首页 > 最新文献

2008 45th ACM/IEEE Design Automation Conference最新文献

英文 中文
Predictive design space exploration using genetically programmed response surfaces 预测性设计空间探索利用基因编程响应面
Pub Date : 2008-06-08 DOI: 10.1145/1391469.1391711
Henry Cook, K. Skadron
Exponential increases in architectural design complexity threaten to make traditional processor design optimization techniques intractable. Genetically programmed response surfaces (GPRS) address this challenge by transforming the optimization process from a lengthy series of detailed simulations into the tractable formulation and rapid evaluation of a predictive model. We validate GPRS methodology on realistic processor design spaces and compare it to recently proposed techniques for predictive microarchitectural design space exploration.
体系结构设计复杂性的指数级增长使得传统的处理器设计优化技术变得难以处理。遗传编程响应面(GPRS)通过将优化过程从冗长的一系列详细模拟转变为可处理的预测模型的制定和快速评估,解决了这一挑战。我们在现实处理器设计空间中验证了GPRS方法,并将其与最近提出的预测性微架构设计空间探索技术进行了比较。
{"title":"Predictive design space exploration using genetically programmed response surfaces","authors":"Henry Cook, K. Skadron","doi":"10.1145/1391469.1391711","DOIUrl":"https://doi.org/10.1145/1391469.1391711","url":null,"abstract":"Exponential increases in architectural design complexity threaten to make traditional processor design optimization techniques intractable. Genetically programmed response surfaces (GPRS) address this challenge by transforming the optimization process from a lengthy series of detailed simulations into the tractable formulation and rapid evaluation of a predictive model. We validate GPRS methodology on realistic processor design spaces and compare it to recently proposed techniques for predictive microarchitectural design space exploration.","PeriodicalId":412696,"journal":{"name":"2008 45th ACM/IEEE Design Automation Conference","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114927916","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 44
Multiprocessor performance estimation using hybrid simulation 基于混合仿真的多处理器性能估计
Pub Date : 2008-06-08 DOI: 10.1145/1391469.1391552
L. Gao, K. Karuri, S. Kraemer, R. Leupers, G. Ascheid, H. Meyr
With the growing number of programmable processing elements in today's Multiprocessor System-on-Chip (MPSoC) designs, the synergy required for the development of the hardware architecture and the software running on them is also increasing. In MPSoC development environment, changes in the hardware architecture can bring in extensive re-partitioning or re-parallelization of the software architecture. Fast and accurate functional simulation and performance estimation techniques are needed to cope with this co-design problem at the early phases of MPSoC design space exploration. The current paper addresses this issue by introducing a framework which combines hybrid simulation, cache simulation and online trace-driven replay techniques to accurately predict performance of programmable elements in an MPSoC environment. The resulting simulation technique can easily cope with the continuous re-organizations of software architectures during an Instruction Set Simulator (ISS) based design process. Experimental results show that this framework can improve system simulation speed by 3-5X on average while achieving accuracy closely comparable to traditional ISSes.
