Pub Date : 2018-07-01DOI: 10.1109/imws-amp.2018.8457160
Ashfaqul Anwar Siraji, Yang Zhao
Highly directional scatterers are designed using coreshell microspheres. Their structural parameters are optimized analytically by genetic algorithm to optimize directional scattering, and the results are verified by finite difference time domain calculations. Using such optimized directional scatterers, the front-to-back ratio and directivity of a dipoleis enhanced to 9 and 4.4 respectively.
{"title":"Enhanced directional scattering by core-shell microspheres","authors":"Ashfaqul Anwar Siraji, Yang Zhao","doi":"10.1109/imws-amp.2018.8457160","DOIUrl":"https://doi.org/10.1109/imws-amp.2018.8457160","url":null,"abstract":"Highly directional scatterers are designed using coreshell microspheres. Their structural parameters are optimized analytically by genetic algorithm to optimize directional scattering, and the results are verified by finite difference time domain calculations. Using such optimized directional scatterers, the front-to-back ratio and directivity of a dipoleis enhanced to 9 and 4.4 respectively.","PeriodicalId":6605,"journal":{"name":"2018 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)","volume":"248 1","pages":"1-3"},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80646138","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-07-01DOI: 10.1109/IMWS-AMP.2018.8457162
S. Hawasli, H. Tsang, N. Lazarus, G. Smith, E. Forsythe
The low conductivity of 3D printed conductive lines is one of the main obstacles in successful 3D printed electronics. These low conductivities lead to lossy transmission lines, poorly performing antennas, and pose many challenges from a circuit design prospective. In this work, two techniques are demonstrated for improving the conductivity of 3D printed silver paste: photonic sintering and selective electroplating. The silver lines were direct write extruded onto a FFF 3D printed substrate and dried before curing. As an alternative to traditional heat curing, parts printed on a uniaxial double sloped 3D surface are photonically sintered using a commercial PulseForge system, resulting in an increase of the line conductivity by 806%. The lines were then electroplated in a copper plating solution, selectively depositing a layer of copper to obtain a further increase in the line conductivity of 886%, a total improvement of 7,150%. Line conductivities were verified using a 4-point measurement setup along with an X-Ray CT scanning system to determine the cross sectional area of the lines. Bringing high resolution 3D printed metal lines closer to bulk conductivities is critical in enabling 3D printed RF and high performance electronics.
{"title":"Improving Conductivity of 3D Printed Conductive Pastes for RF & High Performance Electronics","authors":"S. Hawasli, H. Tsang, N. Lazarus, G. Smith, E. Forsythe","doi":"10.1109/IMWS-AMP.2018.8457162","DOIUrl":"https://doi.org/10.1109/IMWS-AMP.2018.8457162","url":null,"abstract":"The low conductivity of 3D printed conductive lines is one of the main obstacles in successful 3D printed electronics. These low conductivities lead to lossy transmission lines, poorly performing antennas, and pose many challenges from a circuit design prospective. In this work, two techniques are demonstrated for improving the conductivity of 3D printed silver paste: photonic sintering and selective electroplating. The silver lines were direct write extruded onto a FFF 3D printed substrate and dried before curing. As an alternative to traditional heat curing, parts printed on a uniaxial double sloped 3D surface are photonically sintered using a commercial PulseForge system, resulting in an increase of the line conductivity by 806%. The lines were then electroplated in a copper plating solution, selectively depositing a layer of copper to obtain a further increase in the line conductivity of 886%, a total improvement of 7,150%. Line conductivities were verified using a 4-point measurement setup along with an X-Ray CT scanning system to determine the cross sectional area of the lines. Bringing high resolution 3D printed metal lines closer to bulk conductivities is critical in enabling 3D printed RF and high performance electronics.","PeriodicalId":6605,"journal":{"name":"2018 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)","volume":"1 1","pages":"1-3"},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86459103","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：