Pub Date : 2020-07-01DOI: 10.1109/ITherm45881.2020.9190272
Wenbin Tian, Michael Berktold, C. Carte, Ellen Tan
Thermocouples are widely used in industry for temperature measurement due to their high accuracy and sensitivity. However, thermocouples can act as a heatsink or a heat spreader when attached onto the top surface of small components like Voltage Regulator Modules (VRM), Capacitors, Platform Controller Hubs (PCH), and etcetera. This could alter cooling conditions of components, consequently leading to temperature measurement discrepancy on these modules. This discrepancy could be more obvious for smaller components without a heatsink or heat spreader attached. Also, the potential discrepancy relies on not only package material of components but the type of thermocouples considering the different thermocouple wire composition. This paper focuses on investigating temperature measurement discrepancies for 36-gauge type T and 36-gauge type J thermocouples on components without heatsinks or heat spreaders attached. Analysis is performed with both numerical simulation modeling using the CFD tool FloTHERM and actual testing measurements based on Intel commercial server products.
{"title":"Investigation on Reading Discrepancy of Type T and Type J Thermocouples","authors":"Wenbin Tian, Michael Berktold, C. Carte, Ellen Tan","doi":"10.1109/ITherm45881.2020.9190272","DOIUrl":"https://doi.org/10.1109/ITherm45881.2020.9190272","url":null,"abstract":"Thermocouples are widely used in industry for temperature measurement due to their high accuracy and sensitivity. However, thermocouples can act as a heatsink or a heat spreader when attached onto the top surface of small components like Voltage Regulator Modules (VRM), Capacitors, Platform Controller Hubs (PCH), and etcetera. This could alter cooling conditions of components, consequently leading to temperature measurement discrepancy on these modules. This discrepancy could be more obvious for smaller components without a heatsink or heat spreader attached. Also, the potential discrepancy relies on not only package material of components but the type of thermocouples considering the different thermocouple wire composition. This paper focuses on investigating temperature measurement discrepancies for 36-gauge type T and 36-gauge type J thermocouples on components without heatsinks or heat spreaders attached. Analysis is performed with both numerical simulation modeling using the CFD tool FloTHERM and actual testing measurements based on Intel commercial server products.","PeriodicalId":193052,"journal":{"name":"2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134236692","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-07-01DOI: 10.1109/ITherm45881.2020.9190297
Murat Parlak, E. Örs, Abuzer Özsunar
As electronic technology develops continuously, space and power allocated for cooling demands increase with time. Therefore, it becomes necessary to develop effective approaches to decrease the cooling power spent and allocated space to obtain low SWAP (Size Weight and Power) values. In this study, the application of T-Shaped branching is studied numerically in detail to get uniform temperature distribution and low-pressure drop as far as the chip junction temperature (GaN MMIC- Monolithic Microwave Integrated Circuit) is kept below the allowable temperature limit. The hotspot has a very challenging value with over 300W/cm2. The cooling liquid temperature is 45°C and the hot spot case temperature has to be kept below 100°C. In the analysis, the %60 ethylene glycol water mixture (EGW) is used as a cooling fluid and all analyses are done using constant thermal properties of materials. The microchannel heatsink has been already designed according to the given allowable volume and it is kept unchanged throughout the study. Since there are 8x2 heat sources, it is essential to guide the flow for uniform flow and temperature distribution. Because of size limitation in the cold plate, the inlet and outlet of the manifold are squeezed to a small area. It consists of two main lines, one is distributing and the other is collecting. They are designed to distribute the fluid as much as equal among the hotspots. All analyses are carried out with different flow rate input and branching is applied both free design and using the rule of Hess Murray (Construction Law) and the results of the solutions are compared and evaluated in terms of pressure drop, temperature uniformity, pumping power, flow balance
