首页 > 最新文献

Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96最新文献

英文 中文
Dense semiconductor-insulator nanocomposites for navy thermoelectric applications 海军热电应用的致密半导体绝缘体纳米复合材料
Pub Date : 1996-03-26 DOI: 10.1109/ICT.1996.553514
D. Demske
This work is directed at the fabrication and optical characterization of anisotropic semiconductor composites with improved thermoelectric properties. Specifically, the quest is to dramatically improve the thermoelectric figure-of-merit, ZT, with an emphasis on the effects of "nanoconfinement", and on the crystallographic properties which provide an increase in the electrical-to-thermal conductivity ratio. Current work entails the fabrication of force-oriented nanostructural confinement of Bismuth (Bi) and Bismuth Telluride (Bi/sub 2/Te/sub 3/).
这项工作是针对具有改进热电性能的各向异性半导体复合材料的制造和光学表征。具体来说,我们的目标是显著提高热电性能,重点是“纳米限制”的影响,以及晶体学性质,从而提高电导热比。目前的工作需要制造力取向的铋(Bi)和碲化铋(Bi/sub 2/Te/sub 3/)的纳米结构约束。
{"title":"Dense semiconductor-insulator nanocomposites for navy thermoelectric applications","authors":"D. Demske","doi":"10.1109/ICT.1996.553514","DOIUrl":"https://doi.org/10.1109/ICT.1996.553514","url":null,"abstract":"This work is directed at the fabrication and optical characterization of anisotropic semiconductor composites with improved thermoelectric properties. Specifically, the quest is to dramatically improve the thermoelectric figure-of-merit, ZT, with an emphasis on the effects of \"nanoconfinement\", and on the crystallographic properties which provide an increase in the electrical-to-thermal conductivity ratio. Current work entails the fabrication of force-oriented nanostructural confinement of Bismuth (Bi) and Bismuth Telluride (Bi/sub 2/Te/sub 3/).","PeriodicalId":447328,"journal":{"name":"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"1996-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125886888","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
TiNiSn: a gateway to the (1,1,1) intermetallic compounds TiNiSn:通向(1,1,1)金属间化合物的通道
B. Cook, J. Harringa, Z. Tan, W. Jesser
Recent awareness of the transport properties of Skutterudite pnictides has stimulated an interest in numerous other intermetallic compounds having a gap in the density of states at the Fermi level including the MNiSn compounds where M=(Ti, Zr, Hf). These intermetallic 'half-Heusler' compounds are characterized by high Seebeck coefficients (-150 to -300 /spl mu/V/deg.) and reasonable carrier mobilities (30 to 50 cm/sup 2//V-s) at room temperature which make them attractive candidates for intermediate temperature thermoelectric applications. Samples of TiNiSn were prepared by arc melting and homogenized by heat treatment. The temperature dependence of the electrical resistivity, Seebeck coefficient, and thermal diffusivity of these samples was characterized between 22/spl deg/C and 900/spl deg/C. The electrical resistivity and thermopower both decrease with temperature although the resistivity decreases at a faster rate. Electrical power factors in excess of 25 /spl mu/W/cm-/spl deg/C/sup 2/ were observed in nearly single phase alloys within a 300 to 600/spl deg/C temperature range. A brief survey of other selected ternary intermetallic compounds is also presented.
