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ICT 2005. 24th International Conference on Thermoelectrics, 2005.最新文献

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Developing PbTe-based superlattice structures with enhanced thermoelectric performance 开发热电性能增强的pbte基超晶格结构
Pub Date : 2005-06-19 DOI: 10.1109/ICT.2005.1519993
J. Caylor, K. Coonley, J. Stuart, S. Nangaoy, T. Colpitts, R. Venkatasubramanian
The fabrication of n-type PbTe/PbTe/sub 0.75/Se/sub 0.25/ structures using a simple evaporation technique has yielded high-quality superlattice films, a significant reduction in lattice thermal conductivity and potentially enhanced thermoelectric device performance, compared to standard PbTeSe alloys. The room temperature lattice thermal conductivity of PbTeSe alloys have been reduced by a factor of two or more using PbTe/PbTeSe superlattices in the cross-plane direction. Using this advantage, we have begun characterizing the cross-plane ZT of PbTe/PbTeSe superlattice devices, including the development of appropriate Ohmic contacts for the PbTe-material system. We will discuss various device process technologies for improved Ohmic contacts. The room-temperature measurement of cross-plane figure-of-merit in n-type PbTe/PbTe/sub 0.75/Se/sub 0.25/ device structure by the transient method will be reported. Also, these results will be combined with temperature dependent measurements of in-plane resistivity and Seebeck coefficient to yield evidence of enhanced thermoelectric performance. The results from similar p-type films, as well as preliminary data on heteroepitaxial films grown on Bi/sub 2/Te/sub 3/ will be discussed.
与标准的PbTeSe合金相比,利用简单的蒸发技术制备n型PbTe/PbTe/sub 0.75/Se/sub 0.25/结构获得了高质量的超晶格薄膜,显著降低了晶格热导率,并有可能提高热电器件的性能。使用PbTe/PbTeSe超晶格在交叉平面方向上,PbTeSe合金的室温晶格导热系数降低了两倍或更多。利用这一优势,我们已经开始表征PbTe/PbTeSe超晶格器件的交叉平面ZT,包括为PbTe材料系统开发适当的欧姆接触。我们将讨论改善欧姆接触的各种器件工艺技术。本文报道了用瞬态法测量n型PbTe/PbTe/sub 0.75/Se/sub 0.25/器件结构的交叉面品质曲线。此外,这些结果将与平面内电阻率和塞贝克系数的温度相关测量相结合,以获得增强热电性能的证据。本文将讨论类似p型薄膜的结果,以及在Bi/sub 2/Te/sub 3/上生长的异质外延薄膜的初步数据。
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引用次数: 2
Thermoelectric properties and phase stability of La/sub 10/S/sub 14/O La/sub 10/S/sub 14/O的热电性能和相稳定性
Pub Date : 2005-06-19 DOI: 10.1109/ICT.2005.1519917
M. Ohta, S. Hirai, H. Kato, H. Asahi
The electrical resistivity, thermopower, thermal conductivity measurements have been made on tetragonal La/sub 10/S/sub 14/O. The electrical resistivity was measured during heating and successive cooling through 300 and 1000 K to investigate the high-temperature phase stability. The measurements were carried out in the vacuum chamber pumped down to 1.0 Pa. The electrical properties of La/sub 10/S/sub 14/O are changed dramatically through heat treatment. As annealing time increases, the electrical resistivity increases abruptly and then decreases gradually. However, it seems that this phase can be stabilized by a small addition of Ti. In the electrical resistivity of La/sub 10/S/sub 14/O with Ti, the cooling curve agrees with heating curve. Moreover, the ZT value increases abruptly with increasing temperature, reaching a value of 0.18 at 1000 K. The improvement with respect to the thermoelectric properties of the La/sub 10/S/sub 14/O is realized by a small addition of Ti.
