Pub Date : 2018-01-11DOI: 10.1504/IJNM.2018.089181
Wang Sujuan, To Suet, Chen Xin
Ultra-precision raster milling (UPRM) rotates a single crystal diamond tool to discontinuously remove materials from the workpiece and can directly produce freeform surfaces with sub-micrometric form accuracy and nanometric surface finishing. This paper presents theoretical and experimental investigations on the workpiece material effect on single cutting profile in UPRM. Experiments are conducted to study the material effect on cutting profile by single cutting four materials including copper, aluminium alloy 6061, brass and aluminium bronze under the same cutting conditions in UPRM. A characterisation method is presented in the paper to study the effect of different workpiece material on the cutting profiles in UPRM. The experimental results show that copper alloy makes the smallest effect on the single cutting profile because of the lowest elastic recovery ratio while the material effect of aluminium bronze is the highest due to the highest elastic recovery ratio and the highest hardness.
{"title":"Study of materials effects on the single cutting in ultra-precision raster milling","authors":"Wang Sujuan, To Suet, Chen Xin","doi":"10.1504/IJNM.2018.089181","DOIUrl":"https://doi.org/10.1504/IJNM.2018.089181","url":null,"abstract":"Ultra-precision raster milling (UPRM) rotates a single crystal diamond tool to discontinuously remove materials from the workpiece and can directly produce freeform surfaces with sub-micrometric form accuracy and nanometric surface finishing. This paper presents theoretical and experimental investigations on the workpiece material effect on single cutting profile in UPRM. Experiments are conducted to study the material effect on cutting profile by single cutting four materials including copper, aluminium alloy 6061, brass and aluminium bronze under the same cutting conditions in UPRM. A characterisation method is presented in the paper to study the effect of different workpiece material on the cutting profiles in UPRM. The experimental results show that copper alloy makes the smallest effect on the single cutting profile because of the lowest elastic recovery ratio while the material effect of aluminium bronze is the highest due to the highest elastic recovery ratio and the highest hardness.","PeriodicalId":14170,"journal":{"name":"International Journal of Nanomanufacturing","volume":"14 1","pages":"77"},"PeriodicalIF":0.0,"publicationDate":"2018-01-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1504/IJNM.2018.089181","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"49628034","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-01-11DOI: 10.1504/IJNM.2018.10009989
Ningli An, Jingjing Ye
The compression mode and shear mode for energy harvesting experimental platform was estabished. The energy collection efficiency of PVDF/TiO2 nano-composite film in the two mode and nonlinear piezoelectric effect were analysed. Experimental results show that the energy collection efficiency of the shear mode was higher than the compressed mode. The Piezoelectric constant and piezoelectric coupling coefficient have nonlinear changes under large stress. In this paper, the experimental data establish a relationship electromechanical coupling coefficients and parameters of composite thin film piezoelectric stress.
{"title":"Performance of PVDF/TiO2 nano-composite film in the application of energy harvester","authors":"Ningli An, Jingjing Ye","doi":"10.1504/IJNM.2018.10009989","DOIUrl":"https://doi.org/10.1504/IJNM.2018.10009989","url":null,"abstract":"The compression mode and shear mode for energy harvesting experimental platform was estabished. The energy collection efficiency of PVDF/TiO2 nano-composite film in the two mode and nonlinear piezoelectric effect were analysed. Experimental results show that the energy collection efficiency of the shear mode was higher than the compressed mode. The Piezoelectric constant and piezoelectric coupling coefficient have nonlinear changes under large stress. In this paper, the experimental data establish a relationship electromechanical coupling coefficients and parameters of composite thin film piezoelectric stress.","PeriodicalId":14170,"journal":{"name":"International Journal of Nanomanufacturing","volume":"14 1","pages":"1"},"PeriodicalIF":0.0,"publicationDate":"2018-01-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"46630099","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-01-11DOI: 10.1504/IJNM.2018.10009999
Chen Li, Fei-hu Zhang, Xiaoshuang Rao, B. Leng
The orthogonal test L16 (43) was designed, and the impact scratching experiment for K9 glass was carried out by using Vickers diamond indenter on the DMG ULTRASONIC 70-5 linear. The three-dimensional morphology of the surface for glass was observed by scanning electron microscope (SEM), which was compared with that in the quasi static state. The strain rate of the grinding process was obtained by choosing the contact zone length as the impact contact length, which was the evaluation Index of impact. The relationships between strain rate and the depth of radial crack, strain rate and the depth of transverse crack, strain rate and normal scratching force were first analysed. The results showed that the depth of radial of crack, the depth of transversal crack and the normal scratching force decreased with the increase of strain rate. The two-layer BP neural network was established, which took the strain rate as input variables. The depth of radial crack, the depth of transversal crack and normal scratching force were predicted and the errors were within 10%, which indicated that the prediction results of BP neural network were reliable.
