4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)最新文献
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860596
Y. Fu, M. Willander, J. Liu
We have studied the DC electric conductance of isotropically conductive adhesive (ICA). It was demonstrated theoretically that assuming completely random distribution of the metal fillers in the ICA, the volume percentage of the metal fillers can be significantly reduced by adding nano-size fillers into the system originally containing only micro-size fillers. It is however shown experimentally that due to the surface tension nanofillers tend to gather around microfillers as well as form clusters themselves so that the resistivity of the ICA increases following the increase of the nanofillers' volume percentage. In the present work we try to study theoretically these cluster effects by simulating the detailed random walkings of the nanofillers and microfillers in the system. It has been concluded eventually that the cluster effects of the nanofillers deteriorate the electric conductivity of the ICA by separating the microfillers from each other so that electric conduction path becomes more difficult to form in the electric conducting network of the ICA.
{"title":"Cluster effects on electrical conductance of isotropically conductive adhesive","authors":"Y. Fu, M. Willander, J. Liu","doi":"10.1109/ADHES.2000.860596","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860596","url":null,"abstract":"We have studied the DC electric conductance of isotropically conductive adhesive (ICA). It was demonstrated theoretically that assuming completely random distribution of the metal fillers in the ICA, the volume percentage of the metal fillers can be significantly reduced by adding nano-size fillers into the system originally containing only micro-size fillers. It is however shown experimentally that due to the surface tension nanofillers tend to gather around microfillers as well as form clusters themselves so that the resistivity of the ICA increases following the increase of the nanofillers' volume percentage. In the present work we try to study theoretically these cluster effects by simulating the detailed random walkings of the nanofillers and microfillers in the system. It has been concluded eventually that the cluster effects of the nanofillers deteriorate the electric conductivity of the ICA by separating the microfillers from each other so that electric conduction path becomes more difficult to form in the electric conducting network of the ICA.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115468914","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860567
P. Marjamaki, T. Reinikainen, J. Kivilahti
In the present study the effect of chip thickness on life expectancy of solder joints and on stresses in the chip in an underfilled flip chip assembly was investigated with FE analysis. By reducing the thickness of the silicon chip expected lifetime of the joints increased markedly. The life expectancies of the solderjoint based on energy method were 700, 860 and 1060 cycles for 600, 60 and 30 /spl mu/m thick chips, respectively. However, the reduction of the chip thickness increased normal stresses in the chip significantly. In the case of the thickest chip the highest compressive stress in the chip was about 90 MPa, while in the case of the thinnest chip it was about 290 MPa. So, by reducing the thickness the reliability of the solder joints increases but high stresses may cause reliability problems in the active chip.
{"title":"Modeling stresses in ultra-thin flip chips","authors":"P. Marjamaki, T. Reinikainen, J. Kivilahti","doi":"10.1109/ADHES.2000.860567","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860567","url":null,"abstract":"In the present study the effect of chip thickness on life expectancy of solder joints and on stresses in the chip in an underfilled flip chip assembly was investigated with FE analysis. By reducing the thickness of the silicon chip expected lifetime of the joints increased markedly. The life expectancies of the solderjoint based on energy method were 700, 860 and 1060 cycles for 600, 60 and 30 /spl mu/m thick chips, respectively. However, the reduction of the chip thickness increased normal stresses in the chip significantly. In the case of the thickest chip the highest compressive stress in the chip was about 90 MPa, while in the case of the thinnest chip it was about 290 MPa. So, by reducing the thickness the reliability of the solder joints increases but high stresses may cause reliability problems in the active chip.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116080242","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860583
O. Figovsky, F. Romm, V. Karchevsky
Summary form only given. The problem of modeling of branched cross-linked structures is one of most complicated in composite science. Most existing composite materials have branched cross-linked structure, and their theoretical study is indispensable for their optimal application in practical needs. Conventional methods of description of branched cross-linked structures are numerical and do not allow solution in the general case. Their application needs complicated and long computing and the physical sense of the obtained results is not always clear. Some researchers try application of classical chain models to branched systems, although such approximation is incorrect and may cause serious errors. The problem of modeling of branched cross-linked structures was recently solved by statistical polymer method. This method is based on the consideration of averaged structures (statistical polymers). In such approximation, all reactions in equilibrium are considered as reactions between statistical polymers. The statistical polymer method was tested directly and indirectly. The direct test comprised the exact reproduction of Trommsdorf effect for non-equilibrium polymers, whereas the indirect test allowed the theoretical interpretation of adsorption isotherms for silica and alumina gels. In all cases, the correlation of experimental and theoretical results was very good. The statistical polymer method allows modeling of composites, e.g. materials based on quaternary ammonium silicates. Silica globulaes in solution or solid are successfully modeled. Such modeling allows serious reduction (for hundreds-thousands times) of the number of numerical experiments. The proposed statistical polymer method is commendable for description of all kinds of composites with complex structure.
