The High Luminosity upgrade of the CERN Large Hadron Collider (HL-LHC) calls for new high-radiation tolerant silicon pixel sensors, capable of withstanding, in the innermost tracker layer of the CMS experiment, fluences up to 1 . 5 × 10 16 n eq cm − 2 (1 MeV equivalent neutrons) before being replaced. An extensive R&D program aiming at 3D pixel sensors, built with a top-side only process, has been put in place in CMS in collaboration with FBK (Trento, Italy) and CNM (Barcelona, Spain) foundries. The basic 3D cell size has an area of 25 × 100 µm 2 and is connected to a readout chip through a single, central electrode. A number of sensors were interconnected with the CMS pixel ReadOut Chip (CROC): built in 65 nm technology, the chip will be used in the pixel tracker of the CMS experiment during HL-LHC operations. In this paper the first test beam results of irradiated 3D CROC modules are reported. The analysis of collected data shows excellent performance and hit detection efficiencies close to 99% measured after a fluence of 1 × 10 16 n eq cm − 2 while meeting the noise occupancy requirements of the innermost tracker layer.
欧洲核子研究中心大型强子对撞机(HL-LHC)的高亮度升级需要新的高耐辐射硅像素传感器，能够在CMS实验的最内层跟踪器中承受高达1的影响。5 × 10 16 n eq cm−2 (1mev等效中子)。CMS与FBK(意大利特伦托)和CNM(西班牙巴塞罗那)代工厂合作，开展了一项针对3D像素传感器的广泛研发计划，该计划采用顶部制程。基本的3D单元尺寸面积为25 × 100 μ m 2，通过单个中心电极连接到读出芯片。多个传感器与CMS像素读出芯片(CROC)互联:CROC芯片采用65纳米技术，将在HL-LHC运行期间用于CMS实验的像素跟踪器。本文报道了辐照三维CROC模块的首束试验结果。对采集数据的分析表明，在1 × 10 16 n eq cm−2的影响下，命中检测效率接近99%，同时满足最内层跟踪器的噪声占用要求。
{"title":"Results on 3D Pixel Sensors for the CMS Upgrade at the HL-LHC","authors":"R. Ceccarelli","doi":"10.22323/1.420.0046","DOIUrl":"https://doi.org/10.22323/1.420.0046","url":null,"abstract":"The High Luminosity upgrade of the CERN Large Hadron Collider (HL-LHC) calls for new high-radiation tolerant silicon pixel sensors, capable of withstanding, in the innermost tracker layer of the CMS experiment, fluences up to 1 . 5 × 10 16 n eq cm − 2 (1 MeV equivalent neutrons) before being replaced. An extensive R&D program aiming at 3D pixel sensors, built with a top-side only process, has been put in place in CMS in collaboration with FBK (Trento, Italy) and CNM (Barcelona, Spain) foundries. The basic 3D cell size has an area of 25 × 100 µm 2 and is connected to a readout chip through a single, central electrode. A number of sensors were interconnected with the CMS pixel ReadOut Chip (CROC): built in 65 nm technology, the chip will be used in the pixel tracker of the CMS experiment during HL-LHC operations. In this paper the first test beam results of irradiated 3D CROC modules are reported. The analysis of collected data shows excellent performance and hit detection efficiencies close to 99% measured after a fluence of 1 × 10 16 n eq cm − 2 while meeting the noise occupancy requirements of the innermost tracker layer.","PeriodicalId":275608,"journal":{"name":"Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127320087","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Stephan Tobias Burkhalter, L. Caminada, A. Ebrahimi, W. Erdmann, H. Kästli, B. Meier, B. Ristic, T. Rohe, R. Wallny
MoTiC (Monolithic Timing Chip) is a prototype DMAPS Chip that builds on sensor technology developed in the ARCADIA project. The 50 by 50 (cid:181) m 2 pixels contain a small charge collecting electrode with a very low capacitance surrounded by radiation-hard in-pixel electronics. The chip contains a matrix of 5120 pixels on an area of 3.2 by 4 mm 2 . Each pixel features a trimmable and maskable comparator with a sample and hold circuit for the analog pulse height. Groups of 4 pixels share a TDC situated also in the readout matrix. This work presents the chip design and preliminary results of the hit efficiencies and spatial resolution measured in a first test beam campaign with 4-5 GeV/c electrons conducted at DESY
