Pub Date : 2024-01-31DOI: 10.1109/mias.2023.3338786
David B. Durocher
In a recent IEEE Industry Applications Magazine “From the Editor’s Desk” column [1] , I shared the results of a 2023 IEEE Industry Applications Society (IAS) member satisfaction survey conducted by IEEE Strategic Research. The survey queried a randomly selected group of 6,000 active members. We received 811 responses, a response rate of 13.5%, which is considered fairly high for this type of random member survey. One very positive outcome from the respondents was confirmation that a large majority of IAS members are satisfied with their membership (76.8%) and likely to renew (84.5%). If you are reading this article, I thank you! Obviously, you are one of these members.
{"title":"Society Demographics: An Opportunity to Leverage Experience [From the Editor’s Desk]","authors":"David B. Durocher","doi":"10.1109/mias.2023.3338786","DOIUrl":"https://doi.org/10.1109/mias.2023.3338786","url":null,"abstract":"In a recent <italic xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\">IEEE Industry Applications Magazine</i> “From the Editor’s Desk” column <xref ref-type=\"bibr\" r xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\">[1]</xref>\u0000, I shared the results of a 2023 IEEE Industry Applications Society (IAS) member satisfaction survey conducted by IEEE Strategic Research. The survey queried a randomly selected group of 6,000 active members. We received 811 responses, a response rate of 13.5%, which is considered fairly high for this type of random member survey. One very positive outcome from the respondents was confirmation that a large majority of IAS members are satisfied with their membership (76.8%) and likely to renew (84.5%). If you are reading this article, I thank you! Obviously, you are one of these members.","PeriodicalId":50390,"journal":{"name":"IEEE Industry Applications Magazine","volume":null,"pages":null},"PeriodicalIF":0.8,"publicationDate":"2024-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139669637","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-01-17DOI: 10.1109/mias.2023.3345835
Muhammad Arshad, Omid Beik, Ruth Pallapati, Scott Hoberg
{"title":"Overview and Impedance-Based Stability Analyses of Bison Wind Farm: A PRACTICAL EXAMPLE","authors":"Muhammad Arshad, Omid Beik, Ruth Pallapati, Scott Hoberg","doi":"10.1109/mias.2023.3345835","DOIUrl":"https://doi.org/10.1109/mias.2023.3345835","url":null,"abstract":"","PeriodicalId":50390,"journal":{"name":"IEEE Industry Applications Magazine","volume":null,"pages":null},"PeriodicalIF":0.8,"publicationDate":"2024-01-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139955588","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-01-01DOI: 10.1109/mias.2023.3332414
{"title":"0","authors":"","doi":"10.1109/mias.2023.3332414","DOIUrl":"https://doi.org/10.1109/mias.2023.3332414","url":null,"abstract":"","PeriodicalId":50390,"journal":{"name":"IEEE Industry Applications Magazine","volume":null,"pages":null},"PeriodicalIF":0.8,"publicationDate":"2024-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139128443","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-01-01DOI: 10.1109/mias.2023.3332410
{"title":"EPICS IN IEEE","authors":"","doi":"10.1109/mias.2023.3332410","DOIUrl":"https://doi.org/10.1109/mias.2023.3332410","url":null,"abstract":"","PeriodicalId":50390,"journal":{"name":"IEEE Industry Applications Magazine","volume":null,"pages":null},"PeriodicalIF":0.8,"publicationDate":"2024-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139129513","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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