{"title":"Numerical Study of Multi Hot Spot GaN Cooling in a Cold Plate Considering Different Flow Networks","authors":"Murat Parlak, E. Örs, Abuzer Özsunar","doi":"10.1109/ITherm45881.2020.9190297","DOIUrl":"https://doi.org/10.1109/ITherm45881.2020.9190297","url":null,"abstract":"As electronic technology develops continuously, space and power allocated for cooling demands increase with time. Therefore, it becomes necessary to develop effective approaches to decrease the cooling power spent and allocated space to obtain low SWAP (Size Weight and Power) values. In this study, the application of T-Shaped branching is studied numerically in detail to get uniform temperature distribution and low-pressure drop as far as the chip junction temperature (GaN MMIC- Monolithic Microwave Integrated Circuit) is kept below the allowable temperature limit. The hotspot has a very challenging value with over 300W/cm2. The cooling liquid temperature is 45°C and the hot spot case temperature has to be kept below 100°C. In the analysis, the %60 ethylene glycol water mixture (EGW) is used as a cooling fluid and all analyses are done using constant thermal properties of materials. The microchannel heatsink has been already designed according to the given allowable volume and it is kept unchanged throughout the study. Since there are 8x2 heat sources, it is essential to guide the flow for uniform flow and temperature distribution. Because of size limitation in the cold plate, the inlet and outlet of the manifold are squeezed to a small area. It consists of two main lines, one is distributing and the other is collecting. They are designed to distribute the fluid as much as equal among the hotspots. All analyses are carried out with different flow rate input and branching is applied both free design and using the rule of Hess Murray (Construction Law) and the results of the solutions are compared and evaluated in terms of pressure drop, temperature uniformity, pumping power, flow balance","PeriodicalId":193052,"journal":{"name":"2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"146 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133138119","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-07-01DOI: 10.1109/ITherm45881.2020.9190565
C. Kim, G. Ni, G. Kini, Je-Young Chang, A. Saha, Aravindha R. Antoniswamy, Iolanda Klein, Michael Jorgensen, Minseok Ha, Peng Li, B. Wondimu, Dev Kulkarni
This paper reports the corrosion mechanism active in microchannel cold plates used in a liquid cooling system and proposes a kinetic model describing the rate of corrosion-induced failure as a function of testing conditions. The corrosion failure mechanism investigated in this paper is galvanic corrosion because the cold plate is typically made of Cu and is assembled using brazing alloys and there exists a galvanic potential between the Cu and the brazed area. A series of experimental characterizations indicates that the brazed joint is subjected to galvanic attack when exposed to a coolant, a mixture of water and propylene glycol (PG), with a galvanic potential sufficient to dissolve the braze component with an accelerated rate. Various testing on the galvanic corrosion finds that the braze (a ternary alloy of Cu, Ag, and P) becomes an anode in the galvanic pair and loses the component element by the process of dissolution. This type of galvanic corrosion is found to exist even with corrosion inhibitors present in the coolant, necessitating the corrosion assessment methodology that can predict the rate of cold plate failure with the use of the "accelerated testing" and the prediction model. Our research leads to the development of the micro-galvanic cell testing as well as the zero resistance ammeter (ZRA) methodologies. Our investigation with these testing methodologies presents clear evidence showing that the galvanic corrosion is the most active and serious form of corrosion in the cold-plate with the galvanic pair exerting as high as ~0.3V anodic potential on the brazed joint. It is also found that the rate of corrosion can be further accelerated with temperature and the external potential purposely applied across the Cu and the braze. The resulting galvanic corrosion kinetics collected in the form of current may be used to predict the corrosion rate at use conditions as they are found to follow the form of an Arrhenius-type kinetics model with a consideration of the corrosion acceleration factor.
