Pub Date : 2005-10-03DOI: 10.1109/ISEMC.2005.1513541
M. Caldwell, L. Martinez
The Sandia lightning simulator at Sandia National Laboratories can provide up to 200 kA for a simulated single lightning stroke, 100 kA for a subsequent stroke, and hundreds of Amperes of continuing current. It has recently been recommissioned after a decade of inactivity and the single-stroke capability demonstrated. The simulator capabilities, basic design components, upgrades, and diagnostic capabilities are discussed in this paper.
{"title":"The Sandia lightning simulator: recommissioning and upgrades","authors":"M. Caldwell, L. Martinez","doi":"10.1109/ISEMC.2005.1513541","DOIUrl":"https://doi.org/10.1109/ISEMC.2005.1513541","url":null,"abstract":"The Sandia lightning simulator at Sandia National Laboratories can provide up to 200 kA for a simulated single lightning stroke, 100 kA for a subsequent stroke, and hundreds of Amperes of continuing current. It has recently been recommissioned after a decade of inactivity and the single-stroke capability demonstrated. The simulator capabilities, basic design components, upgrades, and diagnostic capabilities are discussed in this paper.","PeriodicalId":6459,"journal":{"name":"2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005.","volume":"1 1","pages":"368-371 Vol. 2"},"PeriodicalIF":0.0,"publicationDate":"2005-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89157904","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-03DOI: 10.1109/ISEMC.2005.1513595
G. Selli, J. Drewniak, R.F. Dubroff, J. Fan, J. Knighten, N. Smith, D. McCoy, B. Archambeault
The engineering of the power delivery network is becoming a fundamental issue in the design of high speed digital systems on PCB's. In fact, providing the required power to the different IC's at the specified noise-free voltage levels allows a correct functioning of the overall PCB systems. More over, the ongoing trend of replacing active devices with peripherally located I/O and PWR/GND pins with areally located I/O and PWR/GND pins (BGA packaged) increases the complexity of the models, when power delivery issues need to be studied in a larger contest, such as the overall PCB's. The employment of the powerful, but simple, concept of the segmentation method allows investigation of the power delivery network of the PCB systems in two fundamental stages. During the first stage, a small cut out of the board corresponding to the BGA footprint is modelled with a 3D full wave simulation tool. During the second stage the equivalent impedance network representation corresponding to this cut out is combined, by means of the segmentation method, with larger pieces of a board, whose network representations can be extracted from the closed form expression of the cavity model approach
{"title":"Power integrity investigation of BGA footprints by means of the segmentation method","authors":"G. Selli, J. Drewniak, R.F. Dubroff, J. Fan, J. Knighten, N. Smith, D. McCoy, B. Archambeault","doi":"10.1109/ISEMC.2005.1513595","DOIUrl":"https://doi.org/10.1109/ISEMC.2005.1513595","url":null,"abstract":"The engineering of the power delivery network is becoming a fundamental issue in the design of high speed digital systems on PCB's. In fact, providing the required power to the different IC's at the specified noise-free voltage levels allows a correct functioning of the overall PCB systems. More over, the ongoing trend of replacing active devices with peripherally located I/O and PWR/GND pins with areally located I/O and PWR/GND pins (BGA packaged) increases the complexity of the models, when power delivery issues need to be studied in a larger contest, such as the overall PCB's. The employment of the powerful, but simple, concept of the segmentation method allows investigation of the power delivery network of the PCB systems in two fundamental stages. During the first stage, a small cut out of the board corresponding to the BGA footprint is modelled with a 3D full wave simulation tool. During the second stage the equivalent impedance network representation corresponding to this cut out is combined, by means of the segmentation method, with larger pieces of a board, whose network representations can be extracted from the closed form expression of the cavity model approach","PeriodicalId":6459,"journal":{"name":"2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005.","volume":"8 1","pages":"655-659"},"PeriodicalIF":0.0,"publicationDate":"2005-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83355163","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-03DOI: 10.1109/ISEMC.2005.1513473
S. Watanabe, K. Iino, K. Saito, O. Hashimoto
