Pub Date : 2007-05-07DOI: 10.1109/ISEE.2007.369100
A. Yoshida, T. Tasaki, A. Terazono
We estimated the material flow of used PCs in Japan, both before and after the enforcement of a household PC recycling system, by minimizing the errors in material flow data. The number of PCs reused in the country and the number exported as secondhand were also estimated.
{"title":"Material flow of used PCs in Japan","authors":"A. Yoshida, T. Tasaki, A. Terazono","doi":"10.1109/ISEE.2007.369100","DOIUrl":"https://doi.org/10.1109/ISEE.2007.369100","url":null,"abstract":"We estimated the material flow of used PCs in Japan, both before and after the enforcement of a household PC recycling system, by minimizing the errors in material flow data. The number of PCs reused in the country and the number exported as secondhand were also estimated.","PeriodicalId":275164,"journal":{"name":"Proceedings of the 2007 IEEE International Symposium on Electronics and the Environment","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129575248","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-07DOI: 10.1109/ISEE.2007.369394
Kun Li, D. Xiang, X. Liu
To control lead pollution," Hot Air Solder Leveling "(HASL), the traditional lead-contained PCB(Printed Circuit Board) surface finish, needs to be replaced by lead- free technique. Immersion Silver (I-Ag) has many merits compared to other lead-free techniques, thereby being increasingly widely used. However, a problem named "galvanic attack", which seriously erodes copper where circuit connects pad, is a serious obstacle to I-Ag's popularization. According to manufacturing experience, consistency of silver ion, temperature, mircoetch rate and liquid level are four major factors in I-Ag process. In this paper, relations between these factors and galvanic attack are studied by experiments. From these relations we get inspirations to reduce galvanic attack in engineering practice.
{"title":"Study of Relations between Several Factors in Immersion Silver Technique and Galvanic Attack Problem","authors":"Kun Li, D. Xiang, X. Liu","doi":"10.1109/ISEE.2007.369394","DOIUrl":"https://doi.org/10.1109/ISEE.2007.369394","url":null,"abstract":"To control lead pollution,\" Hot Air Solder Leveling \"(HASL), the traditional lead-contained PCB(Printed Circuit Board) surface finish, needs to be replaced by lead- free technique. Immersion Silver (I-Ag) has many merits compared to other lead-free techniques, thereby being increasingly widely used. However, a problem named \"galvanic attack\", which seriously erodes copper where circuit connects pad, is a serious obstacle to I-Ag's popularization. According to manufacturing experience, consistency of silver ion, temperature, mircoetch rate and liquid level are four major factors in I-Ag process. In this paper, relations between these factors and galvanic attack are studied by experiments. From these relations we get inspirations to reduce galvanic attack in engineering practice.","PeriodicalId":275164,"journal":{"name":"Proceedings of the 2007 IEEE International Symposium on Electronics and the Environment","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126937375","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-07DOI: 10.1109/ISEE.2007.369366
B. Allenby
The path towards sustainable engineering education is evident, but not trivial. It requires that engineering professors recognize and be able to communicate the mythic nature of the sustainability discourse, and from there create mechanisms that can be understood by their students that translate the precatory language of sustainability into useful input. Continued expansion of industrial ecology methods to include cultural and social considerations, and practice in reducing complex states to quantitative inputs into engineering methodologies, offers one such route. But the engineering education community will also need to revisit its current structure with a view towards principled reform. In particular, the slow progress towards recognition of the masters as the professional level degree should be accelerated by those interested in being able to teach sustainable engineering, and courses which emphasize the quadruple bottom line context within which much modern engineering must be done will need to be developed. Beyond that, especially given the rapid rates of change of technology systems, and the social, economic and environmental systems coupled to them, explicit lifetime learning structures for engineers, and for engineering professors, need to be developed and institutionalized. Taken as a whole, this suggests that expectations of quick fixes through incremental improvements are too optimistic, and that achieving an educational structure that produces professionals skilled in sustainable engineering will require decades of hard work and continued intellectual exploration.
{"title":"Sustainable Engineering Education: Translating Myth to Mechanism","authors":"B. Allenby","doi":"10.1109/ISEE.2007.369366","DOIUrl":"https://doi.org/10.1109/ISEE.2007.369366","url":null,"abstract":"The path towards sustainable engineering education is evident, but not trivial. It requires that engineering professors recognize and be able to communicate the mythic nature of the sustainability discourse, and from there create mechanisms that can be understood by their students that translate the precatory language of sustainability into useful input. Continued expansion of industrial ecology methods to include cultural and social considerations, and practice in reducing complex states to quantitative inputs into engineering methodologies, offers one such route. But the engineering education community will also need to revisit its current structure with a view towards principled reform. In particular, the slow progress towards recognition of the masters as the professional level degree should be accelerated by those interested in being able to teach sustainable engineering, and courses which emphasize the quadruple bottom line context within which much modern engineering must be done will need to be developed. Beyond that, especially given the rapid rates of change of technology systems, and the social, economic and environmental systems coupled to them, explicit lifetime learning structures for engineers, and for engineering professors, need to be developed and institutionalized. Taken as a whole, this suggests that expectations of quick fixes through incremental improvements are too optimistic, and that achieving an educational structure that produces professionals skilled in sustainable engineering will require decades of hard work and continued intellectual exploration.","PeriodicalId":275164,"journal":{"name":"Proceedings of the 2007 IEEE International Symposium on Electronics and the Environment","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130441664","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-07DOI: 10.1109/ISEE.2007.369403
Hilary Nixon, J. Saphores, O. Ogunseitan, A. A. Shapiro
The growing stockpiles of electronic waste (e-waste) pose a threat to human and environmental health if improperly disposed because of the hazardous materials in e-waste. The number of recycling programs across the U.S. is increasing, yet little is known about household e-waste recycling preferences. Our survey of California households indicates that most prefer curbside recycling, but drop-off recycling at regional collection centers also has widespread support. Most importantly, we find that it is important to include information on environmental attitudes and behaviors when estimating willingness to pay (WTP) for e- waste recycling; neglecting environmental attitudes can result in a biased WTP. Other key predictors of WTP include age, gender, ethnicity, and attitudes toward the role of business in protecting the environment.