{"title":"Corrosion in Liquid Cooling Systems with Water-Based Coolant – Part 2: Corrosion Reliability Testing and Failure Model","authors":"C. Kim, G. Ni, G. Kini, Je-Young Chang, A. Saha, Aravindha R. Antoniswamy, Iolanda Klein, Michael Jorgensen, Minseok Ha, Peng Li, B. Wondimu, Dev Kulkarni","doi":"10.1109/ITherm45881.2020.9190565","DOIUrl":"https://doi.org/10.1109/ITherm45881.2020.9190565","url":null,"abstract":"This paper reports the corrosion mechanism active in microchannel cold plates used in a liquid cooling system and proposes a kinetic model describing the rate of corrosion-induced failure as a function of testing conditions. The corrosion failure mechanism investigated in this paper is galvanic corrosion because the cold plate is typically made of Cu and is assembled using brazing alloys and there exists a galvanic potential between the Cu and the brazed area. A series of experimental characterizations indicates that the brazed joint is subjected to galvanic attack when exposed to a coolant, a mixture of water and propylene glycol (PG), with a galvanic potential sufficient to dissolve the braze component with an accelerated rate. Various testing on the galvanic corrosion finds that the braze (a ternary alloy of Cu, Ag, and P) becomes an anode in the galvanic pair and loses the component element by the process of dissolution. This type of galvanic corrosion is found to exist even with corrosion inhibitors present in the coolant, necessitating the corrosion assessment methodology that can predict the rate of cold plate failure with the use of the \"accelerated testing\" and the prediction model. Our research leads to the development of the micro-galvanic cell testing as well as the zero resistance ammeter (ZRA) methodologies. Our investigation with these testing methodologies presents clear evidence showing that the galvanic corrosion is the most active and serious form of corrosion in the cold-plate with the galvanic pair exerting as high as ~0.3V anodic potential on the brazed joint. It is also found that the rate of corrosion can be further accelerated with temperature and the external potential purposely applied across the Cu and the braze. The resulting galvanic corrosion kinetics collected in the form of current may be used to predict the corrosion rate at use conditions as they are found to follow the form of an Arrhenius-type kinetics model with a consideration of the corrosion acceleration factor.","PeriodicalId":193052,"journal":{"name":"2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"106 5","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114048363","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-07-01DOI: 10.1109/ITherm45881.2020.9190277
Pengcheng Yin, Huayan Wang, Jiefeng Xu, Van-Lai Pham, Seungbae Park
Electronic devices suffer from many different types of shock environments. Especially during transportation, hugely large impacts and amplified shock accelerations are transmitted to electronic devices and container, resulting in mechanical failure of the electronic components such as solder-joint failures, chip-cracking and pad cratering, etc. In this paper, we did a container design for rack server in order to increase its shock performance. The foam packaging with different structures were investigated for rack server which can protect rack server in good condition during transportation. Explicit finite element dynamic analysis was performed to improve the shock container. Based on the numerical model, the parametric study was conducted regarding the structure and thickness of foam packaging.
{"title":"Shock Performance Enhancement of a Container for Rack Server","authors":"Pengcheng Yin, Huayan Wang, Jiefeng Xu, Van-Lai Pham, Seungbae Park","doi":"10.1109/ITherm45881.2020.9190277","DOIUrl":"https://doi.org/10.1109/ITherm45881.2020.9190277","url":null,"abstract":"Electronic devices suffer from many different types of shock environments. Especially during transportation, hugely large impacts and amplified shock accelerations are transmitted to electronic devices and container, resulting in mechanical failure of the electronic components such as solder-joint failures, chip-cracking and pad cratering, etc. In this paper, we did a container design for rack server in order to increase its shock performance. The foam packaging with different structures were investigated for rack server which can protect rack server in good condition during transportation. Explicit finite element dynamic analysis was performed to improve the shock container. Based on the numerical model, the parametric study was conducted regarding the structure and thickness of foam packaging.","PeriodicalId":193052,"journal":{"name":"2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128810780","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-07-01DOI: 10.1109/ITherm45881.2020.9190183
Iori Yaguchi, Sho Teradaira, Leo Umino, Qiang Yu
In this paper, the characteristics of the Ag sinter bonding of the Si power module are described, and the effect of the change in creep properties due to sintering condition on the Ag sinter bonding layer was investigated. The authors have been studying changes in creep properties and fatigue life of Ag sinter materials. The Manson-coffin rule is derived using TCT analysis. Calculate the temperature change at the bonding layer using electro-thermal analysis. Based on the result, PCT analysis are performed. the Inelastic strain range of the bonding layer is investigated by thermo-structural analysis. Based on the results, the fatigue strength properties of the Ag sintering bonding layer are investigated using the Manson-coffin rule. It was found that creep has a significant effect on fatigue life.
