Pub Date : 2001-05-07DOI: 10.1109/ISEE.2001.924537
M. Hoffmann, R. Knoth, B. Kopacek, P. Kopacek
Design for environment (DFE) is becoming more and more important, especially as there is a tremendous need to increase resource productivity because of the decreasing capacities of nonrenewable resources. One way to achieve this goal is to enhance a product's lifetime. Therefore the Austrian Society for Systems Engineering and Automation started to build a demonstration plant within the Strategic CARE initiative: "/spl Sigma/! 1592-Disassembly Factory". The idea of this project is to develop a flexible semiautomatic disassembling cell for extracting valuable and reusable components from printed circuit boards (PCB). Furthermore design impacts for a concept of a "disassembly-oriented product structure" is investigated. This paper illustrates how the experience of the Disassembly Factory will influence DFE methodologies in the future.
环境设计(Design for environment, DFE)变得越来越重要，尤其是在不可再生资源容量不断减少的情况下，提高资源生产率的需求越来越大。实现这一目标的一种方法是延长产品的生命周期。因此，奥地利系统工程和自动化协会开始在战略关怀计划中建立一个示范工厂:“/spl Sigma/!”1592 -拆卸工厂”。这个项目的想法是开发一种灵活的半自动拆卸单元，用于从印刷电路板(PCB)中提取有价值的和可重复使用的组件。进一步研究了“面向拆卸的产品结构”概念对设计的影响。本文阐述了拆卸工厂的经验将如何影响未来的DFE方法。
{"title":"How can experiences from reuse activities influence the development of DFE-tools","authors":"M. Hoffmann, R. Knoth, B. Kopacek, P. Kopacek","doi":"10.1109/ISEE.2001.924537","DOIUrl":"https://doi.org/10.1109/ISEE.2001.924537","url":null,"abstract":"Design for environment (DFE) is becoming more and more important, especially as there is a tremendous need to increase resource productivity because of the decreasing capacities of nonrenewable resources. One way to achieve this goal is to enhance a product's lifetime. Therefore the Austrian Society for Systems Engineering and Automation started to build a demonstration plant within the Strategic CARE initiative: \"/spl Sigma/! 1592-Disassembly Factory\". The idea of this project is to develop a flexible semiautomatic disassembling cell for extracting valuable and reusable components from printed circuit boards (PCB). Furthermore design impacts for a concept of a \"disassembly-oriented product structure\" is investigated. This paper illustrates how the experience of the Disassembly Factory will influence DFE methodologies in the future.","PeriodicalId":448468,"journal":{"name":"Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125688534","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-05-07DOI: 10.1109/ISEE.2001.924508
Y. Luo, P. Wirojanagud, R. Caudill
Various performance metrics have been developed to evaluate quantitatively the environmental impact of products, processes and activities. Much attention has been given to developing a stronger scientific basis for comprehensive environmental performance metrics. Eco-indicator 95, Eco-indicator 99, ecological footprints, and EcoPro developed by Lucent Technologies in collaboration with MERC at NJIT, are four environmental performance metrics representing this group. This paper compares the scientific implications, implementation framework, and relative performance of these metrics using various electronic products as case studies. Since each metric is based on different methodological structures, weighting techniques, and assumptions, the absolute magnitude of the output cannot be compared; however, in the context of assessments for competing products with equivalent functionality, the final results can be examined on a relative basis.
