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ICT 2005. 24th International Conference on Thermoelectrics, 2005.最新文献

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Thermoelectric properties of ternary copper thallium telluride: CuTl/sub 9/Te/sub 5/ 三元碲化铜铊的热电性能:cul /sub 9/Te/sub 5/
Pub Date : 2005-06-19 DOI: 10.1109/ICT.2005.1519916
K. Goto, K. Kurosaki, A. Kosuga, H. Muta, S. Yamanaka
We prepared high-density polycrystalline samples of Cu/sub 2/Te, Tl/sub 2/Te, and CuTl/sub 9/Te/sub 5/, and measured the thermoelectric properties. The thermal conductivity of CuTl/sub 9/Te/sub 5/ is very low, 0.49 Wm/sup -1/K/sup -1/ at room temperature. CuTl/sub 9/Te/sub 5/ indicates the relatively high figure of merit ZT because of its very low thermal conductivity. The highest ZT value is 0.38 obtained at 590 K for CuTl/sub 9/Te/sub 5/.
制备了Cu/sub 2/Te、Tl/sub 2/Te和cul /sub 9/Te/sub 5/高密度多晶样品,并对其热电性能进行了测试。cul /sub 9/Te/sub 5/的导热系数很低,室温下为0.49 Wm/sup -1/K/sup -1/。cul /sub 9/Te/sub 5/表示相对较高的ZT,因为它的导热系数很低。cul /sub 9/Te/sub 5/在590 K时ZT值最高,为0.38。
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引用次数: 0
Thermoelectric module construction for low temperature gradient power generation 用于低温梯度发电的热电模块结构
Pub Date : 2005-06-19 DOI: 10.1109/ICT.2005.1519958
Y. Meydbray, R. Singh, A. Shakouri
Energy related carbon dioxide emissions are the largest contributors to greenhouse gasses [1]. Thermoelectric power generation that exploits natural temperature differences between the air and earth can be a zero-emission replacement to small stand-alone power sources. Maximizing the temperature drop across the module is crucial to achieving optimal output power. An equation relating output power to thermoelectric module parameters is derived. In addition, several configurations are investigated experimentally. Output power shows a significant dependence on module surface area. In the setups tested, one side of the thermoelectric module was thermally coupled to the earth, while the other side was left exposed to air. This paper evaluates three 110hour experiments. The surface area of the exposed side was varied by a factor of about 15 without changing the area covered by thermoelectric elements. The output power shows a direct dependence on exposed surface area and changes by about a factor of 25. Nomenclature S surface area of module A cross sectional area covered by elements KA thermal conductivity of air Ke thermal conductivity of elements ρ resistivity of elements q heat transfer through module q’ heat transfer from module to air U heat transfer coefficient TA air temperature TC cold side temperature TH hot side temperature L element length α Seebeck coefficient Rtot. total thermal resistance of module N number of elements
与能源相关的二氧化碳排放是温室气体的最大贡献者[1]。利用空气和地球之间的自然温差的热电发电可以成为小型独立电源的零排放替代品。最大限度地降低整个模块的温度对于实现最佳输出功率至关重要。导出了输出功率与热电模块参数的关系式。此外,还对几种构型进行了实验研究。输出功率显示显著依赖于模块的表面积。在测试的装置中,热电模块的一侧与地面热耦合,而另一侧暴露在空气中。本文对三个110小时的实验进行了评价。在不改变热电元件所覆盖的面积的情况下,暴露侧的表面积变化了约15倍。输出功率显示直接依赖于暴露的表面积和变化约25的因数。术语S元件表面积A元件所覆盖的横截面积KA空气导热系数Ke元件导热系数ρ元件电阻率q通过元件传热q '模块向空气传热U传热系数TA空气温度TC冷侧温度TH热侧温度L元件长度α塞贝克系数Rtot。模块总热阻N个元件个数
