Pub Date : 2011-10-16DOI: 10.1109/CEIDP.2011.6232782
F. Baudoin, D. Mills, P. Lewin, S. Le Roy, G. Teyssèdre, C. Laurent
Recently, a charge transport model allowing the description of electroluminescence in polyethylene films under AC stress has been developed. The fluid model incorporates bipolar charge injection/extraction, transport and recombination. The model has been very successful in explaining the time-dependence of EL under 50 Hz sinusoidal, triangular and square voltage waveforms. In this work we discuss experimental measurements and simulations using different frequencies of the sinusoidal stress, voltage amplitude and offset.
{"title":"Modelling electroluminescence in insulating polymers under sinusoidal stress: Effect of applied voltage, frequency and offset","authors":"F. Baudoin, D. Mills, P. Lewin, S. Le Roy, G. Teyssèdre, C. Laurent","doi":"10.1109/CEIDP.2011.6232782","DOIUrl":"https://doi.org/10.1109/CEIDP.2011.6232782","url":null,"abstract":"Recently, a charge transport model allowing the description of electroluminescence in polyethylene films under AC stress has been developed. The fluid model incorporates bipolar charge injection/extraction, transport and recombination. The model has been very successful in explaining the time-dependence of EL under 50 Hz sinusoidal, triangular and square voltage waveforms. In this work we discuss experimental measurements and simulations using different frequencies of the sinusoidal stress, voltage amplitude and offset.","PeriodicalId":6317,"journal":{"name":"2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena","volume":"2 1","pages":"820-823"},"PeriodicalIF":0.0,"publicationDate":"2011-10-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"78795039","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-10-16DOI: 10.1109/CEIDP.2011.6232693
H. Illias, G. Chen, P. Lewin
In high voltage insulation systems, a typical defect that exists is a void cavity. It is known that voids are a common source of partial discharge (PD) activity within an insulation system. Research on PD activities within a single void in an insulation material has been widely published. However, studies of PDs within insulation containing multiple voids have not been widely reported. Thus, a simulation model has been developed in this work to attain a better insight of PD events due to multiple voids. Two- and three-dimensional model geometries, which consist of two spherical voids, arranged in different positions with respect to the applied field direction in a dielectric material have been developed using finite element analysis (FEA) software. The models have been used to study the electric field distribution in the voids and PD inception voltage for different distances between the two voids, locations in the material and their respective sizes.
{"title":"Partial discharge behaviour within two spherical cavities in a dielectric material","authors":"H. Illias, G. Chen, P. Lewin","doi":"10.1109/CEIDP.2011.6232693","DOIUrl":"https://doi.org/10.1109/CEIDP.2011.6232693","url":null,"abstract":"In high voltage insulation systems, a typical defect that exists is a void cavity. It is known that voids are a common source of partial discharge (PD) activity within an insulation system. Research on PD activities within a single void in an insulation material has been widely published. However, studies of PDs within insulation containing multiple voids have not been widely reported. Thus, a simulation model has been developed in this work to attain a better insight of PD events due to multiple voids. Two- and three-dimensional model geometries, which consist of two spherical voids, arranged in different positions with respect to the applied field direction in a dielectric material have been developed using finite element analysis (FEA) software. The models have been used to study the electric field distribution in the voids and PD inception voltage for different distances between the two voids, locations in the material and their respective sizes.","PeriodicalId":6317,"journal":{"name":"2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena","volume":"1 1","pages":"456-459"},"PeriodicalIF":0.0,"publicationDate":"2011-10-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77862733","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-10-16DOI: 10.1109/CEIDP.2011.6232737
M. Reading, Alun Vaughan, Paul Lewin
It has been seen previously that addition of fillers to host material systems can create composites with superior properties. In particular polymers have been shown to be good hosts for such property-boosting fillers. This investigation looks at such a polymer based nanocomposite, with the aim to produce a thermally conductive high voltage insulator. A standard thermosetting epoxy system and hardener were chosen to act as the host polymer due to its good initial mechanical and electrical properties. This system has also been successfully used previously to host other fillers. The filler chosen was boron nitride powder, due to its claim of having good insulation properties and high thermal conductivity. Several different sizes and aggregation states of boron nitride were tested and it was hoped that successful dispersion of the fillers would not only increase the breakdown strength of the material, but also the thermal conductivity.
