Pub Date : 2023-03-22DOI: 10.3389/fmech.2023.1152930
Q. Lei, Jing Shu, Junming Wang, H. Cheung, J. Cheung, Wing Fai Wong, Sanders Cheuk Yin Lau, J. Yip, Raymond K. Tong
Adolescent idiopathic scoliosis is a common condition that affects children between the age of 10 and young adulthood. Rigid brace treatment is an effective treatment to control the progression of spinal deformity. However, it limits mobility and causes discomfort, which leads to low treatment compliance. In this study, we developed and characterized a kirigami-inspired CT/MRI compatible spring that could be employed to modify our previously designed exoskeleton hinge vertebrae to provide immediate in-brace correction, good wear comfort, and one that does not inhibit mobility simultaneously. Additive manufacturing has drawn significant interest in academic and industrial terms due to its ability to produce geometrically complex structures. The structural design and dimension of the proposed 3D printed kirigami-inspired springs were optimized with the finite element method (FEM). The carbon-fiber-reinforced nylon material (PA-CF) was selected as the material of the kirigami-inspired spring with the balance of printing easiness and performance of the material. The stiffness of designed kirigami-inspired springs varied between 1.20 and 42.01 N/mm. A case series study with three scoliosis patients has been conducted to investigate the immediate in-brace effect on reducing the spinal curvature and asymmetry of the body contours using radiographic examination. The experiment results show that there are 4.6%–50.5% improvements in Cobb angle for different sections of spines. The X-ray images proved that our kirigami-inspired springs would not block views for Cobb angle measurements.
{"title":"Design and characterize of kirigami-inspired springs and the application in vertebrae exoskeleton for adolescent idiopathic scoliosis brace treatment","authors":"Q. Lei, Jing Shu, Junming Wang, H. Cheung, J. Cheung, Wing Fai Wong, Sanders Cheuk Yin Lau, J. Yip, Raymond K. Tong","doi":"10.3389/fmech.2023.1152930","DOIUrl":"https://doi.org/10.3389/fmech.2023.1152930","url":null,"abstract":"Adolescent idiopathic scoliosis is a common condition that affects children between the age of 10 and young adulthood. Rigid brace treatment is an effective treatment to control the progression of spinal deformity. However, it limits mobility and causes discomfort, which leads to low treatment compliance. In this study, we developed and characterized a kirigami-inspired CT/MRI compatible spring that could be employed to modify our previously designed exoskeleton hinge vertebrae to provide immediate in-brace correction, good wear comfort, and one that does not inhibit mobility simultaneously. Additive manufacturing has drawn significant interest in academic and industrial terms due to its ability to produce geometrically complex structures. The structural design and dimension of the proposed 3D printed kirigami-inspired springs were optimized with the finite element method (FEM). The carbon-fiber-reinforced nylon material (PA-CF) was selected as the material of the kirigami-inspired spring with the balance of printing easiness and performance of the material. The stiffness of designed kirigami-inspired springs varied between 1.20 and 42.01 N/mm. A case series study with three scoliosis patients has been conducted to investigate the immediate in-brace effect on reducing the spinal curvature and asymmetry of the body contours using radiographic examination. The experiment results show that there are 4.6%–50.5% improvements in Cobb angle for different sections of spines. The X-ray images proved that our kirigami-inspired springs would not block views for Cobb angle measurements.","PeriodicalId":48635,"journal":{"name":"Frontiers of Mechanical Engineering","volume":" ","pages":""},"PeriodicalIF":4.5,"publicationDate":"2023-03-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"46649412","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-03-15DOI: 10.3389/fmech.2023.1126489
S. Soleimanian, G. Petrone, F. Franco, S. De Rosa, P. Kołakowski
Noise mitigation by means of the acoustic black hole (ABH) effect is a well-known engineering solution. However, the conventional method of applying ABH effect which requires modification of the structure geometry has various limitations which encourage the research of virtual ABH concept. In this study, the effect of ABH was applied through introducing virtual stiffness by a shunt circuit. According to the force-voltage electric analogy, stiffness has an inverse relationship with capacitance. So that the ABH effect can be virtually realized by following a power law profile using an array of independent capacitive shunts. The concept is studied through finite element simulation developing a macro code in ANSYS Parametric Design Language (APDL). To evaluate the influence of capacitance profile on the acoustic radiated power, parametric studies are conducted. Based on the results of the parametric studies, the capacitance profile is tuned for minimum radiated power. It is revealed that the virtual acoustic black hole (ABH) effect can offer 10.29%, 6.37%, and 7.47% reduction in the radiated power from the first to the last targeted mode, respectively. The virtual ABH effect introduced in this study can be used for semi-active structural noise isolation without any weight or manufacturing penalty.