最近,人们对角钨矿化合物输运性质的认识激发了人们对许多其他在费米能级上具有态密度缺口的金属间化合物的兴趣,包括M=(Ti, Zr, Hf)的MNiSn化合物。这些金属间“半赫斯勒”化合物具有高塞贝克系数(-150至-300 /spl mu/V/℃)和室温下合理的载流子迁移率(30至50 cm/sup 2/ V-s)的特点,这使它们成为中温热电应用的有吸引力的候选者。采用电弧熔炼法制备TiNiSn样品,并对样品进行热处理均匀化。这些样品的电阻率、塞贝克系数和热扩散系数的温度依赖性在22 ~ 900/spl℃之间。电阻率和热功率均随温度的升高而降低,但电阻率降低的速度较快。在300 ~ 600 spl℃温度范围内,几乎单相合金的电功率因数超过25 /spl mu/W/cm-/spl℃/sup 2/。简要介绍了其他选定的三元金属间化合物。
{"title":"TiNiSn: a gateway to the (1,1,1) intermetallic compounds","authors":"B. Cook, J. Harringa, Z. Tan, W. Jesser","doi":"10.2172/244657","DOIUrl":"https://doi.org/10.2172/244657","url":null,"abstract":"Recent awareness of the transport properties of Skutterudite pnictides has stimulated an interest in numerous other intermetallic compounds having a gap in the density of states at the Fermi level including the MNiSn compounds where M=(Ti, Zr, Hf). These intermetallic 'half-Heusler' compounds are characterized by high Seebeck coefficients (-150 to -300 /spl mu/V/deg.) and reasonable carrier mobilities (30 to 50 cm/sup 2//V-s) at room temperature which make them attractive candidates for intermediate temperature thermoelectric applications. Samples of TiNiSn were prepared by arc melting and homogenized by heat treatment. The temperature dependence of the electrical resistivity, Seebeck coefficient, and thermal diffusivity of these samples was characterized between 22/spl deg/C and 900/spl deg/C. The electrical resistivity and thermopower both decrease with temperature although the resistivity decreases at a faster rate. Electrical power factors in excess of 25 /spl mu/W/cm-/spl deg/C/sup 2/ were observed in nearly single phase alloys within a 300 to 600/spl deg/C temperature range. A brief survey of other selected ternary intermetallic compounds is also presented.","PeriodicalId":447328,"journal":{"name":"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"1996-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126127101","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 17
Low temperature MOCVD growth of V/VI materials via a Me3SiNMe2 elimination reaction 通过Me3SiNMe2消除反应生长V/VI材料的低温MOCVD
Pub Date : 1996-03-26 DOI: 10.1109/ICT.1996.553521
T. Groshens, R. Gedridge, R. Scheri, T. Cole
The reactive precursors M(NMe/sub 2/)/sub 3/ (M=Sb, Bi) and (Me/sub 1/Si)/sub 2/Te were used to deposit films of M/sub 2/Te/sub 3/ (M=Sb, Bi) on Si(111) cut 4/spl deg/ off-axis, GaAs(100), and Kapton substrates between 25/spl deg/C and 150/spl deg/C in a low pressure MOCVD reactor. The film growth process is a novel N,N-dimethylamino-trimethylsilane (Me/sub 3/SiNMe/sub 2/) elimination reaction and not pyrolysis reactions employed in conventional MOCVD techniques. X-ray diffraction data show the crystalline quality and orientation of the resulting polycrystalline films were dependent on the substrate structure and growth temperature. Amorphous films were deposited below 50/spl deg/C. Films deposited at 75/spl deg/C for Sb/sub 2/Te/sub 3/ and 125/spl deg/C for Bi/sub 2/Te/sub 3/ were highly oriented with the (015) reflection plane parallel to the substrate surface. Films of Sb/sub 2/Te/sub 3/ deposited at 150/spl deg/C were highly oriented with the [00l] reflection planes parallel to the substrate surface. The electrical properties and composition of Bi/sub 2/Te/sub 3/ films deposited at 125/spl deg/C on Kapton were independent of the V/VI precursor ratio used. Variation in the composition of a Sb/sub x/Bi/sub 2-x/Te/sub 3/ ternary film across the susceptor was observed due to differences in the reaction kinetics for formation of Sb/sub 2/Te/sub 3/ and Bi/sub 2/Te/sub 3/. This unique deposition reaction provides an alternative route to prepare group V chalcogenide materials which have potential applications in solar cells, reversible optical storage, and thermoelectrics.
