4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)最新文献
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860568
P. Viswanadham
An important aspect in the fabrication of electronic packages and assemblies is the joining of similar as well dissimilar pairs of materials with a range of physicochemical characteristics. Metal-metal, metal-polymer, and polymer-polymer interface are encountered. It is important to ensure adequate interfacial bonding, namely, adhesion strength between the material pairs for product performance in the intended operating environment. In this paper are highlighted some of the adhesion aspects that are relevant to first and second level electronic packaging and their impact on reliability.
{"title":"Role of adhesion and its reliability implications in electronic assemblies","authors":"P. Viswanadham","doi":"10.1109/ADHES.2000.860568","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860568","url":null,"abstract":"An important aspect in the fabrication of electronic packages and assemblies is the joining of similar as well dissimilar pairs of materials with a range of physicochemical characteristics. Metal-metal, metal-polymer, and polymer-polymer interface are encountered. It is important to ensure adequate interfacial bonding, namely, adhesion strength between the material pairs for product performance in the intended operating environment. In this paper are highlighted some of the adhesion aspects that are relevant to first and second level electronic packaging and their impact on reliability.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"31 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126987919","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860585
C. Wong, D. Lu
As a potential alternative to lead-bearing soldering technology, conductive adhesive technology has attracted more and more attention from the electronics industry. This new technology can offer numerous advantages over traditional soldering technology. However, some critical limitations of this technology has slowed its potentially wide applications in the electronics industry. These limitations include lower electrical conductivity, increased contact resistance during elevated temperature and humidity aging, and poor impact performance. In the past few years, there has been tremendous efforts in addressing these issues, and conductive adhesive technology has advanced significantly. This paper will give an overview of the main research work and achievements in conductive adhesive technology.
{"title":"Recent advances in electrically conductive adhesives for electronics applications","authors":"C. Wong, D. Lu","doi":"10.1109/ADHES.2000.860585","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860585","url":null,"abstract":"As a potential alternative to lead-bearing soldering technology, conductive adhesive technology has attracted more and more attention from the electronics industry. This new technology can offer numerous advantages over traditional soldering technology. However, some critical limitations of this technology has slowed its potentially wide applications in the electronics industry. These limitations include lower electrical conductivity, increased contact resistance during elevated temperature and humidity aging, and poor impact performance. In the past few years, there has been tremendous efforts in addressing these issues, and conductive adhesive technology has advanced significantly. This paper will give an overview of the main research work and achievements in conductive adhesive technology.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"285 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116110961","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860590
Woonghwan Ryu, M. Yim, K. Paik, Joungho Kim
Conductive polymer adhesives have been proposed as lead-free materials for flip-chip interconnection. The Semiconductor Industry Association (SIA) roadmap forecasts off-chip clock frequencies over 1 GHz by 2005. In GHz clock distribution issues such as clock skew, power, and timing jitter are becoming more crucial and strongly impact the operating speed of the digital processors. Interconnection technology, particularly at board-level and package-level, is lagging the VLSI technology. To achieve high performance in digital and microwave devices, an accurate microwave frequency interconnection model is required. This paper describes a model extraction methodology based on S-parameter measurement, microwave network analysis, and parameter optimization using genetic algorithm. Using the microwave frequency interconnection model, an RF clock distribution system for low power multiprocessor digital system was also simulated using HP Advanced Design System (ADS).
{"title":"Anisotropic conductive film (ACF) flip-chip interconnect in over GHz RF clock distribution system","authors":"Woonghwan Ryu, M. Yim, K. Paik, Joungho Kim","doi":"10.1109/ADHES.2000.860590","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860590","url":null,"abstract":"Conductive polymer adhesives have been proposed as lead-free materials for flip-chip interconnection. The Semiconductor Industry Association (SIA) roadmap forecasts off-chip clock frequencies over 1 GHz by 2005. In GHz clock distribution issues such as clock skew, power, and timing jitter are becoming more crucial and strongly impact the operating speed of the digital processors. Interconnection technology, particularly at board-level and package-level, is lagging the VLSI technology. To achieve high performance in digital and microwave devices, an accurate microwave frequency interconnection model is required. This paper describes a model extraction methodology based on S-parameter measurement, microwave network analysis, and parameter optimization using genetic algorithm. Using the microwave frequency interconnection model, an RF clock distribution system for low power multiprocessor digital system was also simulated using HP Advanced Design System (ADS).","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126407669","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860564
J. Liu
Anisotropically Conductive Adhesives (ACAs) have been used in electronics packaging for decades on glass substrate, and recently in contactless smart-card module assembly and for bare chip attach on flexible and rigid substrates. This paper summarises various technologies used in connection with ACA joining. A summary of our understanding on electrical, thermal, physical, chemical, environmental and cost behaviours of ACAs in conjunction with various packaging applications are elaborated. Finally, future research areas and remaining issues are pointed out.