This paper describes the temperature distribution analysis of lambda/4 type EM-absorber using resistive film when high electric power is injected to the absorber. For the temperature analysis, FDTD method is used to analyze electromagnetics and SIMPLE (semi-implicit method for pressure linked equations) method is used for calculation of heat transport and air convection enabling to analyze local heat transfer more strictly than heat transport equation (HTE) method which is the traditional heat transport analysis method. And we propose four types of wave absorbers to analyze these temperature distribution on the resistive film to find the best type with least temperature rise. As a result, when glass and metal plates are used for spacer and reflector, respectively, the absorber proved to be the best one from a view point of temperature descent. And it is shown that the temperature range does not cause the change of absorbing characteristics in the analysis but the temperature rise exceeds 160 degC, the characteristics may change
{"title":"Temperature distribution analysis of /spl lambda//4 type EM-absorber using resistive film","authors":"S. Watanabe, K. Iino, K. Saito, O. Hashimoto","doi":"10.1109/ISEMC.2005.1513473","DOIUrl":"https://doi.org/10.1109/ISEMC.2005.1513473","url":null,"abstract":"This paper describes the temperature distribution analysis of lambda/4 type EM-absorber using resistive film when high electric power is injected to the absorber. For the temperature analysis, FDTD method is used to analyze electromagnetics and SIMPLE (semi-implicit method for pressure linked equations) method is used for calculation of heat transport and air convection enabling to analyze local heat transfer more strictly than heat transport equation (HTE) method which is the traditional heat transport analysis method. And we propose four types of wave absorbers to analyze these temperature distribution on the resistive film to find the best type with least temperature rise. As a result, when glass and metal plates are used for spacer and reflector, respectively, the absorber proved to be the best one from a view point of temperature descent. And it is shown that the temperature range does not cause the change of absorbing characteristics in the analysis but the temperature rise exceeds 160 degC, the characteristics may change","PeriodicalId":6459,"journal":{"name":"2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005.","volume":"3 1","pages":"64-68"},"PeriodicalIF":0.0,"publicationDate":"2005-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83565714","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-03DOI: 10.1109/ISEMC.2005.1513480
K. Harima
The EMI antenna is generally calibrated at open area test sites or in anechoic chambers. We propose a novel method of calibrating the EMI antenna using a reverberation chamber. When two antennas are placed opposite each other in an ideal reverberation chamber, the mean value of the complex received value equals the free-space propagation loss between them because the vector sum of the reflected waves with random phases is zero. Therefore, the free-space antenna factor can be determined from the mean value of the complex received value. Experimental results showed the efficacy of this method for calibrating EMI antennas
{"title":"Determination of EMI antenna factor using reverberation chamber","authors":"K. Harima","doi":"10.1109/ISEMC.2005.1513480","DOIUrl":"https://doi.org/10.1109/ISEMC.2005.1513480","url":null,"abstract":"The EMI antenna is generally calibrated at open area test sites or in anechoic chambers. We propose a novel method of calibrating the EMI antenna using a reverberation chamber. When two antennas are placed opposite each other in an ideal reverberation chamber, the mean value of the complex received value equals the free-space propagation loss between them because the vector sum of the reflected waves with random phases is zero. Therefore, the free-space antenna factor can be determined from the mean value of the complex received value. Experimental results showed the efficacy of this method for calibrating EMI antennas","PeriodicalId":6459,"journal":{"name":"2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005.","volume":"2 1","pages":"93-96"},"PeriodicalIF":0.0,"publicationDate":"2005-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88626401","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
A novel L-bridged frequency selective surface (FSS) power/ground planes is proposed with super-broadband rejection for simultaneous switch noise (SSN) from 600 Mz to 4.6 GHz. The L-shaped bridge design on the FSS power plane not only broadens the stop-band bandwidth, but also increases the mutual coupling between the adjacent FSS cells with allowing the significant decrease of the gap between the cells. It is found the small gap design can ease the degradation of the signal quality for the signal referring to the perforated FSS power plane. The excellent SSN suppression performance with keeping reasonably good signal integrity for the proposed structure is validated both experimentally and numerically. Good agreement is seen.