利用反应前驱体M(NMe/sub 2/)/sub 3/ (M=Sb, Bi)和(Me/sub 1/Si)/sub 2/Te分别在Si(111)切割4/spl度/离轴、GaAs(100)和Kapton衬底(25/spl度/C ~ 150/spl度/C)上沉积M/sub 2/Te/sub 3/ (M=Sb, Bi)薄膜。薄膜生长过程是一种新型的N,N-二甲氨基-三甲基硅烷(Me/sub 3/SiNMe/sub 2/)消除反应,而不是传统MOCVD技术中的热解反应。x射线衍射数据表明,所得到的多晶薄膜的结晶质量和取向取决于衬底结构和生长温度。在50℃以下沉积非晶态薄膜。Sb/sub 2/Te/sub 3/和Bi/sub 2/Te/sub 3/在75/spl°C和125/spl°C下沉积的薄膜具有高度定向,(015)反射面平行于衬底表面。在150℃/spl温度下沉积的Sb/sub / 2/Te/sub / 3薄膜具有高度定向,其[00l]反射面平行于衬底表面。在125℃/spl温度下在Kapton上沉积的Bi/sub 2/Te/sub 3/薄膜的电学性能和组成与V/VI前驱体比例无关。由于Sb/sub 2/Te/sub 3/和Bi/sub 2/Te/sub 3/形成反应动力学的差异,观察到Sb/sub x/Bi/sub 2-x/Te/sub 3/三元膜在感受器上的组成变化。这种独特的沉积反应为制备V族硫族化合物材料提供了另一种途径,这种材料在太阳能电池、可逆光存储和热电器件中具有潜在的应用前景。
{"title":"Low temperature MOCVD growth of V/VI materials via a Me3SiNMe2 elimination reaction","authors":"T. Groshens, R. Gedridge, R. Scheri, T. Cole","doi":"10.1109/ICT.1996.553521","DOIUrl":"https://doi.org/10.1109/ICT.1996.553521","url":null,"abstract":"The reactive precursors M(NMe/sub 2/)/sub 3/ (M=Sb, Bi) and (Me/sub 1/Si)/sub 2/Te were used to deposit films of M/sub 2/Te/sub 3/ (M=Sb, Bi) on Si(111) cut 4/spl deg/ off-axis, GaAs(100), and Kapton substrates between 25/spl deg/C and 150/spl deg/C in a low pressure MOCVD reactor. The film growth process is a novel N,N-dimethylamino-trimethylsilane (Me/sub 3/SiNMe/sub 2/) elimination reaction and not pyrolysis reactions employed in conventional MOCVD techniques. X-ray diffraction data show the crystalline quality and orientation of the resulting polycrystalline films were dependent on the substrate structure and growth temperature. Amorphous films were deposited below 50/spl deg/C. Films deposited at 75/spl deg/C for Sb/sub 2/Te/sub 3/ and 125/spl deg/C for Bi/sub 2/Te/sub 3/ were highly oriented with the (015) reflection plane parallel to the substrate surface. Films of Sb/sub 2/Te/sub 3/ deposited at 150/spl deg/C were highly oriented with the [00l] reflection planes parallel to the substrate surface. The electrical properties and composition of Bi/sub 2/Te/sub 3/ films deposited at 125/spl deg/C on Kapton were independent of the V/VI precursor ratio used. Variation in the composition of a Sb/sub x/Bi/sub 2-x/Te/sub 3/ ternary film across the susceptor was observed due to differences in the reaction kinetics for formation of Sb/sub 2/Te/sub 3/ and Bi/sub 2/Te/sub 3/. This unique deposition reaction provides an alternative route to prepare group V chalcogenide materials which have potential applications in solar cells, reversible optical storage, and thermoelectrics.","PeriodicalId":447328,"journal":{"name":"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"1996-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127428520","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Observation of the effect of grain size on the lattice thermal conductivity of polycrystalline bismuth antimony 晶粒尺寸对多晶铋锑晶格热导率影响的观察
Pub Date : 1996-03-26 DOI: 10.1109/ICT.1996.553249
E. H. Volckmann, H. Goldsmid, J. Sharp
The thermal conductivity of polycrystalline sintered BiSb has been measured from 80 to 300 K. The samples had mean grain sizes between 1 /spl mu/m and 19 /spl mu/m. The electronic contribution to the thermal conductivity was determined by a technique that involves the comparison of the magneto-resistance and the magneto-thermal resistance effects in transverse fields of up to 1.0 tesla. The electronic thermal conductivity seems to be somewhat smaller than expected, bearing in mind that there should be a significant bipolar contribution, yet the technique is believed to be sound since it yields a lattice thermal conductivity for large-grained samples that is intermediate between the values for single crystals in the principal crystal directions. The lattice thermal conductivity is found to decrease as the grain size is reduced. Such a decrease has been predicted on the basis of grain boundary scattering of phonons but it is occurring at grain sizes somewhat larger than expected. It is possible that the effect may be due to the scattering of phonons on point or line defects that have been introduced as a consequence of powder metallurgy. Nevertheless, grain boundary scattering cannot be ruled out as the cause, in view of the simplifications that were made in the theory.