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引用次数: 18
Improved maximum cooling by optimizing the geometry of thermoelectric leg elements 通过优化热电腿元件的几何形状,提高了最大冷却效果
Pub Date : 2005-06-19 DOI: 10.1109/ICT.2005.1519930
Yan Zhang, Z. Bian, A. Shakouri
In this paper, we investigate the effect of the thermoelectric leg geometry and boundary conditions on the overall device cooling performance. We present a detailed 3D electrothermal analysis of heat and current distribution in a Bi/sub 2/Te/sub 3/ single-leg element with 50/spl times/50 /spl mu/m/sup 2/ cold side contact area, which is smaller than the element cross section (410/spl times/410 /spl mu/m/sup 2/). We compared the cases when a uniform voltage is applied at the contact and when a uniform current density is applied. The finite element calculation results demonstrate that in the latter case the 3D single-leg element has a very non-uniform temperature distribution at the contact area. Maximum cooling in the center region is 92/spl deg/C, which is 20% higher than the 1D limit (76/spl deg/C) for a typical Bi/sub 2/Te/sub 3/ material with ZT/spl sim/1. Calculations show that it is possible to take away 600 W/cm/sup 2/ at the center 20/spl times/20 /spl mu/m/sup 2/ region, which is 6 times better than the 1D device with the same thickness. In contrast, with a boundary condition of uniform voltage at the cold side contact area, the temperature distribution is as uniform as 1D device and reaches the same maximum cooling temperature as 1D. We also propose the possibility of using array contact structures to achieve the uniform current boundary condition that can improve the maximum device cooling performance. These findings add contact geometry as another degree of freedom to engineer the performance of single and multi stage TE devices.
在本文中,我们研究了热电腿的几何形状和边界条件对器件整体冷却性能的影响。本文采用50/spl倍/50 /spl mu/m/sup 2/冷侧接触面积小于元件截面(410/spl倍/410 /spl mu/m/sup 2/)的Bi/sub 2/Te/sub 3/单腿元件,对其热和电流分布进行了详细的三维电热分析。我们比较了在触点处施加均匀电压和施加均匀电流密度的情况。有限元计算结果表明,在后一种情况下,三维单腿单元在接触区域的温度分布非常不均匀。中心区域的最大冷却温度为92/spl℃,比典型的ZT/spl sim/1的Bi/sub 2/Te/sub 3/材料的1D极限(76/spl℃)高20%。计算表明,在中心可带走600 W/cm/sup 2/ 20/spl倍/20 /spl亩/m/sup 2/区域,比同等厚度的1D器件好6倍。而在冷侧接触区电压均匀的边界条件下,温度分布与一维器件一样均匀,达到与一维器件相同的最高冷却温度。我们还提出了使用阵列接触结构来实现均匀电流边界条件的可能性,这可以提高器件的最大冷却性能。这些发现增加了接触几何作为设计单级和多级TE器件性能的另一个自由度。
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引用次数: 6
Formation of clathrates 笼形物的形成
Pub Date : 2005-06-19 DOI: 10.1109/ICT.2005.1519981
P. Rogl
The present paper focuses on a systematic study of clathrate formation, clathrate structures and bonding in clathrate materials. The analysis shows the difficulties in preparation and design of clathrate compounds at a given electron/atom concentration. Validity and shortcomings of the Zintl concept for clathrates will be outlined. Nevertheless the information obtained, although not complete for many systems, may provide useful in defining compositional regions of interest for further search for novel clathrate materials with interesting thermoelectric properties.
