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Bottom-up micromachined PZT film-based ultrasonic microphone with compressible parylene tube 基于PZT薄膜的自底向上微机械可压缩聚对二甲苯管超声传声器
IF 2.3 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2023-08-09 DOI: 10.1088/1361-6439/acee89
Chung-Hao Huang, G. Feng
This paper reports on a micromachined ultrasonic microphone using a bottom-up fabrication scheme. Starting with a 4 μm-thick titanium foil as the substrate, each functional film and key element was added to the foil substrate to complete the ultrasonic microphone. The piezoelectric lead zirconate titanate film hydrothermally grown on the patterned substrate with low residual stress effectively deflected the unimorph-sensing cantilever array of the microphone under ultrasound pressure. The created cantilever array structure secured on a 250 μm-thick SU8 hollow plate formed an ultrasonic microphone plate that was tested with a sensitivity of −60 dBV Pa−1 at 21 kHz (with 0 dB gain amplification) and an operation bandwidth of 5–55 kHz. Different thicknesses of parylene films ranging from 0.5 to 2 μm overlaid over the entire sensing region and converted the cantilever-to-diaphragm-structured microphone for further investigation. An enhanced result was observed when the deposited parylene film thickness was in the submicron range. The sensitivity of the microphone can be further enhanced by up to 33% by adding a parylene-film-made compressible tube to act as a Helmholtz resonator (HR). The HR model was discussed and compared with the experimental results. The output amplitude of the developed microphone assembled with the compressible tube demonstrates a 15 dB increase compared to that of a commercial capacitive MEMS ultrasonic microphone.
本文报道了一种采用自底向上制造方法的微机械超声传声器。以4 μm厚的钛箔为衬底,在衬底上加入各功能薄膜和关键元件,完成超声波传声器。在具有低残余应力的图像化衬底上水热生长的锆钛酸铅压电薄膜在超声压力下有效偏转了传声器的均匀传感悬臂阵列。将所创建的悬臂阵列结构固定在250 μm厚的SU8中空板上,形成了在21 kHz下灵敏度为−60 dBV Pa−1(增益为0 dB)、工作带宽为5 ~ 55 kHz的超声波传声器板。在整个传感区域上覆盖了0.5 ~ 2 μm厚度的聚对二甲苯薄膜,将悬臂-膜片结构的传声器转换为进一步的研究。当沉积的聚对二甲苯薄膜厚度在亚微米范围内时,效果明显增强。通过添加聚苯乙烯薄膜制成的可压缩管作为亥姆霍兹谐振器(HR),麦克风的灵敏度可以进一步提高33%。对HR模型进行了讨论,并与实验结果进行了比较。与商用电容式MEMS超声波传声器相比,采用可压缩管组装的传声器的输出振幅提高了15 dB。
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引用次数: 0
Flexible pressure/temperature sensors with heterogeneous integration of ultra-thin silicon and polymer 超薄硅和聚合物异质集成柔性压力/温度传感器
IF 2.3 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2023-08-09 DOI: 10.1088/1361-6439/acee8b
Weiwen Feng, Peng Li, Haozhi Zhang, Ke Sun, Wei Li, Xinxin Li
Flexible pressure sensors and temperature sensors are widely used in various fields because of their advantages in high flexibility, good shape retention and extremely small thickness. However, it is quite challenging to fabricate ultra-thin flexible pressure sensors with reliable sensing performance. In this work, we propose a new type of silicon–polymer heterogeneously integrated MEMS flexible sensor with an ultra-thin silicon-based absolute pressure sensing element and a thermistor. In the study, a flexible MEMS fabrication process is developed, which enables simultaneous fabrication in two different substrates and self-release of the thin and slim flexible sensor. The front-end section of the flexible sensor is with the width as 125 μm, length as 3.2 cm and total thickness as 12 μm, where the integrated silicon substrate thickness is only 3 μm. The sensor takes a slender shape to allow for medical invasive measurement by inserting it into a slim medical catheter or a syringe needle-tube. The sensitivity of the fabricated ultra-thin absolute pressure sensor is tested as 45.2 μV kPa−1 under 3.3 V supplied voltage, with the nonlinearity as only ±0.16% FS. The sensitivity of the thermistor is 10.4 Ω °C−1 in the range of 0 °C–100 °C. Moreover, the polysilicon thermistor can also serve as a micro-heater, where an electric heating power of 107 μW results in a temperature increase of 13.5 °C. With ultra-thin slim structure and satisfactory performance, the MEMS flexible sensor is promising in various fields like biomedical applications.
