4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)最新文献
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860624
K. Hanamura, N. Honda, T. Suzuki, M. Aoki
In reflection of increased environmental consciousness the world over, consideration toward the environment is becoming essential even in the case of electric/electronic equipment. In printed wiring board (PWB) materials brominated flame-retardants are used, and as a result there is concern that dioxin may be generated during combustion. We tackled the development of new flame-retarding method, and we have developed halogen-free FR-4 and resin coated copper foil. Meanwhile, a tendency is also seen to regulate lead within solder, causing progress in the development of lead-free solder. In this paper, we describe the effects of halogen-free materials on the lead-free solder process.
{"title":"Advanced environmental friendly materials for HDI applications","authors":"K. Hanamura, N. Honda, T. Suzuki, M. Aoki","doi":"10.1109/ADHES.2000.860624","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860624","url":null,"abstract":"In reflection of increased environmental consciousness the world over, consideration toward the environment is becoming essential even in the case of electric/electronic equipment. In printed wiring board (PWB) materials brominated flame-retardants are used, and as a result there is concern that dioxin may be generated during combustion. We tackled the development of new flame-retarding method, and we have developed halogen-free FR-4 and resin coated copper foil. Meanwhile, a tendency is also seen to regulate lead within solder, causing progress in the development of lead-free solder. In this paper, we describe the effects of halogen-free materials on the lead-free solder process.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"77 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126726152","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860595
N. Iwamoto
Although process studies are usually done experimentally within the microelectronics board and packaging industry, at Honeywell we have been concerned about facilitating such studies though use of molecular-scale simulation support. For instance, we have used bleed modeling for several years now to understand and target bleed modification additives and to help us predict the effect of both organic and inorganic components on underfill flow. In a similar strategy we have used an adhesion modeling extension to understand stress cycling reliability, and to predict the relative ability of our formulations to withstand thermal cycling. Most recently we have used thermal cycling to help us understand process differences in several resin coated copper foils used in circuit board manufacture. All of these studies have demonstrated usefulness in understanding specific interfacial mechanisms that could not be understood from larger scale simulations or experimental evidence alone. As these studies encompass aspects of both the pre-cure and post-cure state of the adhesive, they require different assumption bases as well as different methodologies to address the performance issues. In this paper we will discuss the strategies applied, their results in in-house formulation and the impacts of using the molecular perspective to increase adhesive understanding in a development scenario.
{"title":"Applying polymer process studies using molecular modeling","authors":"N. Iwamoto","doi":"10.1109/ADHES.2000.860595","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860595","url":null,"abstract":"Although process studies are usually done experimentally within the microelectronics board and packaging industry, at Honeywell we have been concerned about facilitating such studies though use of molecular-scale simulation support. For instance, we have used bleed modeling for several years now to understand and target bleed modification additives and to help us predict the effect of both organic and inorganic components on underfill flow. In a similar strategy we have used an adhesion modeling extension to understand stress cycling reliability, and to predict the relative ability of our formulations to withstand thermal cycling. Most recently we have used thermal cycling to help us understand process differences in several resin coated copper foils used in circuit board manufacture. All of these studies have demonstrated usefulness in understanding specific interfacial mechanisms that could not be understood from larger scale simulations or experimental evidence alone. As these studies encompass aspects of both the pre-cure and post-cure state of the adhesive, they require different assumption bases as well as different methodologies to address the performance issues. In this paper we will discuss the strategies applied, their results in in-house formulation and the impacts of using the molecular perspective to increase adhesive understanding in a development scenario.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"136 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123199476","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860577
R. Dudek, A. Schubert, B. Michel
Computer based thermo-mechanical design and performance optimization are in widespread use. They are mainly based on finite element (FE-) analyses. Applications of the method in performing parametric studies on the thermomechanical behavior of different flip chip assemblies are given. Both die size and underfill material are varied. It is shown that for flip-chip on board (FCOB) assemblies the die size is no key reliability parameter. Fatigue failure limits are estimated for both not underfilled and underfilled assemblies with small dies. Underfill materials with different characteristics, ranging from stiff to soft, are treated. Polymer materials are of special importance for this packaging technology. The theoretical analysis of stresses within polymeric material compounds induced by environmental conditions, especially temperature changes, requires the characterization of material properties, especially for the underfill and solder mask materials. Measurement results on typical commercially available electronic polymers are reported, which have been investigated by DMA and TMA measurements as well as tensile tests. Isothermal relaxation tests were performed on tensile specimens to study the viscoelastic material behavior at different temperatures.
