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A 13.1 mm 2 512 x 256 Multimodal CMOS Array for Spatiochemical Imaging of Bacterial Biofilms. 用于细菌生物膜空间化学成像的13.1 mm 2 512 x 256多模态CMOS阵列。
Pub Date : 2022-04-01 Epub Date: 2022-05-18 DOI: 10.1109/cicc53496.2022.9772787
Kangping Hu, Joseph Incandela, Xiaoyu Lian, Joseph W Larkin, Jacob K Rosenstein
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引用次数: 5
A 27-Mbps, 0.08-mm3 CMOS Transceiver with Simultaneous Near-field Power Transmission and Data Telemetry for Implantable Systems. 一种27mbps, 0.08 mm3 CMOS收发器,具有同步近场功率传输和数据遥测功能,用于植入式系统。
Pub Date : 2020-03-01 Epub Date: 2020-04-23 DOI: 10.1109/CICC48029.2020.9075888
Jordan Thimot, Kukjoo Kim, Chen Shi, Kenneth L Shepard

This paper describes an inductively powered 27-Mbps, 0.08-mm3 CMOS transceiver with integrated RF receiver coils for simultaneous two-way, near-field data telemetry and power transmission for implantable systems. A four-coil inductive link operates at a 27-MHz carrier for power and a 700-MHz carrier for data telemetry with the antennae taking an area of only 2 mm by 2 mm. Amplitude-shift-keying (ASK) modulation is used for data downlink at 6.6 kbps and load-shift keying (LSK) backscattering is used for data uplink at 27 Mbps. The transceiver consumes 2.7 mW and can power a load consuming up to an additional 1.5 mW. Implemented in a 0.18-um silicon-on-insulator (SOI) technology, post-processing steps are used to decrease chip thickness to approximately 15um, making the chip flexible with a tissue-like form factor and removing the effects of the substrate on coil performance. Power harvesting circuitry, including passive rectifier, voltage regulator, RF limiter, ASK and LSK modulator, clock generator, and digital controller are positioned adjacent to the coils and limited to an area of 0.5 mm by 2mm. Complete transceiver functionality of the system has been achieved with overall power transfer efficiency (PTE) of 1.04% through 1 mm of tissue phantom between reader and implant.

本文介绍了一种27mbps, 0.08 mm3的电感供电CMOS收发器,集成了射频接收线圈,用于同时双向,近场数据遥测和植入式系统的电力传输。四线圈感应链路在27兆赫的载波上运行,在700兆赫的载波上运行,用于数据遥测,天线的面积仅为2mm × 2mm。下行数据链路采用幅度移键控(ASK)调制,上行数据链路采用负载移键控(LSK)后向散射,速率为27mbps。收发器的功耗为2.7 mW,可为负载提供高达1.5 mW的额外功耗。采用0.18 um绝缘体上硅(SOI)技术,后处理步骤用于将芯片厚度减少到约15um,使芯片具有类似组织的形状因素,并消除基板对线圈性能的影响。功率采集电路,包括无源整流器、稳压器、射频限制器、ASK和LSK调制器、时钟发生器和数字控制器,位于线圈附近,限制在0.5 mm × 2mm的面积内。该系统实现了完整的收发功能,通过阅读器和植入物之间1毫米的组织模体,总功率传输效率(PTE)为1.04%。
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引用次数: 6
A 6-Transistor Ultra-Low Power CMOS Voltage Reference with 0.02%/V Line Sensitivity. 一种6晶体管超低功耗CMOS基准电压,线路灵敏度为0.02%/V。
Pub Date : 2020-03-01 Epub Date: 2020-04-23 DOI: 10.1109/cicc48029.2020.9075941
Hayden Bialek, Matthew L Johnston, Arun Natarajan

This work presents a technique for design of ultra-low power (ULP) CMOS voltage references achieving extremely low line sensitivity while maintaining state-of-the-art temperature insensitivity through the use of a 6-transistor (6T) structure. The proposed technique demonstrates good performance in sub-100 nm CMOS technologies. The 65-nm CMOS implementation occupies only 840 μm2 of area and consumes 28.6 pA from a 0.5 V supply. Measurements from 6 samples from the same wafer show an average line sensitivity of 0.02 %/V, a 10X improvement over previous 65 nm implementations, and an average temperature coefficient of 99.2 ppm/°C.