对La/sub - 10/S/sub - 14/O等四边形材料进行了电阻率、热功率、导热系数的测量。在加热和连续冷却300和1000 K时测量电阻率,以研究高温相稳定性。测量在真空泵降至1.0 Pa的真空室中进行。经过热处理,La/sub - 10/S/sub - 14/O的电学性能发生了显著变化。随着退火时间的延长,电阻率先增大后逐渐减小。然而,这一相似乎可以通过少量的Ti来稳定。在La/sub - 10/S/sub - 14/O与Ti的电阻率中,冷却曲线与加热曲线一致。ZT值随着温度的升高而急剧增加,在1000 K时达到0.18。La/sub - 10/S/sub - 14/O热电性能的改善是通过少量Ti的加入来实现的。
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引用次数: 0
Thermoelectric properties of ZrNiSn based half Heusler compounds 基于ZrNiSn的半Heusler化合物的热电性质
Pub Date : 2005-06-19 DOI: 10.2320/MATERTRANS.47.1453
H. Muta, T. Yamaguchi, K. Kurosaki, S. Yamanaka
The thermoelectric properties of titanium substituted ZrNiSn have been measured from room temperature to 1000 K. The samples were prepared by arc melting followed by spark plasma sintering (SPS) technique. High SPS temperature increased the homogeneity of titanium substituted sample, result at increase of the electrical conductivity without deterioration of the Seebeck coefficient. Zr/sub 0.7/Ti/sub 0.3/NiSn showed higher power factor than pure ZrNiSn, the value reached 4 mW/mK/sup 2/ at 700 K. The SPS temperature had little influence on the thermal conductivity. However, the titanium substituted sample decomposed upon annealing at high temperature. Thus appropriate heat and preparation treatment appeared to be necessary for the samples containing titanium. Highest ZT was obtained for Zr/sub 0.7/Ti/sub 0.3/NiSn, equal to 0.48 at 800 K.
在室温至1000 K范围内测量了钛取代ZrNiSn的热电性能。采用电弧熔炼后火花等离子烧结(SPS)技术制备样品。较高的SPS温度提高了钛取代样品的均匀性,导致电导率提高,但塞贝克系数没有下降。Zr/sub 0.7/Ti/sub 0.3/NiSn的功率因数高于纯ZrNiSn,在700 K时达到4 mW/mK/sup 2/。SPS温度对导热系数影响不大。然而,钛取代的样品在高温退火后分解。因此,对含钛样品进行适当的加热和制备处理似乎是必要的。Zr/sub 0.7/Ti/sub 0.3/NiSn在800 K时ZT最高,为0.48。
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引用次数: 56
Measurement of thermoelectric properties of individual bismuth telluride nanowires 单个碲化铋纳米线热电性能的测量
Pub Date : 2005-06-19 DOI: 10.1109/ICT.2005.1519876
Jianhua Zhou, Chuangui Jin, J. Seol, Xiaoguang Li, Lio Shi
We have measured the thermoelectric properties of electrochemically deposited bismuth telluride (Bi/sub x/Te/sub 1-x/) nanowires with different atomic ratio or x. In this paper, we report the measurement method and the results for an individual nanowire from a batch with x found to be about 0.54. The Seebeck coefficient of the nanowire was found to be -30 /spl mu/V/K at temperature 300 K. The obtained electrical conductivity of the nanowire showed unusually weak temperature dependence, and the value at 300 K was only 5.6% lower than that of bulk Bi/sub 0.485/Te/sub 0.515/ crystal. The thermal conductivity of the nanowires was found to be 44% lower than that of bulk Bi/sub 0.485/Te/sub 0.515/ crystals.