{"title":"Comparison of major environmental performance metrics and their application to typical electronic products","authors":"Y. Luo, P. Wirojanagud, R. Caudill","doi":"10.1109/ISEE.2001.924508","DOIUrl":"https://doi.org/10.1109/ISEE.2001.924508","url":null,"abstract":"Various performance metrics have been developed to evaluate quantitatively the environmental impact of products, processes and activities. Much attention has been given to developing a stronger scientific basis for comprehensive environmental performance metrics. Eco-indicator 95, Eco-indicator 99, ecological footprints, and EcoPro developed by Lucent Technologies in collaboration with MERC at NJIT, are four environmental performance metrics representing this group. This paper compares the scientific implications, implementation framework, and relative performance of these metrics using various electronic products as case studies. Since each metric is based on different methodological structures, weighting techniques, and assumptions, the absolute magnitude of the output cannot be compared; however, in the context of assessments for competing products with equivalent functionality, the final results can be examined on a relative basis.","PeriodicalId":448468,"journal":{"name":"Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)","volume":"95 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114596760","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-05-07DOI: 10.1109/ISEE.2001.924542
O. Deubzer, H. Hamano, T. Suga, H. Griese
Toxicity, energy consumption and economical effects of applying SnPb/sub 37/ solder and PCB finish, SnAg/sub 3.0/Cu/sub 0.5/ solder, SnCu/sub 0.75/ solder, SnZn/sub 9/ solder and Sn as well as Ni/Au PCB finishes were compared to the respective tin-lead soldering materials. All assessed lead-free materials, besides the Ni/Au PCB finish, considerably reduce the toxic releases from PCBs into the environment. Lead-free soldering with SnAgCu and SnCu solders and current equipment increases the energy consumption in reflow soldering. To a minor degree it also enhances the energy demand for metal production. The energy consumption of the reflow oven is an environmental hot spot in the life cycle. The situation will improve with already available new oven technology. Evaluation with the Eco Indicator 95 and the Eco Point method show, that lead-free soldering with current soldering equipment and with the assessed lead-free solders and the tin PCB finish considerably reduces the overall burden to the environment. Surplus energy cost and, especially in case of SnAgCu solder, increased solder cost will hardly affect the total cost of a PCB, as solder and energy cost are only a minor part of the total PCB cost. Due to the silver content, the SnAgCu solder decreases the recycling cost.
{"title":"Lead-free soldering-toxicity, energy and resource consumption","authors":"O. Deubzer, H. Hamano, T. Suga, H. Griese","doi":"10.1109/ISEE.2001.924542","DOIUrl":"https://doi.org/10.1109/ISEE.2001.924542","url":null,"abstract":"Toxicity, energy consumption and economical effects of applying SnPb/sub 37/ solder and PCB finish, SnAg/sub 3.0/Cu/sub 0.5/ solder, SnCu/sub 0.75/ solder, SnZn/sub 9/ solder and Sn as well as Ni/Au PCB finishes were compared to the respective tin-lead soldering materials. All assessed lead-free materials, besides the Ni/Au PCB finish, considerably reduce the toxic releases from PCBs into the environment. Lead-free soldering with SnAgCu and SnCu solders and current equipment increases the energy consumption in reflow soldering. To a minor degree it also enhances the energy demand for metal production. The energy consumption of the reflow oven is an environmental hot spot in the life cycle. The situation will improve with already available new oven technology. Evaluation with the Eco Indicator 95 and the Eco Point method show, that lead-free soldering with current soldering equipment and with the assessed lead-free solders and the tin PCB finish considerably reduces the overall burden to the environment. Surplus energy cost and, especially in case of SnAgCu solder, increased solder cost will hardly affect the total cost of a PCB, as solder and energy cost are only a minor part of the total PCB cost. Due to the silver content, the SnAgCu solder decreases the recycling cost.","PeriodicalId":448468,"journal":{"name":"Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122423506","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-05-07DOI: 10.1109/ISEE.2001.924528
J. Fava, D. Noble, A. Russell
The electronics sector is a recognized leader in developing and adopting design for environment (DfE) practices. However, there is no standard way of implementing DfE and few guidelines for designing successful DfE programs. Research was done to document and analyze existing DfE programs and the key external and internal drivers shaping the evolution of these DfE programs in several leading electronics firms. The goal of the research was to understand how and why DfE has evolved differently in different electronics firms. A combination of primary (interviews with managers responsible for DfE programs) and secondary research methods using published materials was used. The range of programs examined included companies that developed entirely new DfE programs, to others that modified existing environmental frameworks. Findings indicate that the strengths and weaknesses of a particular DfE program can only be judged by understanding the factors influencing its evolution and by examining how a particular program contributes to implementing the environmental strategy of the specific firm.
