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Kr-Plasma Sputtering for Pt Gate Electrode Deposition on MFSFET with 5 nm-Thick Ferroelectric Nondoped HfO2 Gate Insulator for Analog Memory Application 在5nm厚铁电非掺杂HfO2栅极绝缘体mfset上沉积Pt栅极的kr等离子溅射技术
IF 0.5 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2023-01-01 DOI: 10.1587/transele.2022fup0003
Joong‐Won Shin, Masakazu Tanuma, S. Ohmi
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引用次数: 0
A Method for Researching the Influence of Relay Coil Location on the Transmission Efficiency of Wireless Power Transfer System 继电器线圈位置对无线电力传输系统传输效率影响的研究方法
IF 0.5 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2023-01-01 DOI: 10.1587/transele.2022ecp5057
Pengfei Gao, Xiaoying Tian, Yannan Shi
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引用次数: 0
Evaluation of Transmission Characteristics of 120-GHz-Band Close-Proximity Wireless Links Using Split-Ring-Resonator Absorber Integrated Planar Slot Antenna 分环谐振吸收集成平面缝隙天线对120 ghz频段近距离无线链路传输特性的评估
IF 0.5 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2023-01-01 DOI: 10.1587/transele.2022ecp5065
A. Hirata, Tubasa Saijo, Yuma Kawamoto, T. Nagatsuma, I. Watanabe, N. Sekine, A. Kasamatsu
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引用次数: 0
Broadband port-selective silicon beam scanning device for free-space optical communication 用于自由空间光通信的宽带端口选择性硅束扫描装置
IF 0.5 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2023-01-01 DOI: 10.1587/transele.2022oci0001
Y. Atsumi, Tomoya Yoshida, R. Matsumoto, R. Konoike, Y. Sakakibara, Takashi Inoue, Keijiro Suzuki
SUMMARY Indoor free space optical (FSO) communication technology that provides high-speed connectivity to edge users is expected to be introduced in the near future mobile communication system, where the silicon photonics solid-state beam scanning device is a promising tool because of its low cost, long-term reliability, and other beneficial properties. However, the current two-dimensional beam scanning devices using grating coupler arrays have di ffi culty in increasing the transmission capacity because of bandwidth regulation. To solve the problem, we have introduced a broadband surface optical coupler, “elephant coupler,” which has great potential for combining wavelength and spatial division multiplexing technologies into the beam scanning device, as an alternative to grating couplers. The prototype port-selective silicon beam scanning device fabricated using a 300 mm CMOS pilot line achieved broadband optical beam emission with a 1 dB-loss bandwidth of 40 nm and demonstrated beam scanning using an imaging lens. The device has also exhibited free-space signal transmission of non-return-to-zero on-o ff -keying signals at 10 Gbps over a wide wavelength range of 60 nm. In this paper, we present an overview of the developed beam scanning device. Furthermore, the theoretical design guidelines for indoor mobile FSO communication are discussed.