我们测量了不同原子比或x的电化学沉积碲化铋(Bi/sub x/Te/sub 1-x/)纳米线的热电性能。在本文中,我们报告了测量方法和结果,从一批纳米线中发现x约为0.54。在300 K温度下,纳米线的塞贝克系数为-30 /spl mu/V/K。所得纳米线的电导率表现出异常弱的温度依赖性,在300 K时的电导率仅比本体Bi/sub 0.485/Te/sub 0.515/晶体的电导率低5.6%。该纳米线的导热系数比本体Bi/sub 0.485/Te/sub 0.515/晶体的导热系数低44%。
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引用次数: 4
Galvanomagnetic properties of multicomponent solid solutions based on Bi and Sb chalcogenides 基于铋和锑硫属化合物的多组分固溶体的流磁学性质
Pub Date : 2005-06-19 DOI: 10.1109/ICT.2005.1519978
L. N. Lukyanova, V. Kutasov, V. Popov, P. Konstantinov
Galvanomagnetic properties of multicomponent solid solutions of n-Bi/sub 2-x/Sb/sub x/Te/sub 3-y-z/Se/sub y/S/sub z/ composition were studied in weak and intermediate magnetic fields. Components of the effective mass tensor m/sub i//m/sub j/ were determined in the framework of the many-valley energy spectrum model using the isotropic scattering mechanism for a variety of solid solution compositions and electron concentrations. The influence of constant-energy surface parameters on the solid solutions thermoelectric efficiency was analyzed.
研究了n-Bi/sub - 2-x/Sb/sub -x/ Te/sub - 3-y-z/Se/sub -y /S/sub -z/组成的多组分固溶体在弱磁场和中磁场中的电磁特性。利用各向同性散射机制,在多谷能谱模型框架下确定了不同固溶体成分和电子浓度的有效质量张量m/sub i//m/sub j/的分量。分析了恒能表面参数对固溶体热电效率的影响。
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引用次数: 3
Structural features and transport properties of iodine intercalated misfit layer [BiCaO/sub 2/]/sub 2/[CoO/sub 2/]/sub 1.69/ single crystals 碘嵌入错配层[BiCaO/sub 2/]/sub 2/[CoO/sub 2/]/sub 1.69/单晶的结构特征及输运性质
Pub Date : 2005-06-19 DOI: 10.1109/ICT.2005.1519878
E. Guilmeau, M. Pollet, D. Grebille, M. Hervieu, H. Muguerra, R. Cloots, M. Mikami, R. Funahashi
The thermopower and the electrical resistivity of [BiCaO/sub 2/]/sub 2/[CoO/sub 2/]/sub 1.69/ and corresponding iodine intercalated single crystals have been measured. Upon intercalation, the thermopower is drastically decreased, indicating that there is a hole doping by charge transfer from the intercalated iodine layer to the hexagonal CoO/sub 2/ layer. The resistivity is increased due to stacking faults and disordered structures. Structural analyses confirmed the stacking scheme along the c direction, with the localisation of iodine between the [BiO] double layers. The effect of intercalation on the thermoelectric properties suggested discussions from the view point of hole doping and nano-block layer coupling effect.
测定了[BiCaO/sub 2/]/sub 2/[CoO/sub 2/]/sub 1.69/和相应的碘插层单晶的热功率和电阻率。插入后,热功率急剧下降,表明从插入碘层到六方CoO/sub 2/层发生了电荷转移的空穴掺杂。由于层错和结构紊乱,电阻率增加。结构分析证实了沿c方向的堆叠方案,碘定位在[BiO]双层之间。嵌层对热电性能的影响建议从空穴掺杂和纳米块层耦合效应的角度进行讨论。
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引用次数: 0
Thermoelectric properties of sintered (Mn/sub y/Ni/sub 1-y/)/sub x/Fe/sub 3-x/O/sub 4/ 烧结(Mn/sub -y/ Ni/sub - 1-y/)/sub x/Fe/sub 3-x/O/sub 4/的热电性能
Pub Date : 2005-06-19 DOI: 10.1109/ICT.2005.1519884
N. Koseki, K. Machida, K. Yamamoto, Y. Oikawa, C. Kim, H. Ozaki
Effects of Mn-Ni co-substitution were investigated on the thermoelectric properties of sintered magnetite (Fe/sub 3/O/sub 4/). Following the previous study, investigations were focused on the x dependence for 0/spl les/x/spl les/0.4 with y=2/3, and y dependence for 0/spl les/y/spl les/1 with x=0.2, in (Mn/sub y/Ni/sub 1-y/)/sub x/Fe/sub 3-x/O/sub 4/. Thermoelectric power factor manifested a maximum near x=0.2 and y=2/3, exceeding that of magnetite, due to a remarkable behavior of electrical resistivity in the x and y dependences. This behavior was shown to originate from that of the mobility in the framework of analysis by small-polaron hopping model. In this model, the hopping energy was shown to change at the Neel temperature.