{"title":"Analyses of flip chip attach reliability","authors":"R. Dudek, A. Schubert, B. Michel","doi":"10.1109/ADHES.2000.860577","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860577","url":null,"abstract":"Computer based thermo-mechanical design and performance optimization are in widespread use. They are mainly based on finite element (FE-) analyses. Applications of the method in performing parametric studies on the thermomechanical behavior of different flip chip assemblies are given. Both die size and underfill material are varied. It is shown that for flip-chip on board (FCOB) assemblies the die size is no key reliability parameter. Fatigue failure limits are estimated for both not underfilled and underfilled assemblies with small dies. Underfill materials with different characteristics, ranging from stiff to soft, are treated. Polymer materials are of special importance for this packaging technology. The theoretical analysis of stresses within polymeric material compounds induced by environmental conditions, especially temperature changes, requires the characterization of material properties, especially for the underfill and solder mask materials. Measurement results on typical commercially available electronic polymers are reported, which have been investigated by DMA and TMA measurements as well as tensile tests. Isothermal relaxation tests were performed on tensile specimens to study the viscoelastic material behavior at different temperatures.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121985760","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860605
S.R. MacDavitt, J. E. Morris
The experiments described look at the impact resistance of conductive adhesives. A standard drop test from 5 feet was used to test the adhesives. The goal of the experiments was to determine whether the adhesives successfully passed these tests. The effects of cure temperature on the mechanical bond of the adhesive are discussed as well. The focus of the results is on the effect of cure temperature on adhesion.
{"title":"Effect of cure temperature on impact resistance of conductive adhesives","authors":"S.R. MacDavitt, J. E. Morris","doi":"10.1109/ADHES.2000.860605","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860605","url":null,"abstract":"The experiments described look at the impact resistance of conductive adhesives. A standard drop test from 5 feet was used to test the adhesives. The goal of the experiments was to determine whether the adhesives successfully passed these tests. The effects of cure temperature on the mechanical bond of the adhesive are discussed as well. The focus of the results is on the effect of cure temperature on adhesion.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125260564","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860591
K. Wolter, P. Fruhauf
Underfill is a material used for filling the gap between a flip-chip and the PCB. Usually the material is dispensed after reflowing the solder joints. Driven by capillary force, it fills the gap and encapsulates the solder balls. No-flow underfills are a new technique to eliminate the time consuming flow and curing step of regular materials. These materials are dispensed before reflowing. The curing and soldering takes place at the same time in a reflow oven. As with regular underfills, it is still almost impossible to rework a defective chip. Our goal is not to develop a reworkable underfill material, but to rework a flip-chip using a conventional no-flow underfill. Two approaches were taken into consideration: thermal and chemical rework. A combination of both, as the most likely way to successfully rework, was tested.
{"title":"Development of a rework-technology for flip-chips, using no-flow underfills","authors":"K. Wolter, P. Fruhauf","doi":"10.1109/ADHES.2000.860591","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860591","url":null,"abstract":"Underfill is a material used for filling the gap between a flip-chip and the PCB. Usually the material is dispensed after reflowing the solder joints. Driven by capillary force, it fills the gap and encapsulates the solder balls. No-flow underfills are a new technique to eliminate the time consuming flow and curing step of regular materials. These materials are dispensed before reflowing. The curing and soldering takes place at the same time in a reflow oven. As with regular underfills, it is still almost impossible to rework a defective chip. Our goal is not to develop a reworkable underfill material, but to rework a flip-chip using a conventional no-flow underfill. Two approaches were taken into consideration: thermal and chemical rework. A combination of both, as the most likely way to successfully rework, was tested.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"68 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127415301","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860579
M. Paulasto, T. Hauck, A. Kolbeck
Motorola's Interconnect Systems Laboratory in Munich has developed the assembly technology for a mechatronic multichip power module, a new intelligent connector for automotive applications. Product's requirements for simultaneous high power dissipation, current carrying and device interconnecting capability lead to selection of insulated metal substrate (IMS) as a substrate technology and electroplated eutectic solder bump as an interconnection technology. To develop robust processes capable of meeting high reliability in the automotive product environment, fundamental knowledge was needed about the behavior of the materials and interfaces in a flip chip assembly. This paper presents results of the parametric analysis of flip chip attach on IMS substrate. Impact of main variables, including die size, substrate thickness, underfill material, soldermask material and die passivation on the stress distribution and reliability in IMS assemblies was studied. The detailed stress analyses, materials compatibility and interface studies has resulted in a high level of process control and an excellent reliability performance.