在80 ~ 300 K范围内测量了多晶烧结铋的导热系数。样品的平均粒级在1 ~ 19粒级之间。电子对热导率的贡献是通过一种技术来确定的,该技术涉及在高达1.0特斯拉的横向场中比较磁电阻和磁热电阻效应。电子热导率似乎比预期的要小一些,记住应该有一个显著的双极贡献,但该技术被认为是合理的,因为它产生了大颗粒样品的晶格热导率,在主晶体方向上介于单晶值之间。晶格导热系数随晶粒尺寸的减小而减小。根据声子的晶界散射已经预测了这种减少,但它发生在比预期更大的晶粒尺寸上。这种效应可能是由于声子在点或线缺陷上的散射,这些缺陷是由于粉末冶金而引入的。然而,鉴于在理论中所作的简化,不能排除晶界散射是原因。
{"title":"Observation of the effect of grain size on the lattice thermal conductivity of polycrystalline bismuth antimony","authors":"E. H. Volckmann, H. Goldsmid, J. Sharp","doi":"10.1109/ICT.1996.553249","DOIUrl":"https://doi.org/10.1109/ICT.1996.553249","url":null,"abstract":"The thermal conductivity of polycrystalline sintered BiSb has been measured from 80 to 300 K. The samples had mean grain sizes between 1 /spl mu/m and 19 /spl mu/m. The electronic contribution to the thermal conductivity was determined by a technique that involves the comparison of the magneto-resistance and the magneto-thermal resistance effects in transverse fields of up to 1.0 tesla. The electronic thermal conductivity seems to be somewhat smaller than expected, bearing in mind that there should be a significant bipolar contribution, yet the technique is believed to be sound since it yields a lattice thermal conductivity for large-grained samples that is intermediate between the values for single crystals in the principal crystal directions. The lattice thermal conductivity is found to decrease as the grain size is reduced. Such a decrease has been predicted on the basis of grain boundary scattering of phonons but it is occurring at grain sizes somewhat larger than expected. It is possible that the effect may be due to the scattering of phonons on point or line defects that have been introduced as a consequence of powder metallurgy. Nevertheless, grain boundary scattering cannot be ruled out as the cause, in view of the simplifications that were made in the theory.","PeriodicalId":447328,"journal":{"name":"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"1996-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127713829","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 13
Determination of the thermal band gap from the change of the Seebeck-coefficient at the pn-transition in (Bi0.5Sb0.5)2)Te3 由(Bi0.5Sb0.5)2)Te3中pn跃迁时seebeck系数的变化确定热带隙
Pub Date : 1996-03-26 DOI: 10.1109/ICT.1996.553517
E. Muller, W. Heiliger, P. Reinshaus, H. Submann
The range of existence of the homogeneous /spl delta/-phase of (Bi/sub 0.5/Sb/sub 0.5/)/sub 2/Te/sub 3/ in the phase diagram (Bi,Sb)-Te intersects the stoichiometry line. n-type samples can be obtained by Bridgman growth with excess of tellurium. Due to the strong tellurium segregation the transition from the p-extrinsic region through intrinsic material to n-extrinsic behavior proceeds within a sample section of several millimeters along the axial direction. The positive and negative maximum values S/sub max.p/ and S/sub max.n/ can be read out from a scan of the Seebeck coefficient by the micro-thermoprobe technique over the transition area. The p-type maximum scan value is in good agreement with the value deduced from the integral measurement of homogeneous bulk samples. The width of the thermal band gap and the ratio of the electronic parameters /spl mu//sub B/(m/sub d//m/sub o/)/sup 3/2/ (/spl mu//sub B/-non-degeneracy value of the carrier mobility (reduced to Boltzmann statistics); m/sub d//m/sub o/-reduced d.o.s. mass) of holes and electrons are obtained from S/sub max.p/ and S/sub max.n/. The mobility of holes as minority carriers exhibits a strong sensitivity on doping impurities.