{"title":"MoTIC: Prototype of a Monolithic Particle Tracking Detector with Timing","authors":"Stephan Tobias Burkhalter, L. Caminada, A. Ebrahimi, W. Erdmann, H. Kästli, B. Meier, B. Ristic, T. Rohe, R. Wallny","doi":"10.22323/1.420.0017","DOIUrl":"https://doi.org/10.22323/1.420.0017","url":null,"abstract":"MoTiC (Monolithic Timing Chip) is a prototype DMAPS Chip that builds on sensor technology developed in the ARCADIA project. The 50 by 50 (cid:181) m 2 pixels contain a small charge collecting electrode with a very low capacitance surrounded by radiation-hard in-pixel electronics. The chip contains a matrix of 5120 pixels on an area of 3.2 by 4 mm 2 . Each pixel features a trimmable and maskable comparator with a sample and hold circuit for the analog pulse height. Groups of 4 pixels share a TDC situated also in the readout matrix. This work presents the chip design and preliminary results of the hit efficiencies and spatial resolution measured in a first test beam campaign with 4-5 GeV/c electrons conducted at DESY","PeriodicalId":275608,"journal":{"name":"Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114677903","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This contribution describes TROPix, a parametric simulation tool developed to speed up the simulation time of the response of silicon pixel detectors
这篇文章描述了TROPix，一个参数化仿真工具，旨在加快硅像素探测器响应的仿真时间
{"title":"TROPIX: A Fast Parametric Tool Reproducing the Output of Pixel Detectors","authors":"A. Di Luca, F. Follega, E. Ricci, R. Iuppa","doi":"10.22323/1.420.0090","DOIUrl":"https://doi.org/10.22323/1.420.0090","url":null,"abstract":"This contribution describes TROPix, a parametric simulation tool developed to speed up the simulation time of the response of silicon pixel detectors","PeriodicalId":275608,"journal":{"name":"Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)","volume":"140 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132901327","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The ALICE experiment at CERN is developing an upgrade of the three innermost layers of the Inner Tracking System (ITS3) to be installed during the Long Shutdown 3 of the LHC (2026–28). Based on a commercial 65 nm CMOS imaging technology for monolithic active pixel sensors, it consists of truly cylindrical wafer-scale bent stitched detectors that can be installed as close as 18 mm to the interaction point and will dramatically reduce the material budget in the region close to the interaction point to 0.05% X 0 per layer. This contribution provides an overview on the development of sensor readout for prototypes based on the 65 nm technology within the context of the ITS3 upgrade R&D, as well as an outlook on the final readout system, including requirements, plans, and current advancements.
欧洲核子研究中心(CERN)的ALICE实验正在开发内部跟踪系统(ITS3)最内层的三层升级，将在大型强子对撞机(LHC)长期关闭期间(2026-28年)安装。基于商用65纳米CMOS成像技术的单片有源像素传感器，它由真正的圆柱形晶圆级弯曲缝合探测器组成，可以安装在距离相互作用点18毫米的地方，并将相互作用点附近区域的材料预算大幅减少到每层0.05% X 0。这篇文章概述了在ITS3升级研发的背景下，基于65纳米技术的传感器读出原型的发展，以及对最终读出系统的展望，包括需求、计划和当前进展。
{"title":"The ALICE Pixel Readout Upgrade","authors":"V. Sarritzu","doi":"10.22323/1.420.0027","DOIUrl":"https://doi.org/10.22323/1.420.0027","url":null,"abstract":"The ALICE experiment at CERN is developing an upgrade of the three innermost layers of the Inner Tracking System (ITS3) to be installed during the Long Shutdown 3 of the LHC (2026–28). Based on a commercial 65 nm CMOS imaging technology for monolithic active pixel sensors, it consists of truly cylindrical wafer-scale bent stitched detectors that can be installed as close as 18 mm to the interaction point and will dramatically reduce the material budget in the region close to the interaction point to 0.05% X 0 per layer. This contribution provides an overview on the development of sensor readout for prototypes based on the 65 nm technology within the context of the ITS3 upgrade R&D, as well as an outlook on the final readout system, including requirements, plans, and current advancements.","PeriodicalId":275608,"journal":{"name":"Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)","volume":"80 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130122034","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