{"title":"A new frequency selective surface power plane with broad band rejection for simultaneous switching noise on high-speed printed circuit boards","authors":"Ting-Kuang Wang, Chien-Chung Wang, Sin-Ting Chen, Yen-Hui Lin, Tzong-Lin Wu","doi":"10.1109/ISEMC.2005.1513656","DOIUrl":"https://doi.org/10.1109/ISEMC.2005.1513656","url":null,"abstract":"A novel L-bridged frequency selective surface (FSS) power/ground planes is proposed with super-broadband rejection for simultaneous switch noise (SSN) from 600 Mz to 4.6 GHz. The L-shaped bridge design on the FSS power plane not only broadens the stop-band bandwidth, but also increases the mutual coupling between the adjacent FSS cells with allowing the significant decrease of the gap between the cells. It is found the small gap design can ease the degradation of the signal quality for the signal referring to the perforated FSS power plane. The excellent SSN suppression performance with keeping reasonably good signal integrity for the proposed structure is validated both experimentally and numerically. Good agreement is seen.","PeriodicalId":6459,"journal":{"name":"2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005.","volume":"24 1","pages":"917-920 Vol. 3"},"PeriodicalIF":0.0,"publicationDate":"2005-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86982461","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-03DOI: 10.1109/ISEMC.2005.1513556
H. Jin, E. Li, E. Liu
This paper presents a systematic approach for electromagnetic susceptibility (EMS) analysis of high speed circuit with the presence of an electromagnetic interference. With numerical analysis, the effect of external electromagnetic noise on the interconnect is characterized and modeled as equivalent current source. At the same time, the macromodel of Internet subnetwork is constructed through vector fitting method. Then, the resultant macromodel and equivalent current source are ready to be synthesized into SPICE-compatible circuit simulator to efficiently expedite the transient analysis of the hybrid interconnects and lumped circuit elements with the external electromagnetic interference. Numerical example exhibits that this systematic approach is a computationally efficient method to solve the electromagnetic susceptibility problems, in which the external electromagnetic interference effects are fully considered.
{"title":"A novel integrated approach for simulation of electromagnetic susceptibility problem","authors":"H. Jin, E. Li, E. Liu","doi":"10.1109/ISEMC.2005.1513556","DOIUrl":"https://doi.org/10.1109/ISEMC.2005.1513556","url":null,"abstract":"This paper presents a systematic approach for electromagnetic susceptibility (EMS) analysis of high speed circuit with the presence of an electromagnetic interference. With numerical analysis, the effect of external electromagnetic noise on the interconnect is characterized and modeled as equivalent current source. At the same time, the macromodel of Internet subnetwork is constructed through vector fitting method. Then, the resultant macromodel and equivalent current source are ready to be synthesized into SPICE-compatible circuit simulator to efficiently expedite the transient analysis of the hybrid interconnects and lumped circuit elements with the external electromagnetic interference. Numerical example exhibits that this systematic approach is a computationally efficient method to solve the electromagnetic susceptibility problems, in which the external electromagnetic interference effects are fully considered.","PeriodicalId":6459,"journal":{"name":"2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005.","volume":"4 1","pages":"446-450 Vol. 2"},"PeriodicalIF":0.0,"publicationDate":"2005-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90281915","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-03DOI: 10.1109/ISEMC.2005.1513569
Do-wan Kim, O. Choi, Bae-Won Lee, Seung-Hyun Song
In this paper, the effectiveness of bulk gasket and shield cover is studied. Those materials are widely used in LCD TV, because they strengthen the PCB ground and suppress EMI radiation. In this paper, shielding and grounding effect by those materials is examined by EM field simulation and the result is compared with test one. Finally, it is verified that the simulation result is in good agreement with test result.
{"title":"The effectiveness of bulk gasket and shield cover on the reduction of EMI radiation in LCD TV","authors":"Do-wan Kim, O. Choi, Bae-Won Lee, Seung-Hyun Song","doi":"10.1109/ISEMC.2005.1513569","DOIUrl":"https://doi.org/10.1109/ISEMC.2005.1513569","url":null,"abstract":"In this paper, the effectiveness of bulk gasket and shield cover is studied. Those materials are widely used in LCD TV, because they strengthen the PCB ground and suppress EMI radiation. In this paper, shielding and grounding effect by those materials is examined by EM field simulation and the result is compared with test one. Finally, it is verified that the simulation result is in good agreement with test result.","PeriodicalId":6459,"journal":{"name":"2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005.","volume":"43 1","pages":"515-518 Vol. 2"},"PeriodicalIF":0.0,"publicationDate":"2005-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77964935","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-03DOI: 10.1109/ISEMC.2005.1513516
A.J.M. Martin, A. Ruddle, A. Duffy
This paper outlines the results of a validation study based on simulated and measured data obtained for the electric field in the vicinity of a vehicle equipped with a roof-mounted monopole antenna. Evaluations based on simple statistics and a 2D feature selective validation (FSV) analysis are presented. Statistical differences between the measurements and simulations are found be better than /spl plusmn/3 dB (which is also the estimated uncertainty of the measurements) for more than 83% of the sampling points, depending on the measurement plane. These conclusions are also supported by the 2D FSV analysis. Taking account of measurement uncertainties, results are judged to be "ideal", in terms of the similarities between the amplitudes of the normalized spatial field distributions, and "very good" in terms of the similarities between the shape and locations of features. The study confirms that satisfactory accuracy can be gained in the prediction of field distributions due to vehicle mounted antennas. Using the 2D FSV approach, comparisons between the two antenna configurations are more similar than statistical measures, which are based on amplitude alone, would suggest.
