First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)最新文献
Pub Date : 2001-10-21DOI: 10.1109/POLYTR.2001.973260
J. Felba, K. Friedel
The electrical conduction of adhesive joints is provided by the metal content, and high conductivity requires high metallic content. Isotropic electrically conductive adhesives are usually manufactured with filler concentration sufficiently greater than the percolation threshold to guarantee low resistance with allowance for manufacturing tolerances. However, we have found that it is not sufficient in the case of microwave applications since, due to the skin effect, only a thin layer of adhesive plays an important role in current conduction. Therefore, it is necessary to secure the proper arrangement of filler particles on the adhesive joint surface. In this work, instead of measuring adhesive joint conductivity, we have measured the quality factor of the resonant circuit, which was made as a stripline circuit, including the measured joints. It was found that quality factor did not increase if the blend of silver flakes and heavy silver (powder) was used as a filler. In meantime, in the same filler mixture, the adhesive conductivity has increased in the DC range, as expected. It means that not the filler volume content but eventual particle disorder on the joint surface is of the highest importance in the case of solder replacement with electrically conductive adhesives in microwave electronics.
{"title":"Electrical conduction of adhesive joints in microwave applications","authors":"J. Felba, K. Friedel","doi":"10.1109/POLYTR.2001.973260","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973260","url":null,"abstract":"The electrical conduction of adhesive joints is provided by the metal content, and high conductivity requires high metallic content. Isotropic electrically conductive adhesives are usually manufactured with filler concentration sufficiently greater than the percolation threshold to guarantee low resistance with allowance for manufacturing tolerances. However, we have found that it is not sufficient in the case of microwave applications since, due to the skin effect, only a thin layer of adhesive plays an important role in current conduction. Therefore, it is necessary to secure the proper arrangement of filler particles on the adhesive joint surface. In this work, instead of measuring adhesive joint conductivity, we have measured the quality factor of the resonant circuit, which was made as a stripline circuit, including the measured joints. It was found that quality factor did not increase if the blend of silver flakes and heavy silver (powder) was used as a filler. In meantime, in the same filler mixture, the adhesive conductivity has increased in the DC range, as expected. It means that not the filler volume content but eventual particle disorder on the joint surface is of the highest importance in the case of solder replacement with electrically conductive adhesives in microwave electronics.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"78 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132949382","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-21DOI: 10.1109/POLYTR.2001.973295
A. Meisel, T. Miteva, H. Nothofer, Wolfgang Knoll, D. Sainova, Dieter Neher, Gabriele Nelles, A. Yasuda, F. Grozema, T. Savenije, B. Wegewijs, L. Siebbeles, J. Warman, U. Scherf
Polyfluorenes (PFs) are conjugated polymers with exciting optical and electronic properties and potential applications in optoelectronics. Due to the liquid-crystalline character of most polyfluorene homopolymers, thin layers with a large degree of in-plane alignment can be fabricated with these polymers. Upon appropriate substitution of the polyfluorene backbone, layers with an optical anisotropy in absorption and polarization ratios in emission of more than twenty have recently been fabricated. When included in an organic light-emitting diode structure, highly-polarized blue electroluminescence with an integrated polarization ratio of up to 22 at a brightness of 800 cd/A was realized. These devices represent potential candidates for the illumination of LC displays. Investigations on the anisotropy of the charge carrier mobility revealed that the mobility is highly anisotropic, with only a very small mobility perpendicular to the polymer chains. This is in agreement with expectations based on the results of electron-microscopy studies, which established a structure in which the charge-conducting PF backbone is surrounded by a coaxial, insulating mantle of hydrocarbon side chains. Polyfluorene chains can thus be considered as semiconducting wires, which contain the insulation within their chemical structure.
{"title":"Anisotropy of the optical and electrical properties of highly-oriented polyfluorenes","authors":"A. Meisel, T. Miteva, H. Nothofer, Wolfgang Knoll, D. Sainova, Dieter Neher, Gabriele Nelles, A. Yasuda, F. Grozema, T. Savenije, B. Wegewijs, L. Siebbeles, J. Warman, U. Scherf","doi":"10.1109/POLYTR.2001.973295","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973295","url":null,"abstract":"Polyfluorenes (PFs) are conjugated polymers with exciting optical and electronic properties and potential applications in optoelectronics. Due to the liquid-crystalline character of most polyfluorene homopolymers, thin layers with a large degree of in-plane alignment can be fabricated with these polymers. Upon appropriate substitution of the polyfluorene backbone, layers with an optical anisotropy in absorption and polarization ratios in emission of more than twenty have recently been fabricated. When included in an organic light-emitting diode structure, highly-polarized blue electroluminescence with an integrated polarization ratio of up to 22 at a brightness of 800 cd/A was realized. These devices represent potential candidates for the illumination of LC displays. Investigations on the anisotropy of the charge carrier mobility revealed that the mobility is highly anisotropic, with only a very small mobility perpendicular to the polymer chains. This is in agreement with expectations based on the results of electron-microscopy studies, which established a structure in which the charge-conducting PF backbone is surrounded by a coaxial, insulating mantle of hydrocarbon side chains. Polyfluorene chains can thus be considered as semiconducting wires, which contain the insulation within their chemical structure.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"383 ","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"113994482","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-21DOI: 10.1109/POLYTR.2001.973290
M. Uhlig, A. Bertz, T. Werner, T. Gessner
The ongoing process of miniaturization in ULSI device fabrication has reached its limit. The reduction of cross talk and signal delay time of interconnects requires the application of low permittivity (low k: k <3.9, ultra low k: k<2.2) dielectrics in sub 0.18 /spl mu/m technologies. New materials (low k dielectrics with k/spl les/2.7 in combination with copper) must replace the usually applied SiO/sub 2/ (k/spl ap/3.9) dielectric. Among all new low k materials, amorphous carbon fluoride (CF) polymers deposited by plasma enhanced chemical vapor deposition (PE CVD) are one of the more promising CVD materials with stable 2.3 k. CF polymer films were deposited on silicon and different barrier and etch stop layers. Adhesion failures could be avoided by in situ deposition of a very thin (10 nm) adhesion layer. The influence of the additional film on dielectric film properties (dielectric constant: 2.0/spl les/k/spl les/2.3, break down field strength: Ebd>5 MV/cm, leakage current density @ /spl plusmn/5 V: <4/spl times/10-11 A/cm2) is negligible. After thermal treatment (T/spl les/400/spl deg/C) in vacuum or in nitrogen atmosphere hardly any changes in electrical and optical properties and in surface topology could be detected. Patterning by chemical mechanical polishing (CMP) and reactive ion etching (RIE) was tested successfully and will be applied in single damascene architecture.