(Bi,Sb)-Te相图中(Bi/sub 0.5/Sb/sub 0.5/)/sub 2/Te/sub 3/的均相/spl δ /-相存在范围与化学计量线相交。通过过量碲的Bridgman生长可以得到n型样品。由于碲的强烈偏析,在沿轴向几毫米的样品截面内,从p-外源区通过本征材料向n-外源行为转变。正负最大值S/sub max。p/和S/sub max。通过微热探针技术对过渡区域的塞贝克系数进行扫描,可以读出n/。p型最大扫描值与均匀体样品的积分测量值吻合较好。热带隙的宽度与电子参数/spl mu//sub B/(m/sub d//m/sub o/)/sup 3/2/ (/spl mu//sub B/)的比值——载流子迁移率的非简并值(降约为玻尔兹曼统计);由S/sub max得到空穴和电子的m/sub / d//m/sub / o/-还原d.o.s质量)。p/和S/sub max.n/。作为少数载流子的空穴的迁移率对掺杂杂质表现出很强的敏感性。
{"title":"Determination of the thermal band gap from the change of the Seebeck-coefficient at the pn-transition in (Bi0.5Sb0.5)2)Te3","authors":"E. Muller, W. Heiliger, P. Reinshaus, H. Submann","doi":"10.1109/ICT.1996.553517","DOIUrl":"https://doi.org/10.1109/ICT.1996.553517","url":null,"abstract":"The range of existence of the homogeneous /spl delta/-phase of (Bi/sub 0.5/Sb/sub 0.5/)/sub 2/Te/sub 3/ in the phase diagram (Bi,Sb)-Te intersects the stoichiometry line. n-type samples can be obtained by Bridgman growth with excess of tellurium. Due to the strong tellurium segregation the transition from the p-extrinsic region through intrinsic material to n-extrinsic behavior proceeds within a sample section of several millimeters along the axial direction. The positive and negative maximum values S/sub max.p/ and S/sub max.n/ can be read out from a scan of the Seebeck coefficient by the micro-thermoprobe technique over the transition area. The p-type maximum scan value is in good agreement with the value deduced from the integral measurement of homogeneous bulk samples. The width of the thermal band gap and the ratio of the electronic parameters /spl mu//sub B/(m/sub d//m/sub o/)/sup 3/2/ (/spl mu//sub B/-non-degeneracy value of the carrier mobility (reduced to Boltzmann statistics); m/sub d//m/sub o/-reduced d.o.s. mass) of holes and electrons are obtained from S/sub max.p/ and S/sub max.n/. The mobility of holes as minority carriers exhibits a strong sensitivity on doping impurities.","PeriodicalId":447328,"journal":{"name":"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"1996-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128027889","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Experimental evidence of high power factors and low thermal conductivity in Bi2Te3/Sb2Te3 superlattice thin-films Bi2Te3/Sb2Te3超晶格薄膜的高功率因数和低导热性的实验证据
Pub Date : 1996-03-26 DOI: 10.1109/ICT.1996.553526
R. Venkatasubramanian, T. Colpitts, E. Watko, J. Hutchby
Thermoelectric properties of p-type Bi/sub 2/Te/sub 3//Sb/sub 2/Te/sub 3/ superlattice (SL) thin-films grown by organometallic vapor phase epitaxy (OMVPE) are described. The electrical and thermal transport properties including, hole mobility, Seebeck coefficient and power factor as a function of SL dimension are described. It is observed that the carrier mobility, Seebeck coefficient and power factor of the Bi/sub 2/Te/sub 3//Sb/sub 2/Te/sub 3/ SL structures are better than that of p-type Bi/sub x/Sb/sub 2-x/Te/sub 3/ alloys, with similar bandgap and electrical resistivity. The improvement in carrier mobility is attributed to avoiding or minimizing alloy scattering of carriers with SL structures while the enhanced Seebeck coefficient is related to the bandstructure difference between the alloy and the SL structures. Initial measurements indicate that power factor improvement of /spl sim/50%, over corresponding alloys, can be obtained in SL structures. We have measured the thermal conductivity of the SL structures by the 3-/spl omega/ method and have observed a factor of four to seven reduction in thermal conductivity of optimized structures, with respect to the alloys. The electrical conductivity and Seebeck coefficient are measured in the plane of the SL structures, while the 3-/spl omega/-measured thermal conductivity can potentially be dominated by a component perpendicular to the SL structures. Hence, the figure-of-merit (ZT) values are estimated with a correction for potential anisotropy of thermal conductivity. Including this correction, implying higher assumed thermal conductivities in the plane of SL's, the preliminary estimated ZT for some SL structures are in the range of 1.22 to 1.67 at 300 K.