{"title":"Comparison of measured and computed local electric field distributions due to vehicle-mounted antennas using 2D feature selective validation","authors":"A.J.M. Martin, A. Ruddle, A. Duffy","doi":"10.1109/ISEMC.2005.1513516","DOIUrl":"https://doi.org/10.1109/ISEMC.2005.1513516","url":null,"abstract":"This paper outlines the results of a validation study based on simulated and measured data obtained for the electric field in the vicinity of a vehicle equipped with a roof-mounted monopole antenna. Evaluations based on simple statistics and a 2D feature selective validation (FSV) analysis are presented. Statistical differences between the measurements and simulations are found be better than /spl plusmn/3 dB (which is also the estimated uncertainty of the measurements) for more than 83% of the sampling points, depending on the measurement plane. These conclusions are also supported by the 2D FSV analysis. Taking account of measurement uncertainties, results are judged to be \"ideal\", in terms of the similarities between the amplitudes of the normalized spatial field distributions, and \"very good\" in terms of the similarities between the shape and locations of features. The study confirms that satisfactory accuracy can be gained in the prediction of field distributions due to vehicle mounted antennas. Using the 2D FSV approach, comparisons between the two antenna configurations are more similar than statistical measures, which are based on amplitude alone, would suggest.","PeriodicalId":6459,"journal":{"name":"2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005.","volume":"18 1","pages":"290-295 Vol. 1"},"PeriodicalIF":0.0,"publicationDate":"2005-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73207556","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-03DOI: 10.1109/ISEMC.2005.1513564
S. Korte, M. Camp, H. Garbe
In this paper the destruction effects of semiconductor devices after impact of fast transient electromagnetic pulses are investigated Different logic devices like NANDs and inverter were exposed to high amplitude transient pulses. The pulses have been applied as field threats and as conducted threats. Furthermore a simulation of the destruction effects with the finite element method (FEM) has been performed.
{"title":"Hardware and software simulation of transient pulse impact on integrated circuits","authors":"S. Korte, M. Camp, H. Garbe","doi":"10.1109/ISEMC.2005.1513564","DOIUrl":"https://doi.org/10.1109/ISEMC.2005.1513564","url":null,"abstract":"In this paper the destruction effects of semiconductor devices after impact of fast transient electromagnetic pulses are investigated Different logic devices like NANDs and inverter were exposed to high amplitude transient pulses. The pulses have been applied as field threats and as conducted threats. Furthermore a simulation of the destruction effects with the finite element method (FEM) has been performed.","PeriodicalId":6459,"journal":{"name":"2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005.","volume":"22 1","pages":"489-494 Vol. 2"},"PeriodicalIF":0.0,"publicationDate":"2005-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73733986","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-03DOI: 10.1109/ISEMC.2005.1513470
C. Buccella, M. Feliziani, G. Manzi, F. Maradei
The performances of a twisted wire pairs (TWP) cable above ground are analysed in order to predict the internal propagation. To take into account the nonuniformity produced by the twists, the TWP line is discretized into sections of parallel wire transmission line (TL) whose different electrical parameters are derived analysing the different TWP cross-sections by the finite element method (FEM). The different TWP sections are then connected in a series cascade and the resulting configuration is analysed by a CAD circuit simulator. A comparison of the results obtained in the frequency range 40 MHz - 1 GHz by the proposed model with measurements is presented
{"title":"Prediction of voltage and current propagation in twisted wire pairs (TWPs) by a circuit model","authors":"C. Buccella, M. Feliziani, G. Manzi, F. Maradei","doi":"10.1109/ISEMC.2005.1513470","DOIUrl":"https://doi.org/10.1109/ISEMC.2005.1513470","url":null,"abstract":"The performances of a twisted wire pairs (TWP) cable above ground are analysed in order to predict the internal propagation. To take into account the nonuniformity produced by the twists, the TWP line is discretized into sections of parallel wire transmission line (TL) whose different electrical parameters are derived analysing the different TWP cross-sections by the finite element method (FEM). The different TWP sections are then connected in a series cascade and the resulting configuration is analysed by a CAD circuit simulator. A comparison of the results obtained in the frequency range 40 MHz - 1 GHz by the proposed model with measurements is presented","PeriodicalId":6459,"journal":{"name":"2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005.","volume":"216 1","pages":"51-55"},"PeriodicalIF":0.0,"publicationDate":"2005-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73773035","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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