随着当今多处理器片上系统(MPSoC)设计中可编程处理元件的数量不断增加,硬件架构和运行在其上的软件开发所需的协同作用也在增加。在MPSoC开发环境中,硬件体系结构的变化会导致软件体系结构的重新分区或重新并行化。在MPSoC设计空间探索的早期阶段,需要快速准确的功能仿真和性能评估技术来应对这种协同设计问题。本文通过引入一个框架来解决这个问题,该框架结合了混合仿真、缓存仿真和在线跟踪驱动重放技术,以准确预测MPSoC环境中可编程元件的性能。在基于指令集模拟器(ISS)的设计过程中,所得到的仿真技术可以很容易地处理软件体系结构的不断重组。实验结果表明,该框架可将系统仿真速度平均提高3-5倍,同时达到与传统isse相当的精度。
{"title":"Multiprocessor performance estimation using hybrid simulation","authors":"L. Gao, K. Karuri, S. Kraemer, R. Leupers, G. Ascheid, H. Meyr","doi":"10.1145/1391469.1391552","DOIUrl":"https://doi.org/10.1145/1391469.1391552","url":null,"abstract":"With the growing number of programmable processing elements in today's Multiprocessor System-on-Chip (MPSoC) designs, the synergy required for the development of the hardware architecture and the software running on them is also increasing. In MPSoC development environment, changes in the hardware architecture can bring in extensive re-partitioning or re-parallelization of the software architecture. Fast and accurate functional simulation and performance estimation techniques are needed to cope with this co-design problem at the early phases of MPSoC design space exploration. The current paper addresses this issue by introducing a framework which combines hybrid simulation, cache simulation and online trace-driven replay techniques to accurately predict performance of programmable elements in an MPSoC environment. The resulting simulation technique can easily cope with the continuous re-organizations of software architectures during an Instruction Set Simulator (ISS) based design process. Experimental results show that this framework can improve system simulation speed by 3-5X on average while achieving accuracy closely comparable to traditional ISSes.","PeriodicalId":412696,"journal":{"name":"2008 45th ACM/IEEE Design Automation Conference","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116286020","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 44
Techniques for fully integrated intra-/inter-chip optical communication 完全集成的片内/片间光通信技术
Pub Date : 2008-06-08 DOI: 10.1145/1391469.1391558
C. Favi, E. Charbon
In this paper we propose to replace all data and control pads generally present in conventional chips with a new type of ultra-compact, low-power optical interconnect implemented almost entirely in CMOS. The proposed scheme enables optical through-chip buses that could service hundreds of thinned stacked dies. High throughputs and communication density could be achieved even in tight power budgets. The core of the optical interconnect is a single-photon avalanche diode operating in pulse position modulation. We demonstrate how throughputs of several gigabits per second may be achieved. We also show a systematic analysis of the system and preliminary results to support its suitability in emerging DSM technologies.
在本文中,我们建议用一种几乎完全在CMOS中实现的新型超紧凑、低功耗光互连来取代传统芯片中普遍存在的所有数据和控制垫。提出的方案使光通片总线能够服务于数百个薄堆叠的芯片。即使在紧张的功率预算下,也可以实现高吞吐量和通信密度。光互连的核心是工作在脉冲位置调制的单光子雪崩二极管。我们将演示如何实现每秒几千兆比特的吞吐量。我们还展示了系统分析和初步结果,以支持其在新兴的DSM技术中的适用性。
{"title":"Techniques for fully integrated intra-/inter-chip optical communication","authors":"C. Favi, E. Charbon","doi":"10.1145/1391469.1391558","DOIUrl":"https://doi.org/10.1145/1391469.1391558","url":null,"abstract":"In this paper we propose to replace all data and control pads generally present in conventional chips with a new type of ultra-compact, low-power optical interconnect implemented almost entirely in CMOS. The proposed scheme enables optical through-chip buses that could service hundreds of thinned stacked dies. High throughputs and communication density could be achieved even in tight power budgets. The core of the optical interconnect is a single-photon avalanche diode operating in pulse position modulation. We demonstrate how throughputs of several gigabits per second may be achieved. We also show a systematic analysis of the system and preliminary results to support its suitability in emerging DSM technologies.","PeriodicalId":412696,"journal":{"name":"2008 45th ACM/IEEE Design Automation Conference","volume":"61 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116299422","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 13
MAPS: An integrated framework for MPSoC application parallelization MAPS:用于MPSoC应用程序并行化的集成框架
Pub Date : 2008-06-08 DOI: 10.1145/1391469.1391663
J. Ceng, J. Castrillón, Weihua Sheng, H. Scharwächter, R. Leupers, G. Ascheid, H. Meyr, T. Isshiki, H. Kunieda
In the past few years, MPSoC has become the most popular solution for embedded computing. However, the challenge of programming MPSoCs also comes as the biggest side-effect of the solution. Especially, when designers have to face the legacy C code accumulated through the years, the tool support is mostly unsatisfactory. In this paper, we propose an integrated framework, MAPS, which aims at parallelizing C applications for MPSoC platforms. It extracts coarse-grained parallelism on a novel granularity level. A set of tools have been developed for the framework. We will introduce the major components and their functionalities. Two case studies will be given, which demonstrate the use of MAPS on two different kinds of applications. In both cases the proposed framework helps the programmer to extract parallelism efficiently.