{"title":"Electronic Waste Recycling Preferences in California: The Role of Environmental Attitudes and Behaviors","authors":"Hilary Nixon, J. Saphores, O. Ogunseitan, A. A. Shapiro","doi":"10.1109/ISEE.2007.369403","DOIUrl":"https://doi.org/10.1109/ISEE.2007.369403","url":null,"abstract":"The growing stockpiles of electronic waste (e-waste) pose a threat to human and environmental health if improperly disposed because of the hazardous materials in e-waste. The number of recycling programs across the U.S. is increasing, yet little is known about household e-waste recycling preferences. Our survey of California households indicates that most prefer curbside recycling, but drop-off recycling at regional collection centers also has widespread support. Most importantly, we find that it is important to include information on environmental attitudes and behaviors when estimating willingness to pay (WTP) for e- waste recycling; neglecting environmental attitudes can result in a biased WTP. Other key predictors of WTP include age, gender, ethnicity, and attitudes toward the role of business in protecting the environment.","PeriodicalId":275164,"journal":{"name":"Proceedings of the 2007 IEEE International Symposium on Electronics and the Environment","volume":"28 2","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132624796","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-07DOI: 10.1109/ISEE.2007.369373
J. Harland, D. Harman, L. Drago
In this paper, we provide data on the environmental performance improvements achieved during the conversion from manufacturing semiconductors on 200 mm silicon wafer to manufacturing on 300 mm. Conclusions identify approaches to continue the environmental improvements in future manufacturing generations.
{"title":"Design for Environment in New Semiconductor Manufacturing Technologies","authors":"J. Harland, D. Harman, L. Drago","doi":"10.1109/ISEE.2007.369373","DOIUrl":"https://doi.org/10.1109/ISEE.2007.369373","url":null,"abstract":"In this paper, we provide data on the environmental performance improvements achieved during the conversion from manufacturing semiconductors on 200 mm silicon wafer to manufacturing on 300 mm. Conclusions identify approaches to continue the environmental improvements in future manufacturing generations.","PeriodicalId":275164,"journal":{"name":"Proceedings of the 2007 IEEE International Symposium on Electronics and the Environment","volume":"54 6","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"113941050","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-01DOI: 10.1109/ISEE.2007.369369
M. Economou, E. Banaynal, P. Skillman
The European Union RoHS and WEEE directives have sensitized the electronics industry on the challenges of compliance along with an increasing awareness on the effects of the electronic products on the environment. Similar upcoming regulations from US, China, Japan, Korea and other jurisdictions have highlighted the importance of a focused and dedicated effort and appropriate resources aimed at complying with environmental regulations in a timely manner, thereby minimizing disruptions of the normal course of business. In anticipation of and preparing for future environmental regulations, along with a heightened sensitivity toward the environmental challenges facing the planet, a program was launched at Palm to provide a structured approach for compliance - with efforts going above and beyond compliance - which eventually would lead to environmental stewardship. This paper will present the Palm approach and philosophy behind this effort, lessons learned, and a look at the company's future direction in the journey from environmental compliance to stewardship.
{"title":"Journey from Environmental Compliance to Stewardship","authors":"M. Economou, E. Banaynal, P. Skillman","doi":"10.1109/ISEE.2007.369369","DOIUrl":"https://doi.org/10.1109/ISEE.2007.369369","url":null,"abstract":"The European Union RoHS and WEEE directives have sensitized the electronics industry on the challenges of compliance along with an increasing awareness on the effects of the electronic products on the environment. Similar upcoming regulations from US, China, Japan, Korea and other jurisdictions have highlighted the importance of a focused and dedicated effort and appropriate resources aimed at complying with environmental regulations in a timely manner, thereby minimizing disruptions of the normal course of business. In anticipation of and preparing for future environmental regulations, along with a heightened sensitivity toward the environmental challenges facing the planet, a program was launched at Palm to provide a structured approach for compliance - with efforts going above and beyond compliance - which eventually would lead to environmental stewardship. This paper will present the Palm approach and philosophy behind this effort, lessons learned, and a look at the company's future direction in the journey from environmental compliance to stewardship.","PeriodicalId":275164,"journal":{"name":"Proceedings of the 2007 IEEE International Symposium on Electronics and the Environment","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126866060","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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