{"title":"Experimental study and prediction on impact scratching of single abrasive for K9 glass","authors":"Chen Li, Fei-hu Zhang, Xiaoshuang Rao, B. Leng","doi":"10.1504/IJNM.2018.10009999","DOIUrl":"https://doi.org/10.1504/IJNM.2018.10009999","url":null,"abstract":"The orthogonal test L16 (43) was designed, and the impact scratching experiment for K9 glass was carried out by using Vickers diamond indenter on the DMG ULTRASONIC 70-5 linear. The three-dimensional morphology of the surface for glass was observed by scanning electron microscope (SEM), which was compared with that in the quasi static state. The strain rate of the grinding process was obtained by choosing the contact zone length as the impact contact length, which was the evaluation Index of impact. The relationships between strain rate and the depth of radial crack, strain rate and the depth of transverse crack, strain rate and normal scratching force were first analysed. The results showed that the depth of radial of crack, the depth of transversal crack and the normal scratching force decreased with the increase of strain rate. The two-layer BP neural network was established, which took the strain rate as input variables. The depth of radial crack, the depth of transversal crack and normal scratching force were predicted and the errors were within 10%, which indicated that the prediction results of BP neural network were reliable.","PeriodicalId":14170,"journal":{"name":"International Journal of Nanomanufacturing","volume":"14 1","pages":"89"},"PeriodicalIF":0.0,"publicationDate":"2018-01-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"42253539","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-01-11DOI: 10.1504/IJNM.2018.10009993
Y. Cao, Yuchao Jia, Yongda Yan, Han Lianhuan, Xuesen Zhao, Zhenjiang Hu, D. Zhan
The confined etchant layer technique (CELT) has been proved not only an effective electrochemical microstructures fabrication method, but also a potential polishing method due to its distance sensitiveness. To verify its polishing capability in motion mode and examine the influence of motion parameters on polishing efficiency and material removal rate, motion coupling confined etchant layer technique (MCCELT) polishing experiments were carried out on n-GaAs wafers by adopting central composite inscribe (CCI) design of response surface methodology. Furthermore, the interactions between motion, electrochemical reaction and substrate deformation were analysed using multi-physics coupling finite element simulations. Statistical model shows that sample surface roughness decreases with the decreases of working distance (between the electrode and the substrate) and feeding velocity, and indicates it still has potential to reach more smooth results.
{"title":"Study on a non-contact polishing method using motion coupling confined etchant layer technique","authors":"Y. Cao, Yuchao Jia, Yongda Yan, Han Lianhuan, Xuesen Zhao, Zhenjiang Hu, D. Zhan","doi":"10.1504/IJNM.2018.10009993","DOIUrl":"https://doi.org/10.1504/IJNM.2018.10009993","url":null,"abstract":"The confined etchant layer technique (CELT) has been proved not only an effective electrochemical microstructures fabrication method, but also a potential polishing method due to its distance sensitiveness. To verify its polishing capability in motion mode and examine the influence of motion parameters on polishing efficiency and material removal rate, motion coupling confined etchant layer technique (MCCELT) polishing experiments were carried out on n-GaAs wafers by adopting central composite inscribe (CCI) design of response surface methodology. Furthermore, the interactions between motion, electrochemical reaction and substrate deformation were analysed using multi-physics coupling finite element simulations. Statistical model shows that sample surface roughness decreases with the decreases of working distance (between the electrode and the substrate) and feeding velocity, and indicates it still has potential to reach more smooth results.","PeriodicalId":14170,"journal":{"name":"International Journal of Nanomanufacturing","volume":"14 1","pages":"51"},"PeriodicalIF":0.0,"publicationDate":"2018-01-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"48387281","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-10-20DOI: 10.1504/IJNM.2017.10008414
Jianguo Zhang, N. Suzuki, Yilong Wang, E. Shamoto
Surfaces textured by sophisticated micro/nano structures can provide advanced and useful functions and features as compared with simply smooth surfaces. To promote widespread use of the structured surfaces, manufacturing technology of structured surfaces for ultra-precision dies and moulds made of hardened steel is absolutely essential. Conventional diamond cutting is not applicable to machining of steel due to rapid tool wear and surface deterioration. On the other hand, elliptical vibration cutting (EVC) equipped with the ultra-precision amplitude control sculpturing method is considered as a potential candidate for the functional surface fabrication on steel materials. In this method, tool geometry, especially the clearance angle, imposes a limit on the machinable part geometry due to the flank face contact to the target shape in the downhill machining. In order to clarify the influence of flank face contact on the machining accuracy and the tool wear, a series of theoretical and experimental investigations are conducted in this paper. A surface with micro sine-sweep profile is fabricated on hardened steel by applying the proposed amplitude control sculpturing method. It verified that the interference between flank face and fabricated structure causes not only the serious machining accuracy deterioration but also the serious tool damage due to the enhancing of ploughing process.