在过去的几年中,MPSoC已经成为嵌入式计算最流行的解决方案。然而,编程mpsoc的挑战也是该解决方案最大的副作用。特别是,当设计人员不得不面对多年来积累的遗留C代码时,工具支持大多不令人满意。在本文中,我们提出了一个集成框架MAPS,旨在并行化MPSoC平台上的C应用程序。它在一个新的粒度级别上提取粗粒度的并行性。已经为该框架开发了一组工具。我们将介绍主要组件及其功能。将给出两个案例研究,演示在两种不同类型的应用程序上使用MAPS。在这两种情况下,所提出的框架都可以帮助程序员有效地提取并行性。
{"title":"MAPS: An integrated framework for MPSoC application parallelization","authors":"J. Ceng, J. Castrillón, Weihua Sheng, H. Scharwächter, R. Leupers, G. Ascheid, H. Meyr, T. Isshiki, H. Kunieda","doi":"10.1145/1391469.1391663","DOIUrl":"https://doi.org/10.1145/1391469.1391663","url":null,"abstract":"In the past few years, MPSoC has become the most popular solution for embedded computing. However, the challenge of programming MPSoCs also comes as the biggest side-effect of the solution. Especially, when designers have to face the legacy C code accumulated through the years, the tool support is mostly unsatisfactory. In this paper, we propose an integrated framework, MAPS, which aims at parallelizing C applications for MPSoC platforms. It extracts coarse-grained parallelism on a novel granularity level. A set of tools have been developed for the framework. We will introduce the major components and their functionalities. Two case studies will be given, which demonstrate the use of MAPS on two different kinds of applications. In both cases the proposed framework helps the programmer to extract parallelism efficiently.","PeriodicalId":412696,"journal":{"name":"2008 45th ACM/IEEE Design Automation Conference","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114480558","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 137
Collective computing based on swarm intelligence 基于群体智能的集体计算
Pub Date : 2008-06-08 DOI: 10.1145/1391469.1391561
S. Narasimhan, Somnath Paul, S. Bhunia
We present a novel computing framework consisting of multiple processing cores that exhibits swarm-like behavior. Conventional parallel processing paradigm typically requires a central controller for job assignment, inter-core communications and defect-tolerance. The proposed system leverages on the collective intelligence of a swarm of processing elements to avoid the bottleneck imposed by a central scheduler. Preliminary simulations show promising results for common signal processing applications.
我们提出了一种由多个处理核心组成的新型计算框架,该框架具有群集行为。传统的并行处理范例通常需要一个中央控制器来完成任务分配、核间通信和容错。提出的系统利用一群处理元素的集体智能来避免中央调度程序造成的瓶颈。初步的仿真结果表明,该方法适用于常见的信号处理应用。
{"title":"Collective computing based on swarm intelligence","authors":"S. Narasimhan, Somnath Paul, S. Bhunia","doi":"10.1145/1391469.1391561","DOIUrl":"https://doi.org/10.1145/1391469.1391561","url":null,"abstract":"We present a novel computing framework consisting of multiple processing cores that exhibits swarm-like behavior. Conventional parallel processing paradigm typically requires a central controller for job assignment, inter-core communications and defect-tolerance. The proposed system leverages on the collective intelligence of a swarm of processing elements to avoid the bottleneck imposed by a central scheduler. Preliminary simulations show promising results for common signal processing applications.","PeriodicalId":412696,"journal":{"name":"2008 45th ACM/IEEE Design Automation Conference","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114745904","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Efficient system design space exploration using machine learning techniques 利用机器学习技术进行有效的系统设计空间探索
Pub Date : 2008-06-08 DOI: 10.1145/1391469.1391712
Berkin Özisikyilmaz, G. Memik, A. Choudhary
Computer manufacturers spend a huge amount of time, resources, and money in designing new systems and newer configurations, and their ability to reduce costs, charge competitive prices and gain market share depends on how good these systems perform. In this work, we develop predictive models for estimating the performance of systems by using performance numbers from only a small fraction of the overall design space. Specifically, we first develop three models, two based on artificial neural networks and another based on linear regression. Using these models, we analyze the published Standard Performance Evaluation Corporation (SPEC) benchmark results and show that by using the performance numbers of only 2% and 5% of the machines in the design space, we can estimate the performance of all the systems within 9.1% and 4.6% on average, respectively. Then, we show that the performance of future systems can be estimated with less than 2.2% error rate on average by using the data of systems from a previous year. We believe that these tools can accelerate the design space exploration significantly and aid in reducing the corresponding research/development cost and time- to-market.