R. Zanzottera, A. Andreazza, F. Sabatini, F. Palla, F. Bosi, A. Petri, A. Carbone, L. Meng, H. Fox, I. Perić, R. Schimassek, R. Dong, Y. Gao, J. Velthuis, J. Dopke, F. Wilson, D. Muenstermann, Y. Li, X. Xu, T. Jones
High-voltage CMOS detectors are being developed for application in High-Energy Physics. AT-LASPIX3 is a full-reticle size monolithic pixel detector, consisting of 49000 pixels of dimension 50 × 150 𝜇 m 2 . It has been realized in in TSI 180 nm HVCMOS technology. In view of applications at future electron-positron colliders, multi-chip-modules are built. The module design and its characterization by electrical test and radiation sources will be illustrated, including characterization of shunt regulators for serial chain powering. Lightweight long structure to support and to cool multiple-module chain are also being realized. The multi-chip-modules performance shows no degradation with respect to single-chip devices and the level of integration achieved is suitable for tracking at future 𝑒 + 𝑒 − accelerators.
高压CMOS探测器正被开发用于高能物理。AT-LASPIX3是一个全光栅尺寸的单片像素探测器，由49000个像素组成，尺寸为50 × 150 μ m 2。它已在TSI 180 nm HVCMOS技术中实现。考虑到未来正负电子对撞机的应用，构建了多芯片模块。该模块的设计及其特性的电气测试和辐射源将被说明，包括特性的并联稳压器的串联链供电。支撑和冷却多模块链的轻量化长结构也正在实现。与单芯片器件相比，多芯片模块的性能没有下降，并且实现的集成水平适用于未来𝑒+𝑒−加速器的跟踪。
{"title":"ATLASPIX3 Modules for Experiments at Electron-Positron Colliders","authors":"R. Zanzottera, A. Andreazza, F. Sabatini, F. Palla, F. Bosi, A. Petri, A. Carbone, L. Meng, H. Fox, I. Perić, R. Schimassek, R. Dong, Y. Gao, J. Velthuis, J. Dopke, F. Wilson, D. Muenstermann, Y. Li, X. Xu, T. Jones","doi":"10.22323/1.420.0086","DOIUrl":"https://doi.org/10.22323/1.420.0086","url":null,"abstract":"High-voltage CMOS detectors are being developed for application in High-Energy Physics. AT-LASPIX3 is a full-reticle size monolithic pixel detector, consisting of 49000 pixels of dimension 50 × 150 𝜇 m 2 . It has been realized in in TSI 180 nm HVCMOS technology. In view of applications at future electron-positron colliders, multi-chip-modules are built. The module design and its characterization by electrical test and radiation sources will be illustrated, including characterization of shunt regulators for serial chain powering. Lightweight long structure to support and to cool multiple-module chain are also being realized. The multi-chip-modules performance shows no degradation with respect to single-chip devices and the level of integration achieved is suitable for tracking at future 𝑒 + 𝑒 − accelerators.","PeriodicalId":275608,"journal":{"name":"Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130760960","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
W. Snoeys, G. Aglieri Rinella, A. Andronic, M. Antonelli, R. Baccomi, R. Ballabriga Sune, M. Barbero, P. Barrillon, J. Baudot, P. Becht, F. Benotto, S. Beole, G. Bertolone, A. Besson, W. Białas, G. Borghello, J. Braach, M. Buckland, S. Bugiel, E. Buschmann, P. Camerini, M. Campbell, F. Carnesecchi, L. Cecconi, E. Charbon, Ankur Chauhan, C. Colledani, G. Contin, D. Dannheim, K. Dort, João Pacheco de Melo, W. Deng, G. de Robertis, A. Di Mauro, A. Dorda Martin, A. Dorokhov, P. Dorosz, G. Eberwein, Z. El Bitar, X. Fang, A. Fenigstein, C. Ferrero, D. Fougeron, D. Gajanana, M. Goffe, L. Gonella, A. Grelli, V. Gromov, Alexandre Habib, Adi Haim, K. Hansen, J. Hasenbichler, H. Hillemanns, G. Hong, Ch. Hu, A. Isakov, K. Jaaskelainen, A. Junique, A. Kotliarov, I. Kremastiotis, F. Krizek, A. Kluge, R. Kluit, G. Kucharska, T. Kugathasan, Y. Kwon, P. La Rocca, L. Lautner, Pedro V. Leitão, B. Lim, F. Loddo, M. Mager, D. Marras, P. Martinengo, S. Masciocchi, Soniya Mathew, M. Menzel, F. Morel, B. Mulyanto, M. Münker, L.
