Pub Date : 2009-01-05DOI: 10.1109/VLSI.Design.2009.84
S. Pasricha, N. Dutt, F. Kurdahi
The current paradigm of using Cu interconnects for on-chip global communication is rapidly becoming a serious performance bottleneck in ultra-deep submicron (UDSM) technologies. Carbon nanotube (CNT) based interconnects have been proposed as an alternative, because of their remarkable conductive, mechanical and thermal properties. In this paper, we investigate the system level performance of single-walled CNT (SWCNT) bundles, and mixed SWCNT/multi-walled CNT (MWCNT) bundles. Detailed RLC equivalent circuit models for conventional Cu and CNT bundle interconnects are described and used to determine propagation delays. These models are then incorporated into a system-level environment to estimate the impact of using CNT bundle global interconnects on the overall performance of several multi-core chip multiprocessor (CMP) applications. Our results indicate that the CNT bundle alternatives have a slight performance advantage over Cu global interconnects. With further improvements in CNT fabrication technology, we show how CNT bundle-based interconnects can significantly outperform Cu interconnects.
{"title":"Exploring Carbon Nanotube Bundle Global Interconnects for Chip Multiprocessor Applications","authors":"S. Pasricha, N. Dutt, F. Kurdahi","doi":"10.1109/VLSI.Design.2009.84","DOIUrl":"https://doi.org/10.1109/VLSI.Design.2009.84","url":null,"abstract":"The current paradigm of using Cu interconnects for on-chip global communication is rapidly becoming a serious performance bottleneck in ultra-deep submicron (UDSM) technologies. Carbon nanotube (CNT) based interconnects have been proposed as an alternative, because of their remarkable conductive, mechanical and thermal properties. In this paper, we investigate the system level performance of single-walled CNT (SWCNT) bundles, and mixed SWCNT/multi-walled CNT (MWCNT) bundles. Detailed RLC equivalent circuit models for conventional Cu and CNT bundle interconnects are described and used to determine propagation delays. These models are then incorporated into a system-level environment to estimate the impact of using CNT bundle global interconnects on the overall performance of several multi-core chip multiprocessor (CMP) applications. Our results indicate that the CNT bundle alternatives have a slight performance advantage over Cu global interconnects. With further improvements in CNT fabrication technology, we show how CNT bundle-based interconnects can significantly outperform Cu interconnects.","PeriodicalId":267121,"journal":{"name":"2009 22nd International Conference on VLSI Design","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-01-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114997183","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-01-05DOI: 10.1109/VLSI.Design.2009.59
Lavanya Jagan, Ratan Deep Singh, V. Kamakoti, A. Majhi
Volume Yield Diagnostics (VYD) is crucial to diagnose critical systematic yield issues from the reports obtained by testing thousands of chips. This paper presents an efficient clustering technique for VYD that has been shown to work successfully both in the simulation environment as well as on real industrial failure data.
{"title":"Efficient Grouping of Fail Chips for Volume Yield Diagnostics","authors":"Lavanya Jagan, Ratan Deep Singh, V. Kamakoti, A. Majhi","doi":"10.1109/VLSI.Design.2009.59","DOIUrl":"https://doi.org/10.1109/VLSI.Design.2009.59","url":null,"abstract":"Volume Yield Diagnostics (VYD) is crucial to diagnose critical systematic yield issues from the reports obtained by testing thousands of chips. This paper presents an efficient clustering technique for VYD that has been shown to work successfully both in the simulation environment as well as on real industrial failure data.","PeriodicalId":267121,"journal":{"name":"2009 22nd International Conference on VLSI Design","volume":"4 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-01-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116671350","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-01-05DOI: 10.1109/VLSI.Design.2009.97
P. Easwaran, Prasenjit Bhowmik, Rupak Ghayal
The factors that impact the topology and the performance specifications for a Phase locked loop (PLL) is presented. Correct specification of the PLL is critical for optimizing the performance and power of the system. PLL specifications for different systems have been derived and the architectural tradeoffs have been discussed. Three PLL design examples have been presented for WLAN base-bandPLL application, DVB-H receiver base-band PLL application and a high speed (MIPI) transmitter application.
