Pub Date : 2002-12-16DOI: 10.1109/JMEMS.2002.805057
C. Savran, A. Sparks, J. Sihler, Jian Li, Wangsong Wu, Dean Berlin, T. Burg, J. Fritz, M. Schmidt, S. Manalis
We have micromachined a mechanical sensor that uses interferometry to detect the differential and absolute deflections of two adjacent cantilevers. The overall geometry of the device allows simple fluidic delivery to each cantilever to immobilize molecules for biological and chemical detection. We show that differential sensing is 50 times less affected by ambient temperature changes than the absolute, thus enabling a more reliable differentiation between specific cantilever bending and background effects. We describe the fabrication process and show results related to the dynamic characterization of the device as a differential sensor. The root-mean-squared (r.m.s.) sensor noise in water and air is /spl sim/1 nm over the frequency range of 0.4-40 Hz. We also find that in air, the deflection resolution is limited only by the cantilever's thermomechanical noise level of 0.008 /spl Aring//Hz/sup 1/2/ over the frequency range of 40-1000 Hz.
{"title":"Fabrication and characterization of a micromechanical sensor for differential detection of nanoscale motions","authors":"C. Savran, A. Sparks, J. Sihler, Jian Li, Wangsong Wu, Dean Berlin, T. Burg, J. Fritz, M. Schmidt, S. Manalis","doi":"10.1109/JMEMS.2002.805057","DOIUrl":"https://doi.org/10.1109/JMEMS.2002.805057","url":null,"abstract":"We have micromachined a mechanical sensor that uses interferometry to detect the differential and absolute deflections of two adjacent cantilevers. The overall geometry of the device allows simple fluidic delivery to each cantilever to immobilize molecules for biological and chemical detection. We show that differential sensing is 50 times less affected by ambient temperature changes than the absolute, thus enabling a more reliable differentiation between specific cantilever bending and background effects. We describe the fabrication process and show results related to the dynamic characterization of the device as a differential sensor. The root-mean-squared (r.m.s.) sensor noise in water and air is /spl sim/1 nm over the frequency range of 0.4-40 Hz. We also find that in air, the deflection resolution is limited only by the cantilever's thermomechanical noise level of 0.008 /spl Aring//Hz/sup 1/2/ over the frequency range of 40-1000 Hz.","PeriodicalId":13438,"journal":{"name":"IEEE\\/ASME Journal of Microelectromechanical Systems","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2002-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74542275","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2002-12-16DOI: 10.1109/JMEMS.2002.805047
J. Knapp, M. P. Boer
One of the most important issues facing the continued development and application of microelectromechanical systems (MEMS) is that of adhesion and friction between microstructures intended to transfer force. In this work, we develop modeling approaches for studying adhesion (i.e., stiction) using the observed shape of microcantilevers under electrostatic loading. Analytical models for an idealized configuration are presented first. The solutions reveal the regimes over which the cantilever deflections are sensitive to adhesion versus applied loading. Also, the energy release rate and hence the cantilever adhesion value is shown to be independent of the curvature of the initially freestanding beam. Second, with a finite-element modeling approach, we quantify the slight sensitivity of the cantilever deflections to the surface force law assumed and show that with Angstrom scale resolution of beam deflections, cohesive zone law information can in principle be deduced. We also use this approach to model the nonuniform electrostatic loading force used in our experiments and the effect of support post compliance. We then demonstrate how adhesion values are obtained along the length of a microcantilever.
{"title":"Mechanics of microcantilever beams subject to combined electrostatic and adhesive forces","authors":"J. Knapp, M. P. Boer","doi":"10.1109/JMEMS.2002.805047","DOIUrl":"https://doi.org/10.1109/JMEMS.2002.805047","url":null,"abstract":"One of the most important issues facing the continued development and application of microelectromechanical systems (MEMS) is that of adhesion and friction between microstructures intended to transfer force. In this work, we develop modeling approaches for studying adhesion (i.e., stiction) using the observed shape of microcantilevers under electrostatic loading. Analytical models for an idealized configuration are presented first. The solutions reveal the regimes over which the cantilever deflections are sensitive to adhesion versus applied loading. Also, the energy release rate and hence the cantilever adhesion value is shown to be independent of the curvature of the initially freestanding beam. Second, with a finite-element modeling approach, we quantify the slight sensitivity of the cantilever deflections to the surface force law assumed and show that with Angstrom scale resolution of beam deflections, cohesive zone law information can in principle be deduced. We also use this approach to model the nonuniform electrostatic loading force used in our experiments and the effect of support post compliance. We then demonstrate how adhesion values are obtained along the length of a microcantilever.","PeriodicalId":13438,"journal":{"name":"IEEE\\/ASME Journal of Microelectromechanical Systems","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2002-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88345156","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2002-12-16DOI: 10.1109/JMEMS.2002.805046
J. Darabi, M. Rada, M. Ohadi, J. Lawler
This paper presents the design, fabrication, and testing of a novel electrohydrodynamic (EHD) ion-drag micropump. In order to maximize the electrical field gradients that are responsible for EHD pumping, we incorporated three-dimensional (3-D) triangular bumps of solder as part of the EHD electrodes. To form these bumps, Niobium was sputter-deposited onto a ceramic substrate, coated with photoresist, optically exposed and etched using a reactive ion etcher to define the electrode pattern. The substrate was then "dipped" into a molten solder pool. Since the solder adheres only to the metallic film, bumps of solder form on the electrodes, giving the electrodes a significant 3-D character. The overall dimensions of the micropump are 19 mm /spl times/ 32 mm /spl times/ 1.05 mm. Four different designs were fabricated and tested. Static pressure tests were performed with a 3M Thermal Fluid (HFE-7100) as the working fluid and the optimum design was identified. The results with the thermal fluid were highly promising and indicated a pumping head of up to 700 Pa at an applied voltage of 300 V. The experimental results for the four different designs show that the presence of the 3-D bump structures significantly improves the pumping performance. Also, a much better pumping performance was obtained with the micropump in which the emitter had a saw-tooth shape.