研究了Mn-Ni共取代对烧结磁铁矿(Fe/sub 3/O/sub 4/)热电性能的影响。在此基础上,进一步研究了0/spl les/x/spl les/0.4在y=2/3时的x依赖性,以及0/spl les/y/spl les/1在x=0.2时的y依赖性,分别为(Mn/sub y/Ni/sub 1-y/)/sub x/Fe/sub 3-x/O/sub 4/。热电功率因数在x=0.2和y=2/3附近表现出最大值,超过磁铁矿,这是由于电阻率在x和y依赖关系中表现出显著的行为。在小极化子跳变模型的分析框架下,证明了这种行为源于迁移率的变化。在该模型中,跳跃能在尼尔温度下发生变化。
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引用次数: 0
Synchrotron X-ray structure refinement of Zn/sub 4/Sb/sub 3/ Zn/sub 4/Sb/sub 3/的同步加速器x射线结构精化
Pub Date : 2005-06-19 DOI: 10.1109/ICT.2005.1519950
G. J. Snyder, P. Stephens, S. Haile
The structure of the thermoelectric Zn/sub 4/Sb/sub 3/ is refined using synchrotron X-ray powder diffraction data collected at wavelengths both near to and relatively far from the Zn adsorption edge. In agreement with earlier studies, the compound crystallized in a trigonal structure, space group R~3c with a = 12.2406(3)/spl Aring/, c = 12.4361(3)/spl Aring/ at room temperature, and there are three primary sites in the asymmetric unit. Each site contains only one atomic species, in contrast to many previous studies. The primary Zn (36f) site is slightly less than fully occupied, whereas the two Sb sites (18e and 12c) are fully occupied. In addition, several Zn interstitial sites (36f) with low occupancies (>5%) are also present. The results are in agreement with the model proposed by Snyder, as opposed to that originally proposed by Mayer and more recently by Mozharivskyj. The refined site occupancies yield an overall stoichiometry which is consistent with that measured experimentally. The presence of interstitial Zn can be understood in terms of charge balance requirements and is likely responsible for the exceptionally low thermal conductivity of this material.
利用同步加速器x射线粉末衍射数据,在Zn吸附边附近和相对较远的波长处对热电Zn/sub 4/Sb/sub 3/的结构进行了细化。与前人的研究一致,化合物在室温下结晶为三角形结构,空间群R~3c, a = 12.2406(3)/spl Aring/, c = 12.4361(3)/spl Aring/,在不对称单元中有三个主位。与之前的许多研究不同,每个位点只包含一种原子。主Zn (36f)位点略小于完全占据,而两个Sb位点(18e和12c)则完全占据。此外,还存在几个低占位率(>5%)的Zn间隙位(36f)。结果与Snyder提出的模型一致,而不是最初由Mayer和最近由Mozharivskyj提出的模型。精确的位置占用量产生了与实验测量一致的总体化学计量。间隙锌的存在可以从电荷平衡要求的角度来理解,并且可能是这种材料异常低导热率的原因。
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引用次数: 2
Effect of rare earth doping on the thermoelectric and electrical transport properties of the transition metal pentatelluride HfTe/sub 5/ 稀土掺杂对过渡金属五碲化物HfTe/ sub5 /热电输运性质的影响
Pub Date : 2005-06-19 DOI: 10.1109/ICT.2005.1519882
N. Lowhorn, T. Tritt, E. Abbott, J. Kolis
The transition metal pentatellurides HfTe/sub 5/ and ZrTe/sub 5/ have been observed to possess high thermoelectric power factors and anomalous electrical transport behavior. The temperature dependence of the resistivity is semimetallic except for a large resistive peak as a function of temperature at around 75 K for HfTe/sub 5/ and 145 K for ZrTe/sub 5/. At a temperature corresponding to this peak, the thermopower crosses zero as it moves from large positive values to large negative values. Previous doping studies have shown profound and varied effects on the anomalous transport. In this study we investigate the effect on the electrical resistivity, thermopower, and magnetoresistance of doping HfTe/sub 5/ with rare-earth elements. Doping with rare-earth elements of increasing atomic number leads to a systematic suppression of the anomalous transport behavior and large magnetoresistive effect observed in the parent compound. Rare-earth doping also leads to an enhancement of the thermoelectric power factor over previously studied pentatellurides. For nominal Hf/sub 0.75/Nd/sub 0.25/Te/sub 5/ and Hf/sub 0.75/Sm/sub 0.25/Te/sub 5/, values more than a factor of 2 larger than that of the commonly used thermoelectric material Bi/sub 2/Te/sub 3/ were observed.
