Prediction of the shape of solder joint has drawn special attention in the development of electronic packaging for it’s practical engineering application. Many solder joint models have been developed based on energy minimization principle or analytical method. These methods are extensively utilized to the shape design of solder joint. However, one would find It is important to find a suitable method in real case application. In this study, numerical methods used to predict the shape of solder joint are investigated and compared. The change of geometric shape with respect to different parameters of solder joint are also discussed in this paper. The influence of the geometric parameters such as volumes of solder joint, package weight, contact angles, pad sizes, solder surface tension, and gravity forces to the shape of solder joint are investigated. Results presented in this study can be used to determined the optimal balanced stand-off height of Single Ball Module (SBM) or Multiple Ball Module (MBM) solder joint models.
{"title":"Prediction of the Solder Joint Configuration Under Various Geometric Parameters","authors":"Wei-Long Chen, B. Shyu, K. Chiang","doi":"10.1115/imece1997-1116","DOIUrl":"https://doi.org/10.1115/imece1997-1116","url":null,"abstract":"\u0000 Prediction of the shape of solder joint has drawn special attention in the development of electronic packaging for it’s practical engineering application. Many solder joint models have been developed based on energy minimization principle or analytical method. These methods are extensively utilized to the shape design of solder joint. However, one would find It is important to find a suitable method in real case application. In this study, numerical methods used to predict the shape of solder joint are investigated and compared. The change of geometric shape with respect to different parameters of solder joint are also discussed in this paper. The influence of the geometric parameters such as volumes of solder joint, package weight, contact angles, pad sizes, solder surface tension, and gravity forces to the shape of solder joint are investigated. Results presented in this study can be used to determined the optimal balanced stand-off height of Single Ball Module (SBM) or Multiple Ball Module (MBM) solder joint models.","PeriodicalId":432053,"journal":{"name":"Manufacturing Science and Engineering: Volume 1","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131342950","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This paper presents the application of a laser displacement meter for direct multi-purpose sensing of milling tool conditions. Using a laser displacement meter, a laser beam is projected onto the cutting tool and subsequently reflected. The intensity as well as the angle of the reflected beam are measured. The signals are interpreted for identification of tool geometry, tool whirling, or vibration. Signal processing and analysis depend on the application. A prototype system has been developed to demonstrate the feasibility of various applications, namely, (1) tool setting evaluation, (2) in-process measurement of milling cutter geometry and detection of tool failure, (3) continuous monitoring of milling cutter deterioration, (4) detection and measurement of chatter in milling, (5) measurement of milling tool bending and (6) thermal expansion.
{"title":"A Multi-Purpose Laser Sensor for Cutting Tools","authors":"O. Ryabov, K. Mori, N. Kasashima","doi":"10.1115/imece1997-1069","DOIUrl":"https://doi.org/10.1115/imece1997-1069","url":null,"abstract":"\u0000 This paper presents the application of a laser displacement meter for direct multi-purpose sensing of milling tool conditions. Using a laser displacement meter, a laser beam is projected onto the cutting tool and subsequently reflected. The intensity as well as the angle of the reflected beam are measured. The signals are interpreted for identification of tool geometry, tool whirling, or vibration. Signal processing and analysis depend on the application. A prototype system has been developed to demonstrate the feasibility of various applications, namely, (1) tool setting evaluation, (2) in-process measurement of milling cutter geometry and detection of tool failure, (3) continuous monitoring of milling cutter deterioration, (4) detection and measurement of chatter in milling, (5) measurement of milling tool bending and (6) thermal expansion.","PeriodicalId":432053,"journal":{"name":"Manufacturing Science and Engineering: Volume 1","volume":"87 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131471946","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Two product-oriented manufacturing courses, Printed Wire Board Manufacturing and Processes for Electronic Manufacturing have been developed. The mode of delivery is original and unique, pairing manufacturing experts from industry and university faculty to develop video based instructional materials based on real industrial operations and processes. The final product is a new generation of “text books” in the form of video modules for the rapid dissemination of dynamic types of information as encountered in manufacturing. The goal is to educate both defense and commercial sectors to current practices in packaging manufacturing as well as those students who will make up the next work force.