{"title":"Specification Driven Design of Phase Locked Loops","authors":"P. Easwaran, Prasenjit Bhowmik, Rupak Ghayal","doi":"10.1109/VLSI.Design.2009.97","DOIUrl":"https://doi.org/10.1109/VLSI.Design.2009.97","url":null,"abstract":"The factors that impact the topology and the performance specifications for a Phase locked loop (PLL) is presented. Correct specification of the PLL is critical for optimizing the performance and power of the system. PLL specifications for different systems have been derived and the architectural tradeoffs have been discussed. Three PLL design examples have been presented for WLAN base-bandPLL application, DVB-H receiver base-band PLL application and a high speed (MIPI) transmitter application.","PeriodicalId":267121,"journal":{"name":"2009 22nd International Conference on VLSI Design","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-01-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125138288","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-01-05DOI: 10.1109/VLSI.Design.2009.33
Sohan Purohit, M. Lanuzza, S. Perri, P. Corsonello, M. Margala
This paper presents the VLSI design of a high data throughput, energy and area efficient data path targeted for DSP and multimedia applications. Three different implementations of the reconfigurable data path using static, dynamic domino and D3L logic styles are presented to serve as low power, high speed, and speed-energy optimized variants of the architecture. When implemented using ST Microelectronics 90nm 1V CMOS technology, the proposed data path leads to a maximum supported clock frequency ranging from 917 MHz to 1.2 GHz with a dynamic power consumption @ 500 MHz ranging from 788 µW to 1.02 mW.
{"title":"Design-Space Exploration of Energy-Delay-Area Efficient Coarse-Grain Reconfigurable Datapath","authors":"Sohan Purohit, M. Lanuzza, S. Perri, P. Corsonello, M. Margala","doi":"10.1109/VLSI.Design.2009.33","DOIUrl":"https://doi.org/10.1109/VLSI.Design.2009.33","url":null,"abstract":"This paper presents the VLSI design of a high data throughput, energy and area efficient data path targeted for DSP and multimedia applications. Three different implementations of the reconfigurable data path using static, dynamic domino and D3L logic styles are presented to serve as low power, high speed, and speed-energy optimized variants of the architecture. When implemented using ST Microelectronics 90nm 1V CMOS technology, the proposed data path leads to a maximum supported clock frequency ranging from 917 MHz to 1.2 GHz with a dynamic power consumption @ 500 MHz ranging from 788 µW to 1.02 mW.","PeriodicalId":267121,"journal":{"name":"2009 22nd International Conference on VLSI Design","volume":"26 6","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-01-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120848443","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-01-05DOI: 10.1109/VLSI.Design.2009.37
B. Bozorgzadeh, A. Afzali-Kusha
Designing MOS decoupling capacitors (DECAPs) in nanotechnologies provides many challenges due to the existing trade-offs among transient time response behavior, area, and gate leakage current. In this paper first it is shown that all of these challenges are functions of the MOS DECAP channel length. Then, we propose a method for optimizing the channel length of MOS DECAPs. The technique is applied to 45nm and 32nm technology nodes and the results are extracted using HSPICE simulations. Also the accuracy of the proposed technique is verified. Finally, based on the results, two optimum DECAP configurations which provide trades off among area and gate leakage for different applications in nanotechnologies are proposed.
{"title":"Novel MOS Decoupling Capacitor Optimization Technique for Nanotechnologies","authors":"B. Bozorgzadeh, A. Afzali-Kusha","doi":"10.1109/VLSI.Design.2009.37","DOIUrl":"https://doi.org/10.1109/VLSI.Design.2009.37","url":null,"abstract":"Designing MOS decoupling capacitors (DECAPs) in nanotechnologies provides many challenges due to the existing trade-offs among transient time response behavior, area, and gate leakage current. In this paper first it is shown that all of these challenges are functions of the MOS DECAP channel length. Then, we propose a method for optimizing the channel length of MOS DECAPs. The technique is applied to 45nm and 32nm technology nodes and the results are extracted using HSPICE simulations. Also the accuracy of the proposed technique is verified. Finally, based on the results, two optimum DECAP configurations which provide trades off among area and gate leakage for different applications in nanotechnologies are proposed.","PeriodicalId":267121,"journal":{"name":"2009 22nd International Conference on VLSI Design","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-01-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129957372","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-01-05DOI: 10.1109/VLSI.Design.2009.18
S. Wadhwa
A CMOS low voltage Proportional-to-Absolute Temperature current reference is presented. The proposed circuit can work with supply voltages as low as 1.1V. The circuit is designed in 90nm CMOS technology for 2.2µA reference current at typical corner, 27C, 1.2V. The circuit has been extensively simulated across all possible combinations of MOSFET, Resistor, BJT, supply voltage and temperature variation corners. Simulation results have been given for a wide temperature variation from -40C to 125C and supply voltage variation from 1.1V to 1.3V.