为边缘用户提供高速连接的室内自由空间光学(FSO)通信技术有望在不久的将来被引入移动通信系统,其中硅光子固态光束扫描设备因其低成本、长期可靠性和其他有益特性而成为一种有前途的工具。然而,目前使用光栅耦合器阵列的二维光束扫描设备由于带宽的限制,在提高传输容量方面存在困难。为了解决这个问题,我们引入了一种宽带表面光耦合器,“大象耦合器”,它具有将波长和空分复用技术结合到波束扫描设备中的巨大潜力,作为光栅耦合器的替代品。采用300 mm CMOS导频线制作的端口选择性硅光束扫描装置原型实现了1 db损耗带宽为40 nm的宽带光束发射,并演示了使用成像透镜进行光束扫描。该器件还展示了在60 nm宽波长范围内以10 Gbps的速度传输不归零开关信号的自由空间信号。本文对研制的波束扫描装置进行了综述。在此基础上,讨论了室内移动FSO通信的理论设计准则。
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引用次数: 0
128 Gbit/s operation of AXEL with energy efficiency of 1.5 pJ/bit for optical interconnection 128 Gbit/s的AXEL操作,能量效率为1.5 pJ/bit,用于光互连
IF 0.5 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2023-01-01 DOI: 10.1587/transele.2022oci0002
W. Kobayashi, S. Kanazawa, T. Shindo, M. Mitsuhara, F. Nakajima
SUMMARY We evaluated the energy efficiency per 1-bit transmission of an optical light source on InP substrate to achieve optical interconnection. A semiconductor optical amplifier (SOA) assisted extended reach EADFB laser (AXEL) was utilized as the optical light source to enhance the energy efficiency compared to the conventional electro-absorption modulator integrated with a DFB laser (EML). The AXEL has frequency bandwidth extendibility for operation of over 100 Gbit/s, which is difficult when using a vertical cavity surface emitting laser (VCSEL) without an equalizer. By designing the AXEL for low power consumption, we were able to achieve 64-Gbit/s, 1.0 pJ/bit and 128-Gbit/s, 1.5 pJ/bit operation at 50 °C with the transmitter dispersion and eye closure quaternary of 1.1 dB.
我们评估了光光源在InP衬底上每1位传输的能量效率,以实现光互连。采用半导体光放大器(SOA)辅助的扩展距离EADFB激光器(AXEL)作为光光源,与传统的电吸收调制器集成DFB激光器(EML)相比,提高了光能效率。AXEL具有超过100 Gbit/s的频率带宽可扩展性,这在使用没有均衡器的垂直腔面发射激光器(VCSEL)时是困难的。通过设计低功耗AXEL,我们能够在50°C下实现64 gbit /s, 1.0 pJ/bit和128 gbit /s, 1.5 pJ/bit的工作,发射机色散和眼闭四分之一为1.1 dB。
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引用次数: 0
300-GHz-band diplexer for frequency-division multiplexed wireless communication 用于频分复用无线通信的300 ghz频段双工器
IF 0.5 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2023-01-01 DOI: 10.1587/transele.2023mms0006
Yuma Kawamoto, Toki Yoshioka, Norihiko Shibata, D. Headland, Masayuki Fujita, Ryo Koma, Ryo Igarashi, K. Hara, J. Kani, T. Nagatsuma
SUMMARY We propose a novel silicon diplexer integrated with filters for frequency-division multiplexing in the 300-GHz band. The diplexer consists of a directional coupler formed of unclad silicon wires, a photonic bandgap-based low-pass filter, and a high-pass filter based on frequency-dependent bending loss. These integrated filters are capable of suppressing crosstalk and providing >15 dB isolation over 40 GHz, which is highly beneficial for terahertz-range wireless communications applications. We have used this diplexer in a simultaneous error-free wireless transmission of 300-GHz and 335-GHz channels at the aggregate data rate of 36 Gbit/s.
我们提出了一种集成了滤波器的新型硅双工器,用于300 ghz频段的频分复用。该双工器包括一个由无包层硅线组成的定向耦合器、一个基于光子带隙的低通滤波器和一个基于频率相关弯曲损耗的高通滤波器。这些集成滤波器能够抑制串扰,并在40 GHz范围内提供> - 15 dB隔离,这对太赫兹范围的无线通信应用非常有益。我们已将该双工器用于300 ghz和335 ghz信道的同时无差错无线传输,总数据速率为36 Gbit/s。
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引用次数: 1
Contact Pad Design Considerations for Semiconductor Qubit Devices for Reducing On-Chip Microwave Crosstalk 减少片上微波串扰的半导体量子位器件的接触垫设计考虑
IF 0.5 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2023-01-01 DOI: 10.1587/transele.2022fus0001
Kaito Tomari, J. Yoneda, T. Kodera
SUMMARY Reducing on-chip microwave crosstalk is crucial for semiconductor spin qubit integration. Toward crosstalk reduction and qubit integration, we investigate on-chip microwave crosstalk for gate electrode pad designs with (i) etched trenches between contact pads or (ii) contact pads with reduced sizes. We conclude that the design with feature (ii) is advantageous for high-density integration of semiconductor qubits with small crosstalk (below -25 dB at 6 GHz), favoring the introduction of flip- chip bonding.
