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IEEE/SEMI Conference on Advanced Semiconductor Manufacturing Workshop最新文献

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The physical mechanisms of defect clustering and its correlation to yield model parameters for yield improvement 缺陷聚类的物理机制及其与良率模型参数的关系
Pub Date : 1990-09-11 DOI: 10.1109/ASMC.1990.111227
R. S. Collica
The superposition principle is used to analyze faults of different mechanisms. The sum of individual cluster coefficients is approximately equal to the cluster coefficient for all mechanisms combined. A regression analysis of empirical data is used to demonstrate the concept. The actual fault density is compared to the model fault density and shows excellent agreement. The application of this model to actual chip yields is shown to be more accurate but also contain information about the relative number of fault generating mechanisms for the mask level of interest in the process. Future applications and areas of further work are given.<>
利用叠加原理对不同机构的故障进行分析。单个聚类系数的总和近似等于所有机制的聚类系数的总和。通过对经验数据的回归分析来论证这一概念。将实际故障密度与模型故障密度进行了比较,结果吻合良好。将该模型应用于实际的芯片产量被证明是更准确的,但也包含有关过程中感兴趣的掩模水平的故障产生机制的相对数量的信息。展望了未来的应用和进一步的工作领域。
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引用次数: 3
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IEEE/SEMI Conference on Advanced Semiconductor Manufacturing Workshop
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