{"title":"Modeling of branched crosslinked composites, using the statistical polymer method","authors":"O. Figovsky, F. Romm, V. Karchevsky","doi":"10.1109/ADHES.2000.860583","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860583","url":null,"abstract":"Summary form only given. The problem of modeling of branched cross-linked structures is one of most complicated in composite science. Most existing composite materials have branched cross-linked structure, and their theoretical study is indispensable for their optimal application in practical needs. Conventional methods of description of branched cross-linked structures are numerical and do not allow solution in the general case. Their application needs complicated and long computing and the physical sense of the obtained results is not always clear. Some researchers try application of classical chain models to branched systems, although such approximation is incorrect and may cause serious errors. The problem of modeling of branched cross-linked structures was recently solved by statistical polymer method. This method is based on the consideration of averaged structures (statistical polymers). In such approximation, all reactions in equilibrium are considered as reactions between statistical polymers. The statistical polymer method was tested directly and indirectly. The direct test comprised the exact reproduction of Trommsdorf effect for non-equilibrium polymers, whereas the indirect test allowed the theoretical interpretation of adsorption isotherms for silica and alumina gels. In all cases, the correlation of experimental and theoretical results was very good. The statistical polymer method allows modeling of composites, e.g. materials based on quaternary ammonium silicates. Silica globulaes in solution or solid are successfully modeled. Such modeling allows serious reduction (for hundreds-thousands times) of the number of numerical experiments. The proposed statistical polymer method is commendable for description of all kinds of composites with complex structure.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"61 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114810585","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860608
J. Felba, K.P. Friedel, A. Moscicki
The main advantage of isotropically conductive adhesives used for assembling electronic circuits is lack of lead and other toxic metals in resultant joints. The objective of this paper was to find the best formulation of isotropically conductive adhesive for solder replacement in microwave applications. As a result of the screening experiment the different adhesive formulations were investigated in order to identify the significant factors, which influence the electrical resistance of joints. In these formulations the adhesive base material as well as type of main and additional filler materials were changed. Silver, nickel and graphite were used as a main filler material, whereas soot and heavy silver were filler additives. The adhesive formulations were tested in standard microstrip bandpass filters, which were supplied with an additional gap in the gold strip and bridged by adhesive bonded silver jumper. As the figure-of-merit the quality factor Q and loss L of such a microwave circuit have been investigated. Both the Q-factor and loss of the filter with bonded jumper were measured at the frequency of 3.5 GHz in preliminary experiment and at 3.5 GHz as well as 14 GHz in final experiment. For identifying the best adhesive formulation the experimental design method based on Taguchi techniques for quality engineering has been used. It was stated that to each adhesive, which is prepared on the base of specific type of resin, the strictly defined type of silver filler should be added and strictly defined volume content of the filler should be selected.
{"title":"Characterization and performance of electrically conductive adhesives for microwave applications","authors":"J. Felba, K.P. Friedel, A. Moscicki","doi":"10.1109/ADHES.2000.860608","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860608","url":null,"abstract":"The main advantage of isotropically conductive adhesives used for assembling electronic circuits is lack of lead and other toxic metals in resultant joints. The objective of this paper was to find the best formulation of isotropically conductive adhesive for solder replacement in microwave applications. As a result of the screening experiment the different adhesive formulations were investigated in order to identify the significant factors, which influence the electrical resistance of joints. In these formulations the adhesive base material as well as type of main and additional filler materials were changed. Silver, nickel and graphite were used as a main filler material, whereas soot and heavy silver were filler additives. The adhesive formulations were tested in standard microstrip bandpass filters, which were supplied with an additional gap in the gold strip and bridged by adhesive bonded silver jumper. As the figure-of-merit the quality factor Q and loss L of such a microwave circuit have been investigated. Both the Q-factor and loss of the filter with bonded jumper were measured at the frequency of 3.5 GHz in preliminary experiment and at 3.5 GHz as well as 14 GHz in final experiment. For identifying the best adhesive formulation the experimental design method based on Taguchi techniques for quality engineering has been used. It was stated that to each adhesive, which is prepared on the base of specific type of resin, the strictly defined type of silver filler should be added and strictly defined volume content of the filler should be selected.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"99 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126972763","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860565
Aschenbrenner, F. Ansorge, M. Feil, C. Landesberger, E. Jung, A. Ostmann, H. Reichl
As the number of applications for flexible assemblies is growing there is also a larger variation of requirements for such packages. Therefore different technologies have been developed for applications from CSP's to smart cards. The scope of the paper is to describe different approaches for packaging using ultra-thin and flexible chips. This includes the assembly processes as well as packaging concepts e.g. CSP's, 3D modules and volumetric integration of passive and active components into modules and substrates.