减少片上微波串扰是半导体自旋量子比特集成的关键。为了减少串扰和量子比特集成,我们研究了片上微波串扰的栅极衬垫设计(i)在接触衬垫之间蚀刻沟槽或(ii)减小尺寸的接触衬垫。我们得出的结论是,具有特征(ii)的设计有利于具有小串扰(6 GHz时低于-25 dB)的半导体量子位的高密度集成,有利于引入倒装芯片键合。
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引用次数: 0
Single-Power-Supply Six-Transistor CMOS SRAM Enabling Low-Voltage Writing, Low-Voltage Reading, and Low Standby Power Consumption 支持低电压写入、低电压读取和低待机功耗的单电源六晶体管CMOS SRAM
IF 0.5 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2023-01-01 DOI: 10.1587/transele.2022ecp5053
T. Enomoto, Nobuaki Kobayashi
SUMMARY We developed a self-controllable voltage level (SVL) circuit and applied this circuit to a single-power-supply, six-transistor complementary metal-oxide-semiconductor static random-access memory (SRAM) to not only improve both write and read performances but also to achieve low standby power and data retention (holding) capability. The SVL circuit comprises only three MOSFETs (i.e., pull-up, pull-down and bypass MOSFETs). The SVL circuit is able to adaptively generate both optimal memory cell voltages and word line voltages depending on which mode of operation (i.e., write, read or hold operation) was used. The write margin ( V WM ) and read margin ( V RM ) of the developed (dvlp) SRAM at a supply voltage ( V DD ) of 1 V were 0.470 and 0.1923 V, respectively. These values were 1.309 and 2.093 times V WM and V RM of the conventional (conv) SRAM, respectively. At a large threshold voltage ( V t ) variability (= +6 σ ), the minimum power supply voltage ( V Min ) for the write operation of the conv SRAM was 0.37 V, whereas it decreased to 0.22 V for the dvlp SRAM. V Min for the read operation of the conv SRAM was 1.05 V when the V t variability (= -6 σ ) was large, but the dvlp SRAM lowered it to 0.41 V. These results show that the SVL circuit expands the operating voltage range for both write and read operations to lower voltages. The dvlp SRAM reduces the standby power consumption ( P ST ) while retaining data. The measured P ST of the 2k-bit, 90-nm dvlp SRAM was only 0.957 μ W at V DD = 1.0 V, which was 9.46% of P ST of the conv SRAM (10.12 μ W). The Si area overhead of the SVL circuits was only 1.383% of the dvlp SRAM.