{"title":"Reliability of flip chip die attach in multichip mechatronic power module","authors":"M. Paulasto, T. Hauck, A. Kolbeck","doi":"10.1109/ADHES.2000.860579","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860579","url":null,"abstract":"Motorola's Interconnect Systems Laboratory in Munich has developed the assembly technology for a mechatronic multichip power module, a new intelligent connector for automotive applications. Product's requirements for simultaneous high power dissipation, current carrying and device interconnecting capability lead to selection of insulated metal substrate (IMS) as a substrate technology and electroplated eutectic solder bump as an interconnection technology. To develop robust processes capable of meeting high reliability in the automotive product environment, fundamental knowledge was needed about the behavior of the materials and interfaces in a flip chip assembly. This paper presents results of the parametric analysis of flip chip attach on IMS substrate. Impact of main variables, including die size, substrate thickness, underfill material, soldermask material and die passivation on the stress distribution and reliability in IMS assemblies was studied. The detailed stress analyses, materials compatibility and interface studies has resulted in a high level of process control and an excellent reliability performance.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"178 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134326295","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860603
M. Komagata, G. Toida, T. Hocchi, K. Suzuki
New isotropic conductive adhesive (ICA) for plated Sn or Sn/Pb electrode was developed. The new ICA and our existing ICA were evaluated for SMT as lead containing solder replacement, using on-chip resistors with plated Sn/Pb (90/10) and fired Ag/Pd terminations, from contact resistance and adhesion strength points of view. The new ICA gave more stable contact resistance and adhesion strength through reliability testing, even in the case of using 0/spl Omega/ chip resistor with plated Sn/Pb termination. Formation of boundaries or Sn grains on the surface and diffusion of Ni into Sn/Pb layer in the cross section, after chip resistors with plated Sn/Pb termination exposed to several reliability conditions, were observed by SEM and EDX. Though degree of these changes of plated Sn/Pb termination depends on each exposure condition, it can be estimated that the new ICA gets less influence by the changes of plated Sn/Pb termination and that it has some effect which prevents changing by plated Sn/Pb termination before it occurs.
{"title":"Conductive adhesive for plated Sn or Sn/Pb electrode","authors":"M. Komagata, G. Toida, T. Hocchi, K. Suzuki","doi":"10.1109/ADHES.2000.860603","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860603","url":null,"abstract":"New isotropic conductive adhesive (ICA) for plated Sn or Sn/Pb electrode was developed. The new ICA and our existing ICA were evaluated for SMT as lead containing solder replacement, using on-chip resistors with plated Sn/Pb (90/10) and fired Ag/Pd terminations, from contact resistance and adhesion strength points of view. The new ICA gave more stable contact resistance and adhesion strength through reliability testing, even in the case of using 0/spl Omega/ chip resistor with plated Sn/Pb termination. Formation of boundaries or Sn grains on the surface and diffusion of Ni into Sn/Pb layer in the cross section, after chip resistors with plated Sn/Pb termination exposed to several reliability conditions, were observed by SEM and EDX. Though degree of these changes of plated Sn/Pb termination depends on each exposure condition, it can be estimated that the new ICA gets less influence by the changes of plated Sn/Pb termination and that it has some effect which prevents changing by plated Sn/Pb termination before it occurs.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"64 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133109885","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860622
Z. Illyefalvi-Vitéz
The microelectronics industry is moving toward smaller feature sizes. The main driving forces are to improve performance and to lower cost. From the performance point of view the small distances between chips together with the short interconnection routes have of great importance in order to achieve faster operation. The application of polymers, including electrically and/or thermally conductive and insulating polymeric adhesives, for functional insulating and protective layers of interconnect substrates is beneficial to the performance and to the cost of a circuit module as well. Laser processing of polymeric materials applied for via generation image transfer, contour cutting, etc. has proved to be an efficient tool for the fabrication of interconnects substrates. The paper describes the results of research projects that are aimed at the application of CO/sub 2/ and frequency multiplied Nd:YAG lasers for the drilling of polyester foils and glass fiber reinforced epoxy laminates with the aim of interconnect via preparation. The physics of processing using five wavelengths, i.e. 10600, 1064, 532, 355 and 266 nm, were modeled, examined and evaluated. Through contacting was carried out by screen-printing with polymer thick films, by wet chemical direct plating and by evaporation of thin metal layers, but the details of metallization are not given here. The conclusion refers to the possibilities and limitations of laser processing of polymeric materials in microelectronics packaging applications.