柔性压力传感器和温度传感器以其高柔性、良好的形状保持性和极小的厚度等优点被广泛应用于各个领域。然而,制造具有可靠传感性能的超薄柔性压力传感器是相当具有挑战性的。在这项工作中,我们提出了一种新型的硅-聚合物非均匀集成MEMS柔性传感器,该传感器具有超薄硅基绝对压力传感元件和热敏电阻。在这项研究中,开发了一种柔性MEMS制造工艺,该工艺能够在两种不同的衬底上同时制造,并实现薄柔性传感器和薄柔性传感器的自释放。柔性传感器的前端部分宽度为125μm,长度为3.2cm,总厚度为12μm,其中集成硅衬底厚度仅为3μm。传感器采用细长形状,通过将其插入细长的医疗导管或注射器针管中进行医疗侵入性测量。所制备的超薄绝对压力传感器在3.3 V供电电压下的灵敏度为45.2μV kPa−1,非线性仅为±0.16%FS。热敏电阻的灵敏度在0°C–100°C范围内为10.4Ω°C−1。此外,多晶硅热敏电阻还可以用作微加热器,107μW的电加热功率会使温度升高13.5°C。MEMS柔性传感器具有超薄的结构和令人满意的性能,在生物医学等领域有着广阔的应用前景。
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引用次数: 0
Design and research of a valve-based piezoelectric pump with low forward resistance and high reverse shutoff 低正向阻力高反向关断阀基压电泵的设计与研究
IF 2.3 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2023-08-02 DOI: 10.1088/1361-6439/acec7f
Yong Zhang, Jinyu Li, Xiaoliang Wang, Junqing Shao, Shanlin Liu, Qiaosheng Pan
This paper proposes, designs, manufactures and experimentally studies a wedge valve piezoelectric pump driven by a double displacement amplifier vibrator (DDAV). A novel wedge valve is designed, manufactured and analyzed, and the static performance of the wedge valve is tested. The test results show that it has less forward resistance and high reverse shutoff. The DDAV and pump body are designed, and the test experimental platform is built. Results indicate that the static opening pressure of the wedge valve is 0.27 kPa, and the reverse shutoff pressure can reach 200 kPa. When the driving voltage is 700 Vpp and the driving frequency is 425 Hz, the maximum flow rate is 491.2 ml min−1 and the maximum output pressure is 160 kPa.
本文提出、设计、制造并实验研究了一种由双位移放大器振动器(DDAV)驱动的楔形阀压电泵。设计、制造和分析了一种新型的楔形阀,并对其静态性能进行了测试。试验结果表明,它具有较小的正向阻力和较高的反向关断能力。设计了DDAV和泵体,搭建了测试实验平台。结果表明,楔形阀的静态开启压力为0.27kPa,反向关闭压力可达200kPa。当驱动电压为700 Vpp,驱动频率为425 Hz时,最大流量为491.2 ml min−1,最大输出压力为160 kPa。
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引用次数: 0
A novel multi-axis pendulum sandwich structure accelerometer 一种新型多轴摆夹芯结构加速度计
IF 2.3 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2023-08-02 DOI: 10.1088/1361-6439/acec7e
Zhenyu Wei, C. Si, G. Han, Y. Zhao, Jin Ning, L. Jia, Y. Zeng, Fuhua Yang
This paper proposes a new scheme of pendulum accelerometer with sandwich structure. In this scheme, the electrical signal on the mass is connected to the wafer surface through glass isolated through-silicon-via (TSV), so that the basic characteristics of the accelerometer can be obtained by wafer-level testing. Compared with the current commercial device process scheme, the packaging and testing cost of the device can be greatly reduced. The glass-in-silicon (GIS) encapsulation caps on both sides of the device are prepared by glass isolated TSV and GIS reflow process. By designing the shape and size of the silicon electrode area and glass area of the GIS caps, the parasitic capacitance between the pendulum structure and the fixed electrode is reduced. Another advantage of using TSV to extract the electrical signal of the mass is that the Z-axis inertial force can be detected when the pendulum structure is placed perpendicular to the direction of gravity acceleration. In addition, electrodes are grown on the side of the split device, and when the pendulum structure is placed parallel to the direction of gravity acceleration, the inertial force of the XY-axis can be detected. The test shows that when the range of the pendulum accelerometer based on this scheme is ±2 g, the noise density of the accelerometer is 42 μg √Hz−1 (X-axis), 40 μg √Hz−1 (Y-axis) and 27 μg √Hz−1 (Z-axis), and the bias instability is 6.6 μg (X-axis), 7.1 μg (Y-axis) and 6.8 μg (Z-axis), reaching the level of commercial devices.