{"title":"Concepts for ultra thin packaging technologies","authors":"Aschenbrenner, F. Ansorge, M. Feil, C. Landesberger, E. Jung, A. Ostmann, H. Reichl","doi":"10.1109/ADHES.2000.860565","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860565","url":null,"abstract":"As the number of applications for flexible assemblies is growing there is also a larger variation of requirements for such packages. Therefore different technologies have been developed for applications from CSP's to smart cards. The scope of the paper is to describe different approaches for packaging using ultra-thin and flexible chips. This includes the assembly processes as well as packaging concepts e.g. CSP's, 3D modules and volumetric integration of passive and active components into modules and substrates.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"150 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122762810","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860589
M. Vuorela, M. Holloway, S. Fuchs, F. Stam, J. Kivilahti
In this communication a new bismuth (Bi)-filled anisotropically conductive adhesive (ACA), which can be used to bond pure tin (Sn) or any Sn-based contact areas, is presented. In this study the adhesive was used to join tin-lead (SnPb) -bumped test chips to SnPb-coated contact pads on FR4-substrate. Due to the metallurgical characteristics of the SnPbBi system, the process temperature and bonding pressure remain low. With the help of pure Bi particles, the SnPb bumps are fused with the SnPb-coated contact pads above 92/spl deg/C forming small local solder joints, while the adhesive acts as an underfill. The microscopic solder interconnections retain their electrically continuity even though the adhesive matrix relaxes in service. Good quality metallurgical interconnections were produced by the bonding procedure with relatively low bonding temperature (160/spl deg/C) and pressure (24.5 g/bump). No intermetallics are formed in this bonding system. The Bi-filled ACA exhibits good reliability under high temperature and high humidity conditions (85/spl deg/C/85%RH). Thermal shock test (-40/spl deg/C/+125/spl deg/C, total cycle time 1 hour) showed that good reliability can be achieved even though the bonding process is not yet optimized. The failure of the joints is due to the formation of small liquid phases in the Bi-rich (over 10 at-%) areas in the solid lentils at the upper thermal shock temperature. This can be avoided by using higher bonding temperature. The discrepancy of reliability results is explained by the fact that the temperature of bonding has not been exactly the same for all the samples bonded.
{"title":"Bismuth-filled anisotropically conductive adhesive for flip chip bonding","authors":"M. Vuorela, M. Holloway, S. Fuchs, F. Stam, J. Kivilahti","doi":"10.1109/ADHES.2000.860589","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860589","url":null,"abstract":"In this communication a new bismuth (Bi)-filled anisotropically conductive adhesive (ACA), which can be used to bond pure tin (Sn) or any Sn-based contact areas, is presented. In this study the adhesive was used to join tin-lead (SnPb) -bumped test chips to SnPb-coated contact pads on FR4-substrate. Due to the metallurgical characteristics of the SnPbBi system, the process temperature and bonding pressure remain low. With the help of pure Bi particles, the SnPb bumps are fused with the SnPb-coated contact pads above 92/spl deg/C forming small local solder joints, while the adhesive acts as an underfill. The microscopic solder interconnections retain their electrically continuity even though the adhesive matrix relaxes in service. Good quality metallurgical interconnections were produced by the bonding procedure with relatively low bonding temperature (160/spl deg/C) and pressure (24.5 g/bump). No intermetallics are formed in this bonding system. The Bi-filled ACA exhibits good reliability under high temperature and high humidity conditions (85/spl deg/C/85%RH). Thermal shock test (-40/spl deg/C/+125/spl deg/C, total cycle time 1 hour) showed that good reliability can be achieved even though the bonding process is not yet optimized. The failure of the joints is due to the formation of small liquid phases in the Bi-rich (over 10 at-%) areas in the solid lentils at the upper thermal shock temperature. This can be avoided by using higher bonding temperature. The discrepancy of reliability results is explained by the fact that the temperature of bonding has not been exactly the same for all the samples bonded.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115079764","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860572