{"title":"Influence of clearance angle on micro/nano structure fabrication in elliptical vibration cutting of hardened steel","authors":"Jianguo Zhang, N. Suzuki, Yilong Wang, E. Shamoto","doi":"10.1504/IJNM.2017.10008414","DOIUrl":"https://doi.org/10.1504/IJNM.2017.10008414","url":null,"abstract":"Surfaces textured by sophisticated micro/nano structures can provide advanced and useful functions and features as compared with simply smooth surfaces. To promote widespread use of the structured surfaces, manufacturing technology of structured surfaces for ultra-precision dies and moulds made of hardened steel is absolutely essential. Conventional diamond cutting is not applicable to machining of steel due to rapid tool wear and surface deterioration. On the other hand, elliptical vibration cutting (EVC) equipped with the ultra-precision amplitude control sculpturing method is considered as a potential candidate for the functional surface fabrication on steel materials. In this method, tool geometry, especially the clearance angle, imposes a limit on the machinable part geometry due to the flank face contact to the target shape in the downhill machining. In order to clarify the influence of flank face contact on the machining accuracy and the tool wear, a series of theoretical and experimental investigations are conducted in this paper. A surface with micro sine-sweep profile is fabricated on hardened steel by applying the proposed amplitude control sculpturing method. It verified that the interference between flank face and fabricated structure causes not only the serious machining accuracy deterioration but also the serious tool damage due to the enhancing of ploughing process.","PeriodicalId":14170,"journal":{"name":"International Journal of Nanomanufacturing","volume":"13 1","pages":"351"},"PeriodicalIF":0.0,"publicationDate":"2017-10-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"42749943","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-10-20DOI: 10.1504/IJNM.2017.10008421
Zhang Zhong, Zhao Ji, Ji Shi Jun, Li Gang
Four-axis polishing platform plays an important role in machining a complex optical free-form surface and the kinematic error generally determine the accuracy of the optical free-form surface fabricated by this platform. This paper analyses kinematics of the polishing platform based on the homogeneous coordinate transformation theory and the error of kinematics synthesis model is established. Based on minimum error assumption, transition matrix is obtained from machine tool coordinate system to the cutting tool coordinate system and changing rule of comprehensive error in different position and direction is gained in two-axis motion worktable. Laser interferometer is used to measure the geometric error of polishing platform, it is found that different feed rate and measured spacing had no significant effect on the positioning error of moving axis and positioning error rather than the straightness and angle error has more significant influence on the accuracy of machine tool. Compensation experiment was conducted based on integrated error model, the x-axis and z-axis positioning error was reduced by 87.37% and 90.32% after compensation and the compensation result is remarkable.