本文提出了一种新型的夹层结构摆式加速度计方案。在该方案中,质量块上的电信号通过硅通孔(TSV)隔离的玻璃连接到晶片表面,从而可以通过晶片级测试获得加速度计的基本特性。与目前商业化的器件工艺方案相比,该器件的封装和测试成本可以大大降低。器件两侧的硅中玻璃(GIS)封装帽是通过玻璃隔离TSV和GIS回流工艺制备的。通过设计GIS帽的硅电极区域和玻璃区域的形状和尺寸,降低了摆锤结构与固定电极之间的寄生电容。使用TSV提取质量的电信号的另一个优点是,当摆锤结构垂直于重力加速度方向放置时,可以检测Z轴惯性力。此外,电极生长在分离装置的一侧,并且当摆锤结构平行于重力加速度的方向放置时,可以检测XY轴的惯性力。试验表明,当基于该方案的摆锤式加速度计的量程为±2g时,加速度计的噪声密度为42μg √Hz−1(X轴),40μg √Hz−1(Y轴)和27μg √Hz−1(Z轴),偏置不稳定性分别为6.6μg(X轴)、7.1μg(Y轴)和6.8μg(Z轴线),达到了商用器件的水平。
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引用次数: 0
Corrigendum: On overtravel and skate in cantilever-based probes for on-wafer measurements (2022 J. Micromech. Microeng. 32 057001) 勘误:用于晶圆上测量的悬臂式探头的超行程和滑动(2022 J. Micromech.)。Microeng. 32 057001)
IF 2.3 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2023-07-27 DOI: 10.1088/1361-6439/ace834
S. Arscott
This corrigendum reformulates the equations for the normal contact force of the probe and the condition for tip skate in the presence of friction. This enables a formulation of the effective spring constant of a tilted probe to be written down. This model is compared to that of others.
本更正重新表述了探针法向接触力的方程和存在摩擦时尖端滑板的条件。这使得能够写下倾斜探针的有效弹簧常数的公式。将此模型与其他模型进行比较。
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引用次数: 0
A simple way to predict the flip–chip gap 一个简单的方法来预测倒装芯片的间隙
IF 2.3 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2023-07-27 DOI: 10.1088/1361-6439/aceb00
Yue Huang, Zhi-Kai Gan, Chun Lin
Using laser scanning confocal microscopy measurement, a concise method for extracting the indium bump shape in microelectronics was first established. The extracted bump shape was then used as the input for finite element analysis. The modeled one-bump deformation was used to predict the final flip–chip gap after bonding. Dovetailed with the results of cross-sectional scanning electron microscopy, this simple and non-destructive method for predicting a flip–chip gap of the order of 10 microns or less was eventually validated.
利用激光扫描共聚焦显微镜测量,首次建立了一种在微电子技术中提取铟凸块形状的简明方法。提取的凸起形状然后被用作有限元分析的输入。模型化的单凸块变形用于预测键合后的最终倒装芯片间隙。随着横截面扫描电子显微镜的结果,这种预测10微米或更小数量级倒装芯片间隙的简单无损方法最终得到了验证。
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引用次数: 0
The effect of tool wear on the damaged layer thickness and tool wear rate in ultra-precision turning of quartz glass 超精密车削石英玻璃时刀具磨损对损伤层厚度和刀具磨损率的影响
IF 2.3 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2023-07-26 DOI: 10.1088/1361-6439/acea8b
Yujie Liu, H. Tong, Yong Li, Jialong Chen
Quartz glasses have been extensively used for many fields, such as semiconductor technology, optical instruments, inertial navigation and others. Ultra-precision turning with diamond tools can achieve high surface accuracy when processing non-ferrous materials. In recent years, ultra-precision turning has also been tried to be applied to process brittle materials, but there are constraints including small removal amount and tool wear. When diamond tools are used to cut quartz glass, tool wear occurs under the combined action of thermal effect and mechanical friction, which will affect the damaged layer thickness of the processed quartz glass. In this paper, the tool wear factor is led into the calculation of the extrusion volume, and the damaged layer thickness is calculated by the extrusion volume. Combined with the results of quartz glass turning experiments and the calculated results by simulation, the effect of tool wear factor on the damaged layer thickness and the tool wear rate is analyzed. The analysis shows that tool wear will lead to chip fracture thickness decrease and extrusion volume increase. Combined action of these two aspects, the damage layer thickness keeps unchanged at first and then rises with the increase of tool wear. In addition, the experimental results show that the tool wear rate rises with the increase of tool wear.