{"title":"The evolution of design for environment in electronics firms","authors":"J. Fava, D. Noble, A. Russell","doi":"10.1109/ISEE.2001.924528","DOIUrl":"https://doi.org/10.1109/ISEE.2001.924528","url":null,"abstract":"The electronics sector is a recognized leader in developing and adopting design for environment (DfE) practices. However, there is no standard way of implementing DfE and few guidelines for designing successful DfE programs. Research was done to document and analyze existing DfE programs and the key external and internal drivers shaping the evolution of these DfE programs in several leading electronics firms. The goal of the research was to understand how and why DfE has evolved differently in different electronics firms. A combination of primary (interviews with managers responsible for DfE programs) and secondary research methods using published materials was used. The range of programs examined included companies that developed entirely new DfE programs, to others that modified existing environmental frameworks. Findings indicate that the strengths and weaknesses of a particular DfE program can only be judged by understanding the factors influencing its evolution and by examining how a particular program contributes to implementing the environmental strategy of the specific firm.","PeriodicalId":448468,"journal":{"name":"Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127064669","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-05-07DOI: 10.1109/ISEE.2001.924535
J. Mosovsky, J. Dispenza, D. Dickinson, J. Morabito, R. Caudill, N. Alli
Environmental lifecycle assessment (LCA) must be integrated into design systems to achieve continuous improvement in the environmental performance of products. This provides the designer feedback on the lifecycle environmental impacts of an evolving design, emphasizing material, process or form substitution to decrease environmental impact. The New Jersey Institute of Technology (NJIT) has developed a prototype design for environment (DFE) and environmental LCA software tool that interfaces with Pro/Engineer (CAD tool) to extract product description and bill of materials data in order to conduct an environmental LCA inventory analysis. The inventory analysis is modeled to account for materials flows, energy usage, and environmental burdens, as well as costs associated with the product life cycle. Environmental impact assessment of the inventory analysis and interpretation of the results are performed with EcoPro, a universal lifecycle metric developed at Lucent Technologies that can provide the designer quantified feedback on environmental performance and sustainability in the form of single indicators for resource productivity (RP) and eco-efficiency (EE). Two different circuit pack faceplate designs were evaluated. Pro/Engineer files representing a proposed "two-shot" molded thermoplastic faceplate and a current metal (aluminum) assembly design were evaluated using the NJIT software tool and EcoPro. Results for RP and EE of the two designs and comparison of cost data demonstrate the benefits of the proposed design as well as the advantages of using this approach to evaluate alternative designs, construction, processes and materials.
{"title":"Assessing product design alternatives with respect to environmental performance and sustainability: a case study for circuit pack faceplates","authors":"J. Mosovsky, J. Dispenza, D. Dickinson, J. Morabito, R. Caudill, N. Alli","doi":"10.1109/ISEE.2001.924535","DOIUrl":"https://doi.org/10.1109/ISEE.2001.924535","url":null,"abstract":"Environmental lifecycle assessment (LCA) must be integrated into design systems to achieve continuous improvement in the environmental performance of products. This provides the designer feedback on the lifecycle environmental impacts of an evolving design, emphasizing material, process or form substitution to decrease environmental impact. The New Jersey Institute of Technology (NJIT) has developed a prototype design for environment (DFE) and environmental LCA software tool that interfaces with Pro/Engineer (CAD tool) to extract product description and bill of materials data in order to conduct an environmental LCA inventory analysis. The inventory analysis is modeled to account for materials flows, energy usage, and environmental burdens, as well as costs associated with the product life cycle. Environmental impact assessment of the inventory analysis and interpretation of the results are performed with EcoPro, a universal lifecycle metric developed at Lucent Technologies that can provide the designer quantified feedback on environmental performance and sustainability in the form of single indicators for resource productivity (RP) and eco-efficiency (EE). Two different circuit pack faceplate designs were evaluated. Pro/Engineer files representing a proposed \"two-shot\" molded thermoplastic faceplate and a current metal (aluminum) assembly design were evaluated using the NJIT software tool and EcoPro. Results for RP and EE of the two designs and comparison of cost data demonstrate the benefits of the proposed design as well as the advantages of using this approach to evaluate alternative designs, construction, processes and materials.","PeriodicalId":448468,"journal":{"name":"Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)","volume":"2014 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128226932","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-05-07DOI: 10.1109/ISEE.2001.924501
A. Stevels
Approaches, addressing environmental care in products have been assessed according to requirements which were derived on the basis of practical experiences when implementing Ecodesign/Design for Environment in the electronic industry. Systems examined include ISO standard 14001, ISO technical report (draft) 14062, the European EEE (Environmental conformity initiative) and IPP approaches and ecolabels. None of the approaches as such fulfils all requirements in a satisfactory way. However, if elements with the best scores are combined into one system a very good basis for further tool development is created.
