In a high-power three-level inverter, a middle line is connected between an ac neutral point and a dc neutral point to construct a common-mode (CM) loop, which could reduce low-frequency electromagnetic interference (EMI). However, the stray inductance of the middle line may lead to CM voltage resonance, causing a new EMI problem. To address this challenge, this letter proposes an EMI model of the three-level inverter, which fully considers the neutral point to ground voltage fluctuation and the influence of the middle line stray inductance on resonance. Then, based on the EMI model, sensitivity analysis is performed to identify the primary CM resonance parameters, and the CM resonance mechanism is analyzed. According to the proposed EMI model, a new suppression method is developed. A capacitor is connected between the dc neutral point and the ground to eliminate the resonance, which could significantly reduce the size and cost of EMI filters. Both the accuracy of the EMI model and the effectiveness of the suppression method are validated through simulation and measurement.
{"title":"Modeling and Suppression of Common-Mode Voltage Resonance in a Three-Level Inverter With Middle Line","authors":"Zhaocheng Zhong;Junhao Chang;Yikun Jiang;Henglin Chen","doi":"10.1109/TEMC.2025.3601240","DOIUrl":"10.1109/TEMC.2025.3601240","url":null,"abstract":"In a high-power three-level inverter, a middle line is connected between an ac neutral point and a dc neutral point to construct a common-mode (CM) loop, which could reduce low-frequency electromagnetic interference (EMI). However, the stray inductance of the middle line may lead to CM voltage resonance, causing a new EMI problem. To address this challenge, this letter proposes an EMI model of the three-level inverter, which fully considers the neutral point to ground voltage fluctuation and the influence of the middle line stray inductance on resonance. Then, based on the EMI model, sensitivity analysis is performed to identify the primary CM resonance parameters, and the CM resonance mechanism is analyzed. According to the proposed EMI model, a new suppression method is developed. A capacitor is connected between the dc neutral point and the ground to eliminate the resonance, which could significantly reduce the size and cost of EMI filters. Both the accuracy of the EMI model and the effectiveness of the suppression method are validated through simulation and measurement.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"67 5","pages":"1639-1643"},"PeriodicalIF":2.5,"publicationDate":"2025-09-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145017659","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-09-03DOI: 10.1109/TEMC.2025.3601209
Martin Humeau;Mohsen Koohestani;David Boudikian;Mohamed Ramdani
This article presents an extension of an analytical model designed to predict electromagnetic (EM) near-field coupling in automotive electronic systems. It incorporates a printed circuit board (PCB) into the modeling framework to better reflect real-world configurations and accurately account for EM interactions and signal integrity. The noise source is modeled as a single-turn metallic loop above a PCB ground plane, while the victim is represented by a wire positioned near the noise source. The proposed analytical method takes into account transmission line equations and the Biot–Savart law to calculate mutual inductance while optimizing computational efficiency. A detailed evaluation of the required number of wire sections and image loops ensures accurate modeling of magnetic field interactions. The analytical model was validated through full-wave simulations in Ansys HFSS and a measurement campaign. Results demonstrated good agreement between analytical predictions, simulations, and measurements across a frequency range of 1 MHz to 1 GHz, with deviations limited to acceptable margins. A key advantage of this approach is its computational efficiency, achieving results in seconds compared to hours required by full-wave simulations for the same number of frequencies. This optimization is particularly valuable in industrial contexts, where rapid design iteration is essential. By bridging the gap between analytical simplicity and real-world complexity, this study demonstrates the potential of the developed analytical model as a robust and time-efficient alternative for EM compatibility analysis.