计算机制造商在设计新系统和更新配置上花费了大量的时间、资源和金钱,他们降低成本、收取有竞争力的价格和获得市场份额的能力取决于这些系统的性能。在这项工作中,我们开发了预测模型,通过使用整个设计空间的一小部分的性能数字来估计系统的性能。具体来说,我们首先开发了三个模型,两个基于人工神经网络,另一个基于线性回归。使用这些模型,我们分析了标准性能评估公司(SPEC)发布的基准测试结果,并表明仅使用设计空间中2%和5%的机器的性能数字,我们可以分别在9.1%和4.6%的平均范围内估计所有系统的性能。然后,我们证明了使用前一年的系统数据可以估计未来系统的性能,平均错误率小于2.2%。我们相信这些工具可以大大加快设计空间的探索,并有助于减少相应的研发成本和上市时间。
{"title":"Efficient system design space exploration using machine learning techniques","authors":"Berkin Özisikyilmaz, G. Memik, A. Choudhary","doi":"10.1145/1391469.1391712","DOIUrl":"https://doi.org/10.1145/1391469.1391712","url":null,"abstract":"Computer manufacturers spend a huge amount of time, resources, and money in designing new systems and newer configurations, and their ability to reduce costs, charge competitive prices and gain market share depends on how good these systems perform. In this work, we develop predictive models for estimating the performance of systems by using performance numbers from only a small fraction of the overall design space. Specifically, we first develop three models, two based on artificial neural networks and another based on linear regression. Using these models, we analyze the published Standard Performance Evaluation Corporation (SPEC) benchmark results and show that by using the performance numbers of only 2% and 5% of the machines in the design space, we can estimate the performance of all the systems within 9.1% and 4.6% on average, respectively. Then, we show that the performance of future systems can be estimated with less than 2.2% error rate on average by using the data of systems from a previous year. We believe that these tools can accelerate the design space exploration significantly and aid in reducing the corresponding research/development cost and time- to-market.","PeriodicalId":412696,"journal":{"name":"2008 45th ACM/IEEE Design Automation Conference","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128306052","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 39
Design and CAD for 3D integrated circuits 三维集成电路的设计和CAD
Pub Date : 2008-06-08 DOI: 10.1145/1391469.1391642
P. Franzon, W. R. Davis, M. Steer, S. Lipa, Eun Chu Oh, T. Thorolfsson, S. Melamed, S. Luniya, Tad Doxsee, Stephen Berkeley, Ben Shani, Kurt Obermiller
High density through silicon vias (TSV) can be used to build 3DICs that enable unique applications in computing, signal processing and memory intensive systems. This paper presents several case studies that are uniquely enhanced through 3D implementation, including a 3D CAM, an FFT processor, and a SAR processor. The CAD flow used to implement for these designs is described. 3DIC requires higher fidelity thermal modeling than 2DIC design. The rationale for this requirement is established and a possible solution is presented.