我们开发了一种自可控电压电平(SVL)电路,并将该电路应用于单电源、六晶体管互补金属氧化物半导体静态随机存取存储器(SRAM),不仅提高了写入和读取性能,而且还实现了低待机功耗和数据保留(保持)能力。SVL电路仅包括三个mosfet(即,上拉,下拉和旁路mosfet)。SVL电路能够根据所使用的操作模式(即写、读或保持操作)自适应地产生最佳存储单元电压和字线电压。开发的(dvlp) SRAM在电源电压(vdd)为1 V时的写裕量(vwm)和读裕量(vrm)分别为0.470 V和0.1923 V。这些值分别是常规(conv) SRAM的vwm和vrm的1.309和2.093倍。在较大的阈值电压(V t)变异性(= +6 σ)下,conv SRAM的最小写电源电压(V Min)为0.37 V,而dvlp SRAM的最小写电源电压为0.22 V。当V t变异性(= -6 σ)较大时,逆变式SRAM的读操作最小值为1.05 V,而dvlp SRAM的读操作最小值为0.41 V。这些结果表明,SVL电路将写入和读取操作的工作电压范围扩展到更低的电压。dvlp SRAM在保留数据的同时降低了待机功耗(pst)。在电压DD = 1.0 V时,该电路的pst仅为0.957 μ W,为普通SRAM (10.12 μ W)的9.46%,SRAM的Si面积开销仅为普通SRAM的1.383%。
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引用次数: 0
Fine feature analysis of metal plate based on two-dimensional imaging under non-ideal scattering 基于非理想散射二维成像的金属板精细特征分析
IF 0.5 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2023-01-01 DOI: 10.1587/transele.2022ecp5054
Xiaofang Li, B. Deng, Qiang Fu, Hongqiang Wang
SUMMARY The ideal point scattering model requires that each scattering center is isotropic, the position of the scattering center corresponding to the target remains unchanged, and the backscattering amplitude and phase of the target do not change with the incident frequency and incident azimuth. In fact, these conditions of the ideal point scattering model are difficult to meet, and the scattering models are not ideal in most cases. In order to understand the difference between non-ideal scattering center and ideal scattering center, this paper takes a metal plate as the research object, carries out two-dimensional imaging of the metal plate, compares the difference between the imaging position and the theoretical target position, and compares the shape of the scattering center obtained from two-dimensional imaging of the plate from different angles. From the experimental results, the offset between the scattering center position and the theoretical target position corresponding to the two-dimensional imaging of the plate under the non-ideal point scattering model is less than the range resolution and azimuth resolution. The deviation between the small angle two-dimensional imaging position and the theoretical target position using the ideal point scattering model is small, and the ideal point scattering model is still suitable for the two-dimensional imaging of the plate. In the imaging process, the ratio of range resolution and azimuth resolution affects the shape of the scattering center. The range resolution is equal to the azimuth resolution, the shape of the scattering center is circular; the range resolution is not equal to the azimuth resolution, and the shape of the scattering center is elliptic. In order to obtain more accurate two-dimensional image, the appropriate range resolution and azimuth resolution can be considered when using the ideal point scattering model for two-dimensional imaging. The two-dimensional imaging results of the plate at different azimuth and angle can be used as a reference for the study of non-ideal point scattering model.
理想的点散射模型要求每个散射中心是各向同性的,散射中心对应目标的位置保持不变,目标的后向散射振幅和相位不随入射频率和入射方位角的变化而变化。实际上,理想点散射模型的这些条件很难满足,散射模型在大多数情况下都是不理想的。为了了解非理想散射中心与理想散射中心的区别,本文以金属板为研究对象,对金属板进行二维成像,比较成像位置与理论目标位置的差异,并比较从不同角度对金属板进行二维成像得到的散射中心形状。从实验结果来看,非理想点散射模型下平板二维成像所对应的散射中心位置与理论目标位置之间的偏移量小于距离分辨率和方位角分辨率。理想点散射模型的小角度二维成像位置与理论目标位置的偏差较小,理想点散射模型仍然适用于平板的二维成像。在成像过程中,距离分辨率和方位角分辨率的比值影响着散射中心的形状。距离分辨率等于方位角分辨率,散射中心形状为圆形;距离分辨率不等于方位角分辨率,散射中心呈椭圆形。为了获得更精确的二维图像,在使用理想的点散射模型进行二维成像时,可以考虑适当的距离分辨率和方位角分辨率。平板在不同方位角下的二维成像结果可为非理想点散射模型的研究提供参考。
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引用次数: 0
Uniform/Selective Heating Microwave Oven Using High Efficiency GaN-on-GaN HEMT Power Amplifier 采用高效GaN-on-GaN HEMT功率放大器的均匀/选择性加热微波炉
IF 0.5 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2023-01-01 DOI: 10.1587/transele.2022ecp5046
Masaru Sato, Y. Kumazaki, N. Okamoto, T. Ohki, N. Kurahashi, M. Nishimori, A. Yamada, J. Kotani, N. Hara, Keiji Watanabe
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引用次数: 0
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IEICE Transactions on Electronics
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