS电路设计和设计方法的影响
Pub Date : 2006-01-03 DOI: 10.1109/VLSID.2006.156
R. Puri, T. Karnik, R. Joshi
Summary form only for tutorial. This tutorial discusses design challenges of scaled CMOS circuits in sub-90nm technologies and the design methodologies required to design them in order to produce robust designs with desired power performance trade-off. It is increasingly difficult to sustain supply and threshold voltage scaling to provide the required performance increase, limit energy consumption, control power dissipation, and maintain reliability. These requirements pose several difficulties across a range of disciplines. On the technology front, the question arises whether we can continue along the traditional CMOS scaling path - reduce effective oxide thickness, improve channel mobility, and minimize parasitics. On the design front, researchers are exploring various circuit design techniques to deal with process variation, leakage and soft errors.
仅供教程使用的摘要表单。本教程讨论了在sub-90nm技术中缩放CMOS电路的设计挑战,以及设计它们所需的设计方法,以便产生具有所需功率性能权衡的稳健设计。为了提供所需的性能提升、限制能耗、控制功耗和保持可靠性,维持供电和阈值电压缩放变得越来越困难。这些要求给一系列学科带来了一些困难。在技术方面,问题是我们是否可以继续沿着传统的CMOS缩放路径-减少有效氧化物厚度,提高通道迁移率,并最大限度地减少寄生。在设计方面,研究人员正在探索各种电路设计技术来处理工艺变化、泄漏和软误差。
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引用次数: 2
Design of Embedded Systems with Novel Applications 具有新型应用的嵌入式系统设计
Pub Date : 2006-01-03 DOI: 10.1109/VLSID.2006.66
R. Lacovara, D. Vaman
Summary form only for tutorial. The tutorial introduces the need for restructuring the embedded systems designs with focus on new time critical network centric applications, where full duplex control function plays a vital role over typical interfaces such as LANs, DSLs and serial & parallel ports. Time critical applications are extremely sensitive to random variations of processing times, scheduling information exchanges and clock jitters. These variations produce excessive random delays that are highly problematic for time critical applications. Currently implemented interfaces such as bus architectures and local area network interfaces produce excessive random delays both in expected value and its standard deviation. The embedded systems design needs to take into account the problems with respect to enhancing the existing interfaces as well as developing new interfaces.
仅供教程使用的摘要表单。本教程介绍了重构嵌入式系统设计的必要性,重点介绍了新的以时间为关键的网络为中心的应用,其中全双工控制功能在局域网、dsl和串行并行端口等典型接口上起着至关重要的作用。时间关键型应用程序对处理时间、调度信息交换和时钟抖动的随机变化极其敏感。这些变化会产生过多的随机延迟,这对于时间关键型应用程序来说是非常有问题的。目前实现的接口,如总线体系结构和局域网接口,在期望值和标准差上都会产生过多的随机延迟。嵌入式系统的设计既要考虑对现有接口的改进,也要考虑开发新的接口。
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引用次数: 0
Low-Power Design Strategies for Mobile Computing 移动计算的低功耗设计策略
Pub Date : 2006-01-03 DOI: 10.1109/VLSID.2006.114
A. Prasad, Jacob Mathews, N. Naganathan
Summary form only for tutorial. The advent of nanometer design process has enabled the integration of multi-million gates with a variety of functionality as a system-on-chip (SoC). The demand for high levels of integration in SoCs are fueled by a strong demand in consumer oriented products for hand held computing, multimedia and other communication products. For these products, power budget is a very critical factor deciding the battery life, size and weight of the portable devices. Designers need to use energy reduction techniques to support as many design features and functions and still keep within the system power budget. The tutorial presents a comprehensive introduction to low power design techniques, and challenges in various facets of the design process. We present an in-depth introduction to concepts with a holistic view to overcome the various challenges and present strategies with a practical approach to the key issues in the design of low power solutions. All the techniques are discussed with practical examples.