{"title":"Video Based Manufacturing Courses for Electronics","authors":"J. Fillo, C. Sahay, K. Srihari","doi":"10.1115/imece1997-1126","DOIUrl":"https://doi.org/10.1115/imece1997-1126","url":null,"abstract":"\u0000 Two product-oriented manufacturing courses, Printed Wire Board Manufacturing and Processes for Electronic Manufacturing have been developed. The mode of delivery is original and unique, pairing manufacturing experts from industry and university faculty to develop video based instructional materials based on real industrial operations and processes. The final product is a new generation of “text books” in the form of video modules for the rapid dissemination of dynamic types of information as encountered in manufacturing. The goal is to educate both defense and commercial sectors to current practices in packaging manufacturing as well as those students who will make up the next work force.","PeriodicalId":432053,"journal":{"name":"Manufacturing Science and Engineering: Volume 1","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131560733","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Prediction of machining errors and compensation for these errors during the tool path generation stage can improve the product quality significantly. A traditional approach would be machining a few parts, followed by a measuring process to estimate the errors, and finally using a scheme to compensate for the errors. In this paper two approaches are used to avoid trial runs. In the first approach prediction of the deflection of the cutting tool (based on modelling of the cutting forces) at certain points distributed on the design surface is calculated. An inverse operator is then applied to these errors to calculate a compensation vector at each point. A variable offset geometrical model was developed that uses these vectors to build the compensated surface. A detailed simulation analysis for the proposed compensation scheme is presented for different surface shapes in both up and down milling. The second approach is based on improving the roughing strategy by leaving a uniform thickness layer during the roughing phase on top of the finished surface. This leads to more uniform distribution of the cutting forces that may improve the accuracy of the finished surface.
{"title":"Improving the Accuracy of Machined Parametric Surfaces Using Cutting Force Synthesis and Surface Offset Techniques","authors":"M. Gadalla, W. ElMaraghy","doi":"10.1115/imece1997-1091","DOIUrl":"https://doi.org/10.1115/imece1997-1091","url":null,"abstract":"\u0000 Prediction of machining errors and compensation for these errors during the tool path generation stage can improve the product quality significantly. A traditional approach would be machining a few parts, followed by a measuring process to estimate the errors, and finally using a scheme to compensate for the errors. In this paper two approaches are used to avoid trial runs. In the first approach prediction of the deflection of the cutting tool (based on modelling of the cutting forces) at certain points distributed on the design surface is calculated. An inverse operator is then applied to these errors to calculate a compensation vector at each point. A variable offset geometrical model was developed that uses these vectors to build the compensated surface. A detailed simulation analysis for the proposed compensation scheme is presented for different surface shapes in both up and down milling. The second approach is based on improving the roughing strategy by leaving a uniform thickness layer during the roughing phase on top of the finished surface. This leads to more uniform distribution of the cutting forces that may improve the accuracy of the finished surface.","PeriodicalId":432053,"journal":{"name":"Manufacturing Science and Engineering: Volume 1","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123789714","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
A new technique for improving the accuracy of microscopic laser interferometry system for precision surface measurement is presented. Laser interferometry creates a fringe pattern which contains information about the surface texture of the specimen and the method provides nanometer resolution for height axis of the reconstructed surface. The resolutions of the lateral axes of the surface, however, relies only on optical magnification capability of the measurement system and this often results in poor resolution. This paper presents a new technique to improve the interferometric system resolution in lateral axes. This method is based on an integrated scanning motion of the specimen and the obtained multiple sets of scanned data are processed to improve the lateral axes resolution. Computer simulations show that the proposed method can be an effective approach to improve the resolution in the lateral axes for commonly used laser interferometric system. It provides a new principle for the design of modern laser interferometric measurement instruments.