{"title":"An investigation into improving the breakdown strength and thermal conduction of an epoxy system using boron nitride","authors":"M. Reading, Alun Vaughan, Paul Lewin","doi":"10.1109/CEIDP.2011.6232737","DOIUrl":"https://doi.org/10.1109/CEIDP.2011.6232737","url":null,"abstract":"It has been seen previously that addition of fillers to host material systems can create composites with superior properties. In particular polymers have been shown to be good hosts for such property-boosting fillers. This investigation looks at such a polymer based nanocomposite, with the aim to produce a thermally conductive high voltage insulator. A standard thermosetting epoxy system and hardener were chosen to act as the host polymer due to its good initial mechanical and electrical properties. This system has also been successfully used previously to host other fillers. The filler chosen was boron nitride powder, due to its claim of having good insulation properties and high thermal conductivity. Several different sizes and aggregation states of boron nitride were tested and it was hoped that successful dispersion of the fillers would not only increase the breakdown strength of the material, but also the thermal conductivity.","PeriodicalId":6317,"journal":{"name":"2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena","volume":"26 1","pages":"636-639"},"PeriodicalIF":0.0,"publicationDate":"2011-10-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82461184","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-10-01DOI: 10.1109/CEIDP.2011.6232708
Rongsheng Liu, G. Dominguez, A. Farkas
A new test cell is designed for making breakdown test on solid insulation materials for DC cables. Different from a conventional method, the new system uses a specially designed test chamber instead of insulation oil as ambient medium in order to prevent experiment failure from external flashover. The measure eliminates the need of the liquid and has ability to create breakdown data closer to the nature of solid insulation. Lightning impulse breakdown tests were performed on selected insulation materials. Breakdown strength of 400 kV/mm has been obtained for films about 100 μm in thickness. The data was compared with those of model cables tested with a larger thickness of insulation. Breakdown volume theory and up-scale effect are discussed. Power curve fit was made between breakdown strength and the thickness of insulation. A good correlation has been found, which makes it possible to predict the low probability value of breakdown of extruded DC cables at any thickness of insulation. A hypothesis is proposed which indicates that the propagation velocity of breakdown made contributions to the lightning impulse breakdown strength of an insulation material. Higher breakdown strength was found with a lower propagation velocity of a breakdown. The breakdown results show good agreement with data reported by others for the similar materials, and for polyethylene with inorganic fillers the breakdown strength might be slightly decreased.