{"title":"Design, fabrication, and testing of an electrohydrodynamic ion-drag micropump","authors":"J. Darabi, M. Rada, M. Ohadi, J. Lawler","doi":"10.1109/JMEMS.2002.805046","DOIUrl":"https://doi.org/10.1109/JMEMS.2002.805046","url":null,"abstract":"This paper presents the design, fabrication, and testing of a novel electrohydrodynamic (EHD) ion-drag micropump. In order to maximize the electrical field gradients that are responsible for EHD pumping, we incorporated three-dimensional (3-D) triangular bumps of solder as part of the EHD electrodes. To form these bumps, Niobium was sputter-deposited onto a ceramic substrate, coated with photoresist, optically exposed and etched using a reactive ion etcher to define the electrode pattern. The substrate was then \"dipped\" into a molten solder pool. Since the solder adheres only to the metallic film, bumps of solder form on the electrodes, giving the electrodes a significant 3-D character. The overall dimensions of the micropump are 19 mm /spl times/ 32 mm /spl times/ 1.05 mm. Four different designs were fabricated and tested. Static pressure tests were performed with a 3M Thermal Fluid (HFE-7100) as the working fluid and the optimum design was identified. The results with the thermal fluid were highly promising and indicated a pumping head of up to 700 Pa at an applied voltage of 300 V. The experimental results for the four different designs show that the presence of the 3-D bump structures significantly improves the pumping performance. Also, a much better pumping performance was obtained with the micropump in which the emitter had a saw-tooth shape.","PeriodicalId":13438,"journal":{"name":"IEEE\\/ASME Journal of Microelectromechanical Systems","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2002-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89032908","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2002-12-16DOI: 10.1109/JMEMS.2002.805054
H. Toshiyoshi, M. Mita, H. Fujita
This paper reports a new fabrication process and designing method to integrate MEMS piggyback actuators on a silicon-on-insulator (SOI) wafer with magnetic read/write heads of hard-disk drives. Large bandwidth of the tracking servo system is designed by reducing the load mass for the tracking microactuator to be around 40 /spl mu/g. A prototype electrostatic MEMS actuator (2 mm /spl times/ 3 mm /spl times/ 0.6 mm) of multiple parallel plates has been successfully integrated by using high-aspect ratio microstructures (gap opening 2 /spl mu/m into 50-/spl mu/m-SOI wafer) patterned by deep reactive-ion-etching (DRIE). A dc displacement of 0.5 /spl mu/m, which is almost the same size as data track width, has been obtained at a driving voltage of dc 60 V and the fundamental resonance is found at 16 kHz. An analytical model of the MEMS piggyback actuator has been proposed to predict electromechanical performance. The fabrication method proposed here is very simple and straightforward to put the head-element-drive mechanism into practice.
{"title":"A MEMS piggyback actuator for hard-disk drives","authors":"H. Toshiyoshi, M. Mita, H. Fujita","doi":"10.1109/JMEMS.2002.805054","DOIUrl":"https://doi.org/10.1109/JMEMS.2002.805054","url":null,"abstract":"This paper reports a new fabrication process and designing method to integrate MEMS piggyback actuators on a silicon-on-insulator (SOI) wafer with magnetic read/write heads of hard-disk drives. Large bandwidth of the tracking servo system is designed by reducing the load mass for the tracking microactuator to be around 40 /spl mu/g. A prototype electrostatic MEMS actuator (2 mm /spl times/ 3 mm /spl times/ 0.6 mm) of multiple parallel plates has been successfully integrated by using high-aspect ratio microstructures (gap opening 2 /spl mu/m into 50-/spl mu/m-SOI wafer) patterned by deep reactive-ion-etching (DRIE). A dc displacement of 0.5 /spl mu/m, which is almost the same size as data track width, has been obtained at a driving voltage of dc 60 V and the fundamental resonance is found at 16 kHz. An analytical model of the MEMS piggyback actuator has been proposed to predict electromechanical performance. The fabrication method proposed here is very simple and straightforward to put the head-element-drive mechanism into practice.","PeriodicalId":13438,"journal":{"name":"IEEE\\/ASME Journal of Microelectromechanical Systems","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2002-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87605299","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2002-12-16DOI: 10.1109/JMEMS.2002.805056
E. Buks, M. Roukes
We employ optical diffraction to study the mechanical properties of a grating array of suspended doubly clamped beams made of Au. The device allows application of electrostatic coupling between the beams that gives rise to formation of a band of normal modes of vibration (phonons). We parametrically excite these collective modes and study the response by measuring the diffraction signal. The results indicate that nonlinear effects strongly affect the dynamics of the system. Further optimization will allow employing similar systems for real-time mechanical spectrum analysis of electrical waveforms.