石英玻璃在半导体技术、光学仪器、惯性导航等领域有着广泛的应用。在加工有色金属材料时,使用金刚石工具进行超精密车削可以实现高表面精度。近年来,超精密车削也被尝试应用于脆性材料的加工,但存在去除量小和刀具磨损等限制。金刚石刀具在切割石英玻璃时,在热效应和机械摩擦的共同作用下,刀具磨损会影响加工后石英玻璃的损伤层厚度。本文将刀具磨损因子引入挤压体积的计算中,并通过挤压体积计算损伤层厚度。结合石英玻璃车削实验结果和模拟计算结果,分析了刀具磨损因素对损伤层厚度和刀具磨损率的影响。分析表明,刀具磨损会导致切屑断裂厚度减小,挤压体积增大。在这两个方面的共同作用下,随着刀具磨损的增加,损伤层厚度先保持不变,然后上升。此外,实验结果表明,刀具磨损率随着刀具磨损的增加而增加。
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引用次数: 0
Voice coil motor-driven multi-DOF compliant parallel micropositioning stage based on a large range beam-based spherical hinge and fully symmetrical layout 基于大范围波束球面铰链和全对称布局的音圈电机驱动多自由度柔性并联微定位平台
IF 2.3 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2023-07-20 DOI: 10.1088/1361-6439/ace918
Yunzhuang Chen, Leijie Lai, Yu Fang, Li-Min Zhu
With the recent rapid developments in the field of precision engineering, demand for the large range multi-degrees-of-freedom (DOF) micropositioning stage has increased significantly. In this paper, to solve the problems of small motion range, local stress concentration, and low motion accuracy caused by the parasitic motion of the traditional flexure hinge in the multi-DOF micropositioning stage, we first propose a type of large-range beam-based flexure spherical hinge (BFSH). Subsequently, based on the proposed BFSH, a large range 3-DOF θxθyz spatial micropositioning stage driven by the voice coil motor is designed employing parallel branch chains and a fully symmetrical layout. This arrangement realizes theoretical motion decoupling in structural design. Furthermore, we use the geometric method to derive kinematic equations of the moving platform, which are used as the decoupling matrix of the control loop. Based on the compliance matrix method and Lagrange’s method, the compliance matrix model of the BFSH, the 3-DOF micropositioning stage, and the stage dynamic model are determined respectively. Additionally, finite element analysis and experimental tests are conducted to verify the accuracy of the analytical model and assess the static and dynamic performance of the designed 3-DOF stage. Moreover, a fractional order phase advanced proportional integral controller is designed for closed-loop control to track the sinusoidal trajectory and spherical trajectory. The results reveal that the stage can achieve the desired large workspace of ± 21.5 mrad × ± 20.3 mrad × ± 3.23 mm, as well as excellent decoupling and trajectory tracking performance.
随着近年来精密工程领域的快速发展,对大范围多自由度微定位平台的需求显著增加。针对传统柔性铰链在多自由度微定位阶段存在的运动范围小、局部应力集中、运动精度低等问题,首次提出了一种基于大范围梁的柔性球面铰链(BFSH)。随后,基于所提出的BFSH,设计了一种由音圈电机驱动的大范围3-DOF θxθyz空间微定位级,采用平行分支链和全对称布局。这种布置实现了结构设计中的理论运动解耦。利用几何方法推导出运动平台的运动方程,作为控制回路的解耦矩阵。基于柔度矩阵法和拉格朗日法,分别确定了BFSH柔度矩阵模型、三自由度微定位工作台柔度矩阵模型和工作台动力学模型。通过有限元分析和试验验证了分析模型的准确性,并对所设计的三自由度平台进行了静态和动态性能评估。此外,设计了分数阶相位进阶比例积分控制器,用于跟踪正弦轨迹和球面轨迹的闭环控制。结果表明,该平台可以实现±21.5 mrad ×±20.3 mrad ×±3.23 mm的大工作空间,并具有良好的解耦和轨迹跟踪性能。
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引用次数: 0
First multiplexed electrochemical wax-on-plastic chip: PNA/GO interface integration for DNA detection 首个多路电化学塑料上蜡芯片:PNA/GO接口集成DNA检测
IF 2.3 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2023-07-12 DOI: 10.1088/1361-6439/ace6b1
P. Das, O. Adil, M. Shamsi
This study presents the fabrication of the first multiplexed wax-on-plastic electrochemical chip with low-temperature sintering of the conductive layers. A total of 169 sensing electrodes (1.2 mm diameter each) were printed on a wax-patterned plastic substrate using silver inkjet printing. Fidelity of the device was confirmed using optical and electrical techniques. The sensing electrodes were modified using graphene oxide (GO) ink and peptide nucleic acid (PNA) probes through simple drop-casting. The PNA/GO interface on the multiplexed chip was used to detect DNA using differential pulse voltammetry, which records the electrons transfer from the diffusion of a soluble redox probe. The PNA/GO interface was then tested against a target concentration, target size, and mismatched target. The response of the DNA-PNA duplex on the surface was additionally compared with the prehybridized duplex, and the lower affinity of the duplexes for the GO surface was confirmed by removing Mg2+. The interface was responsive to such variables at attomolar concentrations. The low volume of the target (300 nL) at that concentration level demonstrated the chip sensitivity with only 18 target molecules on the surface.