仅供教程使用的摘要表单。纳米设计工艺的出现使得数百万门具有各种功能的集成成为片上系统(SoC)。对soc中高水平集成的需求是由手持计算、多媒体和其他通信产品的消费者导向产品的强劲需求推动的。对于这些产品来说,功率预算是决定便携式设备电池寿命、尺寸和重量的一个非常关键的因素。设计人员需要使用节能技术来支持尽可能多的设计特性和功能,同时仍保持在系统功率预算之内。本教程全面介绍了低功耗设计技术,以及设计过程中各个方面的挑战。我们从整体的角度深入介绍了概念,以克服各种挑战,并提出了针对低功耗解决方案设计中的关键问题的实用方法。并结合实例对这些技术进行了讨论。
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引用次数: 7
Design Challenges for High Performance Nano-Technology 高性能纳米技术的设计挑战
Pub Date : 2006-01-03 DOI: 10.1109/VLSID.2006.64
Goutam Debnath, P. J. Thadikaran
Summary form only for tutorial. This tutorial present the key aspects of design challenges and its solutions that are being experienced in VLSI design in the era of nanotechnology. The focus is on design challenges that are experienced in microprocessor designs. It captures the design issues in the areas of high level architectural modeling, design for manufacturability (DFM), layout synthesis, standard cell design, and performance verification. It describes the requirements to meet power, timing, physical dimension and process portability goals with nanotechnology. It also addresses the pre and post silicon verification difficulties that have a direct impact on taking the product to market.
仅供教程使用的摘要表单。本教程介绍了纳米技术时代VLSI设计中遇到的设计挑战及其解决方案的关键方面。重点是在微处理器设计中遇到的设计挑战。它捕获了高级体系结构建模、可制造性设计(DFM)、布局综合、标准单元设计和性能验证等领域的设计问题。它描述了用纳米技术满足功率、时序、物理尺寸和过程可移植性目标的要求。它还解决了对产品推向市场有直接影响的前期和后期硅验证困难。
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引用次数: 1
The Technological and Geographical Migration of the Semiconductor Industry 半导体产业的技术和地理迁移
Pub Date : 2006-01-03 DOI: 10.1109/VLSID.2006.161
Jackson Hu
The first transistor was invented in late 1947. In less than sixty years, this innovation has led to the creation of global semiconductor and IT industries which have had a tremendous impact on human life. In his speech, Dr. Jackson Hu first reviews the technology migration from discrete transistor to SoC (system on chip). He then addresses how the semiconductor industry has migrated from the USA to the rest of the world, and discuss the implications to emerging regions such as India and China.
第一个晶体管是在1947年末发明的。在不到60年的时间里,这一创新催生了全球半导体和IT产业,对人类生活产生了巨大影响。在他的演讲中,Jackson Hu博士首先回顾了从分立晶体管到SoC(片上系统)的技术迁移。然后,他阐述了半导体产业如何从美国迁移到世界其他地区,并讨论了对印度和中国等新兴地区的影响。
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引用次数: 0
65nm Omnibudsman 65海里Omnibudsman
Pub Date : 2005-01-03 DOI: 10.1109/ICVD.2005.5
T. Vucurevich
Summary form only given. Just as the semiconductor industry has begun to ship production products at 90nm we find ourselves starting "pipe cleaner" designs at 65nm. Each process generation provides both opportunities and challenges to design teams and the 65nm node is no exception. This paper provides a short overview of the challenges of designing at 65nm with special emphasis on the relationship of the design process to the manufacturing process and what is changing in the way that design tools keep complexity at bay in a world where power density and process variability threaten to drive us off of Moore's now famous law.
只提供摘要形式。就在半导体行业开始生产90纳米的产品时,我们发现自己开始采用65纳米的“管道清洁器”设计。每一代工艺都为设计团队提供了机遇和挑战,65nm节点也不例外。本文简要概述了65纳米设计的挑战,特别强调了设计过程与制造过程的关系,以及在功率密度和工艺可变性威胁着我们脱离著名的摩尔定律的世界中,设计工具保持复杂性的方式正在发生什么变化。
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引用次数: 0
Moore's Law is Unconstitutional 摩尔定律是违宪的
Pub Date : 2005-01-03 DOI: 10.1109/ICVD.2005.121
W. Rhines
Moore's law is the empirical observation that component density and performance of integrated circuits - approximately doubles every eighteen months. It is not a 'law' in the sense that basic principals of physics and thermodynamics constitute the rules of nature. But there is a 'law' that serves as the basis for Moore's law; it is the general principle that governs learning curves, i.e. that efficiencies improve a fixed percentage with increases in the total accumulated volume of production, when analyzed on a logarithmic scale. Analyzing current trends in integrated circuit technology reveals the potential left to achieve performance, reliability and cost improvements via the traditional means of shrinking design rules and increasing die and wafer size. It also suggests where nontraditional innovation is likely to have its greatest impact. This talk explores these projections for future technology and suggest where the discontinuities are most likely to occur.