{"title":"ACA bonding technology for low cost electronics packaging applications-current status and remaining challenges","authors":"J. Liu","doi":"10.1109/ADHES.2000.860564","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860564","url":null,"abstract":"Anisotropically Conductive Adhesives (ACAs) have been used in electronics packaging for decades on glass substrate, and recently in contactless smart-card module assembly and for bare chip attach on flexible and rigid substrates. This paper summarises various technologies used in connection with ACA joining. A summary of our understanding on electrical, thermal, physical, chemical, environmental and cost behaviours of ACAs in conjunction with various packaging applications are elaborated. Finally, future research areas and remaining issues are pointed out.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133552165","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860578
J. Okura, T. Reinikainen, A. Dasgupta, J. Caers
The effect of thermo-mechanical properties of underfill, such as coefficient of thermal expansion (CTE) and stiffness (Young's modulus), on reliability of flip chip on board (FCOB) under thermal cycling stresses is investigated in this study. 3-D and quasi three-dimensional viscoplastic stress analysis using finite element modeling (FEM) is combined with an energy partitioning (EP) model for creep-fatigue damage accumulation, to predict the fatigue durability for a given thermal cycle. Parametric FEM simulations are performed for five different CTEs and five different stiffnesses of the underfill. The creep work dissipation due to thermal cycling is estimated with quasi 3-D model, while 3-D model is used to estimate the hydrostatic stresses. To minimize the computational effort, the 3-D analysis is conducted only for the extreme values of the two parameters (CTE and stiffness) and the results are interpolated for intermediate values. The results show that the stiffness of the underfill material as well as the CTE play important role in influencing the fatigue life of FCOB assemblies. The fatigue durability increases as underfill stiffness and CTE increase. The eventual goal is to define the optimum design parameters of the FCOB underfill, in order to maximize the fatigue endurance of the solder joints under cyclic thermal loading environments.
{"title":"Guidelines to select underfills for flip chip on board assemblies","authors":"J. Okura, T. Reinikainen, A. Dasgupta, J. Caers","doi":"10.1109/ADHES.2000.860578","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860578","url":null,"abstract":"The effect of thermo-mechanical properties of underfill, such as coefficient of thermal expansion (CTE) and stiffness (Young's modulus), on reliability of flip chip on board (FCOB) under thermal cycling stresses is investigated in this study. 3-D and quasi three-dimensional viscoplastic stress analysis using finite element modeling (FEM) is combined with an energy partitioning (EP) model for creep-fatigue damage accumulation, to predict the fatigue durability for a given thermal cycle. Parametric FEM simulations are performed for five different CTEs and five different stiffnesses of the underfill. The creep work dissipation due to thermal cycling is estimated with quasi 3-D model, while 3-D model is used to estimate the hydrostatic stresses. To minimize the computational effort, the 3-D analysis is conducted only for the extreme values of the two parameters (CTE and stiffness) and the results are interpolated for intermediate values. The results show that the stiffness of the underfill material as well as the CTE play important role in influencing the fatigue life of FCOB assemblies. The fatigue durability increases as underfill stiffness and CTE increase. The eventual goal is to define the optimum design parameters of the FCOB underfill, in order to maximize the fatigue endurance of the solder joints under cyclic thermal loading environments.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134110372","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860584
M. Pietila, T. Makela, K. Levon, J. Kivilahti, H. Isotalo
Electrically conductive adhesives were prepared using commercial dodecylbenzenesulfonic acid (DBSA) doped polyaniline (PANI) as the conducting material. The adhesives investigated were based on commercial methacrylate/acrylate monomers and UV-initiator. Conductivity, tensile strength and thermal properties of adhesives containing different amounts of PANI/DBSA are reported. Conductivity values up to 1 S/cm were measured. Monomer/PANI/DBSA-systems formed highly transparent films when cured.