本文主要对包合物的形成、包合物结构和包合物材料中的键合进行了系统的研究。分析表明,在给定的电子/原子浓度下,包合物化合物的制备和设计存在困难。本文将概述包合物的Zintl概念的有效性和缺点。然而,所获得的信息,尽管对许多系统来说并不完整,但可能为进一步寻找具有有趣热电性质的新型笼形物材料提供有用的定义感兴趣的成分区域。
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引用次数: 6
Exploratory synthesis of new heavy main group chalcogenides 新型重主基硫属化合物的探索性合成
Pub Date : 2005-06-19 DOI: 10.1109/ICT.2005.1519948
A. Assoud, S. Derakhshan, N. Soheilnia, H. Kleinke
We have recently commenced to investigate mixed valent tin chalcogenides as well as polychalcogenides, namely SrSn/sub 2/Se/sub 4/, Sr/sub 2/SnSe/sub 5/, Ba/sub 2/SnSe/sub 5/, and Ba/sub 2/SnTe/sub 5/. These materials exhibit (calculated and in part experimentally confirmed) band gaps between 0.2 eV (Ba/sub 2/SnTe/sub 5/) and 1.2 eV (Ba/sub 2/SnSe/sub 5/). Molecular units are predominant in these materials, namely SnSe/sub 4//sup 4-/ tetrahedra, Sn/sub 3/Se/sub 10//sup 8-/ and Sn/sub 3/Te/sub 10//sup 8u/ilding blocks, respectively, as well as Se/sub 3//sup 2-/ and Te/sub 5//sup 4-/ units. Three-dimensionally interconnected covalent networks were found in the new quaternaries Ba/sub 3/Cu/sub 2/Sn/sub 3/Se/sub 10/, BaCu/sub 2/SnSe/sub 4/, and BaAg/sub 2/SnSe/sub 4/, including the Ba/sup 2+/ cations in one-dimensional channels. Despite the small band gaps (e.g., 0.2 eV for BaAg/sub 2/SnSe/sub 4/), the as-prepared samples exhibit rather small electrical conductivities, but large Seebeck coefficients (above +500 /spl mu/V/K at 300 K). Our most recently discovered polytellurides Ba/sub 3/Cu/sub 14-/spl delta//Te/sub 12/ and Ba/sub 2/Cu/sub 4-/spl delta//Te/sub 5/ comprising extended Cu atom substructures appear to have thermoelectric properties superior to the tin chalcogenides.
我们最近开始研究混合价锡硫族化合物和多价锡硫族化合物,即SrSn/sub 2/Se/sub 4/、Sr/sub 2/SnSe/sub 5/、Ba/sub 2/SnSe/sub 5/和Ba/sub 2/SnTe/sub 5/。这些材料的带隙(经过计算和部分实验证实)在0.2 eV (Ba/sub 2/SnTe/sub 5/)和1.2 eV (Ba/sub 2/SnSe/sub 5/)之间。这些材料以分子单元为主,分别为SnSe/sub 4//sup 4-/四面体、Sn/sub 3/Se/sub 10//sup 8-/和Sn/sub 3/Te/sub 10//sup 8u/单元,以及Se/sub 3//sup 2-/和Te/sub 5//sup 4-/单元。新季系Ba/sub 3/Cu/sub 2/Sn/sub 3/Se/sub 10/、BaCu/sub 2/SnSe/sub 4/和BaAg/sub 2/SnSe/sub 4/中发现了三维相互连接的共价网络,包括一维通道中的Ba/sup 2+/阳离子。尽管带隙小(例如BaAg/sub 2/SnSe/sub 4/的带隙为0.2 eV),但制备的样品具有相当小的电导率,但具有较大的塞贝克系数(在300 K时高于+500 /spl mu/V/K)。我们最近发现的包含扩展Cu原子亚结构的多碲化物Ba/sub 3/Cu/sub 14-/spl delta//Te/sub 12/和Ba/sub 2/Cu/sub 4-/spl delta//Te/sub 5/具有优于锡硫族化合物的热电性能。
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引用次数: 0
Potential applications of thermoelectric waste heat recovery in the automotive industry 热电余热回收在汽车工业中的潜在应用
Pub Date : 2005-06-19 DOI: 10.1109/ICT.2005.1519911
J. Yang
Several proposed applications of thermoelectric (TE) waste heat recovery devices in the automotive industry are reviewed. To assess the feasibility of these applications at a vehicle level, the effect of electrical load and weight on fuel economy for a series of cars and trucks was investigated. These results will help us to identify the appropriate vehicle platforms for TE waste heat recovery, and to establish a set of requirements for an automotive TE waste heat recovery subsystem. The key to the realization of this technology is still the continued development of new materials with increased TE efficiency.