本研究首次采用低温烧结的导电层制备了多路蜡基塑料电化学芯片。采用银喷墨打印技术,将169个传感电极(每个直径1.2 mm)打印在蜡纹塑料衬底上。使用光学和电学技术证实了该装置的保真度。传感电极采用氧化石墨烯(GO)墨水和肽核酸(PNA)探针进行简单滴铸修饰。多路复用芯片上的PNA/GO接口使用差分脉冲伏安法检测DNA,该方法记录了可溶性氧化还原探针扩散时的电子转移。然后对PNA/GO界面进行靶浓度、靶尺寸和不匹配靶的测试。DNA-PNA双链在氧化石墨烯表面的反应也与预杂交双链进行了比较,并通过去除Mg2+证实了双链对氧化石墨烯表面的亲和力较低。在原子摩尔浓度下,界面对这些变量有响应。在该浓度水平下,低体积的目标(300 nL)显示了仅在表面上有18个目标分子的芯片灵敏度。
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引用次数: 1
Noise analysis and modeling for a digital control architecture for Lissajous frequency-modulated MEMS gyroscope with amplitude-modulated readout 具有调幅读出的Lissajous调频MEMS陀螺仪数字控制体系结构的噪声分析与建模
IF 2.3 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2023-07-12 DOI: 10.1088/1361-6439/ace6af
Xuetong Wang, Xu-dong Zheng, Yaojie Shen, Chenhao Xia, Wenyuan Tong, Zhonghe Jin, Zhipeng Ma
We report a digital control architecture that demodulates both amplitude-modulated (AM) and frequency-modulated (FM) rate information simultaneously from a gyroscope working in Lissajous frequency-modulated (LFM) mode. The angular rate information is derived from both quadrature (X and Y) resonance modes of the gyroscope simultaneously. A noise model for the AM signal processing channel of the LFM gyroscope is built, analyzed and compared with that of a conventional AM gyroscope, which shows that methods to improve the performance of the conventional AM gyroscope can also be applied to the AM signal processing channel of the LFM gyroscope. The angular rate output obtained from the AM information of the LFM gyroscope has better noise characteristics, which therefore supplements the low precision inadequacy of the FM signal channel of the LFM mode. Tests on the same gyroscope working in different control architectures are conducted. The angle random walk (ARW) and bias instability (BI) of the AM channel of the proposed architecture are 0.51 deg √h−1 and 1.8 deg h−1, respectively, which are better than the results obtained from the FM channel in the same architecture, with values of 0.99 deg √h−1 and 4.3 deg h−1, respectively. Also ARW amd BI of the same gyroscope working in conventional AM mode is 0.50 deg √h−1 and 5.2 deg h−1, respectively.
我们报道了一种数字控制架构,该架构同时解调来自利萨茹调频(LFM)模式下工作的陀螺仪的调幅(AM)和调频(FM)速率信息。角速率信息同时从陀螺仪的正交(X和Y)谐振模式导出。建立了线性调频陀螺仪AM信号处理通道的噪声模型,并与传统AM陀螺仪的噪声模型进行了比较,结果表明,提高传统AM陀螺仪性能的方法也可以应用于线性调频陀螺仪的AM信号处理信道。从LFM陀螺仪的AM信息获得的角速率输出具有更好的噪声特性,从而补充了LFM模式的FM信号通道的低精度不足。对在不同控制结构下工作的同一陀螺仪进行了测试。所提出的架构的AM信道的角度随机游动(ARW)和偏置不稳定性(BI)分别为0.51°√h−1和1.8°h−1,这比从相同架构的FM信道获得的结果要好,其值分别为0.99°√h‑1和4.3°h−1。同样,在传统AM模式下工作的同一陀螺仪的ARW和BI分别为0.50°√h−1和5.2°h−1。
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引用次数: 0
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Journal of Micromechanics and Microengineering
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