Information Display最新文献

Cost, performance, and ease of adoption are key factors in implementing QDEL emissive display technology.

OLED continues to improve in technical terms and put pressure on LCD applications, while the LCD market has become more stable.

THE USE OF MICROLEDS (TINY LIGHT-EMITTING DIODES of gallium nitride) as subpixels represents a significant advancement in display technology, offering improved luminance, energy efficiency, and color quality. This innovation unlocks new opportunities in high dynamic range in direct-view displays, while also enabling high brightness and wider viewing angle near-eye displays for augmented and mixed reality (AR/MR) applications. However, to fully realize this potential, several critical challenges must be addressed, particularly in the realms of pixel yield during die-transfer and laser-assisted or anisotropic conductive film (ACF) bonding, optical efficiency, and manufacturing costs.

The traditional fabrication methods for microLED displays involve the use of red, green, and blue (RGB) GaN LED dice epitaxially grown on sapphire (or silicon) wafers. It is worth noting that AlGaInP red dice grown on gallium arsenide (or silicon or germanium) substrates may be substituted. In these conventional approaches, arrays of dice are created on each wafer and subsequently transferred to a backplane through a series of complex steps involving multiple interposers. This intricate transfer process can lead to yield loss, necessitating the implementation of die repair measures or redundancy in the form of two sets of RGB dice, both of which contribute to higher manufacturing costs. Furthermore, as the die-size decreases to achieve cost efficiency, microLED efficiency tends to decline based on increased carrier loss at the sidewalls, ultimately limiting overall pixel efficiency.

Current display technologies predominantly use backplanes with thin-film transistors (TFT) on glass substrates, optimized for high-yield production in display fabrication facilities that handle large substrates. Transitioning these TFT production lines to accommodate high-resolution microLED backplanes required for AR/MR displays presents significant engineering hurdles that may not be financially sustainable. For instance, manufacturing AR/MR displays at 5,000 ppi entails producing millions of subpixels in a small area—a monumental engineering feat. A more viable solution for AR/MR displays may lie in using silicon complementary metal-oxide semiconductor (CMOS) backplanes. Some companies have already demonstrated silicon CMOS backplanes capable of achieving 3,000-ppi resolutions. The ongoing development of high-yield CMOS backplanes at larger sizes with resolutions exceeding 5,000 ppi is still in its nascent stages, but this holds promise for future advancements.

To foster a sustainable business model, it is essential to develop microLED display technology applicable to both direct-view and near-eye applications using processes and tools adaptable for both TFT on glass and silicon CMOS backplanes. The advancements in microLED display manufacturing are highlighted in this issue, which includes three articles focused on critical aspects of microLED manufacturing t

The microLED mass transfer process is a critical step in display manufacturing. Laser-assisted eutectic bonding significantly improves photoelectric efficiency, accelerating microLED display commercialization.

Progress was evident in resolution and refresh rates, the integration of artificial intelligence, and sensing functionalities.

Novel particle-arrayed anisotropic conductive film enables reliable, low-temperature bonding on ultra-small pads, addressing key manufacturing challenges.

The latest impact factor of JSID is 2.2. Thank you to the authors, reviewers, and editorial team for their hard work.

Two special issues—artificial intelligence and machine learning in the display industry and augmented, virtual, and mixed reality (AR/VR/MR)—are set to be released in late 2025.

Chromaticity space uniformity and gamut: Analysis and visualization | Kenichiro Masaoka | https://doi.org/10.1002/jsid.2094

Stereopsis–occlusion conflicts impair visual performance in augmented reality | Daniel P. Spiegel & Ian M. Erkelens | https://doi.org/10.1002/jsid.2095

Riemannian color difference metric for spatial color gratings | Patrick Candry & Kristiaan Neyts | https://doi.org/10.1002/jsid.2100

A miniaturized augmented reality head-up display system based on real-time holographic with dynamic depth variation | Chien-Yu Chen et al. | https://doi.org/10.1002/jsid.2048

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Dynamic x-ray detection can acquire images at high frequency, continuously and smoothly, in contrast to the traditional method that relies on manually stitching and analyzing static images frame by frame.