综述了几种热电余热回收装置在汽车工业中的应用。为了评估这些应用在车辆层面的可行性,研究了一系列汽车和卡车的电负载和重量对燃油经济性的影响。这些结果将帮助我们确定适合TE废热回收的车辆平台,并为汽车TE废热回收子系统建立一套要求。实现该技术的关键仍然是不断开发具有更高TE效率的新材料。
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引用次数: 189
Physical properties of rare-earth-based Heusler phases REPdZ and REPd/sub 2/Z (Z = Sb,Bi) 稀土基Heusler相REPdZ和REPd/sub 2/Z (Z = Sb,Bi)的物理性质
Pub Date : 2005-06-19 DOI: 10.1109/ICT.2005.1519966
K. Gofryk, D. Kaczorowski, A. Jasper, Y. Grin
Four series of ternary compounds REPdSb (RE = Y, Ho, Er), REPdBi (RE = Nd, Y, Dy, Ho, Er), REPd/sub 2/Sb (RE = Y, Gd-Er) and REPd/sub 2/Bi (RE = Y, Dy-Er) were studied by means of magnetization, magnetic susceptibility, electrical resistivity, and thermoelectric power measurements performed in the temperature range 1.7-300 K and in magnetic fields up to 5 T. Magnetic susceptibility measurements of the Heusler phases REPdZ and REPd/sub 2/Z (RE = Y, Gd-Er; Z = Sb, Bi) have revealed that at low temperatures the compounds studied are either paramagnetic or antiferromagnetic with the Neel points of several Kelvin. For all these compounds but Y-based alloys experimental values of the effective magnetic moment are close to the theoretical ones for respective RE/sup 3+/ ions. Electrical resistivity measurements of the half-Heusler phases REPdX (X = Sb, Bi) have indicated their half-metallic or semimetallic character. At low temperatures the resistivity exhibits a metallic-like behaviour, which is probably due to an impurity band possibly overlapping with the conduction band. At high temperatures the electrical conductivities follow the activation law that accounts for gradual thermal depopulation of impurity levels. The positive sign of the Seebeck coefficient could indicate that holes arising from some acceptor centres are dominant carriers. The energy gaps near the Fermi level are of the order of tens millielectron volts and thus are much smaller than values estimated from the electronic structure calculations made for similar compounds. The Seebeck coefficient is quite large, of the order expected for low carrier density semimetals. The thermoelectric figure of merit evaluated for ErPdSb is ZT /spl ap/ 0.15 at room temperature. While half-Heusler alloys have been characterised as narrow-gap semiconductors all the REPd/sub 2/Sb and REPd/sub 2/Bi ternaries have been found to exhibit metallic-like conductivity. For the REPd/sub 2/Bi series a structural transformation from cubic to lower symmetry structures occurs that manifests itself as distinct anomalies in the transport characteristics. The thermoelectric power for these materials is much lower than that of the REPdX alloys.