{"title":"Impulse breakdown of extruded cable insulation materials","authors":"Rongsheng Liu, G. Dominguez, A. Farkas","doi":"10.1109/CEIDP.2011.6232708","DOIUrl":"https://doi.org/10.1109/CEIDP.2011.6232708","url":null,"abstract":"A new test cell is designed for making breakdown test on solid insulation materials for DC cables. Different from a conventional method, the new system uses a specially designed test chamber instead of insulation oil as ambient medium in order to prevent experiment failure from external flashover. The measure eliminates the need of the liquid and has ability to create breakdown data closer to the nature of solid insulation. Lightning impulse breakdown tests were performed on selected insulation materials. Breakdown strength of 400 kV/mm has been obtained for films about 100 μm in thickness. The data was compared with those of model cables tested with a larger thickness of insulation. Breakdown volume theory and up-scale effect are discussed. Power curve fit was made between breakdown strength and the thickness of insulation. A good correlation has been found, which makes it possible to predict the low probability value of breakdown of extruded DC cables at any thickness of insulation. A hypothesis is proposed which indicates that the propagation velocity of breakdown made contributions to the lightning impulse breakdown strength of an insulation material. Higher breakdown strength was found with a lower propagation velocity of a breakdown. The breakdown results show good agreement with data reported by others for the similar materials, and for polyethylene with inorganic fillers the breakdown strength might be slightly decreased.","PeriodicalId":6317,"journal":{"name":"2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena","volume":"70 1","pages":"518-521"},"PeriodicalIF":0.0,"publicationDate":"2011-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73193068","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-10-01DOI: 10.1109/CEIDP.2011.6232785
H. Okubo
Research and development results of enhancement techniques of electrical insulation performance for higher electric field application in power transmission/substation equipment such as transformers, switchgears and cables are described, especially based on the view point of dielectric materials. Firstly, the electric field analysis and field measurement techniques are introduced to discuss higher electric field equipment. Secondly, material techniques including gas, liquid, solid, vacuum and their composite systems, are discussed to clarify power equipment, with higher performance, lower losses, lower environmental impact and higher reliability. In the process of the development, a highly sophisticated new approach to clarify the physical mechanisms of the partial discharges was developed and applied. By the introduction and applications of the above mentioned new electrical insulation techniques based on dielectric materials, concepts of future power equipment with a higher electric field are proposed.
{"title":"Enhancement of electrical insulation performance in power equipment based on dielectric material techniques","authors":"H. Okubo","doi":"10.1109/CEIDP.2011.6232785","DOIUrl":"https://doi.org/10.1109/CEIDP.2011.6232785","url":null,"abstract":"Research and development results of enhancement techniques of electrical insulation performance for higher electric field application in power transmission/substation equipment such as transformers, switchgears and cables are described, especially based on the view point of dielectric materials. Firstly, the electric field analysis and field measurement techniques are introduced to discuss higher electric field equipment. Secondly, material techniques including gas, liquid, solid, vacuum and their composite systems, are discussed to clarify power equipment, with higher performance, lower losses, lower environmental impact and higher reliability. In the process of the development, a highly sophisticated new approach to clarify the physical mechanisms of the partial discharges was developed and applied. By the introduction and applications of the above mentioned new electrical insulation techniques based on dielectric materials, concepts of future power equipment with a higher electric field are proposed.","PeriodicalId":6317,"journal":{"name":"2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena","volume":"244 1","pages":"1-19"},"PeriodicalIF":0.0,"publicationDate":"2011-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75357103","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-10-01DOI: 10.1109/CEIDP.2011.6232667
H. Couderc, S. Savoie, M. Frechette, É. David, F. Guastavino, A. S. Thelakkadan, G. Coletti, A. Fina
Microcomposites are a well known class of materials. The enhancement of polymer matrix properties can be explained by the classical mixing law. But if the inclusion size is decreased to reach the nanometric range, the improvement of properties is no more due to mixing effect but to the influence of interface of nanoparticles on the matrix. A new emerging class of materials is composites reinforced with microparticles using a polymer matrix reinforced by nanoparticles. In order to study dielectric properties of such new materials, epoxy composites have been prepared using quartz as micro filler and organically modified Montmorillonite as nanofiller. Transmission Electron Microscopy has been used to determine the structure of the composites, which is neither exfoliated nor intercalated although the C30B stacks thickness is in the nanometric range. Differential Scanning Calorimetry experiments have been carried out to highlight the nano and microparticles effect on the epoxy matrix amorphous structure. The glass transition temperature is slightly affected by C30B addition but the microparticles inclusion produces a drastic decrease from 357K to 325K. The heat capacity step is rather unchanged except for the microcomposite. And finally, the dielectric properties of the materials have been studied by Broadband Dielectric Spectroscopy at different temperatures and frequencies. The relaxation times and the dielectric strengths associated with local β and γ relaxations and main α relaxation have been studied.