{"title":"A Low Voltage CMOS Proportional-to-Absolute Temperature Current Reference","authors":"S. Wadhwa","doi":"10.1109/VLSI.Design.2009.18","DOIUrl":"https://doi.org/10.1109/VLSI.Design.2009.18","url":null,"abstract":"A CMOS low voltage Proportional-to-Absolute Temperature current reference is presented. The proposed circuit can work with supply voltages as low as 1.1V. The circuit is designed in 90nm CMOS technology for 2.2µA reference current at typical corner, 27C, 1.2V. The circuit has been extensively simulated across all possible combinations of MOSFET, Resistor, BJT, supply voltage and temperature variation corners. Simulation results have been given for a wide temperature variation from -40C to 125C and supply voltage variation from 1.1V to 1.3V.","PeriodicalId":267121,"journal":{"name":"2009 22nd International Conference on VLSI Design","volume":"377 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-01-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122858870","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-01-05DOI: 10.1109/VLSI.Design.2009.111
N. Mukherjee, J. Rajski, J. Tyszer
The rapid scaling of semiconductor devices along with technological innovations including material and process changes such as high-k gate dielectric, metal gate electrodes, etc., are making conventional fault models inadequate. In addition, the evolution of interconnects from single to multiple-levels, the use of new materials to meet the wire conductivity requirements and reduce dielectric permittivity, and the scaling of conventional metal/dielectric system have had significant impact on the performance and power dissipation of devices. Multi-core designs, heterogeneous component integration, and sophisticated packaging techniques further aggravate the challenge of testing such devices effectively. This tutorial will focus on some of the advances shaping the test industry today to address the above mentioned design and process changes. New fault models that are termed as “defect aware” are being proposed and there is a demand for test vectors targeting such defects. Bridging (static and dynamic), n-detect, stuck-open, inlineresistance, propagation delay, etc., are some examples of new fault models that are being used to various extent in the industry today. At the same time, at-speed testing is becoming the norm as the industry moves towards smaller technology nodes. Methods to handle false and multi-cycle paths effectively are common in practice to prevent unnecessary yield losses. For the first time, timing information is being considered during Automatic Test Pattern Generation (ATPG) targeting small-delay defects. Each one of the fault models will be discussed and the current trends in the industry along with some preliminary silicon experiments will be presented. Another industry trend posing a serious challenge to manufacturing test is the advent of poweraware designs. Various techniques such as architecture driven voltage reduction, switching activity minimization, switched capacitance minimization, and dynamic power management are being deployed in designing low power devices. New DFT techniques are required as well to limit power dissipation during test (preferably matching the power dissipation in functional mode of operation) thereby preventing IR drops, voltage droop, or hot spots. Test pattern generation needs to be tweaked to consider power dissipation during the key steps of the algorithm. In this tutorial, methods to control power dissipation during test, both from DFT as well as test generation perspectives will be discussed. As numerous fault models are being proposed, all the different pattern sets along with poweraware test pattern generation results in a significant increase in the number of patterns. This directly impacts test cost as both test application time as well as the tester memory needed to store the vectors are increasing. Compression schemes with not only aggressive compression ratios are being adopted; they need to fit into the low power DFT methodology. This tutorial will highlight some methods to handle low
{"title":"Defect Aware to Power Conscious Tests - The New DFT Landscape","authors":"N. Mukherjee, J. Rajski, J. Tyszer","doi":"10.1109/VLSI.Design.2009.111","DOIUrl":"https://doi.org/10.1109/VLSI.Design.2009.111","url":null,"abstract":"The rapid scaling of semiconductor devices along with technological innovations including material and process changes such as high-k gate dielectric, metal gate electrodes, etc., are making conventional fault models inadequate. In addition, the evolution of interconnects from single to multiple-levels, the use of new materials to meet the wire conductivity requirements and reduce dielectric permittivity, and the scaling of conventional metal/dielectric system have had significant impact on the performance and power dissipation of devices. Multi-core designs, heterogeneous component integration, and sophisticated packaging techniques further aggravate the challenge of testing such devices effectively. This tutorial will focus on some of the advances shaping the test industry today to address the above mentioned design and process changes. New fault models that are termed as “defect aware” are being proposed and