{"title":"Modeling and Characterization of Near-Field Coupling Between Components and Harnesses in Presence of Ground Planes: A Case Study","authors":"Martin Humeau;Mohsen Koohestani;David Boudikian;Mohamed Ramdani","doi":"10.1109/TEMC.2025.3601209","DOIUrl":"10.1109/TEMC.2025.3601209","url":null,"abstract":"This article presents an extension of an analytical model designed to predict electromagnetic (EM) near-field coupling in automotive electronic systems. It incorporates a printed circuit board (PCB) into the modeling framework to better reflect real-world configurations and accurately account for EM interactions and signal integrity. The noise source is modeled as a single-turn metallic loop above a PCB ground plane, while the victim is represented by a wire positioned near the noise source. The proposed analytical method takes into account transmission line equations and the Biot–Savart law to calculate mutual inductance while optimizing computational efficiency. A detailed evaluation of the required number of wire sections and image loops ensures accurate modeling of magnetic field interactions. The analytical model was validated through full-wave simulations in Ansys HFSS and a measurement campaign. Results demonstrated good agreement between analytical predictions, simulations, and measurements across a frequency range of 1 MHz to 1 GHz, with deviations limited to acceptable margins. A key advantage of this approach is its computational efficiency, achieving results in seconds compared to hours required by full-wave simulations for the same number of frequencies. This optimization is particularly valuable in industrial contexts, where rapid design iteration is essential. By bridging the gap between analytical simplicity and real-world complexity, this study demonstrates the potential of the developed analytical model as a robust and time-efficient alternative for EM compatibility analysis.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"67 5","pages":"1605-1613"},"PeriodicalIF":2.5,"publicationDate":"2025-09-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144987693","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-09-03DOI: 10.1109/temc.2025.3600686
Yaya Liang, Wei Zhang, Pan Ren, Kaijin Wang, Xiaojie Li, Pingan Du
{"title":"Reconstructing Radiation Model of Chip in SiP Based on Magnetic Amplitude from Near-Field Scanning Measurements","authors":"Yaya Liang, Wei Zhang, Pan Ren, Kaijin Wang, Xiaojie Li, Pingan Du","doi":"10.1109/temc.2025.3600686","DOIUrl":"https://doi.org/10.1109/temc.2025.3600686","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"28 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-09-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144987590","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-08-29DOI: 10.1109/TEMC.2025.3594106
José A. Brandão Faria
This article comments on a recent IEEE Trans. EMC paper titled “New methodology for representing soil ionization in FDTD simulations of grounding electrodes,” where the Liew–Darveniza algorithm (1974) is used. We show that the assumption of cylinder-hemisphere equipotential patterns is not physically sound and propose an alternative that uses confocal hemi-ellipsoidal equipotential patterns.
{"title":"Comments on “New Methodology for Representing Soil Ionization in FDTD Simulations of Grounding Electrodes”","authors":"José A. Brandão Faria","doi":"10.1109/TEMC.2025.3594106","DOIUrl":"10.1109/TEMC.2025.3594106","url":null,"abstract":"This article comments on a recent IEEE Trans. EMC paper titled “New methodology for representing soil ionization in FDTD simulations of grounding electrodes,” where the Liew–Darveniza algorithm (1974) is used. We show that the assumption of cylinder-hemisphere equipotential patterns is not physically sound and propose an alternative that uses confocal hemi-ellipsoidal equipotential patterns.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"67 5","pages":"1644-1646"},"PeriodicalIF":2.5,"publicationDate":"2025-08-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144919234","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-08-29DOI: 10.1109/temc.2025.3595604
Jian-Bin Fan, Zhong-Xin Li
{"title":"Simulation of Lightning Response of Grounding Grids in Horizontal Multilayered Soils Based on Time-Domain Galerkin’s Moment Method","authors":"Jian-Bin Fan, Zhong-Xin Li","doi":"10.1109/temc.2025.3595604","DOIUrl":"https://doi.org/10.1109/temc.2025.3595604","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"23 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-08-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144919235","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-08-26DOI: 10.1109/temc.2025.3596686
Nur Sarma, Secil Genc, Burcu Mantar Gundogdu, Kubra Nur Akpinar, Cenk Gezegin, Okan Ozgonenel
{"title":"Conducted Emission Study of a Grid-Connected Single-Phase Bidirectional AC–DC Converter for Grid to Vehicle Applications","authors":"Nur Sarma, Secil Genc, Burcu Mantar Gundogdu, Kubra Nur Akpinar, Cenk Gezegin, Okan Ozgonenel","doi":"10.1109/temc.2025.3596686","DOIUrl":"https://doi.org/10.1109/temc.2025.3596686","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"3 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-08-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144905904","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：