这项工作提出了一种设计超低功耗(ULP) CMOS电压基准的技术,通过使用6晶体管(6T)结构,实现极低的线路灵敏度,同时保持最先进的温度不灵敏度。该技术在亚100纳米CMOS技术中表现出良好的性能。65纳米CMOS实现仅占用840 μm2的面积,在0.5 V电源下消耗28.6 pA。来自同一晶圆的6个样品的测量结果显示,平均线灵敏度为0.02% /V,比以前的65 nm实现提高了10倍,平均温度系数为99.2 ppm/°C。
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引用次数: 1
An EEPROM compact circuit model EEPROM紧凑电路模型
P. Klein, K. Hoffmann, O. Kowarik
The model allows the simulation of threshold voltage and drain current shifts as well as FN-tunnel and substrate currents caused by FN and band-to-band tunneling. This is achieved by determining the floating gate charge and voltage as function of time and short channel and geometry effects during programming, erasing and reading.
该模型允许模拟阈值电压和漏极电流的移位,以及FN隧道和基片电流引起的FN和带到带隧道。这是通过在编程、擦除和读取期间确定浮栅电荷和电压作为时间、短通道和几何效应的函数来实现的。
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引用次数: 1
Exploiting locality for low-power design 利用局部性实现低功耗设计
R. Mehra, L. Guerra, J. Rabney
We propose a new high-level synthesis technique for the low-power implementation of real-time applications. The technique uses algorithm partitioning to preserve locality in the assignment of operations to hardware units. This results in reduced usage of long high-capacitance buses, fewer accesses to multiplexers and buffers, and more compact layouts. Experimental results show average reductions in bus and multiplexer power of 62.9% and 38.5%, respectively, resulting in an average reduction of 18.5% in total power.
我们提出了一种新的高阶综合技术,用于实时应用的低功耗实现。该技术使用算法划分来保持对硬件单元的操作分配的局部性。这减少了长高电容总线的使用,减少了对多路复用器和缓冲区的访问,并使布局更紧凑。实验结果表明,母线和复用器功率平均分别降低62.9%和38.5%,总功率平均降低18.5%。
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引用次数: 6
A 100 dB, 480 MHz OTA in 0.7 /spl mu/m CMOS for sampled-data applications 用于采样数据应用的100 dB, 480 MHz OTA在0.7 /spl mu/m CMOS中
T. Burger, Qiuting Huang
A fully differential operational transconductance amplifier with a gain-bandwidth of 480 MHz at 52 degrees of phase margin and a DC-gain of 100 dB has been implemented in a 0.7 /spl mu/m CMOS process. The circuit utilizes the regulated cascode gain enhancement technique and has a switched-capacitor dynamic common mode feedback structure. It has been designed for a +/- 3 V output swing at a single supply of 5 V. The power consumption is 145 mW.
在0.7 /spl mu/m CMOS工艺中实现了一种增益带宽为480 MHz、相位裕度为52度、直流增益为100 dB的全差分操作跨导放大器。该电路采用可调节级联码增益增强技术,并具有开关电容动态共模反馈结构。它已被设计为一个+/- 3v的输出摆幅在一个5 V的单电源。功耗为145兆瓦。
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引用次数: 8
Fast simulation algorithms for RF circuits 射频电路的快速仿真算法
R. Telichevesky, K. Kundert, I. Elfadel, J. White
RF integrated circuit designers make extensive use of simulation tools which perform nonlinear periodic steady-state analysis and its extensions. However, the computational costs of these simulation tools have restricted users from examining the detailed behavior of complete RF subsystems. Recent algorithmic developments, based on matrix-implicit iterative methods, is rapidly changing this situation and providing new faster tools which can easily analyze circuits with hundreds of devices. In this paper we present these new methods by describing how they can be used to accelerate finite-difference, shooting-Newton, and harmonic-balance based algorithms for periodic steady-state analysis.