{"title":"Laser processing of adhesives and polymeric materials for microelectronics packaging applications","authors":"Z. Illyefalvi-Vitéz","doi":"10.1109/ADHES.2000.860622","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860622","url":null,"abstract":"The microelectronics industry is moving toward smaller feature sizes. The main driving forces are to improve performance and to lower cost. From the performance point of view the small distances between chips together with the short interconnection routes have of great importance in order to achieve faster operation. The application of polymers, including electrically and/or thermally conductive and insulating polymeric adhesives, for functional insulating and protective layers of interconnect substrates is beneficial to the performance and to the cost of a circuit module as well. Laser processing of polymeric materials applied for via generation image transfer, contour cutting, etc. has proved to be an efficient tool for the fabrication of interconnects substrates. The paper describes the results of research projects that are aimed at the application of CO/sub 2/ and frequency multiplied Nd:YAG lasers for the drilling of polyester foils and glass fiber reinforced epoxy laminates with the aim of interconnect via preparation. The physics of processing using five wavelengths, i.e. 10600, 1064, 532, 355 and 266 nm, were modeled, examined and evaluated. Through contacting was carried out by screen-printing with polymer thick films, by wet chemical direct plating and by evaporation of thin metal layers, but the details of metallization are not given here. The conclusion refers to the possibilities and limitations of laser processing of polymeric materials in microelectronics packaging applications.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123525762","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860610
L. Fan, C. Wong
The application of the underfill materials has been to enhance the solder joint fatigue life in flip chip assembly, where normally only thermosetting systems have been extensively employed in industry. However, thermoplastics may be of great economic/cost interest as underfill for some low end use microelectronic products; and furthermore, such investigations could enrich our understanding of the potential thermoplastic systems. In this paper both thermosetting and thermoplastic epoxy resins were studied for the feasibility as underfill materials. The former includes basic liquid resin and advanced solid resin of different molecular weight, while the latter is the so-called phenoxy resin. The solution and hot melt approach were taken for the assembly procedure of the die shear strength test at selected solid content and curing/drying condition. The die shear strength of the systems was collected, which could enable us to get insights into the effects of aging, temperature and coupling agent, etc., for the thermosetting and thermoplastic materials.
{"title":"Adhesion comparison between thermosetting and thermoplastic resin systems based on poly(bisphenol A-co-epichlorohydrin) chemistry","authors":"L. Fan, C. Wong","doi":"10.1109/ADHES.2000.860610","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860610","url":null,"abstract":"The application of the underfill materials has been to enhance the solder joint fatigue life in flip chip assembly, where normally only thermosetting systems have been extensively employed in industry. However, thermoplastics may be of great economic/cost interest as underfill for some low end use microelectronic products; and furthermore, such investigations could enrich our understanding of the potential thermoplastic systems. In this paper both thermosetting and thermoplastic epoxy resins were studied for the feasibility as underfill materials. The former includes basic liquid resin and advanced solid resin of different molecular weight, while the latter is the so-called phenoxy resin. The solution and hot melt approach were taken for the assembly procedure of the die shear strength test at selected solid content and curing/drying condition. The die shear strength of the systems was collected, which could enable us to get insights into the effects of aging, temperature and coupling agent, etc., for the thermosetting and thermoplastic materials.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130091975","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860612
J. Ge, R. Tuominen, J. Kivilahti
The adhesion between the photosensitive epoxy and electroless copper was measured with a pull test designed and executed in this work. The test pads were fabricated on the substrate by using semi-additive plating process. The pull strength was measured with a mechanical tester. The chemical treatment was used to roughen the polymer surface, two sets of specimens were tested with different swelling time and etching time to get the optimal adhesion strength. Effects of the chemical treatment on surface morphology and adhesion were studied. The surface morphology of the polymer was examined with optical microscopy and the SEM/EDS technique. The ranges of swelling time and etching time, which result in good adhesion, were given. It was confirmed that the swelling and etching processes have to be optimised with respect to each other for achieving the desired polymer surface properties without altering the bulk properties.
{"title":"Adhesion between photosensitive epoxy and electroless copper","authors":"J. Ge, R. Tuominen, J. Kivilahti","doi":"10.1109/ADHES.2000.860612","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860612","url":null,"abstract":"The adhesion between the photosensitive epoxy and electroless copper was measured with a pull test designed and executed in this work. The test pads were fabricated on the substrate by using semi-additive plating process. The pull strength was measured with a mechanical tester. The chemical treatment was used to roughen the polymer surface, two sets of specimens were tested with different swelling time and etching time to get the optimal adhesion strength. Effects of the chemical treatment on surface morphology and adhesion were studied. The surface morphology of the polymer was examined with optical microscopy and the SEM/EDS technique. The ranges of swelling time and etching time, which result in good adhesion, were given. It was confirmed that the swelling and etching processes have to be optimised with respect to each other for achieving the desired polymer surface properties without altering the bulk properties.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"132 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124562074","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)
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