{"title":"Product environmental care, a praxis-based system uniting ISO 14001, ISO 14062, IPP, EEE and ecolabel elements","authors":"A. Stevels","doi":"10.1109/ISEE.2001.924501","DOIUrl":"https://doi.org/10.1109/ISEE.2001.924501","url":null,"abstract":"Approaches, addressing environmental care in products have been assessed according to requirements which were derived on the basis of practical experiences when implementing Ecodesign/Design for Environment in the electronic industry. Systems examined include ISO standard 14001, ISO technical report (draft) 14062, the European EEE (Environmental conformity initiative) and IPP approaches and ecolabels. None of the approaches as such fulfils all requirements in a satisfactory way. However, if elements with the best scores are combined into one system a very good basis for further tool development is created.","PeriodicalId":448468,"journal":{"name":"Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)","volume":"81 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124288498","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-05-07DOI: 10.1109/ISEE.2001.924495
V. Mani, S. Das, R. Caudill
It is well known that most decisions that effect the end-of-life disposal and recycling of a product are made during the product design phase. The premise of a design for environment (DfE) approach is that product designers will evaluate and improve their designs from an environmental perspective. The authors' survey of designers indicates they are typically overburdened with product functionality and cost reduction objectives. This more or less eliminates any serious DfE analysis, particularly in small and medium sized companies. There is therefore a need for DfE tools that require minimal user input and hence can be run automatically in the shadow of the design process. At MERC, the authors are involved in the development of such a suite of tools, which evaluate several life-cycle analysis dimensions simultaneously. In this paper, they present DfD-Compact, a design tool that evaluates disassembly complexity and material recyclability. The only input data required by this tool is readily extracted from common CAD programs. Specifically, this data includes a part relationship tree, part weight and part material composition. All other data is stored in standardized libraries. The CAD file data does not typically include all the data required to make a detailed analysis. The authors have developed a procedure that is able to use this core data to estimate other product data and then combine this with the library data to generate a reliable DfD-Ratio. This ratio evaluates the product in three dimensions: (i) material separation and recyclability; (ii) unfastening difficulty; and (iii) disassembly accessibility. The DfD-Ratio is measured on an open-ended scale starting from zero, with zero indicating the worst case. The higher the ratio the better the design. This ratio can be used by the designer to compare design alternatives, improve the design, and/or meet minimum DfE objectives. The procedure is illustrated by an example.
{"title":"Disassembly complexity and recyclability analysis of new designs from CAD file data","authors":"V. Mani, S. Das, R. Caudill","doi":"10.1109/ISEE.2001.924495","DOIUrl":"https://doi.org/10.1109/ISEE.2001.924495","url":null,"abstract":"It is well known that most decisions that effect the end-of-life disposal and recycling of a product are made during the product design phase. The premise of a design for environment (DfE) approach is that product designers will evaluate and improve their designs from an environmental perspective. The authors' survey of designers indicates they are typically overburdened with product functionality and cost reduction objectives. This more or less eliminates any serious DfE analysis, particularly in small and medium sized companies. There is therefore a need for DfE tools that require minimal user input and hence can be run automatically in the shadow of the design process. At MERC, the authors are involved in the development of such a suite of tools, which evaluate several life-cycle analysis dimensions simultaneously. In this paper, they present DfD-Compact, a design tool that evaluates disassembly complexity and material recyclability. The only input data required by this tool is readily extracted from common CAD programs. Specifically, this data includes a part relationship tree, part weight and part material composition. All other data is stored in standardized libraries. The CAD file data does not typically include all the data required to make a detailed analysis. The authors have developed a procedure that is able to use this core data to estimate other product data and then combine this with the library data to generate a reliable DfD-Ratio. This ratio evaluates the product in three dimensions: (i) material separation and recyclability; (ii) unfastening difficulty; and (iii) disassembly accessibility. The DfD-Ratio is measured on an open-ended scale starting from zero, with zero indicating the worst case. The higher the ratio the better the design. This ratio can be used by the designer to compare design alternatives, improve the design, and/or meet minimum DfE objectives. The procedure is illustrated by an example.","PeriodicalId":448468,"journal":{"name":"Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116977409","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-05-07DOI: 10.1109/ISEE.2001.924533
S. Das, S. Naik
In this paper we present the DBOM (Disassembly Bill of Materials) standard, which attempts to facilitate the transfer of product disassembly and recycling data from OEMs to the recycling community. We believe this standard will not only improve disassembly and recycling economics, but will also increase the number of product types that are demanufactured. The DBOM provides a representation of the physical structure of the product in a disassembly context. Our analysis reveals that to facilitate efficient disassembly, the DBOM must contain information about the parts, the fasteners, and the fastening structure. We present a standard coding structure for documenting and transmitting this knowledge. The DBOM part list is usually an aggregated version of the assembly bill of materials, since details about all parts is typically not required. We provide guidelines to determine whether a group of mating parts should be listed as one part in the DBOM. The DBOM also relates each part to a material recycling stream and provides an estimate of its purity. In the future we expect the product manufacturer to create and distribute the DBOM to potential collection and disassembly facilities through product labeling or a public access website.