{"title":"Optimization of a 65 nm CMOS Imaging Technology for Monolithic Sensors in High Energy Physics","authors":"W. Snoeys, G. Aglieri Rinella, A. Andronic, M. Antonelli, R. Baccomi, R. Ballabriga Sune, M. Barbero, P. Barrillon, J. Baudot, P. Becht, F. Benotto, S. Beole, G. Bertolone, A. Besson, W. Białas, G. Borghello, J. Braach, M. Buckland, S. Bugiel, E. Buschmann, P. Camerini, M. Campbell, F. Carnesecchi, L. Cecconi, E. Charbon, Ankur Chauhan, C. Colledani, G. Contin, D. Dannheim, K. Dort, João Pacheco de Melo, W. Deng, G. de Robertis, A. Di Mauro, A. Dorda Martin, A. Dorokhov, P. Dorosz, G. Eberwein, Z. El Bitar, X. Fang, A. Fenigstein, C. Ferrero, D. Fougeron, D. Gajanana, M. Goffe, L. Gonella, A. Grelli, V. Gromov, Alexandre Habib, Adi Haim, K. Hansen, J. Hasenbichler, H. Hillemanns, G. Hong, Ch. Hu, A. Isakov, K. Jaaskelainen, A. Junique, A. Kotliarov, I. Kremastiotis, F. Krizek, A. Kluge, R. Kluit, G. Kucharska, T. Kugathasan, Y. Kwon, P. La Rocca, L. Lautner, Pedro V. Leitão, B. Lim, F. Loddo, M. Mager, D. Marras, P. Martinengo, S. Masciocchi, Soniya Mathew, M. Menzel, F. Morel, B. Mulyanto, M. Münker, L. ","doi":"10.22323/1.420.0083","DOIUrl":"https://doi.org/10.22323/1.420.0083","url":null,"abstract":"","PeriodicalId":275608,"journal":{"name":"Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129770935","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The increase in luminosity and pileup foreseen for future colliders has recently pushed central pixel detector technology towards an increase in timing resolution. Increased time resolution can ease track reconstruction by adding a more precise timestamp to events for better track separation. An alternative approach to timing with silicon pixel detectors is proposed in this paper. Current approaches are based either on amplitude increase due to avalanche charge multiplication or in the reduction of charge collection time in a 3D geometry detector. Both approaches uses charge integration amplifiers for signal pre-amplification. The main feature of the proposed approach is based on current preamplifier signal readout and a more comprehensive approach to time resolution improvement. An additional aspect of this approach is that it shifts the attention from the detector design to the readout electronics design. The current pulse of a silicon detector has an intrinsically fast (in the order of 5 ps) rise-time however the actual rise-time of a detector connected to a current (low impedance) preamplifier is limited by the RC product of the input resistance and the capacitance of the detector/preamplifier interface and the bandwidth of the preamplifier itself; using low impedance amplifier and low capacitance pixel detector the rise-time of this pulse can be kept below 200 ps. The amplitude of the signal can be increased by bias overvoltage and temperature reduction (increases mobility shrinking the current pulse duration). Furthermore low temperature operation (- 30 °C or less) and the low input capacitance of the detector can help to reduce noise. The combination of reduced rise-time, increased amplitude and reduced noise can tentatively improve the overall time resolution below 20 ps which is considered the best result achieved.