{"title":"Numerical realization of a semi-active virtual acoustic black hole effect","authors":"S. Soleimanian, G. Petrone, F. Franco, S. De Rosa, P. Kołakowski","doi":"10.3389/fmech.2023.1126489","DOIUrl":"https://doi.org/10.3389/fmech.2023.1126489","url":null,"abstract":"Noise mitigation by means of the acoustic black hole (ABH) effect is a well-known engineering solution. However, the conventional method of applying ABH effect which requires modification of the structure geometry has various limitations which encourage the research of virtual ABH concept. In this study, the effect of ABH was applied through introducing virtual stiffness by a shunt circuit. According to the force-voltage electric analogy, stiffness has an inverse relationship with capacitance. So that the ABH effect can be virtually realized by following a power law profile using an array of independent capacitive shunts. The concept is studied through finite element simulation developing a macro code in ANSYS Parametric Design Language (APDL). To evaluate the influence of capacitance profile on the acoustic radiated power, parametric studies are conducted. Based on the results of the parametric studies, the capacitance profile is tuned for minimum radiated power. It is revealed that the virtual acoustic black hole (ABH) effect can offer 10.29%, 6.37%, and 7.47% reduction in the radiated power from the first to the last targeted mode, respectively. The virtual ABH effect introduced in this study can be used for semi-active structural noise isolation without any weight or manufacturing penalty.","PeriodicalId":48635,"journal":{"name":"Frontiers of Mechanical Engineering","volume":" ","pages":""},"PeriodicalIF":4.5,"publicationDate":"2023-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"43399942","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-03-13DOI: 10.3389/fmech.2023.1139385
T. Newcomb
Hybrid electric and electric vehicles have represented a small portion of the automotive market for many years and mainly use current lubricants, typically automatic transmission fluids (ATFs). However, regulatory compliance to limit greenhouse gases and increased consumer demand have resulted in a rapid global transition to electrified vehicles. This has prompted the need for new advances in vehicle technology to improve efficiency and thereby increase range. Enabling and optimizing such advances requires a new generation of driveline lubricants. Incorporating an electric motor in a transmission or axle, where the motor is exposed to the gear box lubricant, creates new challenges that focus attention on lubricant characteristics that were previously not differentiating features, for example, electrical and thermal properties. Additionally, lubricants must now also be compatible with the constituents used in electric motors which include new polymeric materials and, in some cases, exposed copper. Compatibility tests of these polymers vary within the industry and the risk of copper corrosion in these applications is not always properly assessed by current specification tests. In this paper we will begin with a brief history of electric vehicles, highlight how driveline lubricants, specifically ATFs, have evolved over the years to meet new hardware requirements and then describe the performance requirements expected of lubricants specifically designed for vehicles with electric drive units (EDUs). Our primary goal, however, is to summarize the recent literature that illustrates the changing importance of various lubricant performance properties, new proposed test methods and offer some insight into future e-lubricant evolution.