{"title":"Comprehensive error modelling and error compensation for complex optical free-form surface polishing platform","authors":"Zhang Zhong, Zhao Ji, Ji Shi Jun, Li Gang","doi":"10.1504/IJNM.2017.10008421","DOIUrl":"https://doi.org/10.1504/IJNM.2017.10008421","url":null,"abstract":"Four-axis polishing platform plays an important role in machining a complex optical free-form surface and the kinematic error generally determine the accuracy of the optical free-form surface fabricated by this platform. This paper analyses kinematics of the polishing platform based on the homogeneous coordinate transformation theory and the error of kinematics synthesis model is established. Based on minimum error assumption, transition matrix is obtained from machine tool coordinate system to the cutting tool coordinate system and changing rule of comprehensive error in different position and direction is gained in two-axis motion worktable. Laser interferometer is used to measure the geometric error of polishing platform, it is found that different feed rate and measured spacing had no significant effect on the positioning error of moving axis and positioning error rather than the straightness and angle error has more significant influence on the accuracy of machine tool. Compensation experiment was conducted based on integrated error model, the x-axis and z-axis positioning error was reduced by 87.37% and 90.32% after compensation and the compensation result is remarkable.","PeriodicalId":14170,"journal":{"name":"International Journal of Nanomanufacturing","volume":"13 1","pages":"371"},"PeriodicalIF":0.0,"publicationDate":"2017-10-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"44861454","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-10-20DOI: 10.1504/IJNM.2017.10008419
Seung Jae Kim, D. Jang
Primary electrons are emitted from the cathode in a scanning electron microscope (SEM). The electron gun's cathode diameter is ~60 µm and the anode's internal diameter is ~3 mm. When the cathode and anode centres do not match, the SEM image is distorted. We developed an automatic alignment method for the electron gun. The primary electrons are scanned under the anode hole for secondary electron image acquisition. However, when the primary electrons are scanned from the upper anode hole, secondary electrons on the specimen as big as the size of the anode hole are generated. The alignment of the cathode and anode centres is determined from the image's brightness and position on the screen; if the image is very bright, the alignment is normal. We employ pattern recognition to analyse images to achieve automatic alignment of the electron gun. We designed a scanning device and performed image scale calibration.
{"title":"Study on algorithm of automatic alignment compensation of electron gun in a scanning electron microscope","authors":"Seung Jae Kim, D. Jang","doi":"10.1504/IJNM.2017.10008419","DOIUrl":"https://doi.org/10.1504/IJNM.2017.10008419","url":null,"abstract":"Primary electrons are emitted from the cathode in a scanning electron microscope (SEM). The electron gun's cathode diameter is ~60 µm and the anode's internal diameter is ~3 mm. When the cathode and anode centres do not match, the SEM image is distorted. We developed an automatic alignment method for the electron gun. The primary electrons are scanned under the anode hole for secondary electron image acquisition. However, when the primary electrons are scanned from the upper anode hole, secondary electrons on the specimen as big as the size of the anode hole are generated. The alignment of the cathode and anode centres is determined from the image's brightness and position on the screen; if the image is very bright, the alignment is normal. We employ pattern recognition to analyse images to achieve automatic alignment of the electron gun. We designed a scanning device and performed image scale calibration.","PeriodicalId":14170,"journal":{"name":"International Journal of Nanomanufacturing","volume":"13 1","pages":"362"},"PeriodicalIF":0.0,"publicationDate":"2017-10-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"44190441","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-10-20DOI: 10.1504/IJNM.2017.10008407
S. Ma, Zhanhui Wang, Lingyu Lin
EDM is an important means of processing in mould processing industry. In this paper, the Su-Field analysis method is applied to study the mechanism of EDM, the application process of Su-Field analysis method to solve the problem of EDM discharge system was established, the microscopic process of EDM dielectric breakdown was described, the Su-Field model of the single pulse discharge four phases, discharge channel formation, breakdown discharge, galvanic corrosion throwing and the deionisation between the medium, was established, and finally the complete Su-Field model of single pulse discharge process of EDM was achieved. In the single-pulse discharge established Su-Field model basis, the factors affecting the processing speed, surface roughness and electrode wear were analysed, further integration of 76 standard solutions, the plan to solve the problem of instability in the discharge process was achieved, at the same time, a new way for the research of EDM process was provided.