{"title":"Electrically conductive polyaniline adhesive","authors":"M. Pietila, T. Makela, K. Levon, J. Kivilahti, H. Isotalo","doi":"10.1109/ADHES.2000.860584","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860584","url":null,"abstract":"Electrically conductive adhesives were prepared using commercial dodecylbenzenesulfonic acid (DBSA) doped polyaniline (PANI) as the conducting material. The adhesives investigated were based on commercial methacrylate/acrylate monomers and UV-initiator. Conductivity, tensile strength and thermal properties of adhesives containing different amounts of PANI/DBSA are reported. Conductivity values up to 1 S/cm were measured. Monomer/PANI/DBSA-systems formed highly transparent films when cured.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133327506","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860613
J. Qu
Summary form only given, as follows. The loss of interfacial adhesion is mostly seen in the failure of adhesive joints. The interfacial adhesion strength is believed to highly depend on a number of parameters, such as surface topology and treatment, adhesive chemistry/structure, rheological properties of the solids, and elastic mismatch across the interface. Thermal mismatch between polymer adhesive and adherend also has considerable effect on adhesion. Surface science provides modern tools to quantify the thermodynamic work of adhesion (microscopic adhesion energy) through surface contact angle measurement, while fracture mechanics enables the measurement of the interfacial fracture toughness (macroscopic energy density) through various experimental techniques. The objectives of this work are (i) to understand how the thermodynamic work of adhesion is related to the fracture toughness, and (ii) what and how other factors (crack tip plasticity, surface roughness, residual stresses, etc.) affect the fracture toughness.
{"title":"Mechanics of polymer/metal interfaces in microelectronic packaging","authors":"J. Qu","doi":"10.1109/ADHES.2000.860613","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860613","url":null,"abstract":"Summary form only given, as follows. The loss of interfacial adhesion is mostly seen in the failure of adhesive joints. The interfacial adhesion strength is believed to highly depend on a number of parameters, such as surface topology and treatment, adhesive chemistry/structure, rheological properties of the solids, and elastic mismatch across the interface. Thermal mismatch between polymer adhesive and adherend also has considerable effect on adhesion. Surface science provides modern tools to quantify the thermodynamic work of adhesion (microscopic adhesion energy) through surface contact angle measurement, while fracture mechanics enables the measurement of the interfacial fracture toughness (macroscopic energy density) through various experimental techniques. The objectives of this work are (i) to understand how the thermodynamic work of adhesion is related to the fracture toughness, and (ii) what and how other factors (crack tip plasticity, surface roughness, residual stresses, etc.) affect the fracture toughness.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132091775","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860600
FrCdCric Ferrando, Jean-Franqois Zeberli, P. Clot, J.-M. Chenuz
As the use of lead in electronics will not be possible any more in the coming years, research institutes and packaging industries are focusing on alternative materials for flip-chip assembly. Various conductive and non-conductive adhesives have been developed in recent years: today, they are mature enough and are excellent candidates to be implemented in a wide range of lead-free flip-chip applications. This paper describe an industrial approach to a flip-chip method using the gold stud-bumps connections with a non-conductive paste (NCP): the resulting connections are not soldered with the pads of the printed circuit boards (PCB), but are based on a pure mechanical contact. This original and low-cost technique does not require any additional operation such as underfilling once the die is flipped, and is particularly suitable for organic substrates where TCE mismatches are critical concerns. In addition, it can be applied to large production runs as well as prototyping. A test vehicle was developed to evaluate the reliability of the packages: excellent performance was observed, especially with regard to thermal and humidity tests; these results are presented in this paper. Thanks to the fact that the bumps are crushed on the pads of the PCB, they adapt their shape perfectly to the surface where the contacts are located, allowing flip-chip on flex PCB where planarity is sometimes critical. Today, these techniques are being used for a wide range of applications, such as chip-scale packages (CSP) and multi-chip modules (MCM) including high i/o count dice.
{"title":"Industrial approach of a flip-chip method using the stud-bumps with a non-conductive paste","authors":"FrCdCric Ferrando, Jean-Franqois Zeberli, P. Clot, J.-M. Chenuz","doi":"10.1109/ADHES.2000.860600","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860600","url":null,"abstract":"As the use of lead in electronics will not be possible any more in the coming years, research institutes and packaging industries are focusing on alternative materials for flip-chip assembly. Various conductive and non-conductive adhesives have been developed in recent years: today, they are mature enough and are excellent candidates to be implemented in a wide range of lead-free flip-chip applications. This paper describe an industrial approach to a flip-chip method using the gold stud-bumps connections with a non-conductive paste (NCP): the resulting connections are not soldered with the pads of the printed circuit boards (PCB), but are based on a pure mechanical contact. This original and low-cost technique does not require any additional operation such as underfilling once the die is flipped, and is particularly suitable for organic substrates where TCE mismatches are critical concerns. In addition, it can be applied to large production runs as well as prototyping. A test vehicle was developed to evaluate the reliability of the packages: excellent performance was observed, especially with regard to thermal and humidity tests; these results are presented in this paper. Thanks to the fact that the bumps are crushed on the pads of the PCB, they adapt their shape perfectly to the surface where the contacts are located, allowing flip-chip on flex PCB where planarity is sometimes critical. Today, these techniques are being used for a wide range of applications, such as chip-scale packages (CSP) and multi-chip modules (MCM) including high i/o count dice.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121302989","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860625
H. Kergel
In order to overcome the problems of the use of adhesives in electronics manufacturing, a so called "Thematic Network" on "Adhesive Joining Technology in Electronics Manufacturing (Adhesives in Electronics)" was launched March 1998. Within this project, which is funded by the European Community, 52 partners throughout Europe cooperate in order to exchange relevant information and to coordinate future fields for research and development.