{"title":"A brief review of the rapid transformation of driveline lubricants for hybrid electric and electric vehicles","authors":"T. Newcomb","doi":"10.3389/fmech.2023.1139385","DOIUrl":"https://doi.org/10.3389/fmech.2023.1139385","url":null,"abstract":"Hybrid electric and electric vehicles have represented a small portion of the automotive market for many years and mainly use current lubricants, typically automatic transmission fluids (ATFs). However, regulatory compliance to limit greenhouse gases and increased consumer demand have resulted in a rapid global transition to electrified vehicles. This has prompted the need for new advances in vehicle technology to improve efficiency and thereby increase range. Enabling and optimizing such advances requires a new generation of driveline lubricants. Incorporating an electric motor in a transmission or axle, where the motor is exposed to the gear box lubricant, creates new challenges that focus attention on lubricant characteristics that were previously not differentiating features, for example, electrical and thermal properties. Additionally, lubricants must now also be compatible with the constituents used in electric motors which include new polymeric materials and, in some cases, exposed copper. Compatibility tests of these polymers vary within the industry and the risk of copper corrosion in these applications is not always properly assessed by current specification tests. In this paper we will begin with a brief history of electric vehicles, highlight how driveline lubricants, specifically ATFs, have evolved over the years to meet new hardware requirements and then describe the performance requirements expected of lubricants specifically designed for vehicles with electric drive units (EDUs). Our primary goal, however, is to summarize the recent literature that illustrates the changing importance of various lubricant performance properties, new proposed test methods and offer some insight into future e-lubricant evolution.","PeriodicalId":48635,"journal":{"name":"Frontiers of Mechanical Engineering","volume":" ","pages":""},"PeriodicalIF":4.5,"publicationDate":"2023-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"45645532","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-03-06DOI: 10.3389/fmech.2023.1148276
Lars La Heij, S. Gkantonas, E. Mastorakos
There is evidence to suggest that airborne droplets play an important role in the transmission of respiratory diseases. The highest risk of exposure to these pathogens is in indoor environments, where airflow control has been recognized as one of the most effective engineering means to combat its spread. However, this can contribute to a significant increase in energy costs, as conventional ventilation is often not designed to remove contaminants efficiently. In this study, Computational Fluid Dynamics simulations were used to analyze how a novel ventilation approach, called Personalized Displacement Ventilation (PerDiVent), can simultaneously reduce both pathogenic airborne transmission and reduce energy costs in an open office. In addition, thermal comfort and noise were investigated to assess the practicality of the concept. PerDiVent was found to reduce the risk of cross infection by a factor of 1.08–2.0 compared to mixing ventilation in the worst and best case scenarios analyzed, and lead to savings in mechanical power of at least 30%. Furthermore, there is great potential to further improve the system and to increase the stated numbers substantially with relatively simple alterations to the design. Tools that can be used to great advantage for such optimization are also proposed in this work. These include a simple integral model and analytical metrics to estimate the reduction in cross-infection risk and energy savings as a function of PerDiVent’s effectiveness in removing contaminants. Finally, the system has a modular and highly flexible arrangement, which makes it suitable for retrofitting purposes in various indoor environments and integration with current ventilation systems. The concept shows great promise for the future, where ventilation is required to create healthier and more sustainable environments.
{"title":"Personalized displacement ventilation as an energy-efficient solution for airborne disease transmission control in offices","authors":"Lars La Heij, S. Gkantonas, E. Mastorakos","doi":"10.3389/fmech.2023.1148276","DOIUrl":"https://doi.org/10.3389/fmech.2023.1148276","url":null,"abstract":"There is evidence to suggest that airborne droplets play an important role in the transmission of respiratory diseases. The highest risk of exposure to these pathogens is in indoor environments, where airflow control has been recognized as one of the most effective engineering means to combat its spread. However, this can contribute to a significant increase in energy costs, as conventional ventilation is often not designed to remove contaminants efficiently. In this study, Computational Fluid Dynamics simulations were used to analyze how a novel ventilation approach, called Personalized Displacement Ventilation (PerDiVent), can simultaneously reduce both pathogenic airborne transmission and reduce energy costs in an open office. In addition, thermal comfort and noise were investigated to assess the practicality of the concept. PerDiVent was found to reduce the risk of cross infection by a factor of 1.08–2.0 compared to mixing ventilation in the worst and best case scenarios analyzed, and lead to