{"title":"Dielectric properties of epoxy/Montmorillonite nanocomposites and nanostructured epoxy/SiO2/Montmorillonite microcomposites","authors":"H. Couderc, S. Savoie, M. Frechette, É. David, F. Guastavino, A. S. Thelakkadan, G. Coletti, A. Fina","doi":"10.1109/CEIDP.2011.6232667","DOIUrl":"https://doi.org/10.1109/CEIDP.2011.6232667","url":null,"abstract":"Microcomposites are a well known class of materials. The enhancement of polymer matrix properties can be explained by the classical mixing law. But if the inclusion size is decreased to reach the nanometric range, the improvement of properties is no more due to mixing effect but to the influence of interface of nanoparticles on the matrix. A new emerging class of materials is composites reinforced with microparticles using a polymer matrix reinforced by nanoparticles. In order to study dielectric properties of such new materials, epoxy composites have been prepared using quartz as micro filler and organically modified Montmorillonite as nanofiller. Transmission Electron Microscopy has been used to determine the structure of the composites, which is neither exfoliated nor intercalated although the C30B stacks thickness is in the nanometric range. Differential Scanning Calorimetry experiments have been carried out to highlight the nano and microparticles effect on the epoxy matrix amorphous structure. The glass transition temperature is slightly affected by C30B addition but the microparticles inclusion produces a drastic decrease from 357K to 325K. The heat capacity step is rather unchanged except for the microcomposite. And finally, the dielectric properties of the materials have been studied by Broadband Dielectric Spectroscopy at different temperatures and frequencies. The relaxation times and the dielectric strengths associated with local β and γ relaxations and main α relaxation have been studied.","PeriodicalId":6317,"journal":{"name":"2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena","volume":"35 1","pages":"346-352"},"PeriodicalIF":0.0,"publicationDate":"2011-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74045796","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-10-01DOI: 10.1109/CEIDP.2011.6232729
R. Polanský, P. Prosr, V. Mentlík
An influence of thermal and voltage treatments on properties of high-temperature electrical insulating material based on mica and silicone binder was analyzed. Tested material is intended for an operation at extremely high temperatures along with electric field stress. The main aim was to describe the high temperature and electric field influence on the material inner structure. Thermal treatment was simulated by unrepeated thermal stress of 320°C for the time of 500 hours. The material was also exposed to electric field intensities ranging from 9.6 to 15.9 kV/mm for times ranging from 7 to 280 hours. The samples were analyzed via Fourier Transform Infrared Spectroscopy, using the Attenuated Total Reflectance (FT-IR ATR) technique, and also via Microscopic Analysis. According to the measurement, accelerated thermal treatment has no significant effect on the inner structure. On the contrary, voltage treatment causes expressive degradation of the material.
{"title":"Analysis of influence of thermal and voltage treatments on silicone/mica electrical insulation by FT-IR ATR","authors":"R. Polanský, P. Prosr, V. Mentlík","doi":"10.1109/CEIDP.2011.6232729","DOIUrl":"https://doi.org/10.1109/CEIDP.2011.6232729","url":null,"abstract":"An influence of thermal and voltage treatments on properties of high-temperature electrical insulating material based on mica and silicone binder was analyzed. Tested material is intended for an operation at extremely high temperatures along with electric field stress. The main aim was to describe the high temperature and electric field influence on the material inner structure. Thermal treatment was simulated by unrepeated thermal stress of 320°C for the time of 500 hours. The material was also exposed to electric field intensities ranging from 9.6 to 15.9 kV/mm for times ranging from 7 to 280 hours. The samples were analyzed via Fourier Transform Infrared Spectroscopy, using the Attenuated Total Reflectance (FT-IR ATR) technique, and also via Microscopic Analysis. According to the measurement, accelerated thermal treatment has no significant effect on the inner structure. On the contrary, voltage treatment causes expressive degradation of the material.","PeriodicalId":6317,"journal":{"name":"2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena","volume":"99 1","pages":"603-606"},"PeriodicalIF":0.0,"publicationDate":"2011-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74819592","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-10-01DOI: 10.1109/CEIDP.2011.6232780
T. X. Nguyen, S. Bouchareb, V. Griseri, L. Berquez
Dielectric materials are frequently used in satellite's structure and especially as thermal blanket which are protecting the electronic devices embarked. Their behavior in relation to an electronic irradiation due to space environment must be clearly defined in order to prevent electrostatic discharges. Such discharges can be very harmful for the equipment. To study these materials an irradiation chamber called `Matspace' has been built in the laboratory. In this study, we will focus our work on the analysis of electron behavior post irradiation in PolyTetraFluoroEthylene films of various thicknesses as they are storing charges for long period of time and they are widely employed in space industry. Space charge distribution will be recorded by mean of two complementary techniques: the Pulsed Electro-Acoustic method and the Focused Laser Intensity Modulated Method.