{"title":"Alternative Approach to Front-end Amplifiers Design for Timing Measurement with Silicon Pixel Detectors","authors":"M. Menichelli","doi":"10.22323/1.420.0049","DOIUrl":"https://doi.org/10.22323/1.420.0049","url":null,"abstract":"The increase in luminosity and pileup foreseen for future colliders has recently pushed central pixel detector technology towards an increase in timing resolution. Increased time resolution can ease track reconstruction by adding a more precise timestamp to events for better track separation. An alternative approach to timing with silicon pixel detectors is proposed in this paper. Current approaches are based either on amplitude increase due to avalanche charge multiplication or in the reduction of charge collection time in a 3D geometry detector. Both approaches uses charge integration amplifiers for signal pre-amplification. The main feature of the proposed approach is based on current preamplifier signal readout and a more comprehensive approach to time resolution improvement. An additional aspect of this approach is that it shifts the attention from the detector design to the readout electronics design. The current pulse of a silicon detector has an intrinsically fast (in the order of 5 ps) rise-time however the actual rise-time of a detector connected to a current (low impedance) preamplifier is limited by the RC product of the input resistance and the capacitance of the detector/preamplifier interface and the bandwidth of the preamplifier itself; using low impedance amplifier and low capacitance pixel detector the rise-time of this pulse can be kept below 200 ps. The amplitude of the signal can be increased by bias overvoltage and temperature reduction (increases mobility shrinking the current pulse duration). Furthermore low temperature operation (- 30 °C or less) and the low input capacitance of the detector can help to reduce noise. The combination of reduced rise-time, increased amplitude and reduced noise can tentatively improve the overall time resolution below 20 ps which is considered the best result achieved.","PeriodicalId":275608,"journal":{"name":"Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125503291","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The tracking detector of the Compact Muon Solenoid (CMS) experiment at the Large Hadron Collider (LHC) is an all-silicon device. It is comprised of two sub-detectors. The pixel detector is the inner one, which is surrounded by the strip detector. The pixel detector provides seeds for charged particle tracking and measures the impact parameter of the reconstructed tracks. The impact parameter is essential in the reconstruction of primary interaction and secondary decay vertices. The pixel detector was upgraded in the beginning of 2017, during Run 2 of the LHC. Various interventions have been performed on the detector since then, the latest refurbishment taking place during Long Shutdown 2 (LS2) between 2019 and 2022, right after Run 2. The expected fluence in the innermost layer reaches the expected limit for the sensors after about 250 fb − 1 of integrated luminosity; therefore, this layer was also scheduled to be replaced during LS2. In this paper, we describe the successful refurbishment and recommissioning program and the following relatively smooth data-taking period in the first year of Run 3. Preliminary studies of the performance will be presented along with the verification of the new layer 1 modules in which several weaknesses that were revealed during Run 2 have been fixed.
{"title":"Status of the CMS pixel detector","authors":"V. Veszpremi","doi":"10.22323/1.420.0008","DOIUrl":"https://doi.org/10.22323/1.420.0008","url":null,"abstract":"The tracking detector of the Compact Muon Solenoid (CMS) experiment at the Large Hadron Collider (LHC) is an all-silicon device. It is comprised of two sub-detectors. The pixel detector is the inner one, which is surrounded by the strip detector. The pixel detector provides seeds for charged particle tracking and measures the impact parameter of the reconstructed tracks. The impact parameter is essential in the reconstruction of primary interaction and secondary decay vertices. The pixel detector was upgraded in the beginning of 2017, during Run 2 of the LHC. Various interventions have been performed on the detector since then, the latest refurbishment taking place during Long Shutdown 2 (LS2) between 2019 and 2022, right after Run 2. The expected fluence in the innermost layer reaches the expected limit for the sensors after about 250 fb − 1 of integrated luminosity; therefore, this layer was also scheduled to be replaced during LS2. In this paper, we describe the successful refurbishment and recommissioning program and the following relatively smooth data-taking period in the first year of Run 3. Preliminary studies of the performance will be presented along with the verification of the new layer 1 modules in which several weaknesses that were revealed during Run 2 have been fixed.","PeriodicalId":275608,"journal":{"name":"Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131959043","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The CMS silicon tracking system measures the trajectories of charged particles with a hit resolution of the order of microns in the pixel detector and tens of microns in the strip detector. One of the most important inputs for track reconstruction is the precision with which the tracker geometry is known. Therefore the position, orientation, and curvature of each tracker sensor must be precisely determined. Changes in the operating conditions can cause movements in the different substructures and also in the sensors. For maintaining the targeted precision, frequent corrections are needed, and the procedure to determine these corrections is commonly referred to as tracker alignment. Due to accumulated radiation during data taking, the response of the sensors changes over time. This affects the local reconstruction of pixel hits and consequently the result of the alignment procedure. In this contribution, the alignment procedure in CMS is introduced, as well as the dedicated calibration for the pixel local reconstruction. The effect of the change in the local reconstruction due to aging of the sensors on the alignment procedure is discussed.