{"title":"Electrically tunable collective response in a coupled micromechanical array","authors":"E. Buks, M. Roukes","doi":"10.1109/JMEMS.2002.805056","DOIUrl":"https://doi.org/10.1109/JMEMS.2002.805056","url":null,"abstract":"We employ optical diffraction to study the mechanical properties of a grating array of suspended doubly clamped beams made of Au. The device allows application of electrostatic coupling between the beams that gives rise to formation of a band of normal modes of vibration (phonons). We parametrically excite these collective modes and study the response by measuring the diffraction signal. The results indicate that nonlinear effects strongly affect the dynamics of the system. Further optimization will allow employing similar systems for real-time mechanical spectrum analysis of electrical waveforms.","PeriodicalId":13438,"journal":{"name":"IEEE\\/ASME Journal of Microelectromechanical Systems","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2002-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75660423","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2002-12-16DOI: 10.1109/JMEMS.2002.805213
J. Plaza, A. Collado, E. Cabruja, J. Esteve
Describes the first steps carried out for the integration of piezoresistive accelerometers in an MCM-D (D-type multichip modules with flip-chip interconnection) package. The bulk micromachined accelerometer technology and its modification to comply with MCM-D packaging technology requirements are presented. The accelerometer technology is based on BESOI (Bond and Etch Back Silicon-On-Insulator) wafers. The main characteristic of this technology is the use of the buried silicon oxide layer as an etch stop and as a sacrificial layer. In addition, over-range protection and self-test systems are defined without any additional photolithographic step or process. The flip chip attachment requires solderable metals in the bump pads. In addition, a sealing ring has been defined around the movable parts of the sensors to protect them from the underfill used during the final packaging process. Cantilever beam accelerometers with a self-test system are presented as example of the combined technology. The design, simulation, fabrication and characterization of the devices prior to the MCM-D packaging are presented as well.
介绍将压阻式加速度计集成到MCM-D(带倒装互连的d型多芯片模块)封装中的第一步。介绍了本体微机械加速度计技术及其为满足MCM-D封装技术要求而进行的改进。加速度计技术基于BESOI (Bond and Etch Back Silicon-On-Insulator)晶圆。该技术的主要特点是使用埋置氧化硅层作为蚀刻停止层和牺牲层。此外，超量程保护和自检系统的定义无需任何额外的光刻步骤或过程。倒装芯片附件需要在凸垫中焊接金属。此外，在传感器的可移动部件周围定义了一个密封圈，以保护它们免受最终包装过程中使用的下填料的影响。以悬臂梁式加速度计和自检系统为例，介绍了这种组合技术。介绍了MCM-D封装前器件的设计、仿真、制造和表征。
{"title":"Piezoresistive accelerometers for MCM package","authors":"J. Plaza, A. Collado, E. Cabruja, J. Esteve","doi":"10.1109/JMEMS.2002.805213","DOIUrl":"https://doi.org/10.1109/JMEMS.2002.805213","url":null,"abstract":"Describes the first steps carried out for the integration of piezoresistive accelerometers in an MCM-D (D-type multichip modules with flip-chip interconnection) package. The bulk micromachined accelerometer technology and its modification to comply with MCM-D packaging technology requirements are presented. The accelerometer technology is based on BESOI (Bond and Etch Back Silicon-On-Insulator) wafers. The main characteristic of this technology is the use of the buried silicon oxide layer as an etch stop and as a sacrificial layer. In addition, over-range protection and self-test systems are defined without any additional photolithographic step or process. The flip chip attachment requires solderable metals in the bump pads. In addition, a sealing ring has been defined around the movable parts of the sensors to protect them from the underfill used during the final packaging process. Cantilever beam accelerometers with a self-test system are presented as example of the combined technology. The design, simulation, fabrication and characterization of the devices prior to the MCM-D packaging are presented as well.","PeriodicalId":13438,"journal":{"name":"IEEE\\/ASME Journal of Microelectromechanical Systems","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2002-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90229776","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-06-01DOI: 10.1007/978-94-017-2264-3_10
S. Firebaugh, K. Jensen, M. Schmidt
{"title":"Miniaturization and integration of photoacoustic detection with a microfabricated chemical reactor system","authors":"S. Firebaugh, K. Jensen, M. Schmidt","doi":"10.1007/978-94-017-2264-3_10","DOIUrl":"https://doi.org/10.1007/978-94-017-2264-3_10","url":null,"abstract":"","PeriodicalId":13438,"journal":{"name":"IEEE\\/ASME Journal of Microelectromechanical Systems","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2001-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74143229","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：