{"title":"Effect of Changes in Creep Properties Due to Sintering on Fatigue Life of Ag Sinter Bonding Layer of Power Module","authors":"Iori Yaguchi, Sho Teradaira, Leo Umino, Qiang Yu","doi":"10.1109/ITherm45881.2020.9190183","DOIUrl":"https://doi.org/10.1109/ITherm45881.2020.9190183","url":null,"abstract":"In this paper, the characteristics of the Ag sinter bonding of the Si power module are described, and the effect of the change in creep properties due to sintering condition on the Ag sinter bonding layer was investigated. The authors have been studying changes in creep properties and fatigue life of Ag sinter materials. The Manson-coffin rule is derived using TCT analysis. Calculate the temperature change at the bonding layer using electro-thermal analysis. Based on the result, PCT analysis are performed. the Inelastic strain range of the bonding layer is investigated by thermo-structural analysis. Based on the results, the fatigue strength properties of the Ag sintering bonding layer are investigated using the Manson-coffin rule. It was found that creep has a significant effect on fatigue life.","PeriodicalId":193052,"journal":{"name":"2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117299016","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-07-01DOI: 10.1109/ITherm45881.2020.9190502
Melissa K. McCann, M. Fish, L. Boteler, D. Agonafer
This work aims to mitigate the overdesign of steady state packaging systems by combining an organic phase change material (o-PCM) and a metallic PCM (m-PCM) to create a passive cooling composite for pulse power applications. The organic constituent, melamine microencapsulated paraffin spheres, is manually mixed into a Field’s metal (32.5Bi/51In/16.5Sn wt%) matrix. Four concentrations are synthesized containing organic volumetric fractions (VF) of 21.8%, 40.3%, 50.1%, and 61.2%, with a liquid-solid melting temperature near 60°C. Several tools aid in determining the physical arrangement and thermal properties of the prepared PCM composites. A scanning electron microscope (SEM) shows preliminary o-PCM orientations on the composite surface at various magnifications. For interior o-PCM sphere distribution analysis, still images are taken from time-lapse videos created from a micro-computed tomographic (micro-CT) system. Binarization and pixel counting techniques are able to determine effective internal VFs within 3-5% of the prepared bulk VF. Differential scanning calorimetry is employed to determine the phase change onset temperature, heating peak temperature, and latent heat of the PCM composites. This novel PCM fabrication approach decreases the device package size, limits the associated weight, increases the system performance, and minimizes the composite cost.
{"title":"Analyzing the Distribution of Microencapsulated Organic Phase Change Materials Embedded in a Metallic Matrix","authors":"Melissa K. McCann, M. Fish, L. Boteler, D. Agonafer","doi":"10.1109/ITherm45881.2020.9190502","DOIUrl":"https://doi.org/10.1109/ITherm45881.2020.9190502","url":null,"abstract":"This work aims to mitigate the overdesign of steady state packaging systems by combining an organic phase change material (o-PCM) and a metallic PCM (m-PCM) to create a passive cooling composite for pulse power applications. The organic constituent, melamine microencapsulated paraffin spheres, is manually mixed into a Field’s metal (32.5Bi/51In/16.5Sn wt%) matrix. Four concentrations are synthesized containing organic volumetric fractions (VF) of 21.8%, 40.3%, 50.1%, and 61.2%, with a liquid-solid melting temperature near 60°C. Several tools aid in determining the physical arrangement and thermal properties of the prepared PCM composites. A scanning electron microscope (SEM) shows preliminary o-PCM orientations on the composite surface at various magnifications. For interior o-PCM sphere distribution analysis, still images are taken from time-lapse videos created from a micro-computed tomographic (micro-CT) system. Binarization and pixel counting techniques are able to determine effective internal VFs within 3-5% of the prepared bulk VF. Differential scanning calorimetry is employed to determine the phase change onset temperature, heating peak temperature, and latent heat of the PCM composites. This novel PCM fabrication approach decreases the device package size, limits the associated weight, increases the system performance, and minimizes the composite cost.","PeriodicalId":193052,"journal":{"name":"2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115481447","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-07-01DOI: 10.1109/ITherm45881.2020.9190552
S. Chang, K. Chiang, F. Lin, W. Hung
The thermal performances of two loop heat pipes driven by capillary force (CF) and pumping force (PF) using R245a as working fluid were experimentally studied. The variations responsive to the adjustments of heating power, condenser cooling condition and flow rate of working fluid for the average Nusselt numbers of evaporator and condenser, the heat transmission networks, the total thermal resistances and the cooling power consumptions for the CF and PF loop heat pipes were comparatively examined. A selective set of experimental data demonstrated the improvements of thermal performance for the PF loop heat pipe due to the increased vapor-liquid circulation rates and the modified pressure drop characteristics along the loop. The dominant physics for the thermal performance improvements from the CF references were discussed. A set of empirical correlations that permitted the evaluation of the total thermal resistances of the PF loop were devised to assist the relevant engineering applications. Justified by the vanished start-up limit and the reductions of thermal resistance disclosed by the present preliminary study, the research focuses for the technology advancement of the forced convective loop heat pipe was recommended.