描述了用有机金属气相外延(OMVPE)生长p型Bi/sub 2/Te/sub 3/ Sb/sub 2/Te/sub 3/超晶格(SL)薄膜的热电性能。描述了电和热输运性质,包括空穴迁移率、塞贝克系数和功率因数作为SL尺寸的函数。Bi/sub - 2/Te/sub - 3/ Sb/sub - 2/Te/sub - 3/ SL结构的载流子迁移率、塞贝克系数和功率因数均优于p型Bi/sub -x/ Sb/sub - 2-x/Te/sub - 3/合金,且具有相似的带隙和电阻率。载流子迁移率的提高是由于避免或减少了SL结构载流子的合金散射,而塞贝克系数的提高与合金与SL结构之间的能带结构差异有关。初步测量表明,与相应合金相比,在SL结构中可以获得/spl sim/50%的功率因数提高。我们用3-/spl ω /方法测量了SL结构的导热系数,并观察到与合金相比,优化结构的导热系数降低了4到7倍。电导率和塞贝克系数是在SL结构平面上测量的,而3-/spl ω /-测量的导热系数可能由垂直于SL结构的分量主导。因此,通过对导热系数的潜在各向异性进行校正来估计性能值(ZT)。包括这一修正,意味着在SL的平面上假设更高的热导率,一些SL结构在300 K时的初步估计ZT在1.22到1.67之间。
{"title":"Experimental evidence of high power factors and low thermal conductivity in Bi2Te3/Sb2Te3 superlattice thin-films","authors":"R. Venkatasubramanian, T. Colpitts, E. Watko, J. Hutchby","doi":"10.1109/ICT.1996.553526","DOIUrl":"https://doi.org/10.1109/ICT.1996.553526","url":null,"abstract":"Thermoelectric properties of p-type Bi/sub 2/Te/sub 3//Sb/sub 2/Te/sub 3/ superlattice (SL) thin-films grown by organometallic vapor phase epitaxy (OMVPE) are described. The electrical and thermal transport properties including, hole mobility, Seebeck coefficient and power factor as a function of SL dimension are described. It is observed that the carrier mobility, Seebeck coefficient and power factor of the Bi/sub 2/Te/sub 3//Sb/sub 2/Te/sub 3/ SL structures are better than that of p-type Bi/sub x/Sb/sub 2-x/Te/sub 3/ alloys, with similar bandgap and electrical resistivity. The improvement in carrier mobility is attributed to avoiding or minimizing alloy scattering of carriers with SL structures while the enhanced Seebeck coefficient is related to the bandstructure difference between the alloy and the SL structures. Initial measurements indicate that power factor improvement of /spl sim/50%, over corresponding alloys, can be obtained in SL structures. We have measured the thermal conductivity of the SL structures by the 3-/spl omega/ method and have observed a factor of four to seven reduction in thermal conductivity of optimized structures, with respect to the alloys. The electrical conductivity and Seebeck coefficient are measured in the plane of the SL structures, while the 3-/spl omega/-measured thermal conductivity can potentially be dominated by a component perpendicular to the SL structures. Hence, the figure-of-merit (ZT) values are estimated with a correction for potential anisotropy of thermal conductivity. Including this correction, implying higher assumed thermal conductivities in the plane of SL's, the preliminary estimated ZT for some SL structures are in the range of 1.22 to 1.67 at 300 K.","PeriodicalId":447328,"journal":{"name":"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"1996-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121078575","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Structure and transport properties of Ga-doped semi- and polycrystalline Si/sub 1-x/Gex films 掺ga半晶和多晶Si/sub - 1-x/Gex薄膜的结构和输运性质
Pub Date : 1996-03-26 DOI: 10.1109/ICT.1996.553530
F. Edelman, M. Stolzer, P. Werner, R. Butz
Polycrystalline SiGe films have applications in solar cells, thermoelectrical devices and field-effect transistors for large area integration (liquid crystal displays etc.). Recently, a nanocrystalline state was detected by us in heavily B-doped SiGe films after vacuum annealing. Amorphous (a) Si/sub 1-x/Ge/sub x/ films with x=0.25-0.60, about 200-300 nm thick and heavily doped with Ga (1%), were deposited by molecular beam on SiO/sub 2//Si[001] substrates at room temperature. For crystallization, a-SiGe/SiO/sub 2//Si structures were annealed in vacuum of 10/sup -6/ Torr at 600 to 900/spl deg/C. X-ray diffraction and TEM observations in situ showed nanocrystalline (nc) structure in SiGe films with grain size of about 5-20 nm. The nc-Si/sub 1-x/Ge/sub x/ films demonstrated high hole mobility (1 to 100 cm/sup 2//Vs) and Seebeck coefficient values (5 to 110 /spl mu/V/K).