{"title":"Thematic network \"Adhesives in Electronics\". A two year review and future plans","authors":"H. Kergel","doi":"10.1109/ADHES.2000.860625","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860625","url":null,"abstract":"In order to overcome the problems of the use of adhesives in electronics manufacturing, a so called \"Thematic Network\" on \"Adhesive Joining Technology in Electronics Manufacturing (Adhesives in Electronics)\" was launched March 1998. Within this project, which is funded by the European Community, 52 partners throughout Europe cooperate in order to exchange relevant information and to coordinate future fields for research and development.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"94 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115855524","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-06-18DOI: 10.1109/ADHES.2000.860582
D. Lu, C. Wong
With the phasing out of lead-bearing solders, electrically conductive adhesives (ECAs) have been identified as an environmentally friendly alternative to tin/lead (Sn/Pb) solders in electronics packaging applications. Compared to Sn/Pb solders, conductive adhesive technology offers numerous advantages. However, this new technology still has reliability limitations. Two critical limitations are unstable contact resistance on non-noble metals and poor impact performance. Our previous study indicated that galvanic corrosion was the dominant mechanism for the unstable contact resistance during elevated temperature and humidity aging. The ultimate goal of this study is to formulate conductive adhesives with stable contact resistance and desirable impact performance. In this study, effects of purity of the resins and moisture absorption on contact resistance are investigated. Several different additives (oxygen scavengers and corrosion inhibitors) on contact resistance stability during elevated temperature and humidity aging are studied, and effective additives are identified based on this study. Then, several rubber-modified epoxy resins and a few synthesized epoxide-terminated polyurethane resins are introduced into ECA formulations to determine their effects on impact strength. Tan /spl delta/ of each formulation is measured using a dynamic mechanical analyzer (DMA) and impact strength is evaluated using National Center for Manufacturing Science (NCMS) standard drop test procedure. Finally, high performance conductive adhesives are formulated by combining the modified resins and the effective additives. It is found that (1) purity of the resins and moisture absorption of the formulation affect the contact resistance stability of an EGA; (2) the oxygen scavengers can delay contact resistance shift; (3) one of the corrosion inhibitors studied is very effective in stabilizing the contact resistance; (4) some rubber-modified epoxy resins and the epoxide-terminated polyurethane resins can provide the conductive adhesives with superior impact performance; and (5) conductive adhesives with stable contact resistance and desirable impact performance are developed.
{"title":"Development of solder replacement conductive adhesives with stable resistance and superior impact performance","authors":"D. Lu, C. Wong","doi":"10.1109/ADHES.2000.860582","DOIUrl":"https://doi.org/10.1109/ADHES.2000.860582","url":null,"abstract":"With the phasing out of lead-bearing solders, electrically conductive adhesives (ECAs) have been identified as an environmentally friendly alternative to tin/lead (Sn/Pb) solders in electronics packaging applications. Compared to Sn/Pb solders, conductive adhesive technology offers numerous advantages. However, this new technology still has reliability limitations. Two critical limitations are unstable contact resistance on non-noble metals and poor impact performance. Our previous study indicated that galvanic corrosion was the dominant mechanism for the unstable contact resistance during elevated temperature and humidity aging. The ultimate goal of this study is to formulate conductive adhesives with stable contact resistance and desirable impact performance. In this study, effects of purity of the resins and moisture absorption on contact resistance are investigated. Several different additives (oxygen scavengers and corrosion inhibitors) on contact resistance stability during elevated temperature and humidity aging are studied, and effective additives are identified based on this study. Then, several rubber-modified epoxy resins and a few synthesized epoxide-terminated polyurethane resins are introduced into ECA formulations to determine their effects on impact strength. Tan /spl delta/ of each formulation is measured using a dynamic mechanical analyzer (DMA) and impact strength is evaluated using National Center for Manufacturing Science (NCMS) standard drop test procedure. Finally, high performance conductive adhesives are formulated by combining the modified resins and the effective additives. It is found that (1) purity of the resins and moisture absorption of the formulation affect the contact resistance stability of an EGA; (2) the oxygen scavengers can delay contact resistance shift; (3) one of the corrosion inhibitors studied is very effective in stabilizing the contact resistance; (4) some rubber-modified epoxy resins and the epoxide-terminated polyurethane resins can provide the conductive adhesives with superior impact performance; and (5) conductive adhesives with stable contact resistance and desirable impact performance are developed.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115392956","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)
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