savings in mechanical power of at least 30%. Furthermore, there is great potential to further improve the system and to increase the stated numbers substantially with relatively simple alterations to the design. Tools that can be used to great advantage for such optimization are also proposed in this work. These include a simple integral model and analytical metrics to estimate the reduction in cross-infection risk and energy savings as a function of PerDiVent’s effectiveness in removing contaminants. Finally, the system has a modular and highly flexible arrangement, which makes it suitable for retrofitting purposes in various indoor environments and integration with current ventilation systems. The concept shows great promise for the future, where ventilation is required to create healthier and more sustainable environments.","PeriodicalId":48635,"journal":{"name":"Frontiers of Mechanical Engineering","volume":" ","pages":""},"PeriodicalIF":4.5,"publicationDate":"2023-03-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"47005405","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-03-02DOI: 10.3389/fmech.2023.1142981
A. Zope, Sheng-Shian Li
Throughout human history, certain technologies/discoveries (e.g., fire, wheel, agriculture, printing, etc.) have had an unparalleled effect on the lifestyle. Integrated Circuit (IC) technology had an imitable impact on day-to-day lives in the late 20th century. The rapid growth in the performance of computation and its related applications was possible due to the regular shrinking of transistor size following Moore’s law (Moore, 2006). There is a growing demand for low-power, high computation, high data rate, and wireless chips in industry, automobiles, hospitals, homes, and personal devices. The recent semiconductor shortage due to the pandemic disrupted manufacturing directly affects the economy of many countries (Saracco, 2022). This has resulted in renewed interest in the acquisition of semiconductor technologies around the world. The pervasive adoption of 5G communication systems, electronic vehicles, high-performance computing, virtual reality, and personal entertainment devices is constrained by the complex and expensive fabrication technology required to continue device scaling with more-Moore (Yeric, 2016). Microelectromechanical Systems (MEMS) have been used to realize complex functions like sensors and actuators. MEMS can be combined with circuits to provide more-than-Moore functionality. The technology scaling has resulted in system-on-chip (SoC) which incorporates analog, digital, and RF circuits to satisfy multiple applications (i.e., more-than-Moore). This was extended with MEMS to the system-in-package (SiP) incorporating an accelerometer, gyroscope, barometer, magnetometer, heart-rate sensors, etc., with SoC in a package (Lammel, 2015). Traditionally, piezoelectric MEMS has seen greater interest due to the larger electromechanical coupling coefficient and direct replacement with quartz systems. Piezoelectric materials are not compatible with the CMOS fabrication process and require SiP. This limits device performance due to the parasitic effect of inter-package interconnects (Pillai et al., 2016). The fast data rate of modern SoC requires a small form factor to reduce the parasitic effect from PCB routing. With the advent of the Internet of Things (IoT), smart gadgets are needed to prevent congestion of the widely used 2.4 GHz band. Smart devices can collect data and process it to give predictive analysis, e.g., fall detection and call for assistance, warning about irregular heartbeats, increase in particulate matter, etc. A Smart system-on-chip (S-SoC) is the next logical step. A conceptual smart system on chip schematic for MEMS and circuit integration is depicted in Figure 1. The S-SoC would have sensors for the detection of physical, chemical, optical, and biological quantities. It would also have a MEMS transceiver integrated with OPEN ACCESS
{"title":"Editorial: Design and analysis of CMOS-MEMS transducers","authors":"A. Zope, Sheng-Shian Li","doi":"10.3389/fmech.2023.1142981","DOIUrl":"https://doi.org/10.3389/fmech.2023.1142981","url":null,"abstract":"Throughout human history, certain technologies/discoveries (e.g., fire, wheel, agriculture, printing, etc.) have had an unparalleled effect on the lifestyle. Integrated Circuit (IC) technology had an imitable impact on day-to-day lives in the late 20th century. The rapid growth in the performance of computation and its related applications was possible due to the regular shrinking of transistor size following Moore’s law (Moore, 2006). There is a growing demand for low-power, high computation, high data rate, and wireless chips in industry, automobiles, hospitals, homes, and personal devices. The recent semiconductor shortage due to the pandemic disrupted manufacturing directly affects the economy of many countries (Saracco, 2022). This has resulted in renewed interest in the acquisition of semiconductor technologies around the world. The pervasive adoption of 5G communication systems, electronic vehicles, high-performance computing, virtual reality, and personal entertainment devices is constrained by the complex and expensive fabrication technology required to continue device scaling with more-Moore (Yeric, 2016). Microelectromechanical Systems (MEMS) have been used to realize complex functions like sensors and actuators. MEMS can be combined with circuits to provide more-than-Moore functionality. The