there is a demand for test vectors targeting such defects. Bridging (static and dynamic), n-detect, stuck-open, inlineresistance, propagation delay, etc., are some examples of new fault models that are being used to various extent in the industry today. At the same time, at-speed testing is becoming the norm as the industry moves towards smaller technology nodes. Methods to handle false and multi-cycle paths effectively are common in practice to prevent unnecessary yield losses. For the first time, timing information is being considered during Automatic Test Pattern Generation (ATPG) targeting small-delay defects. Each one of the fault models will be discussed and the current trends in the industry along with some preliminary silicon experiments will be presented. Another industry trend posing a serious challenge to manufacturing test is the advent of poweraware designs. Various techniques such as architecture driven voltage reduction, switching activity minimization, switched capacitance minimization, and dynamic power management are being deployed in designing low power devices. New DFT techniques are required as well to limit power dissipation during test (preferably matching the power dissipation in functional mode of operation) thereby preventing IR drops, voltage droop, or hot spots. Test pattern generation needs to be tweaked to consider power dissipation during the key steps of the algorithm. In this tutorial, methods to control power dissipation during test, both from DFT as well as test generation perspectives will be discussed. As numerous fault models are being proposed, all the different pattern sets along with poweraware test pattern generation results in a significant increase in the number of patterns. This directly impacts test cost as both test application time as well as the tester memory needed to store the vectors are increasing. Compression schemes with not only aggressive compression ratios are being adopted; they need to fit into the low power DFT methodology. This tutorial will highlight some methods to handle low ","PeriodicalId":267121,"journal":{"name":"2009 22nd International Conference on VLSI Design","volume":"520 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-01-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123077671","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-01-05DOI: 10.1109/VLSI.Design.2009.25
S. Penolazzi, A. Hemani, Luca Bolognino
We present a high-level methodology for efficient and accurate estimation of energy and performance in SoCs at Functional Untimed Level. We then validate the proposed method against gate level for accuracy and against TLM-PV for speed. We show that the method is within 15 % of gate-level accuracy and in average 28x faster than TLM-PV, for the benchmark applications selected.
{"title":"A General Approach to High-Level Energy and Performance Estimation in SoCs","authors":"S. Penolazzi, A. Hemani, Luca Bolognino","doi":"10.1109/VLSI.Design.2009.25","DOIUrl":"https://doi.org/10.1109/VLSI.Design.2009.25","url":null,"abstract":"We present a high-level methodology for efficient and accurate estimation of energy and performance in SoCs at Functional Untimed Level. We then validate the proposed method against gate level for accuracy and against TLM-PV for speed. We show that the method is within 15 % of gate-level accuracy and in average 28x faster than TLM-PV, for the benchmark applications selected.","PeriodicalId":267121,"journal":{"name":"2009 22nd International Conference on VLSI Design","volume":"94 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-01-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123086573","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-01-05DOI: 10.1109/VLSI.Design.2009.23
J. Manikandan, B. Venkataramani, V. Avanthi
In this paper, two schemes for FPGA implementation of multi-class SVM based isolated digit recognition system are proposed, one using only logic elements and another using both soft-core processor and logic elements(LEs). One of the major contributions of this paper is the proposal for implementation of the decision function using only fixed point arithmetic without compromising the recognition accuracy. Compared to the scheme which uses floating point arithmetic, the proposed scheme reduces the number of LEs required by a factor of 3.29. The second scheme proposed results in about 25 times lower area compared to the first scheme. For the soft-core processor approach, a custom instruction is proposed for floating point arithmetic. Speaker dependent TI46 database of isolated digits is used for training and testing. Features are extracted using both Linear Predictive Coefficients (LPC) and Mel Frequency Cepstral Coefficients(MFCC) and features are compressed using Self Organized Feature Mapping (SOFM). This in turn is used by the SVM classifier to evaluate the recognition accuracy and the hardware resources utilized. Both the schemes proposed result in 100% recognition accuracy when implemented on Altera Cyclone II FPGA. The proposed schemes can also be used for speaker verification and speaker authentication applications. Since the scheme which uses soft-core processor requires lower area, it can be used for systems which require a large vocabulary size.