{"title":"The DBOM standard: a specification for efficient product data transfer between manufacturers and demanufacturers","authors":"S. Das, S. Naik","doi":"10.1109/ISEE.2001.924533","DOIUrl":"https://doi.org/10.1109/ISEE.2001.924533","url":null,"abstract":"In this paper we present the DBOM (Disassembly Bill of Materials) standard, which attempts to facilitate the transfer of product disassembly and recycling data from OEMs to the recycling community. We believe this standard will not only improve disassembly and recycling economics, but will also increase the number of product types that are demanufactured. The DBOM provides a representation of the physical structure of the product in a disassembly context. Our analysis reveals that to facilitate efficient disassembly, the DBOM must contain information about the parts, the fasteners, and the fastening structure. We present a standard coding structure for documenting and transmitting this knowledge. The DBOM part list is usually an aggregated version of the assembly bill of materials, since details about all parts is typically not required. We provide guidelines to determine whether a group of mating parts should be listed as one part in the DBOM. The DBOM also relates each part to a material recycling stream and provides an estimate of its purity. In the future we expect the product manufacturer to create and distribute the DBOM to potential collection and disassembly facilities through product labeling or a public access website.","PeriodicalId":448468,"journal":{"name":"Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129006507","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-05-07DOI: 10.1109/ISEE.2001.924518
T. L. Neal, M. Heintz
Environmental design needs for new products are becoming more demanding and diverse. They are changing as new concepts emerge and existing concepts are modified. Some design for environment (DFE) needs have or will become legal and regulatory requirements, while many remain as "preferred practices" that need to be recognized and addressed. As a result, ith can sometimes be difficult to get design groups to take responsibility for the wide variety of DFE objectives. Thus, a product steward faces the challenge of trying to inject desired environmental characteristics into new product design objectives.
{"title":"A system for integrating design for environment (DFE) criteria into the new product introduction process","authors":"T. L. Neal, M. Heintz","doi":"10.1109/ISEE.2001.924518","DOIUrl":"https://doi.org/10.1109/ISEE.2001.924518","url":null,"abstract":"Environmental design needs for new products are becoming more demanding and diverse. They are changing as new concepts emerge and existing concepts are modified. Some design for environment (DFE) needs have or will become legal and regulatory requirements, while many remain as \"preferred practices\" that need to be recognized and addressed. As a result, ith can sometimes be difficult to get design groups to take responsibility for the wide variety of DFE objectives. Thus, a product steward faces the challenge of trying to inject desired environmental characteristics into new product design objectives.","PeriodicalId":448468,"journal":{"name":"Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)","volume":"107 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116680862","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-05-07DOI: 10.1109/ISEE.2001.924512
R. Knoth, M. Hoffmann, B. Kopacek, P. Kopacek
If one considers the huge amounts of WEEE (waste from electrical and electronic equipment) which will become available for recovery, one has to strengthen various end-of-life possibilities such as upgrade, re-use, recondition, re-manufacture, resale or recycling of materials. The quality of these end-of-life possibilities are decisively determined by the quality of the logistic systems. Today the end-of-life electric and electronic equipment is mostly regarded as scrap and treated like it is usual for scrap-in a destructive way. This makes it impossible to re-use equipment, components and parts. This paper describes the development of a logistic solution which meets the demands for several re-use strategies and also increases the effectiveness in material recycling.
{"title":"A logistic concept to improve the re-usability of electric and electronic equipment","authors":"R. Knoth, M. Hoffmann, B. Kopacek, P. Kopacek","doi":"10.1109/ISEE.2001.924512","DOIUrl":"https://doi.org/10.1109/ISEE.2001.924512","url":null,"abstract":"If one considers the huge amounts of WEEE (waste from electrical and electronic equipment) which will become available for recovery, one has to strengthen various end-of-life possibilities such as upgrade, re-use, recondition, re-manufacture, resale or recycling of materials. The quality of these end-of-life possibilities are decisively determined by the quality of the logistic systems. Today the end-of-life electric and electronic equipment is mostly regarded as scrap and treated like it is usual for scrap-in a destructive way. This makes it impossible to re-use equipment, components and parts. This paper describes the development of a logistic solution which meets the demands for several re-use strategies and also increases the effectiveness in material recycling.","PeriodicalId":448468,"journal":{"name":"Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)","volume":"79 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117225023","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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