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IEEE Transactions on Electromagnetic Compatibility最新文献

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Two-Stage Adaptive Data Recovery Method From Electromagnetic Emanations Using Error Detection Codes 基于错误检测码的电磁辐射两阶段自适应数据恢复方法
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Electromagnetic Compatibility
Pub Date : 2025-11-18 DOI: 10.1109/temc.2025.3631109
Koki Abe, Taiki Kitazawa, Daisuke Fujimoto, Yuichi Hayashi
{"title":"Two-Stage Adaptive Data Recovery Method From Electromagnetic Emanations Using Error Detection Codes","authors":"Koki Abe, Taiki Kitazawa, Daisuke Fujimoto, Yuichi Hayashi","doi":"10.1109/temc.2025.3631109","DOIUrl":"https://doi.org/10.1109/temc.2025.3631109","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"32 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-11-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145545734","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Modeling Mutual Inductance in Horizontal Inductors: A Simple Analytical Method Accounting for Multidirectional Near-Field Coupling 水平电感互感的建模：一种考虑多向近场耦合的简单解析方法
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Electromagnetic Compatibility
Pub Date : 2025-11-14 DOI: 10.1109/temc.2025.3628063
Mohamed G. Congo, Mohsen Koohestani, Frédéric Lafon, Richard Perdriau, Mohamed Ramdani
{"title":"Modeling Mutual Inductance in Horizontal Inductors: A Simple Analytical Method Accounting for Multidirectional Near-Field Coupling","authors":"Mohamed G. Congo, Mohsen Koohestani, Frédéric Lafon, Richard Perdriau, Mohamed Ramdani","doi":"10.1109/temc.2025.3628063","DOIUrl":"https://doi.org/10.1109/temc.2025.3628063","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"174 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-11-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145515964","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Reinforcement Learning-Based Multiphysics Optimization of Composite Material Component With Slot-Structure in UAV System 基于强化学习的无人机缝状结构复合材料构件多物理场优化
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Electromagnetic Compatibility
Pub Date : 2025-11-13 DOI: 10.1109/temc.2025.3627846
Xinsong Wang, Guangzhi Chen, Shunchuan Yang, Qiang Ren, Zhiyu Jia, Jingxuan Chen, Yifei Gao, Wanli Du, Donglin Su
{"title":"A Reinforcement Learning-Based Multiphysics Optimization of Composite Material Component With Slot-Structure in UAV System","authors":"Xinsong Wang, Guangzhi Chen, Shunchuan Yang, Qiang Ren, Zhiyu Jia, Jingxuan Chen, Yifei Gao, Wanli Du, Donglin Su","doi":"10.1109/temc.2025.3627846","DOIUrl":"https://doi.org/10.1109/temc.2025.3627846","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"25 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145509478","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Characterization and Full-Wave Modeling of Corona Discharge Induced Coupling to Touchscreen Displays 触屏显示器电晕放电耦合特性及全波建模
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Electromagnetic Compatibility
Pub Date : 2025-11-13 DOI: 10.1109/temc.2025.3626743
Zhekun Peng, Shubhankar Marathe, Javad Meiguni, Ali Foudazi, Jianchi Zhou, Li Shen, Viswa Pilla, Cheung-Wei Lam, DongHyun Kim, David Pommerenke, Daryl G. Beetner
{"title":"Characterization and Full-Wave Modeling of Corona Discharge Induced Coupling to Touchscreen Displays","authors":"Zhekun Peng, Shubhankar Marathe, Javad Meiguni, Ali Foudazi, Jianchi Zhou, Li Shen, Viswa Pilla, Cheung-Wei Lam, DongHyun Kim, David Pommerenke, Daryl G. Beetner","doi":"10.1109/temc.2025.3626743","DOIUrl":"https://doi.org/10.1109/temc.2025.3626743","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"7 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145509481","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Modeling of Slot-Backed Microstrip Line for EMI Applications 用于电磁干扰应用的槽背微带线建模
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Electromagnetic Compatibility
Pub Date : 2025-11-13 DOI: 10.1109/temc.2025.3626471
Jongsuk Hyun, Wenchang Huang, Chulsoon Hwang