本文提出了两种FPGA实现基于多类支持向量机的隔离数字识别系统的方案，一种方案仅使用逻辑元件，另一种方案同时使用软核处理器和逻辑元件。本文的主要贡献之一是在不影响识别精度的情况下，仅使用不动点算法实现决策函数。与使用浮点算法的方案相比，所提出的方案将所需的le数量减少了3.29倍。与第一方案相比，第二方案的面积减少了约25倍。对于软核处理器方法，提出了一个自定义的浮点运算指令。与说话人相关的TI46孤立数字数据库用于训练和测试。使用线性预测系数(LPC)和Mel频率倒谱系数(MFCC)提取特征，并使用自组织特征映射(SOFM)压缩特征。支持向量机分类器利用这一数据来评估识别精度和所使用的硬件资源。在Altera Cyclone II FPGA上实现后，两种方案的识别准确率均达到100%。所提出的方案也可用于说话人验证和说话人身份验证应用。由于采用软核处理器的方案占用的空间较小，因此可用于对词汇量要求较大的系统。
{"title":"FPGA Implementation of Support Vector Machine Based Isolated Digit Recognition System","authors":"J. Manikandan, B. Venkataramani, V. Avanthi","doi":"10.1109/VLSI.Design.2009.23","DOIUrl":"https://doi.org/10.1109/VLSI.Design.2009.23","url":null,"abstract":"In this paper, two schemes for FPGA implementation of multi-class SVM based isolated digit recognition system are proposed, one using only logic elements and another using both soft-core processor and logic elements(LEs). One of the major contributions of this paper is the proposal for implementation of the decision function using only fixed point arithmetic without compromising the recognition accuracy. Compared to the scheme which uses floating point arithmetic, the proposed scheme reduces the number of LEs required by a factor of 3.29. The second scheme proposed results in about 25 times lower area compared to the first scheme. For the soft-core processor approach, a custom instruction is proposed for floating point arithmetic. Speaker dependent TI46 database of isolated digits is used for training and testing. Features are extracted using both Linear Predictive Coefficients (LPC) and Mel Frequency Cepstral Coefficients(MFCC) and features are compressed using Self Organized Feature Mapping (SOFM). This in turn is used by the SVM classifier to evaluate the recognition accuracy and the hardware resources utilized. Both the schemes proposed result in 100% recognition accuracy when implemented on Altera Cyclone II FPGA. The proposed schemes can also be used for speaker verification and speaker authentication applications. Since the scheme which uses soft-core processor requires lower area, it can be used for systems which require a large vocabulary size.","PeriodicalId":267121,"journal":{"name":"2009 22nd International Conference on VLSI Design","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-01-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132920291","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-01-05DOI: 10.1109/VLSI.Design.2009.51
Shubhankar Basu, Balaji Kommineni, R. Vemuri
Manufacturing and process irregularities in nanometer technologies can degrade yield and severely slow down the design cycle time. Process variation aware methodologies can help in yield improvement and meeting time-to-market requirements for system-on-chip designs. Analog circuits are extremely sensitive to device mismatches and exhibit non-linear variations in their performance under the influence of manufacturing irregularities. Performance variation in blocks can lead to degraded system performance. In this work, we present a variation-aware performance macromodeling technique for analog building blocks that is fast and accurate and guarantees convergence during synthesis. The improvements in accuracy and time complexity of the macromodel generation process is achieved by constructing a target design region graph and dynamic reduction of the design space. The target design region also helps in reducing time during re-synthesis and achieving faster convergence. Experimental results demonstrate the accuracy of the macromodels and the reduction in synthesis time compared to spice based simulation-in-the-loop evaluations and static and adaptive sampling based techniques.
{"title":"Variation-Aware Macromodeling and Synthesis of Analog Circuits Using Spline Center and Range Method and Dynamically Reduced Design Space","authors":"Shubhankar Basu, Balaji Kommineni, R. Vemuri","doi":"10.1109/VLSI.Design.2009.51","DOIUrl":"https://doi.org/10.1109/VLSI.Design.2009.51","url":null,"abstract":"Manufacturing and process irregularities in nanometer technologies can degrade yield and severely slow down the design cycle time. Process variation aware methodologies can help in yield improvement and meeting time-to-market requirements for system-on-chip designs. Analog circuits are extremely sensitive to device mismatches and exhibit non-linear variations in their performance under the influence of manufacturing irregularities. Performance variation in blocks can lead to degraded system performance. In this work, we present a variation-aware performance macromodeling technique for analog building blocks that is fast and accurate and guarantees convergence during synthesis. The improvements in accuracy and time complexity of the macromodel generation process is achieved by constructing a target design region graph and dynamic reduction of the design space. The target design region also helps in reducing time during re-synthesis and achieving faster convergence. Experimental results demonstrate the accuracy of the macromodels and the reduction in synthesis time compared to spice based simulation-in-the-loop evaluations and static and adaptive sampling based techniques.","PeriodicalId":267121,"journal":{"name":"2009 22nd International Conference on VLSI Design","volume":"96 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-01-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122910826","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：