四大系列的三元化合物REPdSb (Er) = Y, Ho, REPdBi (RE = Nd, Y, Dy, Ho Er), REPd /子2 /某人(= Y, Gd-Er)和REPd /子2 / Bi (= Y, Dy-Er)研究了磁化,磁化率、电阻率、热电动力测量温度范围中执行1.7 -300 K和5 t的磁场磁化率测量的赫斯勒阶段REPdZ和REPd /子2 / Z (RE = Y, Gd-Er;Z = Sb, Bi)表明,在低温下,所研究的化合物要么是顺磁性的,要么是反铁磁性的,具有几个开尔文的尼尔点。除基合金外,所有化合物的有效磁矩的实验值都接近于各自稀土/sup 3+/离子的理论值。对半heusler相REPdX (X = Sb, Bi)的电阻率测量表明其半金属或半金属性质。在低温下,电阻率表现出类似金属的行为,这可能是由于杂质带可能与导带重叠。在高温下,电导率遵循激活定律,该定律解释了杂质水平的逐渐热减少。塞贝克系数的正号可能表明某些受体中心产生的空穴是主要载流子。费米能级附近的能隙约为几十毫电子伏特,因此比类似化合物的电子结构计算估计的值要小得多。塞贝克系数相当大,与低载流子密度半金属的量级相当。在室温下,ErPdSb的热电优值为ZT /spl / 0.15。当半赫斯勒合金被表征为窄间隙半导体时,所有的REPd/sub 2/Sb和REPd/sub 2/Bi三元体都被发现具有类似金属的导电性。对于REPd/ sub2 /Bi系列,发生了从立方结构到低对称结构的结构转换,表现为输运特征的明显异常。这些材料的热电功率远低于REPdX合金。
{"title":"Physical properties of rare-earth-based Heusler phases REPdZ and REPd/sub 2/Z (Z = Sb,Bi)","authors":"K. Gofryk, D. Kaczorowski, A. Jasper, Y. Grin","doi":"10.1109/ICT.2005.1519966","DOIUrl":"https://doi.org/10.1109/ICT.2005.1519966","url":null,"abstract":"Four series of ternary compounds REPdSb (RE = Y, Ho, Er), REPdBi (RE = Nd, Y, Dy, Ho, Er), REPd/sub 2/Sb (RE = Y, Gd-Er) and REPd/sub 2/Bi (RE = Y, Dy-Er) were studied by means of magnetization, magnetic susceptibility, electrical resistivity, and thermoelectric power measurements performed in the temperature range 1.7-300 K and in magnetic fields up to 5 T. Magnetic susceptibility measurements of the Heusler phases REPdZ and REPd/sub 2/Z (RE = Y, Gd-Er; Z = Sb, Bi) have revealed that at low temperatures the compounds studied are either paramagnetic or antiferromagnetic with the Neel points of several Kelvin. For all these compounds but Y-based alloys experimental values of the effective magnetic moment are close to the theoretical ones for respective RE/sup 3+/ ions. Electrical resistivity measurements of the half-Heusler phases REPdX (X = Sb, Bi) have indicated their half-metallic or semimetallic character. At low temperatures the resistivity exhibits a metallic-like behaviour, which is probably due to an impurity band possibly overlapping with the conduction band. At high temperatures the electrical conductivities follow the activation law that accounts for gradual thermal depopulation of impurity levels. The positive sign of the Seebeck coefficient could indicate that holes arising from some acceptor centres are dominant carriers. The energy gaps near the Fermi level are of the order of tens millielectron volts and thus are much smaller than values estimated from the electronic structure calculations made for similar compounds. The Seebeck coefficient is quite large, of the order expected for low carrier density semimetals. The thermoelectric figure of merit evaluated for ErPdSb is ZT /spl ap/ 0.15 at room temperature. While half-Heusler alloys have been characterised as narrow-gap semiconductors all the REPd/sub 2/Sb and REPd/sub 2/Bi ternaries have been found to exhibit metallic-like conductivity. For the REPd/sub 2/Bi series a structural transformation from cubic to lower symmetry structures occurs that manifests itself as distinct anomalies in the transport characteristics. The thermoelectric power for these materials is much lower than that of the REPdX alloys.","PeriodicalId":422400,"journal":{"name":"ICT 2005. 24th International Conference on Thermoelectrics, 2005.","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126414970","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
ErAs/InGaAs superlattice Seebeck coefficient ErAs/InGaAs超晶格塞贝克系数
Pub Date : 2005-06-19 DOI: 10.1109/ICT.2005.1519992
G. Zeng, J. Bowers, Yan Zhang, A. Shakouri, J. Zide, A. Gossard, Woochul Kim, A. Majumdar
InGaAs with embedded ErAs nano-particles is a promising material for thermoelectric applications. The incorporation of erbium arsenide metallic nanoparticles into the semiconductor can provide both charge carriers and create scattering centers for phonons. Electron filtering by heterostructure barriers can also enhance Seebeck coefficient by selective emission of hot electrons. 2.1 /spl mu/m-thick ErAs/InGaAs superlattices with a period of 10 nm InAlGaAs and 20 nm InGaAs were grown using molecular beam epitaxy, and the effective doping is from 2/spl times/10/sup 18/ to 1/spl times/10/sup 19/ cm/sup -3/. Special device patterns were developed for the measurement of the cross-plane Seebeck coefficient of the superlattice layers. Using these device patterns, the combined Seebeck coefficient of superlattice and the substrate were measured and the temperature drops through the superlattice and InP substrate were determined with 3D ANSYS/spl reg/ simulations. The Seebeck coefficient of the superlattice layers is obtained based on the measurements and simulation results.