{"title":"Improving the Accuracy of Microscopic Laser Interferometry System for Precision Surface Measurement by Integrated Scanning Motions","authors":"K. Moon, Yiding Wang","doi":"10.1115/imece1997-1094","DOIUrl":"https://doi.org/10.1115/imece1997-1094","url":null,"abstract":"\u0000 A new technique for improving the accuracy of microscopic laser interferometry system for precision surface measurement is presented. Laser interferometry creates a fringe pattern which contains information about the surface texture of the specimen and the method provides nanometer resolution for height axis of the reconstructed surface. The resolutions of the lateral axes of the surface, however, relies only on optical magnification capability of the measurement system and this often results in poor resolution. This paper presents a new technique to improve the interferometric system resolution in lateral axes. This method is based on an integrated scanning motion of the specimen and the obtained multiple sets of scanned data are processed to improve the lateral axes resolution. Computer simulations show that the proposed method can be an effective approach to improve the resolution in the lateral axes for commonly used laser interferometric system. It provides a new principle for the design of modern laser interferometric measurement instruments.","PeriodicalId":432053,"journal":{"name":"Manufacturing Science and Engineering: Volume 1","volume":"190 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122111617","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The compressor and turbine blades used in jet aircraft engines wear down due to tip rubbing against the outer shroud. To restore the original shape, these blades must be either replaced, or, more economically, refurbished. Refurbishment of blades is accomplished by applying a weld bead to the tip, followed by removal of excess material. This paper describes an overview of an integrated system for accomplishing the material removal step. The separate tasks of digitizing the blade to obtain original shape information, automatically calculating the tool paths, and machining the blades, are combined into a turnkey system implemented using a five-axis machine tool and attached personal computer. Experimental results demonstrate the capability of the system for sample blade shapes.
{"title":"Integrated Digitizing, Path Planning, and Five-Axis Machining for the Refurbishment of Compressor and Turbine Blades","authors":"R. Fleisig, A. Spence","doi":"10.1115/imece1997-1072","DOIUrl":"https://doi.org/10.1115/imece1997-1072","url":null,"abstract":"\u0000 The compressor and turbine blades used in jet aircraft engines wear down due to tip rubbing against the outer shroud. To restore the original shape, these blades must be either replaced, or, more economically, refurbished. Refurbishment of blades is accomplished by applying a weld bead to the tip, followed by removal of excess material. This paper describes an overview of an integrated system for accomplishing the material removal step. The separate tasks of digitizing the blade to obtain original shape information, automatically calculating the tool paths, and machining the blades, are combined into a turnkey system implemented using a five-axis machine tool and attached personal computer. Experimental results demonstrate the capability of the system for sample blade shapes.","PeriodicalId":432053,"journal":{"name":"Manufacturing Science and Engineering: Volume 1","volume":"77 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122147747","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
P. Tsao, L. C. Chang, T. C. Chen, C. Haung, C. Z. Chen
An assembly test chip (ATC), consisting of varieties of test structures, had been utilized to monitor the package integrity of SOJ lead-on-chip (LOC) packages after various reliability tests. Two different types of epoxy molding compounds, namely biphenyl and EOCN epoxies, were chosen to investigate their effects on package’s reliability. After the reliability tests, silicon chip crack was observed in three test samples due to the existence of a large chip backside chipping (−120 μm). Qualitative study about this failure mechanism was carried out by a finite element analysis, and it was found that, due to the higher flexural modulus and CTE of the biphenyl epoxy, the thermally induced stresses developed in the chip encapsulated by this epoxy during reliability tests were more likely to cause the crack propagation in the silicon chip than those induced by using EOCN type epoxy.
{"title":"Investigation of the Lead-On-Chip Package’s Reliability","authors":"P. Tsao, L. C. Chang, T. C. Chen, C. Haung, C. Z. Chen","doi":"10.1115/1.2792613","DOIUrl":"https://doi.org/10.1115/1.2792613","url":null,"abstract":"\u0000 An assembly test chip (ATC), consisting of varieties of test structures, had been utilized to monitor the package integrity of SOJ lead-on-chip (LOC) packages after various reliability tests. Two different types of epoxy molding compounds, namely biphenyl and EOCN epoxies, were chosen to investigate their effects on package’s reliability. After the reliability tests, silicon chip crack was observed in three test samples due to the existence of a large chip backside chipping (−120 μm). Qualitative study about this failure mechanism was carried out by a finite element analysis, and it was found that, due to the higher flexural modulus and CTE of the biphenyl epoxy, the thermally induced stresses developed in the chip encapsulated by this epoxy during reliability tests were more likely to cause the crack propagation in the silicon chip than those induced by using EOCN type epoxy.","PeriodicalId":432053,"journal":{"name":"Manufacturing Science and Engineering: Volume 1","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127772593","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Monitoring of machining processes by the use of acoustic emission (AE) is a common technique. But the relation between the measured AE signal and the machining process is often not obvious. Here we present a method for the determination of the transfer function of the complete signal path between AE source and monitoring device. The signal acquisition system including the AE sensor can thus be “calibrated”, which allows the scaling of the measured signal in physically interpretable units. The method is specially adapted to the situation found in monitoring of machining, where the sensor position is fixed and the signal path is therefore kept constant.