{"title":"Modeling of Slot-Backed Microstrip Line for EMI Applications","authors":"Jongsuk Hyun, Wenchang Huang, Chulsoon Hwang","doi":"10.1109/temc.2025.3626471","DOIUrl":"https://doi.org/10.1109/temc.2025.3626471","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"11 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145509476","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Orthopedic Implants Induced Unintended Nerve Stimulation During Transcutaneous Electrical Nerve Stimulation Treatment 骨科植入物在经皮神经电刺激治疗中诱导非预期神经刺激
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Electromagnetic Compatibility
Pub Date : 2025-11-11 DOI: 10.1109/temc.2025.3627884
Farzad Mir, Mingtao Du, Ziyu Zuo, Lijian Yang, Norbert Kaula, Hui Ye, Jianfeng Zheng, Ji Chen
{"title":"Orthopedic Implants Induced Unintended Nerve Stimulation During Transcutaneous Electrical Nerve Stimulation Treatment","authors":"Farzad Mir, Mingtao Du, Ziyu Zuo, Lijian Yang, Norbert Kaula, Hui Ye, Jianfeng Zheng, Ji Chen","doi":"10.1109/temc.2025.3627884","DOIUrl":"https://doi.org/10.1109/temc.2025.3627884","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"72 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-11-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145491810","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Dual-Mode Decoupling Network for Differential- and Common-Mode Noise Suppression in High-Speed Connector Systems 一种用于高速连接器系统差分和共模噪声抑制的双模解耦网络
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Electromagnetic Compatibility
Pub Date : 2025-11-07 DOI: 10.1109/temc.2025.3624698
Chih-Yu Fang, Bin-Chyi Tseng, Tzong-Lin Wu
{"title":"A Dual-Mode Decoupling Network for Differential- and Common-Mode Noise Suppression in High-Speed Connector Systems","authors":"Chih-Yu Fang, Bin-Chyi Tseng, Tzong-Lin Wu","doi":"10.1109/temc.2025.3624698","DOIUrl":"https://doi.org/10.1109/temc.2025.3624698","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"167 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145461359","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Parsimonious Angular Sampling for Fast Assessment of Mechanical Stirrer Efficiency 用于快速评估机械搅拌器效率的简约角度取样
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Electromagnetic Compatibility
Pub Date : 2025-11-05 DOI: 10.1109/temc.2025.3625532
Andrea Cozza
{"title":"Parsimonious Angular Sampling for Fast Assessment of Mechanical Stirrer Efficiency","authors":"Andrea Cozza","doi":"10.1109/temc.2025.3625532","DOIUrl":"https://doi.org/10.1109/temc.2025.3625532","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"40 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145447633","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Robust Estimation of the Effective Sample Size in Mode-Stirred Reverberation Chamber Measurements 模式搅拌混响室测量中有效样本量的鲁棒估计
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Electromagnetic Compatibility
Pub Date : 2025-11-05 DOI: 10.1109/temc.2025.3618326
Carlo F. M. Carobbi, Ramiro Serra
{"title":"Robust Estimation of the Effective Sample Size in Mode-Stirred Reverberation Chamber Measurements","authors":"Carlo F. M. Carobbi, Ramiro Serra","doi":"10.1109/temc.2025.3618326","DOIUrl":"https://doi.org/10.1109/temc.2025.3618326","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"18 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145447634","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Evolutionary Multiobjective T-Matrix Assisted Pin Map Optimization for Ball Grid Array Design 演化多目标t矩阵辅助针阵优化球栅阵列设计
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Electromagnetic Compatibility
Pub Date : 2025-11-03 DOI: 10.1109/temc.2025.3621456
Ruifeng Xu, Da Li, Ruyi Song, Hongchao Wang, Er-Ping Li
{"title":"Evolutionary Multiobjective T-Matrix Assisted Pin Map Optimization for Ball Grid Array Design","authors":"Ruifeng Xu, Da Li, Ruyi Song, Hongchao Wang, Er-Ping Li","doi":"10.1109/temc.2025.3621456","DOIUrl":"https://doi.org/10.1109/temc.2025.3621456","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"84 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-11-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145434067","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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