{"title":"Thermal Performance of Pump-assisted Loop Heat Pipe using R245fa as Working Fluid","authors":"S. Chang, K. Chiang, F. Lin, W. Hung","doi":"10.1109/ITherm45881.2020.9190552","DOIUrl":"https://doi.org/10.1109/ITherm45881.2020.9190552","url":null,"abstract":"The thermal performances of two loop heat pipes driven by capillary force (CF) and pumping force (PF) using R245a as working fluid were experimentally studied. The variations responsive to the adjustments of heating power, condenser cooling condition and flow rate of working fluid for the average Nusselt numbers of evaporator and condenser, the heat transmission networks, the total thermal resistances and the cooling power consumptions for the CF and PF loop heat pipes were comparatively examined. A selective set of experimental data demonstrated the improvements of thermal performance for the PF loop heat pipe due to the increased vapor-liquid circulation rates and the modified pressure drop characteristics along the loop. The dominant physics for the thermal performance improvements from the CF references were discussed. A set of empirical correlations that permitted the evaluation of the total thermal resistances of the PF loop were devised to assist the relevant engineering applications. Justified by the vanished start-up limit and the reductions of thermal resistance disclosed by the present preliminary study, the research focuses for the technology advancement of the forced convective loop heat pipe was recommended.","PeriodicalId":193052,"journal":{"name":"2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114179525","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-07-01DOI: 10.1109/ITherm45881.2020.9190324
Jian Zhao, Yongzhan He, Hongmei Liu, Jiajun Zhang, B. Liu, Jun Zhang, Wenqing Lv, Alex Zhou, Feng Jiang, Jing Liu, Ahujia Nishi
Today, with the deep popularization of the Internet, continuous development of 5G, cloud and artificial intelligence, the total global data volume is increasing explosively. With more and more data stored in the data center, traditional hard drives are still hosting large amounts of data, and the single-drive capacity is increasing with an average annual rate of more than 10%, so the availability of hard drives is increasingly impacting data security. According to statistics, hard disk failure rate is more than 50% in the whole server failure accounted, the data center has to sacrifice disk performance and time to recover data continuously. There are huge problems with traditional SMART-based fault monitoring in the fault alarm aging, coverage, accuracy, it can not be avoided in advance. Disk failure early warning systems based on disk customized SMART features are designed to solve these problems. It customized the status information, error statistics, environmental information, reliability information, etc. for the basic components related to disk, disc, motor, etc., and trained the hard disk characteristics of fault classes and normal classes by analyzing the statistics and clustering of various factors, and using the machine learning method strains related to the decision tree. Gradually establish a fault prediction model. The fault prediction model can handle the failed hard drive in advance, data backup and migration timely, so as to avoid failure and data loss, to protect the data security in the data center. The results show there is strong correlation with hard disk failure for the error rate of hard disk, reallocate sector, command timeout and so on, and the accuracy of the model in disk failure prediction can reach more than 98%.