高密度硅通孔(TSV)可用于构建3dic,使其在计算,信号处理和内存密集型系统中具有独特的应用。本文介绍了几个案例研究,这些案例研究通过3D实现得到了独特的增强,包括3D CAM、FFT处理器和SAR处理器。描述了用于实现这些设计的CAD流程。3DIC需要比2DIC设计更高的保真度热建模。建立了这一需求的基本原理,并提出了一个可能的解决方案。
{"title":"Design and CAD for 3D integrated circuits","authors":"P. Franzon, W. R. Davis, M. Steer, S. Lipa, Eun Chu Oh, T. Thorolfsson, S. Melamed, S. Luniya, Tad Doxsee, Stephen Berkeley, Ben Shani, Kurt Obermiller","doi":"10.1145/1391469.1391642","DOIUrl":"https://doi.org/10.1145/1391469.1391642","url":null,"abstract":"High density through silicon vias (TSV) can be used to build 3DICs that enable unique applications in computing, signal processing and memory intensive systems. This paper presents several case studies that are uniquely enhanced through 3D implementation, including a 3D CAM, an FFT processor, and a SAR processor. The CAD flow used to implement for these designs is described. 3DIC requires higher fidelity thermal modeling than 2DIC design. The rationale for this requirement is established and a possible solution is presented.","PeriodicalId":412696,"journal":{"name":"2008 45th ACM/IEEE Design Automation Conference","volume":"4 2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128508179","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 24
Statistical modeling and simulation of threshold variation under dopant fluctuations and line-edge roughness 掺杂剂波动和线边缘粗糙度下阈值变化的统计建模与仿真
Pub Date : 2008-06-08 DOI: 10.1145/1391469.1391698
Y. Ye, Frank Liu, S. Nassif, Yu Cao
The threshold voltage (Vth) of a nanoscale transistor is severely affected by random dopant fluctuations and line-edge roughness. The analysis of these effects usually requires atomistic simulations that are too expensive computationally for statistical circuit design. In this work, we develop an efficient SPICE simulation method and statistical transistor model that accurately predict threshold variation as a function of dopant fluctuations and gate length change caused by sub-wavelength lithography and gate etching process. By understanding the physical principles of atomistic simulations, we (a) identify the appropriate method to divide a non-uniform gate into slices in order to map those fluctuations into the device model; (b) extract the variation of Vth from the strong-inversion region instead of the leakage current, benefiting from the linearity of the saturation current with respect to Vth and (c) propose a compact model of Vth variation that is scalable with gate size and the amount of dopant and gate length fluctuations. The proposed SPICE simulation method is fully validated against atomistic simulation results. Given the post-lithography gate geometry, this approach correctly models the variation of device output current in all operating regions. Based on the new results, we further project the amount of Vth variation at advanced technology nodes, to help shed light on the challenges of future robust circuit design.
纳米晶体管的阈值电压(Vth)受到掺杂剂随机波动和线边缘粗糙度的严重影响。这些效应的分析通常需要原子模拟,这对于统计电路设计来说计算成本太高。在这项工作中,我们开发了一种有效的SPICE模拟方法和统计晶体管模型,可以准确预测阈值变化作为亚波长光刻和栅极刻蚀过程引起的掺杂剂波动和栅极长度变化的函数。通过理解原子模拟的物理原理,我们(a)确定了将非均匀栅极划分为薄片的适当方法,以便将这些波动映射到器件模型中;(b)利用饱和电流相对于Vth的线性关系,从强反转区域而不是泄漏电流中提取Vth的变化;(c)提出一个紧凑的Vth变化模型,该模型可随栅极尺寸、掺杂量和栅极长度波动而扩展。本文提出的SPICE仿真方法通过原子仿真结果得到了充分的验证。考虑到光刻后栅极的几何形状,这种方法正确地模拟了所有工作区域中器件输出电流的变化。基于新的结果,我们进一步预测了先进技术节点的Vth变化量,以帮助阐明未来稳健电路设计的挑战。
{"title":"Statistical modeling and simulation of threshold variation under dopant fluctuations and line-edge roughness","authors":"Y. Ye, Frank Liu, S. Nassif, Yu Cao","doi":"10.1145/1391469.1391698","DOIUrl":"https://doi.org/10.1145/1391469.1391698","url":null,"abstract":"The threshold voltage (Vth) of a nanoscale transistor is severely affected by random dopant fluctuations and line-edge roughness. The analysis of these effects usually requires atomistic simulations that are too expensive computationally for statistical circuit design. In this work, we develop an efficient SPICE simulation method and statistical transistor model that accurately predict threshold variation as a function of dopant fluctuations and gate length change caused by sub-wavelength lithography and gate etching process. By understanding the physical principles of atomistic simulations, we (a) identify the appropriate method to divide a non-uniform gate into slices in order to map those fluctuations into the device model; (b) extract the variation of Vth from the strong-inversion region instead of the leakage current, benefiting from the linearity of the saturation current with respect to Vth and (c) propose a compact model of Vth variation that is scalable with gate size and the amount of dopant and gate length fluctuations. The proposed SPICE simulation method is fully validated against atomistic simulation results. Given the post-lithography gate geometry, this approach correctly models the variation of device output current in all operating regions. Based on the new results, we further project the amount of Vth variation at advanced technology nodes, to help shed light on the challenges of future robust circuit design.","PeriodicalId":412696,"journal":{"name":"2008 45th ACM/IEEE Design Automation Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132725062","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 65
Low power passive equalizer optimization using tritonic step response 采用三次阶跃响应的低功耗无源均衡器优化
Pub Date : 2008-06-08 DOI: 10.1145/1391469.1391613
Ling Zhang, Wenjian Yu, Haikun Zhu, A. Deutsch, G. Katopis, D. Dreps, E. Kuh, Chung-Kuan Cheng
A low power passive equalizer using RL terminator is proposed and optimized in this work. The equalizer includes an inductor in series with the resistive terminator, which boosts high frequency components and therefore improves the interconnect bandwidth with little overhead on power consumption. An analytic estimation method for eye-opening and jitter based on tritonic step response is also introduced in this work, which enables the optimization procedure. Our experimental results show that our estimation method is accurate and a board level transmission line of 50 cm wire length can achieve 15 Gb/s data rate. With 15 GHz frequency input, the power consumption of the equalizer is less than 2.5 mW, and the total power is 5 mW.