射频集成电路设计人员广泛使用仿真工具来执行非线性周期稳态分析及其扩展。然而,这些仿真工具的计算成本限制了用户检查完整RF子系统的详细行为。最近基于矩阵隐式迭代方法的算法发展正在迅速改变这种情况,并提供新的更快的工具,可以轻松地分析数百个器件的电路。在本文中,我们通过描述如何使用这些新方法来加速周期稳态分析的有限差分,射击牛顿和谐波平衡算法。
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引用次数: 81
A micropower safety IC for rechargeable lithium batteries 一种用于可充电锂电池的微功率安全集成电路
T. Stockstad, T. Petty, R. Yee
A rechargeable lithium battery safety IC designed for monitoring cell voltage and current in the battery is presented. The circuitry is capable of protecting batteries of one to four series connected cells via a programmable circuit architecture with a cell voltage limit accuracy of +/-1%. The circuitry has an average current drain of 25 /spl mu/A. The Li safety IC with integrated series FETs has an area of 18.4 mm/sup 2/.
介绍了一种可充电锂电池安全集成电路,用于监测电池内的电压和电流。该电路能够通过可编程电路架构保护一到四个串联电池,电池电压限制精度为+/-1%。该电路的平均电流损耗为25 /spl mu/A。集成系列fet的Li安全IC的面积为18.4 mm/sup /。
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引用次数: 1
Modeling, characterization and design of monolithic inductors for silicon RFICs 硅射频集成电路单片电感器的建模、表征与设计
John R. Long, Miles A. Copeland
The results of a comprehensive investigation into the characteristics and optimization of inductors fabricated in the top-level metal of a sub-micron silicon VLSI process are presented. A computer program which extracts a physically-based model of microstrip components which is suitable for circuit (SPICE) simulation has been used to evaluate variations in metallization, layout geometry and substrate parameters upon inductor performance. 3-D numerical simulations and experimental measurements of inductors were also used to benchmark the model accuracy. It is shown in this work that low inductor Q is primarily due to the restrictions imposed by the thin interconnect metallization available in most VLSI technologies, and that computer optimization of the inductor layout can be used to achieve a 50% improvement in component Q-factor over unoptimized designs.
本文介绍了在亚微米硅超大规模集成电路工艺的顶层金属中制作的电感的特性和优化的综合研究结果。一个计算机程序提取了一个适合电路(SPICE)仿真的微带元件的物理模型,用于评估金属化,布局几何形状和衬底参数对电感性能的影响。利用三维数值模拟和电感的实验测量来验证模型的精度。在这项工作中显示,低电感器Q主要是由于大多数VLSI技术中可用的薄互连金属化所施加的限制,并且电感器布局的计算机优化可用于实现元件Q因子比未优化设计提高50%。
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引用次数: 48
Yield loss forecasting in the early phases of the VLSI design process 超大规模集成电路设计初期的良率损失预测
H. Heineken, J. Khare, Wojciech Maly
This paper describes three new yield models. The first takes as input the critical area of a layout; the second approximates the critical area with the minimum spacing area between metal lines; and the third uses transistor density to model critical area. The models were developed and verified using manufacturing data.
本文介绍了三种新的产量模型。第一种方法将布局的关键区域作为输入;第二种方法以金属线之间的最小间距近似临界区域;第三种是使用晶体管密度来模拟临界区域。利用制造数据对模型进行了开发和验证。
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引用次数: 27
期刊
Proceedings of the ... Custom Integrated Circuits Conference. Custom Integrated Circuits Conference
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