嵌入era纳米粒子的InGaAs是一种很有前途的热电材料。在半导体中掺入砷化铒金属纳米粒子,既能提供载流子,又能产生声子的散射中心。异质结构势垒的电子过滤也可以通过选择性发射热电子来提高塞贝克系数。利用分子束外延技术生长出周期为10 nm和20 nm的2.1 /spl μ m/ m厚的InAlGaAs和InGaAs超晶格,有效掺杂范围从2/spl倍/10/sup 18/到1/spl倍/10/sup 19/ cm/sup -3/。开发了用于测量超晶格层的平面塞贝克系数的特殊器件图样。利用这些器件模式,测量了超晶格和衬底的联合塞贝克系数,并利用三维ANSYS/spl reg/ simulation计算了通过超晶格和InP衬底的温度降。根据测量和模拟结果,得到了超晶格层的塞贝克系数。
{"title":"ErAs/InGaAs superlattice Seebeck coefficient","authors":"G. Zeng, J. Bowers, Yan Zhang, A. Shakouri, J. Zide, A. Gossard, Woochul Kim, A. Majumdar","doi":"10.1109/ICT.2005.1519992","DOIUrl":"https://doi.org/10.1109/ICT.2005.1519992","url":null,"abstract":"InGaAs with embedded ErAs nano-particles is a promising material for thermoelectric applications. The incorporation of erbium arsenide metallic nanoparticles into the semiconductor can provide both charge carriers and create scattering centers for phonons. Electron filtering by heterostructure barriers can also enhance Seebeck coefficient by selective emission of hot electrons. 2.1 /spl mu/m-thick ErAs/InGaAs superlattices with a period of 10 nm InAlGaAs and 20 nm InGaAs were grown using molecular beam epitaxy, and the effective doping is from 2/spl times/10/sup 18/ to 1/spl times/10/sup 19/ cm/sup -3/. Special device patterns were developed for the measurement of the cross-plane Seebeck coefficient of the superlattice layers. Using these device patterns, the combined Seebeck coefficient of superlattice and the substrate were measured and the temperature drops through the superlattice and InP substrate were determined with 3D ANSYS/spl reg/ simulations. The Seebeck coefficient of the superlattice layers is obtained based on the measurements and simulation results.","PeriodicalId":422400,"journal":{"name":"ICT 2005. 24th International Conference on Thermoelectrics, 2005.","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131534170","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Circuit model of a thermoelectric module for ac electrical measurements 交流电测量用热电模块的电路模型
Pub Date : 2005-06-19 DOI: 10.1109/ICT.2005.1519892
A. Downey, T. Hogan
Measurements of assembled thermoelectric modules commonly include investigations of the module output power versus load resistance. Such measurements include non-ideal effects such as electrical and thermal contact resistances. Using an AC electrical measurement, a model for a thermoelectric module has been developed utilizing electrical circuits for both the thermal and electrical characteristics of the module. Measurements were taken over the frequency range of 1mHz to 500Hz using lock-in amplifiers. We present data showing the extraction of ZT from such measurements on commercially available modules. By knowing either the heat capacity of the module or the average module Seebeck coefficient, determination of the thermal conductance can also be achieved. The model proposed here provides a simple equivalent circuit which can be analyzed using an electrical simulator such as SPICE. This model makes use of the magnitude and phase of the electrical impedance measured by the lock-in amplifiers at the input terminals of the module and includes fitting parameters of the total electrical resistance, thermal conductance, heat capacitance, and module Seebeck coefficient.