本文提出并优化了一种基于RL终止器的低功耗无源均衡器。均衡器包括一个电感串联电阻终结器,提高高频成分,从而提高互连带宽,功耗很小。本文还介绍了一种基于三阶阶跃响应的开眼抖动分析估计方法,使优化过程成为可能。实验结果表明,我们的估计方法是准确的,线长为50 cm的板级传输线可以达到15 Gb/s的数据速率。当输入频率为15ghz时,均衡器功耗小于2.5 mW,总功率为5mw。
{"title":"Low power passive equalizer optimization using tritonic step response","authors":"Ling Zhang, Wenjian Yu, Haikun Zhu, A. Deutsch, G. Katopis, D. Dreps, E. Kuh, Chung-Kuan Cheng","doi":"10.1145/1391469.1391613","DOIUrl":"https://doi.org/10.1145/1391469.1391613","url":null,"abstract":"A low power passive equalizer using RL terminator is proposed and optimized in this work. The equalizer includes an inductor in series with the resistive terminator, which boosts high frequency components and therefore improves the interconnect bandwidth with little overhead on power consumption. An analytic estimation method for eye-opening and jitter based on tritonic step response is also introduced in this work, which enables the optimization procedure. Our experimental results show that our estimation method is accurate and a board level transmission line of 50 cm wire length can achieve 15 Gb/s data rate. With 15 GHz frequency input, the power consumption of the equalizer is less than 2.5 mW, and the total power is 5 mW.","PeriodicalId":412696,"journal":{"name":"2008 45th ACM/IEEE Design Automation Conference","volume":"04 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130604740","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
Addressing library creation challenges from recent liberty extensions 解决最近自由扩展带来的图书馆创建挑战
Pub Date : 2008-06-08 DOI: 10.1145/1391469.1391591
R. Trihy
The Liberty Format is an open source industry standard for library modeling that has seen significant enhancement in recent years to address the challenges introduced by the new smaller technologies at 65 nm and below. Issues associated with modeling Timing, Power and Noise have seen an explosion in complexity. The paper discusses the challenges introduced by the new high accuracy models and techniques to ameliorate them for Library providers.
自由格式是用于库建模的开源行业标准,近年来该标准得到了显著的增强,以应对65纳米及以下的新小型技术带来的挑战。与建模时间、功率和噪声相关的问题已经看到了复杂性的爆炸式增长。本文讨论了新的高精度模型和技术给图书馆提供服务带来的挑战。
{"title":"Addressing library creation challenges from recent liberty extensions","authors":"R. Trihy","doi":"10.1145/1391469.1391591","DOIUrl":"https://doi.org/10.1145/1391469.1391591","url":null,"abstract":"The Liberty Format is an open source industry standard for library modeling that has seen significant enhancement in recent years to address the challenges introduced by the new smaller technologies at 65 nm and below. Issues associated with modeling Timing, Power and Noise have seen an explosion in complexity. The paper discusses the challenges introduced by the new high accuracy models and techniques to ameliorate them for Library providers.","PeriodicalId":412696,"journal":{"name":"2008 45th ACM/IEEE Design Automation Conference","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133193681","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 15
期刊
2008 45th ACM/IEEE Design Automation Conference
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1