过渡金属五碲化物HfTe/sub - 5/和ZrTe/sub - 5/具有较高的热电功率因子和异常的电输运行为。除了HfTe/sub 5/在75 K左右和ZrTe/sub 5/在145 K左右有一个大的电阻峰作为温度的函数外,电阻率的温度依赖性是半金属的。在与这个峰值相对应的温度下,当热功率从较大的正值移动到较大的负值时,热功率穿过零。以往的研究表明,掺杂对异常输运的影响是深刻而多样的。在本研究中,我们研究了稀土元素对HfTe/ sub5 /的电阻率、热功率和磁阻的影响。随着原子序数的增加,稀土元素的掺入抑制了母体化合物的异常输运行为和较大的磁阻效应。稀土掺杂也导致热电功率因数比先前研究的五碲化物增强。对于标称Hf/sub 0.75/Nd/sub 0.25/Te/sub 5/和Hf/sub 0.75/Sm/sub 0.25/Te/sub 5/,观察到的值比常用热电材料Bi/sub 2/Te/sub 3/的值大2倍以上。
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引用次数: 2
Cooling performance of silicon-based thermoelectric device on high power LED 大功率LED上硅基热电器件的散热性能
Pub Date : 2005-06-19 DOI: 10.1109/ICT.2005.1519885
Jen-Hau Cheng, Chun-Kai Liu, Y. Chao, R. Tain
In this paper, a new thermal management application of silicon-based thermoelectric (TE) device on high power LED is unveiled. The silicon-based TE device is fabricated by the microfabrication and flip-chip assembly process. Thermal images photographed by infrared camera demonstrate the cooling function of the silicon-based TE devices. Because the LED chip is encapsulated in a package, the junction temperature of the LED chip cannot be measured directly. An electrical-thermal conversion method is used to measure the junction temperature of the high power LED. The result shows that the silicon-based thermoelectric device can effectively reduce the thermal resistance of the high power LED.
本文介绍了硅基热电器件在大功率LED上的热管理新应用。硅基TE器件采用微细加工和倒装组装工艺制备。红外热像仪拍摄的热图像证明了硅基TE器件的冷却功能。由于LED芯片封装在封装中,无法直接测量LED芯片的结温。采用电-热转换法测量大功率LED的结温。结果表明,硅基热电器件可以有效地降低大功率LED的热阻。
{"title":"Cooling performance of silicon-based thermoelectric device on high power LED","authors":"Jen-Hau Cheng, Chun-Kai Liu, Y. Chao, R. Tain","doi":"10.1109/ICT.2005.1519885","DOIUrl":"https://doi.org/10.1109/ICT.2005.1519885","url":null,"abstract":"In this paper, a new thermal management application of silicon-based thermoelectric (TE) device on high power LED is unveiled. The silicon-based TE device is fabricated by the microfabrication and flip-chip assembly process. Thermal images photographed by infrared camera demonstrate the cooling function of the silicon-based TE devices. Because the LED chip is encapsulated in a package, the junction temperature of the LED chip cannot be measured directly. An electrical-thermal conversion method is used to measure the junction temperature of the high power LED. The result shows that the silicon-based thermoelectric device can effectively reduce the thermal resistance of the high power LED.","PeriodicalId":422400,"journal":{"name":"ICT 2005. 24th International Conference on Thermoelectrics, 2005.","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132569301","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 83
期刊
ICT 2005. 24th International Conference on Thermoelectrics, 2005.
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