T. Seidowski, F. Kriebel, J. Galties
Adhesive FC technologies have proven to be very competitive to classic solder FC technologies. Smart card and applications require chip connections with thickness of the entire card or label. Only FC technologies can meet these low cost, high throughput and thin packaging demands. The use of isotropic conductive adhesive (ICA) for bumping and assembly for smart cards results in a number of advantages such as a simple versatile process, lower temperatures and environmental friendliness. Using an anisotropic conductive adhesive (ACA) or an nonconductive adhesive (NCA) for smart label production allows a high throughput from reel to reel. All technologies require suitable bond pads. The commonly used aluminum alloys results in unstable contacts for the conductive adhesives and hence there's an urgent need for an additional under bump metallization for these technologies. KSW Microtec has developed a technology which is based on electroless deposition of palladium. This metallization is performed as backend process. An homogeneous film of palladium with the required thickness of about 1 /spl mu/m for the ICA process and about 15 /spl mu/m for metallic bumps is deposited. In this article an introduction to adhesive FC technologies is given. Several bumping technologies used for the assembly process are shown. The authors explain their mass production experiences in KSW Microtec and advantages and disadvantages of each of the technologies. Detailed reliability tests performed on some adhesive FC technologies are shown. Practical experiences in mass production of smart cards and smart label especially in a reel to reel assembly process are discussed.
{"title":"Smart cards and smart labels-high volume applications of adhesive flip-chip technologies","authors":"T. Seidowski, F. Kriebel, J. Galties","doi":"10.1109/ADHES.2000.860572","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860572","url":null,"abstract":"Adhesive FC technologies have proven to be very competitive to classic solder FC technologies. Smart card and applications require chip connections with thickness of the entire card or label. Only FC technologies can meet these low cost, high throughput and thin packaging demands. The use of isotropic conductive adhesive (ICA) for bumping and assembly for smart cards results in a number of advantages such as a simple versatile process, lower temperatures and environmental friendliness. Using an anisotropic conductive adhesive (ACA) or an nonconductive adhesive (NCA) for smart label production allows a high throughput from reel to reel. All technologies require suitable bond pads. The commonly used aluminum alloys results in unstable contacts for the conductive adhesives and hence there's an urgent need for an additional under bump metallization for these technologies. KSW Microtec has developed a technology which is based on electroless deposition of palladium. This metallization is performed as backend process. An homogeneous film of palladium with the required thickness of about 1 /spl mu/m for the ICA process and about 15 /spl mu/m for metallic bumps is deposited. In this article an introduction to adhesive FC technologies is given. Several bumping technologies used for the assembly process are shown. The authors explain their mass production experiences in KSW Microtec and advantages and disadvantages of each of the technologies. Detailed reliability tests performed on some adhesive FC technologies are shown. Practical experiences in mass production of smart cards and smart label especially in a reel to reel assembly process are discussed.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"232 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131964614","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860627
O. Rusanen, H. Rohde, V. Brielmann
Within the European Thematic Network "Adhesives in Electronics" a Roadmap has been prepared to establish the present status of adhesive use in automotive electronics and to find out the most important requirements for the future. Presently non and isotropically conductive adhesives are used for die bonding and underfills for solder flip chip processes. The biggest challenge for automotive electronics is the harsh environment that results in demands on device and materials reliability. Processing aspects such as short curing times are also an important criteria in material selection. In addition, the materials should be low cost.