technology scaling has resulted in system-on-chip (SoC) which incorporates analog, digital, and RF circuits to satisfy multiple applications (i.e., more-than-Moore). This was extended with MEMS to the system-in-package (SiP) incorporating an accelerometer, gyroscope, barometer, magnetometer, heart-rate sensors, etc., with SoC in a package (Lammel, 2015). Traditionally, piezoelectric MEMS has seen greater interest due to the larger electromechanical coupling coefficient and direct replacement with quartz systems. Piezoelectric materials are not compatible with the CMOS fabrication process and require SiP. This limits device performance due to the parasitic effect of inter-package interconnects (Pillai et al., 2016). The fast data rate of modern SoC requires a small form factor to reduce the parasitic effect from PCB routing. With the advent of the Internet of Things (IoT), smart gadgets are needed to prevent congestion of the widely used 2.4 GHz band. Smart devices can collect data and process it to give predictive analysis, e.g., fall detection and call for assistance, warning about irregular heartbeats, increase in particulate matter, etc. A Smart system-on-chip (S-SoC) is the next logical step. A conceptual smart system on chip schematic for MEMS and circuit integration is depicted in Figure 1. The S-SoC would have sensors for the detection of physical, chemical, optical, and biological quantities. It would also have a MEMS transceiver integrated with OPEN ACCESS","PeriodicalId":48635,"journal":{"name":"Frontiers of Mechanical Engineering","volume":" ","pages":""},"PeriodicalIF":4.5,"publicationDate":"2023-03-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"45686260","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-03-02DOI: 10.3389/fmech.2023.1019979
Junxiao Du, Steve Franklin, B. Weber
In the pre-sliding friction regime, interfaces partially stick and partially slip. The pre-slip is thought to be locally initiated at regions of the interface where the ratio of shear stress to normal stress exceeds a critical value. The displacements involved in pre-slip can be limited to the nanoscale, especially for stiff interfaces. Furthermore, little is known experimentally about the interplay between surface topography, pre-sliding behavior and wear. In this work, we introduce a pre-sliding tribometer that enables the study of how the pre-sliding friction at various types of ball-on-flat interfaces evolves as a function of wear. Polytetrafluoroethylene-on-silicon (PTFE-on-Si) pre-sliding measurements covering interfacial displacements up to 50 nm, conducted with the new instrument, show good agreement with Mindlin theory predictions, without adjustable parameters.
{"title":"A force controlled tribometer for pre-sliding measurements at the nanometer scale","authors":"Junxiao Du, Steve Franklin, B. Weber","doi":"10.3389/fmech.2023.1019979","DOIUrl":"https://doi.org/10.3389/fmech.2023.1019979","url":null,"abstract":"In the pre-sliding friction regime, interfaces partially stick and partially slip. The pre-slip is thought to be locally initiated at regions of the interface where the ratio of shear stress to normal stress exceeds a critical value. The displacements involved in pre-slip can be limited to the nanoscale, especially for stiff interfaces. Furthermore, little is known experimentally about the interplay between surface topography, pre-sliding behavior and wear. In this work, we introduce a pre-sliding tribometer that enables the study of how the pre-sliding friction at various types of ball-on-flat interfaces evolves as a function of wear. Polytetrafluoroethylene-on-silicon (PTFE-on-Si) pre-sliding measurements covering interfacial displacements up to 50 nm, conducted with the new instrument, show good agreement with Mindlin theory predictions, without adjustable parameters.","PeriodicalId":48635,"journal":{"name":"Frontiers of Mechanical Engineering","volume":" ","pages":""},"PeriodicalIF":4.5,"publicationDate":"2023-03-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"44749709","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-03-01DOI: 10.1007/s11465-022-0729-8
Heng Luo, Z. Dong, R. Kang, Yidan Wang, Jian-hua Sun, Zhaocheng Wei
{"title":"Postprocessor development for ultrasonic cutting of honeycomb core curved surface with a straight blade","authors":"Heng Luo, Z. Dong, R. Kang, Yidan Wang, Jian-hua Sun, Zhaocheng Wei","doi":"10.1007/s11465-022-0729-8","DOIUrl":"https://doi.org/10.1007/s11465-022-0729-8","url":null,"abstract":"","PeriodicalId":48635,"journal":{"name":"Frontiers of Mechanical Engineering","volume":"18 1","pages":"1-16"},"PeriodicalIF":4.5,"publicationDate":"2023-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"41622162","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-03-01DOI: 10.1007/s11465-022-0731-1
Chunyan Ao, Baijie Qiao, Kai Zhou, Lei Chen, S. Fu, X. Chen
{"title":"Full-field dynamic strain reconstruction of an aero-engine blade from limited displacement responses","authors":"Chunyan Ao, Baijie Qiao, Kai Zhou, Lei Chen, S. Fu, X. Chen","doi":"10.1007/s11465-022-0731-1","DOIUrl":"https://doi.org/10.1007/s11465-022-0731-1","url":null,"abstract":"","PeriodicalId":48635,"journal":{"name":"Frontiers of Mechanical Engineering","volume":" ","pages":"1-17"},"PeriodicalIF":4.5,"publicationDate":"2023-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"46074685","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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