{"title":"Application Specific Calibration of AE Sensors for Machining Monitoring","authors":"W. Hundt, C. Scheer","doi":"10.1115/imece1997-1076","DOIUrl":"https://doi.org/10.1115/imece1997-1076","url":null,"abstract":"\u0000 Monitoring of machining processes by the use of acoustic emission (AE) is a common technique. But the relation between the measured AE signal and the machining process is often not obvious. Here we present a method for the determination of the transfer function of the complete signal path between AE source and monitoring device. The signal acquisition system including the AE sensor can thus be “calibrated”, which allows the scaling of the measured signal in physically interpretable units. The method is specially adapted to the situation found in monitoring of machining, where the sensor position is fixed and the signal path is therefore kept constant.","PeriodicalId":432053,"journal":{"name":"Manufacturing Science and Engineering: Volume 1","volume":"93 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116915291","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
In this paper, a modified shadow moiré technique is applied to measure surface topology of wafers. When a wafer is sliced, either by an inner-diameter (ID) saw or wiresaw, the surface needs to be measured to ensure the consistency of quality. Two important characteristics of the wafer surface measurements are the warpage and total thickness variation (TTV). Currently, the most commonly used method of wafer measurement employs a pair of capacitive measuring probes which sample points on the surface of a rotating wafer to obtain the contours of surface. Many sampling points on the surface are needed for more accurate measurements; however, this will require more time for the inspection of wafers during production. An innovative alternative for full-field, whole-wafer measurement is developed using a laser light source and the modified shadow moiré technique. This methodology enables one to examine the whole wafer surface quickly and simultaneously. In this study, a 1000 lines/inch reference grating is employed as the standard to create a shadow moiré pattern. In addition, the Talbot effect is utilized to adjust the gap, or the so-called Talbot distance, between the grating and the wafer surface such that a fringe pattern of good quality can be obtained. By using the phase shifting technique, the resolution (or sensitivity) can be enhanced by two order of magnitude. The results show that not only the full view of whole wafer surface can be obtained, but also enhanced surface resolution and accuracy can be realized. In addition, warpage due to excessive residual stresses can be observed distinctly with fringe patterns because of the global and interconnected moiré fringes. This process is faster, especially when dealing with wafers with diameter larger than 200mm (8″). Experimental results of both 200mm single crystalline and 100 × 90mm polycrystalline wafers are presented. The system can also be fully automated to become an on-line inspection tool.