{"title":"Post-electronic irradiation measurements by PEA and FLIMM methods on dielectric films","authors":"T. X. Nguyen, S. Bouchareb, V. Griseri, L. Berquez","doi":"10.1109/CEIDP.2011.6232780","DOIUrl":"https://doi.org/10.1109/CEIDP.2011.6232780","url":null,"abstract":"Dielectric materials are frequently used in satellite's structure and especially as thermal blanket which are protecting the electronic devices embarked. Their behavior in relation to an electronic irradiation due to space environment must be clearly defined in order to prevent electrostatic discharges. Such discharges can be very harmful for the equipment. To study these materials an irradiation chamber called `Matspace' has been built in the laboratory. In this study, we will focus our work on the analysis of electron behavior post irradiation in PolyTetraFluoroEthylene films of various thicknesses as they are storing charges for long period of time and they are widely employed in space industry. Space charge distribution will be recorded by mean of two complementary techniques: the Pulsed Electro-Acoustic method and the Focused Laser Intensity Modulated Method.","PeriodicalId":6317,"journal":{"name":"2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena","volume":"34 1","pages":"812-815"},"PeriodicalIF":0.0,"publicationDate":"2011-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79757955","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-10-01DOI: 10.1109/CEIDP.2011.6232762
R. Khazaka, M. Bechara, S. Diaham, M. Locatelli
The effect of some experimental parameters (electrode area, thickness, temperature and voltage rising rate) on the breakdown strength of films of poly(α,α, α',α'-tetrafluoro-p-xylylene), a fluorinated parylene (PA-F), has been studied. The measurements were performed in air on 20 capacitor structures for each condition and the two parameters of the Weibull distribution (α and β) were fitted to the data. The influences of electrode area (0.28, 4.5 and 18 mm2), film thickness (1.4, 5.0, 9.8, 21.5 and 49.4 μm), for a temperature range from 25°C to 350°C and voltage rising rate between 10 V/s and 100 V/s, have been investigated and discussed for the thinnest films. The thickness increases up to 5 μm leads to an increase in the dielectric strength with increasing the thickness whereas a continuous decrease is observed for higher thicknesses. Those results are correlated to the thickness dependent crystallinity of parylene films. The effect of electrode area, measured on the thinnest films, on the PA-F dielectric strength does not impact the Weibull parameters at 25 °C for high dielectric breakdown field values, whereas it induces a decrease in the β values at low field with increasing electrode area. This highlights the presence of randomly distributed defects in the tested structures. The temperature dependence of the dielectric strength was also investigated between 25°C and 350°C for two different thicknesses (1.4 and 5 μm) and shows negative temperature dependence in both cases. Finally, the effect of the rate of the applied field rising between 0.07 and 0.7 MV/cm.s on the thin films was studied at 25°C and 300°C and does not show any remarkable effect on the Weibull parameters.