摩尔定律是一种经验观察,即集成电路的组件密度和性能大约每18个月翻一番。从物理学和热力学的基本原理构成自然规律的意义上说,它不是一个“定律”。但是有一条“定律”可以作为摩尔定律的基础;这是支配学习曲线的一般原则,即,当以对数尺度分析时,效率随着总累积产量的增加而提高一个固定的百分比。分析集成电路技术的当前趋势,揭示了通过缩小设计规则和增加芯片和晶圆尺寸的传统方法来实现性能、可靠性和成本改进的潜力。报告还指出,非传统创新可能在哪些领域产生最大影响。这次演讲探讨了这些对未来技术的预测,并提出了最可能发生不连续性的地方。
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引用次数: 2
ESL - The Next Leadership Opportunity for India? ESL -印度的下一个领导机会?
Pub Date : 2005-01-03 DOI: 10.1109/ICVD.2005.92
A. Naumann
Summary form only given. This paper lectures on the increasingly critical role played by electronic system level (ESL) design tools in the development of the complex system-on-chip (SoC) devices that are now the indispensable engines of advanced consumer and communications products. Drawing upon his experience in managing CoWare, which has world-class software development resources in India, the author argues that ESL tool development expertise can be an effective differentiator for Indian software engineering. This paper discusses the growing impact of SoC technology on the global electronics market, and the factors driving it. In particular, contrary to the conventional wisdom, the design cost per gate continues to fall - because rising mask costs are more than offset by the massive increase in the number of gates per chip. This increase in gate capacity presents SoC designers not only with a significant market opportunity, but also with a serious design challenge - how to integrate so much functionality into one chip without the multiple re-spins that destroy a product's time to market and bury its design budget. Also discussed is the ESL design methodology, and it is argued that the adoption of such a methodology is a pre-requisite for meeting this SoC design challenge. This paper argues that Indian engineers - with their proven expertise in software modelling and development - can occupy a pole position in this new industrial revolution.
只提供摘要形式。电子系统级(ESL)设计工具在复杂的片上系统(SoC)器件的开发中发挥着越来越重要的作用,而这些器件现在是先进消费和通信产品不可或缺的引擎。根据他管理CoWare的经验,该公司在印度拥有世界级的软件开发资源,作者认为ESL工具开发专业知识可以成为印度软件工程的有效区别。本文讨论了SoC技术对全球电子市场日益增长的影响,以及推动它的因素。特别是,与传统智慧相反,每个栅极的设计成本继续下降-因为每个芯片栅极数量的大量增加抵消了掩模成本的上升。栅极容量的增加不仅给SoC设计人员带来了巨大的市场机会,同时也带来了严峻的设计挑战——如何将如此多的功能集成到一个芯片中,而不需要多次重新旋转,从而破坏产品的上市时间并埋没其设计预算。还讨论了ESL设计方法,并认为采用这种方法是满足这种SoC设计挑战的先决条件。本文认为,印度工程师——他们在软件建模和开发方面的专长已得到证实——可以在这场新的工业革命中占据有利地位。
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引用次数: 0
VLSI Design Challenges for Gigascale Integration 面向千兆级集成的VLSI设计挑战
Pub Date : 2005-01-03 DOI: 10.1109/ICVD.2005.171
S. Borkar
VLSI system performance increased by five orders of magnitude in the last three decades, made possible by continued technology scaling, improving transistor performance to increase frequency, increasing integration capacity to realize complex architectures, and reducing energy consumed per logic operation to keep power dissipation within limit. The technology treadmill will continue, providing integration capacity of billions of transistors; however, power and energy consumption will be the barriers. Performance at any cost will not be an option in the future; VLSI systems will have to emphasize performance delivered in a given power envelope, with complexity limited by energy efficiency. This paper discusses potential solutions in process technology, circuits, and microarchitectures to exploit future gigascale integration capacity. The system on a chip (SOC) concept will help integrate diverse functional blocks, providing valued performance. The paper concludes with recommendations to the VLSI system designers on how to exploit these emerging paradigms.
VLSI系统的性能在过去的三十年中提高了五个数量级,这是由于持续的技术规模,提高晶体管性能以提高频率,增加集成能力以实现复杂的架构,以及降低每个逻辑运算的能量消耗以保持功耗在限制之内。技术将继续发展,提供数十亿个晶体管的集成能力;然而,电力和能源消耗将成为障碍。在未来,不计任何代价的业绩将不再是一种选择;VLSI系统将不得不强调在给定功率范围内提供的性能,其复杂性受到能源效率的限制。本文讨论了在工艺技术、电路和微架构方面的潜在解决方案,以开发未来的千兆级集成能力。片上系统(SOC)概念将有助于集成各种功能模块,提供有价值的性能。本文最后就如何利用这些新兴范例向VLSI系统设计者提出建议。
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引用次数: 12
Introduction to SystemC SystemC简介
Pub Date : 2001-01-03 DOI: 10.1109/VLSID.2001.10014
S. Bhawmik
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引用次数: 3
期刊
VLSI design (Print)
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