{"title":"Wafer Surface Measurements Using Shadow Moiré With Talbot Effect","authors":"S. Wu, S. Wei, I. Kao, F. Chiang","doi":"10.1115/imece1997-1112","DOIUrl":"https://doi.org/10.1115/imece1997-1112","url":null,"abstract":"\u0000 In this paper, a modified shadow moiré technique is applied to measure surface topology of wafers. When a wafer is sliced, either by an inner-diameter (ID) saw or wiresaw, the surface needs to be measured to ensure the consistency of quality. Two important characteristics of the wafer surface measurements are the warpage and total thickness variation (TTV). Currently, the most commonly used method of wafer measurement employs a pair of capacitive measuring probes which sample points on the surface of a rotating wafer to obtain the contours of surface. Many sampling points on the surface are needed for more accurate measurements; however, this will require more time for the inspection of wafers during production. An innovative alternative for full-field, whole-wafer measurement is developed using a laser light source and the modified shadow moiré technique. This methodology enables one to examine the whole wafer surface quickly and simultaneously. In this study, a 1000 lines/inch reference grating is employed as the standard to create a shadow moiré pattern. In addition, the Talbot effect is utilized to adjust the gap, or the so-called Talbot distance, between the grating and the wafer surface such that a fringe pattern of good quality can be obtained. By using the phase shifting technique, the resolution (or sensitivity) can be enhanced by two order of magnitude. The results show that not only the full view of whole wafer surface can be obtained, but also enhanced surface resolution and accuracy can be realized. In addition, warpage due to excessive residual stresses can be observed distinctly with fringe patterns because of the global and interconnected moiré fringes. This process is faster, especially when dealing with wafers with diameter larger than 200mm (8″). Experimental results of both 200mm single crystalline and 100 × 90mm polycrystalline wafers are presented. The system can also be fully automated to become an on-line inspection tool.","PeriodicalId":432053,"journal":{"name":"Manufacturing Science and Engineering: Volume 1","volume":"145 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126934802","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
In this paper, a non-linear finite element framework was established for processing mechanics modeling of electronic packaging assemblies and layered manufacturing. In particular, topological change was considered in order to model the sequential steps during a typical IC package assembly. Geometric and material nonlinearity, temperature-dependent material properties were considered. Different stress-free temperatures for different elements in the same model were used to simulate practical manufacturing process-induced thermal residual stress field in the chip assembly. As comparison, two FEM models (Processing Model and Non-Processing Model) of a encapsulated IC package considered, associated with different processing schemes, were analyzed. From the finite element analysis, it is found that due to the coefficient of thermal expansion (CTE) mismatch between the solder and silicon chip, the substrate and the solder, there exist very high stress fields near these interfaces when the encapsulated IC package is cooled down to room temperature after processing for these two models. But in contrast with the stresses near the edges of all interfaces obtained from Non-Processing Model, the stresses near the edges of all interfaces corresponding to Processing Model are generally higher than those obtained from Non-Processing Model. In particular, the Von Mises stress at the edge of silicon chip/solder interface obtained from Processing Model is nearly 50% higher than that obtained from Non-Processing Model. It is shown that Processing Model which is based on the FEM framework established in this paper can more realistically simulate a series of practical manufacturing processes in the chip assembly, whereas a larger error can be caused by using Non-Processing Model in the analysis of process-induced residual stress field in the packaging assemblies due to the negligence of the bonding process during cooling from 250° C to 160° C.
{"title":"Sequential Processing Mechanics Modeling for a Model IC Package","authors":"Jianjun Wang, Sheng Liu","doi":"10.1109/3476.650966","DOIUrl":"https://doi.org/10.1109/3476.650966","url":null,"abstract":"\u0000 In this paper, a non-linear finite element framework was established for processing mechanics modeling of electronic packaging assemblies and layered manufacturing. In particular, topological change was considered in order to model the sequential steps during a typical IC package assembly. Geometric and material nonlinearity, temperature-dependent material properties were considered. Different stress-free temperatures for different elements in the same model were used to simulate practical manufacturing process-induced thermal residual stress field in the chip assembly. As comparison, two FEM models (Processing Model and Non-Processing Model) of a encapsulated IC package considered, associated with different processing schemes, were analyzed. From the finite element analysis, it is found that due to the coefficient of thermal expansion (CTE) mismatch between the solder and silicon chip, the substrate and the solder, there exist very high stress fields near these interfaces when the encapsulated IC package is cooled down to room temperature after processing for these two models. But in contrast with the stresses near the edges of all interfaces obtained from Non-Processing Model, the stresses near the edges of all interfaces corresponding to Processing Model are generally higher than those obtained from Non-Processing Model. In particular, the Von Mises stress at the edge of silicon chip/solder interface obtained from Processing Model is nearly 50% higher than that obtained from Non-Processing Model. It is shown that Processing Model which is based on the FEM framework established in this paper can more realistically simulate a series of practical manufacturing processes in the chip assembly, whereas a larger error can be caused by using Non-Processing Model in the analysis of process-induced residual stress field in the packaging assemblies due to the negligence of the bonding process during cooling from 250° C to 160° C.","PeriodicalId":432053,"journal":{"name":"Manufacturing Science and Engineering: Volume 1","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121680492","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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