{"title":"Study on the analysis of the mechanism of EDM based on Su-Field","authors":"S. Ma, Zhanhui Wang, Lingyu Lin","doi":"10.1504/IJNM.2017.10008407","DOIUrl":"https://doi.org/10.1504/IJNM.2017.10008407","url":null,"abstract":"EDM is an important means of processing in mould processing industry. In this paper, the Su-Field analysis method is applied to study the mechanism of EDM, the application process of Su-Field analysis method to solve the problem of EDM discharge system was established, the microscopic process of EDM dielectric breakdown was described, the Su-Field model of the single pulse discharge four phases, discharge channel formation, breakdown discharge, galvanic corrosion throwing and the deionisation between the medium, was established, and finally the complete Su-Field model of single pulse discharge process of EDM was achieved. In the single-pulse discharge established Su-Field model basis, the factors affecting the processing speed, surface roughness and electrode wear were analysed, further integration of 76 standard solutions, the plan to solve the problem of instability in the discharge process was achieved, at the same time, a new way for the research of EDM process was provided.","PeriodicalId":14170,"journal":{"name":"International Journal of Nanomanufacturing","volume":"13 1","pages":"307"},"PeriodicalIF":0.0,"publicationDate":"2017-10-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"44266347","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-10-20DOI: 10.1504/IJNM.2017.10008410
Joo-Sang Lee
Smartphones are currently the most popular electronic devices with high volume production activities driven by high demand and requirements for rapid turnaround time. The changes of displacement were analysed according to a variable of the gate size and runner system. The radial type and gate with large size were shown that better results in displacement. While the design and production of lenses, the key component of a camera, still need to be improved, the current technology has run into its limit with regard to trends in size and weight reduction. In this study, an injection moulding analysis was performed on plastic lenses that are widely employed for smartphone cameras. Specifically, the displacement of lenses at the time of injection moulding was studied by varying the gate size and runner system.
{"title":"A study on the displacement analysis in the injection moulding for the camera-phone","authors":"Joo-Sang Lee","doi":"10.1504/IJNM.2017.10008410","DOIUrl":"https://doi.org/10.1504/IJNM.2017.10008410","url":null,"abstract":"Smartphones are currently the most popular electronic devices with high volume production activities driven by high demand and requirements for rapid turnaround time. The changes of displacement were analysed according to a variable of the gate size and runner system. The radial type and gate with large size were shown that better results in displacement. While the design and production of lenses, the key component of a camera, still need to be improved, the current technology has run into its limit with regard to trends in size and weight reduction. In this study, an injection moulding analysis was performed on plastic lenses that are widely employed for smartphone cameras. Specifically, the displacement of lenses at the time of injection moulding was studied by varying the gate size and runner system.","PeriodicalId":14170,"journal":{"name":"International Journal of Nanomanufacturing","volume":"13 1","pages":"333"},"PeriodicalIF":0.0,"publicationDate":"2017-10-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"49359498","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-10-20DOI: 10.1504/IJNM.2017.10008422
Jinxuan Bai, Q. Bai
Although polycrystalline diamond (PCD) is ever viewed as brittle materials, it can present strong dislocation activity in certain condition. In this paper, the two dimensional discrete dislocation plastic (DDP) simulation under fully periodic boundary conditions was employed to study PCD dislocation behaviour. Crystal dissipation and entropy theory were introduced into the computational study to reveal dislocation density evolution and disordered sequence during PCD failure process. Our result showed that the developed model can capture the essential features of PCD dislocation evolution behaviour and realises accurate description of PCD failure process. Investigations of plastic dissipation and dislocation structure evolution reveal that the dislocation structure evolution plays a key role in the fracture process.
{"title":"A multiscale simulation investigation of dislocation behaviour of PCD failure process","authors":"Jinxuan Bai, Q. Bai","doi":"10.1504/IJNM.2017.10008422","DOIUrl":"https://doi.org/10.1504/IJNM.2017.10008422","url":null,"abstract":"Although polycrystalline diamond (PCD) is ever viewed as brittle materials, it can present strong dislocation activity in certain condition. In this paper, the two dimensional discrete dislocation plastic (DDP) simulation under fully periodic boundary conditions was employed to study PCD dislocation behaviour. Crystal dissipation and entropy theory were introduced into the computational study to reveal dislocation density evolution and disordered sequence during PCD failure process. Our result showed that the developed model can capture the essential features of PCD dislocation evolution behaviour and realises accurate description of PCD failure process. Investigations of plastic dissipation and dislocation structure evolution reveal that the dislocation structure evolution plays a key role in the fracture process.","PeriodicalId":14170,"journal":{"name":"International Journal of Nanomanufacturing","volume":"13 1","pages":"384"},"PeriodicalIF":0.0,"publicationDate":"2017-10-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"44230353","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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