多晶SiGe薄膜应用于太阳能电池、热电器件和用于大面积集成的场效应晶体管(液晶显示器等)。最近,我们在重掺杂b的SiGe薄膜真空退火后,检测到纳米晶态。在室温下,用分子束法在SiO/sub - 2//Si[001]衬底上沉积了厚度为200 ~ 300 nm、x=0.25 ~ 0.60、掺有大量Ga(1%)的(a) Si/sub -x/Ge/sub -x/薄膜。对a-SiGe/SiO/sub - 2//Si结构进行了600 ~ 900℃、10/sup -6/ Torr的真空退火。x射线衍射和透射电镜原位观察表明,SiGe薄膜具有纳米晶(nc)结构,晶粒尺寸约为5 ~ 20 nm。nc-Si/sub - 1-x/Ge/sub -x/薄膜具有较高的空穴迁移率(1 ~ 100 cm/sup 2//Vs)和塞贝克系数(5 ~ 110 /spl mu/V/K)。
{"title":"Structure and transport properties of Ga-doped semi- and polycrystalline Si/sub 1-x/Gex films","authors":"F. Edelman, M. Stolzer, P. Werner, R. Butz","doi":"10.1109/ICT.1996.553530","DOIUrl":"https://doi.org/10.1109/ICT.1996.553530","url":null,"abstract":"Polycrystalline SiGe films have applications in solar cells, thermoelectrical devices and field-effect transistors for large area integration (liquid crystal displays etc.). Recently, a nanocrystalline state was detected by us in heavily B-doped SiGe films after vacuum annealing. Amorphous (a) Si/sub 1-x/Ge/sub x/ films with x=0.25-0.60, about 200-300 nm thick and heavily doped with Ga (1%), were deposited by molecular beam on SiO/sub 2//Si[001] substrates at room temperature. For crystallization, a-SiGe/SiO/sub 2//Si structures were annealed in vacuum of 10/sup -6/ Torr at 600 to 900/spl deg/C. X-ray diffraction and TEM observations in situ showed nanocrystalline (nc) structure in SiGe films with grain size of about 5-20 nm. The nc-Si/sub 1-x/Ge/sub x/ films demonstrated high hole mobility (1 to 100 cm/sup 2//Vs) and Seebeck coefficient values (5 to 110 /spl mu/V/K).","PeriodicalId":447328,"journal":{"name":"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"1996-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124515019","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Effective figure of merit increase at the large temperature drops 当温度下降较大时,有效系数增大
Pub Date : 1996-03-26 DOI: 10.1109/ICT.1996.553293
V. Yurchenko
Optimum configuration, assembling and commutation of the cells in a thermoelectric device have been investigated taking into account the temperature dependence of resistivity, thermal conductivity and Seebeck coefficient of the material operating at the large temperature drop. A solution is proposed which enables one to increase the effective figure of merit of the device as compared to the mean value of Z measured at the same temperature drop in a single wafer thermoelectric cell.
考虑到材料的电阻率、导热系数和塞贝克系数对温度的依赖,研究了热电器件中电池的最佳配置、组装和换相。提出了一种解决方案,使人们能够提高器件的有效品质系数,与在单片热电电池中相同温度降下测量的Z平均值相比。
{"title":"Effective figure of merit increase at the large temperature drops","authors":"V. Yurchenko","doi":"10.1109/ICT.1996.553293","DOIUrl":"https://doi.org/10.1109/ICT.1996.553293","url":null,"abstract":"Optimum configuration, assembling and commutation of the cells in a thermoelectric device have been investigated taking into account the temperature dependence of resistivity, thermal conductivity and Seebeck coefficient of the material operating at the large temperature drop. A solution is proposed which enables one to increase the effective figure of merit of the device as compared to the mean value of Z measured at the same temperature drop in a single wafer thermoelectric cell.","PeriodicalId":447328,"journal":{"name":"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"1996-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114263152","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Thermoelectric properties of Bi-Sb composite prepared by mechanical alloying method 机械合金化法制备Bi-Sb复合材料的热电性能
Pub Date : 1996-03-26 DOI: 10.1109/ICT.1996.553248
M. Miyajima, K. Takagi, H. Okamura, Gil-Geun Lee, Y. Noda, R. Watanabe
To study the mechanical alloying process and the properties of thermoelectric semiconductor with fine dispersed ceramic particles, Bi-Sb alloys with addition of fine BN and ZrO/sub 2/ were prepared by mechanical alloying. The milled powders were sintered by hot pressing. The Bi/sub 92.5/Sb/sub 7.5/ solid solution with fine dispersion of BN and ZrO ceramic particles were successfully synthesized. The sintered composites show very fine microstructures in which average grain size are less than one micron. The thermal properties of composites were measured by laser flash method at room temperature. The electrical properties were measured by Van der Pauw method at room temperature and at 77 K. The BN addition has obtained larger reduction of thermal conductivity compared to ZrO/sub 2/. The thermal conductivity has been reduced to 20% of the reported value of Bi-Sb single crystal, which achieved with 10 vol% addition of BN.