{"title":"Disk Failure Early Warning Based on the Characteristics of Customized SMART","authors":"Jian Zhao, Yongzhan He, Hongmei Liu, Jiajun Zhang, B. Liu, Jun Zhang, Wenqing Lv, Alex Zhou, Feng Jiang, Jing Liu, Ahujia Nishi","doi":"10.1109/ITherm45881.2020.9190324","DOIUrl":"https://doi.org/10.1109/ITherm45881.2020.9190324","url":null,"abstract":"Today, with the deep popularization of the Internet, continuous development of 5G, cloud and artificial intelligence, the total global data volume is increasing explosively. With more and more data stored in the data center, traditional hard drives are still hosting large amounts of data, and the single-drive capacity is increasing with an average annual rate of more than 10%, so the availability of hard drives is increasingly impacting data security. According to statistics, hard disk failure rate is more than 50% in the whole server failure accounted, the data center has to sacrifice disk performance and time to recover data continuously. There are huge problems with traditional SMART-based fault monitoring in the fault alarm aging, coverage, accuracy, it can not be avoided in advance. Disk failure early warning systems based on disk customized SMART features are designed to solve these problems. It customized the status information, error statistics, environmental information, reliability information, etc. for the basic components related to disk, disc, motor, etc., and trained the hard disk characteristics of fault classes and normal classes by analyzing the statistics and clustering of various factors, and using the machine learning method strains related to the decision tree. Gradually establish a fault prediction model. The fault prediction model can handle the failed hard drive in advance, data backup and migration timely, so as to avoid failure and data loss, to protect the data security in the data center. The results show there is strong correlation with hard disk failure for the error rate of hard disk, reallocate sector, command timeout and so on, and the accuracy of the model in disk failure prediction can reach more than 98%.","PeriodicalId":193052,"journal":{"name":"2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"84 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115219083","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-07-01DOI: 10.1109/ITherm45881.2020.9190241
Varun Prasanna Rajamuthu, S. Panse, S. Ekkad
Metal foams have shown promise in enhancing heat dissipation from heated surfaces and find applications in forced convection cooling environments like electronics cooling. The thermal and hydraulic performance of metal foams have a strong correlation to its pore density (pores per inch: PPI) and porosity. While high pore density is desired to enhance heat dissipation (due to higher effective heat transfer area), high porosity is suitable to maintain low pressure drop in forced convective cooling applications. Towards this end, an experimental study was carried out to evaluate the thermal-hydraulic performance of high pore density (90 PPI), high porosity (95%), thin Copper foams (3 mm thick) strategically placed over a heated surface of base area 20 mm x 20 mm. Heat transfer was facilitated with air as the working fluid impinging through a 3x3 array (x⁄dj = y⁄dj = 4) of circular nozzles of diameter, dj = 1.5 mm. Two metal foam-heated surface configurations were tested, a full foam configuration; where the metal foam covered the entire heated surface area, and a foam stripes configuration, where metal foam stripes were strategically placed over the heated surface, were studied for their heat transfer, pressure drop and thermal hydraulic performance at Reynolds numbers (Rej) between 3000 and 12000. A smooth surface, without metal foam, served as the baseline case. Additionally, the effect of varying jet-to-target plate distance (z) as z⁄dj = 2, 3, 5, 7 was studied. From experiments, it was observed that the stripes configuration had highest heat transfer enhancement of about 1.45 times that of the smooth surface target, at the expense of a marginal increase in pumping power, thereby making it the best configuration in terms of thermal hydraulic performance.