{"title":"Tracker alignment in CMS: interplay with pixel local reconstruction","authors":"A. V. Barroso","doi":"10.22323/1.420.0079","DOIUrl":"https://doi.org/10.22323/1.420.0079","url":null,"abstract":"The CMS silicon tracking system measures the trajectories of charged particles with a hit resolution of the order of microns in the pixel detector and tens of microns in the strip detector. One of the most important inputs for track reconstruction is the precision with which the tracker geometry is known. Therefore the position, orientation, and curvature of each tracker sensor must be precisely determined. Changes in the operating conditions can cause movements in the different substructures and also in the sensors. For maintaining the targeted precision, frequent corrections are needed, and the procedure to determine these corrections is commonly referred to as tracker alignment. Due to accumulated radiation during data taking, the response of the sensors changes over time. This affects the local reconstruction of pixel hits and consequently the result of the alignment procedure. In this contribution, the alignment procedure in CMS is introduced, as well as the dedicated calibration for the pixel local reconstruction. The effect of the change in the local reconstruction due to aging of the sensors on the alignment procedure is discussed.","PeriodicalId":275608,"journal":{"name":"Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121653818","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The High Luminosity upgrade of Large Hadron Collider (HL-LHC) will increase the LHC Luminosity and with it the density of particles on the detector by an order of magnitude. For protecting the inner silicon detectors of the ATLAS and other experiments and for monitoring the delivered luminosity, a radiation hard beam monitor is being developed. We are developing a set of detectors based on pCVD diamonds and a new dedicated rad-hard front-end ASIC. Due to the large range of particle flux through the detector, flexibility is very important. To satisfy the requirements imposed by the HL-LHC, our solution is based on segmenting diamond sensors into pixel devices of varying size and reading them out with new multichannel readout ASICs divided into two independent parts - each of them serving one of the tasks of the system. In this talk we describe the proposed system design including detectors, electronics, mechanics and services and present preliminary results from the first detectors fabricated using our prototype ASIC with data from beam tests at CERN.
{"title":"Development of the BCM' System for Beam Abort and Luminosity Monitoring at the HL-LHC","authors":"A. Gorišek","doi":"10.22323/1.420.0040","DOIUrl":"https://doi.org/10.22323/1.420.0040","url":null,"abstract":"The High Luminosity upgrade of Large Hadron Collider (HL-LHC) will increase the LHC Luminosity and with it the density of particles on the detector by an order of magnitude. For protecting the inner silicon detectors of the ATLAS and other experiments and for monitoring the delivered luminosity, a radiation hard beam monitor is being developed. We are developing a set of detectors based on pCVD diamonds and a new dedicated rad-hard front-end ASIC. Due to the large range of particle flux through the detector, flexibility is very important. To satisfy the requirements imposed by the HL-LHC, our solution is based on segmenting diamond sensors into pixel devices of varying size and reading them out with new multichannel readout ASICs divided into two independent parts - each of them serving one of the tasks of the system. In this talk we describe the proposed system design including detectors, electronics, mechanics and services and present preliminary results from the first detectors fabricated using our prototype ASIC with data from beam tests at CERN.","PeriodicalId":275608,"journal":{"name":"Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120859781","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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