{"title":"Roadmap \"Adhesives Technologies in Automotive and Harsh Environment Applications\"","authors":"O. Rusanen, H. Rohde, V. Brielmann","doi":"10.1109/ADHES.2000.860627","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860627","url":null,"abstract":"Within the European Thematic Network \"Adhesives in Electronics\" a Roadmap has been prepared to establish the present status of adhesive use in automotive electronics and to find out the most important requirements for the future. Presently non and isotropically conductive adhesives are used for die bonding and underfills for solder flip chip processes. The biggest challenge for automotive electronics is the harsh environment that results in demands on device and materials reliability. Processing aspects such as short curing times are also an important criteria in material selection. In addition, the materials should be low cost.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128486735","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860575
M. Lebbai, J.K. Kim, M. Yuen, P. Tong
A study is made of the effects of black copper oxide coating and other plating variables on adhesion strength of glob-top resin to copper substrates for Tape Ball Grid Array (TBGA) package applications. The button shear test was performed to measure the interfacial bonding strength. Several surface analytical techniques were employed to establish the correlations between the interface bond strength and various surface parameters, such as surface free energy, chemical element, surface roughness and fracture morphology. The experimental results showed that the presence of black oxide coating (Sample C) resulted in significantly higher interface bond strength than the bare copper (Sample A) or nickel coated (Sample B) surfaces. Further processes (Samples D and E) after the black oxide coating exhibited detrimental effects, to a varying degree, on interface bond strength. The interface bond strength was approximately proportional both to surface free energy and roughness of surface finishes, indicating that wettability and mechanical interlocking both played a significant role in forming adhesion with glob top resins.
{"title":"Effect of black copper oxide on interface adhesion between copper substrate and glob-top resin","authors":"M. Lebbai, J.K. Kim, M. Yuen, P. Tong","doi":"10.1109/ADHES.2000.860575","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860575","url":null,"abstract":"A study is made of the effects of black copper oxide coating and other plating variables on adhesion strength of glob-top resin to copper substrates for Tape Ball Grid Array (TBGA) package applications. The button shear test was performed to measure the interfacial bonding strength. Several surface analytical techniques were employed to establish the correlations between the interface bond strength and various surface parameters, such as surface free energy, chemical element, surface roughness and fracture morphology. The experimental results showed that the presence of black oxide coating (Sample C) resulted in significantly higher interface bond strength than the bare copper (Sample A) or nickel coated (Sample B) surfaces. Further processes (Samples D and E) after the black oxide coating exhibited detrimental effects, to a varying degree, on interface bond strength. The interface bond strength was approximately proportional both to surface free energy and roughness of surface finishes, indicating that wettability and mechanical interlocking both played a significant role in forming adhesion with glob top resins.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131312797","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860620
S. Wakabayashi, S. Koyama, T. Iijima, M. Nakazawa, N. Kaneko
A build-up substrate consisting of PPE resin (poly-phenylene ether) was developed to mount high pin count flip chips. It is essential to achieve high density patterns with controlled characteristic impedance for MPU packages and telecommunication devices. Via fill technology by electroplating incorporated with new via designs is effective for this application. Stacked via design and the technology to fill the via are an essential part of the technology for future packages. It is effective to stabilize the power supply to the chip since it shortens the continuum of the chip to substrate. To realize the micro via filling, a new copper electrolytic plating solution and plating method were investigated. The copper solution used for via fill contains chloride ions, polyester type polymers, sulfur-containing brighteners and dyes as additives. It was confirmed that the adsorption behavior of the additives, agitation strength and current waveform for the plating influenced strongly the via filling phenomena. The optimum plating conditions for the large boards were determined and the micro vias on the large boards were confirmed well filled with copper electroplating. The mechanism of the via filling was explained based on the data of the electrochemical measurements, SEM observation and relevant information available in the literature.
{"title":"A build-up substrate utilizing a new via fill technology by electroplating","authors":"S. Wakabayashi, S. Koyama, T. Iijima, M. Nakazawa, N. Kaneko","doi":"10.1109/ADHES.2000.860620","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860620","url":null,"abstract":"A build-up substrate consisting of PPE resin (poly-phenylene ether) was developed to mount high pin count flip chips. It is essential to achieve high density patterns with controlled characteristic impedance for MPU packages and telecommunication devices. Via fill technology by electroplating incorporated with new via designs is effective for this application. Stacked via design and the technology to fill the via are an essential part of the technology for future packages. It is effective to stabilize the power supply to the chip since it shortens the continuum of the chip to substrate. To realize the micro via filling, a new copper electrolytic plating solution and plating method were investigated. The copper solution used for via fill contains chloride ions, polyester type polymers, sulfur-containing brighteners and dyes as additives. It was confirmed that the adsorption behavior of the additives, agitation strength and current waveform for the plating influenced strongly the via filling phenomena. The optimum plating conditions for the large boards were determined and the micro vias on the large boards were confirmed well filled with copper electroplating. The mechanism of the via filling was explained based on the data of the electrochemical measurements, SEM observation and relevant information available in the literature.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"51 2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123699581","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)
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