{"title":"Thermal Hydraulic Performance of High Porosity High Pore Density Thin Copper Foams Subject to Array Jet Impingement","authors":"Varun Prasanna Rajamuthu, S. Panse, S. Ekkad","doi":"10.1109/ITherm45881.2020.9190241","DOIUrl":"https://doi.org/10.1109/ITherm45881.2020.9190241","url":null,"abstract":"Metal foams have shown promise in enhancing heat dissipation from heated surfaces and find applications in forced convection cooling environments like electronics cooling. The thermal and hydraulic performance of metal foams have a strong correlation to its pore density (pores per inch: PPI) and porosity. While high pore density is desired to enhance heat dissipation (due to higher effective heat transfer area), high porosity is suitable to maintain low pressure drop in forced convective cooling applications. Towards this end, an experimental study was carried out to evaluate the thermal-hydraulic performance of high pore density (90 PPI), high porosity (95%), thin Copper foams (3 mm thick) strategically placed over a heated surface of base area 20 mm x 20 mm. Heat transfer was facilitated with air as the working fluid impinging through a 3x3 array (x⁄dj = y⁄dj = 4) of circular nozzles of diameter, dj = 1.5 mm. Two metal foam-heated surface configurations were tested, a full foam configuration; where the metal foam covered the entire heated surface area, and a foam stripes configuration, where metal foam stripes were strategically placed over the heated surface, were studied for their heat transfer, pressure drop and thermal hydraulic performance at Reynolds numbers (Rej) between 3000 and 12000. A smooth surface, without metal foam, served as the baseline case. Additionally, the effect of varying jet-to-target plate distance (z) as z⁄dj = 2, 3, 5, 7 was studied. From experiments, it was observed that the stripes configuration had highest heat transfer enhancement of about 1.45 times that of the smooth surface target, at the expense of a marginal increase in pumping power, thereby making it the best configuration in terms of thermal hydraulic performance.","PeriodicalId":193052,"journal":{"name":"2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116074667","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-07-01DOI: 10.1109/ITherm45881.2020.9190371
Chady al Sayed, Omidreza Ghaffari, Francis Grenier, W. Tong, M. Bolduc, J. Morissette, Simon Jasmin, J. Sylvestre
Pool boiling cooling systems are one of the most promising candidates to address the increase of electronics power consumption. This cooling technique still exhibits many challenges to be fully adopted, such as the high-reliability risk associated with the full immersion of electronic components in dielectric liquids and the film boiling phenomena. This paper reports an investigation of the effects of multiple boiling scenarios on the overall thermal resistance of a close two-phase cooling system, mounted directly over a functional microprocessor. Two dielectric fluids (Novec 649 and 7000 from the 3M Corporation) were tested over nickel and copper processor surfaces. A better overall thermal resistance was achieved when boiling the Novec 7000 on top of the copper exposed processor surface. Degassing the setup to remove non-condensable gases lowered the absolute pressure inside the system and reduced the overall thermal resistance. Moreover, partially immersing inward heat sink pins into the dielectric liquid was observed to also lower thermal resistance. The best boiling scenario was achieved while using Novec 7000 and combining all other improvements. A (0.38±0.01) °C/W minimum overall thermal resistance was calculated from junction to air at a (130±4) W power consumption and a (73±0.4) °C maximum junction temperature. This minimum overall thermal value was 30% lower than the one associated with the best boiling scenario using Novec 649.
{"title":"Localized Pool Boiling and Condensation Experiments over Functional CPU: Optimizing the Overall Thermal Resistance via Different Heat Transfer Scenarios","authors":"Chady al Sayed, Omidreza Ghaffari, Francis Grenier, W. Tong, M. Bolduc, J. Morissette, Simon Jasmin, J. Sylvestre","doi":"10.1109/ITherm45881.2020.9190371","DOIUrl":"https://doi.org/10.1109/ITherm45881.2020.9190371","url":null,"abstract":"Pool boiling cooling systems are one of the most promising candidates to address the increase of electronics power consumption. This cooling technique still exhibits many challenges to be fully adopted, such as the high-reliability risk associated with the full immersion of electronic components in dielectric liquids and the film boiling phenomena. This paper reports an investigation of the effects of multiple boiling scenarios on the overall thermal resistance of a close two-phase cooling system, mounted directly over a functional microprocessor. Two dielectric fluids (Novec 649 and 7000 from the 3M Corporation) were tested over nickel and copper processor surfaces. A better overall thermal resistance was achieved when boiling the Novec 7000 on top of the copper exposed processor surface. Degassing the setup to remove non-condensable gases lowered the absolute pressure inside the system and reduced the overall thermal resistance. Moreover, partially immersing inward heat sink pins into the dielectric liquid was observed to also lower thermal resistance. The best boiling scenario was achieved while using Novec 7000 and combining all other improvements. A (0.38±0.01) °C/W minimum overall thermal resistance was calculated from junction to air at a (130±4) W power consumption and a (73±0.4) °C maximum junction temperature. This minimum overall thermal value was 30% lower than the one associated with the best boiling scenario using Novec 649.","PeriodicalId":193052,"journal":{"name":"2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128053393","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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