为了研究细分散陶瓷颗粒的机械合金化工艺及热电半导体的性能,采用机械合金化法制备了添加细BN和ZrO/sub 2/的Bi-Sb合金。研磨后的粉末经热压烧结而成。成功地合成了Bi/sub 92.5/Sb/sub 7.5/分散良好的BN和ZrO陶瓷颗粒固溶体。烧结后的复合材料的显微组织非常精细,平均晶粒尺寸小于1微米。采用激光闪蒸法测定了复合材料在室温下的热性能。在室温和77 K条件下,用范德泡法测定了材料的电学性能。与ZrO/ sub2 /相比,BN的加入获得了更大的导热系数降低。当BN添加量为10 vol%时,其导热系数降至Bi-Sb单晶的20%。
{"title":"Thermoelectric properties of Bi-Sb composite prepared by mechanical alloying method","authors":"M. Miyajima, K. Takagi, H. Okamura, Gil-Geun Lee, Y. Noda, R. Watanabe","doi":"10.1109/ICT.1996.553248","DOIUrl":"https://doi.org/10.1109/ICT.1996.553248","url":null,"abstract":"To study the mechanical alloying process and the properties of thermoelectric semiconductor with fine dispersed ceramic particles, Bi-Sb alloys with addition of fine BN and ZrO/sub 2/ were prepared by mechanical alloying. The milled powders were sintered by hot pressing. The Bi/sub 92.5/Sb/sub 7.5/ solid solution with fine dispersion of BN and ZrO ceramic particles were successfully synthesized. The sintered composites show very fine microstructures in which average grain size are less than one micron. The thermal properties of composites were measured by laser flash method at room temperature. The electrical properties were measured by Van der Pauw method at room temperature and at 77 K. The BN addition has obtained larger reduction of thermal conductivity compared to ZrO/sub 2/. The thermal conductivity has been reduced to 20% of the reported value of Bi-Sb single crystal, which achieved with 10 vol% addition of BN.","PeriodicalId":447328,"journal":{"name":"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"1996-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131658136","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Synthesis and evaluation of thermoelectric multilayer films 热电多层膜的合成与评价
Pub Date : 1996-03-26 DOI: 10.1109/ICT.1996.553527
A. V. Wagner, R. Foreman, L. Summers, T. Barbee, J. Farmer
The deposition of compositionally-modulated (Bi/sub 1-x/Sb/sub x/)/sub 2/(Te/sub 1-y/Se/sub y/)/sub 3/ thermoelectric multilayer films by magnetron sputtering has been demonstrated. Structures with a period of 140 /spl Aring/ are shown to be stable to interdiffusion at the high deposition temperatures necessary for growth of single-layer crystalline films with ZT>0.5. These multilayers are of the correct dimension to exhibit the electronic properties of quantum well structures. Furthermore it is shown that the Seebeck coefficient of the films is not degraded by the presence of this multilayer structure. It may be possible to synthesize a multilayer thermoelectric material with enhanced ZT by maximizing the barrier height through optimization of the composition of the barrier.
用磁控溅射法制备了(Bi/sub - 1-x/Sb/sub -x/)/sub - 2/(Te/sub - 1-y/Se/sub -y/)/sub - 3/热电多层膜。周期为140 /spl的结构在生长ZT>0.5的单层晶膜所需的高沉积温度下具有稳定的互扩散。这些多层层具有正确的尺寸,以显示量子阱结构的电子特性。此外,该多层结构的存在并没有降低薄膜的塞贝克系数。通过优化势垒的组成,使势垒高度最大化,有可能合成具有增强ZT的多层热电材料。
{"title":"Synthesis and evaluation of thermoelectric multilayer films","authors":"A. V. Wagner, R. Foreman, L. Summers, T. Barbee, J. Farmer","doi":"10.1109/ICT.1996.553527","DOIUrl":"https://doi.org/10.1109/ICT.1996.553527","url":null,"abstract":"The deposition of compositionally-modulated (Bi/sub 1-x/Sb/sub x/)/sub 2/(Te/sub 1-y/Se/sub y/)/sub 3/ thermoelectric multilayer films by magnetron sputtering has been demonstrated. Structures with a period of 140 /spl Aring/ are shown to be stable to interdiffusion at the high deposition temperatures necessary for growth of single-layer crystalline films with ZT>0.5. These multilayers are of the correct dimension to exhibit the electronic properties of quantum well structures. Furthermore it is shown that the Seebeck coefficient of the films is not degraded by the presence of this multilayer structure. It may be possible to synthesize a multilayer thermoelectric material with enhanced ZT by maximizing the barrier height through optimization of the composition of the barrier.","PeriodicalId":447328,"journal":{"name":"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"1996-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128574964","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
期刊
Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1