{"title":"Parameters affecting the DC breakdown strength of parylene F thin films","authors":"R. Khazaka, M. Bechara, S. Diaham, M. Locatelli","doi":"10.1109/CEIDP.2011.6232762","DOIUrl":"https://doi.org/10.1109/CEIDP.2011.6232762","url":null,"abstract":"The effect of some experimental parameters (electrode area, thickness, temperature and voltage rising rate) on the breakdown strength of films of poly(α,α, α',α'-tetrafluoro-p-xylylene), a fluorinated parylene (PA-F), has been studied. The measurements were performed in air on 20 capacitor structures for each condition and the two parameters of the Weibull distribution (α and β) were fitted to the data. The influences of electrode area (0.28, 4.5 and 18 mm2), film thickness (1.4, 5.0, 9.8, 21.5 and 49.4 μm), for a temperature range from 25°C to 350°C and voltage rising rate between 10 V/s and 100 V/s, have been investigated and discussed for the thinnest films. The thickness increases up to 5 μm leads to an increase in the dielectric strength with increasing the thickness whereas a continuous decrease is observed for higher thicknesses. Those results are correlated to the thickness dependent crystallinity of parylene films. The effect of electrode area, measured on the thinnest films, on the PA-F dielectric strength does not impact the Weibull parameters at 25 °C for high dielectric breakdown field values, whereas it induces a decrease in the β values at low field with increasing electrode area. This highlights the presence of randomly distributed defects in the tested structures. The temperature dependence of the dielectric strength was also investigated between 25°C and 350°C for two different thicknesses (1.4 and 5 μm) and shows negative temperature dependence in both cases. Finally, the effect of the rate of the applied field rising between 0.07 and 0.7 MV/cm.s on the thin films was studied at 25°C and 300°C and does not show any remarkable effect on the Weibull parameters.","PeriodicalId":6317,"journal":{"name":"2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena","volume":"43 1","pages":"740-743"},"PeriodicalIF":0.0,"publicationDate":"2011-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80047298","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-10-01DOI: 10.1109/CEIDP.2011.6232705
M. Marzinotto, G. Mazzanti
In this paper the innovative theoretical approach to the enlargement law for HVDC cables previously developed by the authors is investigated in more detail, by evaluating the role played by the main quantities that appear in the enlargement law. Firstly, the paper studies the effect of the Weibull shape parameter and of conductor temperature on the reduction of breakdown voltage with cable length in the enlargement from test to power HVDC cables by considering quantities related to typical extruded compounds for DC applications, thereby demonstrating a major role played not only by Weibull shape parameter, but also by volume electrical resistivity of the insulation, hence by the different compounds. Secondly, the behaviour of the cumbersome function HDC appearing in the enlargement formula for HVDC cables is analyzed via the Monte Carlo method and approximate expressions for HDC are proposed that are useful for insulation coordination and design.
{"title":"A deeper insight into the application of the enlargement law to HVDC cable lines","authors":"M. Marzinotto, G. Mazzanti","doi":"10.1109/CEIDP.2011.6232705","DOIUrl":"https://doi.org/10.1109/CEIDP.2011.6232705","url":null,"abstract":"In this paper the innovative theoretical approach to the enlargement law for HVDC cables previously developed by the authors is investigated in more detail, by evaluating the role played by the main quantities that appear in the enlargement law. Firstly, the paper studies the effect of the Weibull shape parameter and of conductor temperature on the reduction of breakdown voltage with cable length in the enlargement from test to power HVDC cables by considering quantities related to typical extruded compounds for DC applications, thereby demonstrating a major role played not only by Weibull shape parameter, but also by volume electrical resistivity of the insulation, hence by the different compounds. Secondly, the behaviour of the cumbersome function HDC appearing in the enlargement formula for HVDC cables is analyzed via the Monte Carlo method and approximate expressions for HDC are proposed that are useful for insulation coordination and design.","PeriodicalId":6317,"journal":{"name":"2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena","volume":"16 1","pages":"505-509"},"PeriodicalIF":0.0,"publicationDate":"2011-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80464813","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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