组装热电模块的测量通常包括对模块输出功率与负载电阻的研究。这些测量包括非理想的影响,如电和热接触电阻。利用交流电测量,开发了热电模块的模型,该模型利用了模块的热电特性的电路。使用锁相放大器在1mHz至500Hz的频率范围内进行测量。我们提供的数据显示,从商业上可用的模块上的这种测量中提取ZT。通过知道模块的热容或模块的平均塞贝克系数,也可以确定导热系数。本文提出的模型提供了一个简单的等效电路,可以使用SPICE等电子模拟器进行分析。该模型利用模块输入端锁相放大器测量的电阻抗的幅值和相位,包括总电阻、热导、热容和模块塞贝克系数的拟合参数。
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引用次数: 8
The thermoelectric properties of (Ce,La)/sub y/Fe/sub 1.0/Co/sub 3.0/Sb/sub 12/ compounds by solid state reaction and spark plasma sintering 采用固相反应和放电等离子烧结技术研究了(Ce,La)/亚y/Fe/亚1.0/Co/亚3.0/Sb/亚12/化合物的热电性能
Pub Date : 2005-06-19 DOI: 10.1109/ICT.2005.1519909
J.X. Zhang, Q. Lu, X. Zhang, Y.Q. Liu, D. Liu, M.L. Zhou
Filled skutterudite compounds (Ce,La)/sub y/FeCo/sub 3/Sb/sub 12/ with y=0.1/spl sim/0.3 were synthesized by solid state reaction-spark plasma sintering (SPS) using powders of Co, Sb, Fe and rare earth Ce as starting materials, and the thermoelectric properties of the compounds were also studied. It is shown that there is a little Sb in filled skutterudite compounds (Ce,La)/sub y/FeCo/sub 3/Sb/sub 12/ with y=0.1/spl sim/0.3 at 900 K. The lattice constant and the Seebeck coefficient of the compounds increases with the filling fraction of the Ce and La, while the thermal conductivity and electrical conductivity is greatly reduced The compounds had a minimum value of thermal conductivity with y=0.3, indicating that it is the coupling rattling and the irregular distribution between the two filler ions of La and Ce that give rise to the mass change of atom and the additional phonon scattering produced by lattice aberration when the Sb voids in the skutterudite structure were filled by Ce and La. The compound of Ce/sub 0.1/La/sub 0.2/Fe/sub 1.0/Co/sub 3.0/Sb/sub 12/ with Co-rich had a maximum value of the dimensionless figure of merit ZT=0.46 at 773 K.
以Co、Sb、Fe和稀土Ce粉末为原料,采用固相反应-火花等离子烧结(SPS)法制备了y=0.1/spl sim/0.3的填充型角钨矿化合物(Ce,La)/sub y/FeCo/sub 3/Sb/sub 12/,并对化合物的热电性能进行了研究。结果表明,在900 K时,在y=0.1/spl sim/0.3的情况下,填满的角长石化合物(Ce,La)/sub y/FeCo/sub 3/Sb/sub 12/中存在少量Sb。随着Ce和La填充量的增加,化合物的晶格常数和Seebeck系数增大,而导热系数和电导率则大大降低,导热系数在y=0.3时达到最小值;表明镧和铈两种填充离子之间的耦合咔嗒声和不规则分布是导致原子质量变化和晶格畸变产生的附加声子散射的主要原因。Ce/sub 0.1/La/sub 0.2/Fe/sub 1.0/Co/sub 3.0/Sb/sub 12/富Co化合物在773 K时的无因次品质曲线ZT=0.46的最大值。
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引用次数: 0
期刊
ICT 2005. 24th International Conference on Thermoelectrics, 2005.
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