在ULSI器件制造中，正在进行的小型化过程已经达到了极限。减少互连的串扰和信号延迟时间需要应用低介电常数(低k: k 5 MV/cm，漏电流密度@ /spl plusmn/5 V: <4/spl倍/10-11 A/cm2)可以忽略不计。在真空或氮气气氛中热处理(T/spl /400/spl℃)后，材料的电学、光学性质和表面拓扑结构几乎没有变化。化学机械抛光(CMP)和反应离子蚀刻(RIE)的图案测试成功，并将应用于单大马士革建筑。
{"title":"Plasma deposited CF polymer films as ultra low k intermetal dielectric, film properties and application","authors":"M. Uhlig, A. Bertz, T. Werner, T. Gessner","doi":"10.1109/POLYTR.2001.973290","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973290","url":null,"abstract":"The ongoing process of miniaturization in ULSI device fabrication has reached its limit. The reduction of cross talk and signal delay time of interconnects requires the application of low permittivity (low k: k <3.9, ultra low k: k<2.2) dielectrics in sub 0.18 /spl mu/m technologies. New materials (low k dielectrics with k/spl les/2.7 in combination with copper) must replace the usually applied SiO/sub 2/ (k/spl ap/3.9) dielectric. Among all new low k materials, amorphous carbon fluoride (CF) polymers deposited by plasma enhanced chemical vapor deposition (PE CVD) are one of the more promising CVD materials with stable 2.3 k. CF polymer films were deposited on silicon and different barrier and etch stop layers. Adhesion failures could be avoided by in situ deposition of a very thin (10 nm) adhesion layer. The influence of the additional film on dielectric film properties (dielectric constant: 2.0/spl les/k/spl les/2.3, break down field strength: Ebd>5 MV/cm, leakage current density @ /spl plusmn/5 V: <4/spl times/10-11 A/cm2) is negligible. After thermal treatment (T/spl les/400/spl deg/C) in vacuum or in nitrogen atmosphere hardly any changes in electrical and optical properties and in surface topology could be detected. Patterning by chemical mechanical polishing (CMP) and reactive ion etching (RIE) was tested successfully and will be applied in single damascene architecture.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133211970","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-21DOI: 10.1109/POLYTR.2001.973257
E. Mena‐Osteritz, G. Fuhrmann, A. Kaiser, P. Bauerle
Since conjugated oligomers and polymers can be considered as 'molecular wires' and building blocks for 'molecular' or 'nano-electronics', we will describe their self-assembling behaviour which was investigated by means of scanning tunneling microscopy (STM). Furthermore, the self-assembling properties of novel macrocycles are reported. 2D- and 3D-structural characterizations provide intriguing self-organization properties.
{"title":"Self-assembling /spl pi/-conjugated oligothiophenes for nanoelectronics: from organized molecular wires to macrocyclic circuits","authors":"E. Mena‐Osteritz, G. Fuhrmann, A. Kaiser, P. Bauerle","doi":"10.1109/POLYTR.2001.973257","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973257","url":null,"abstract":"Since conjugated oligomers and polymers can be considered as 'molecular wires' and building blocks for 'molecular' or 'nano-electronics', we will describe their self-assembling behaviour which was investigated by means of scanning tunneling microscopy (STM). Furthermore, the self-assembling properties of novel macrocycles are reported. 2D- and 3D-structural characterizations provide intriguing self-organization properties.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"95 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122047283","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-21DOI: 10.1109/POLYTR.2001.973297
F. Kuschel, Klaus-Uwe Badeke, C. Boeffel, M. Bauer
To obtain oriented LC-polymer composites, in a first step randomly oriented (micro-) separated systems are produced by physical or chemical phase separation processes. The following step involves mechanical shearing or stretching. As a result, the composites become birefringent. Thin films of such material fabricated from nematic, cholesteric or smectic LC phases and doped with dichroic dyes are promosing for flexible displays, effective non-absorptive polarizers, polarization-sensitive light shutters, etc. In particular, we investigated the electro-optical properties of numerous PDLC (Polymer Dispersed Liquid Crystals) films constituted of micron-sized LC droplets and tested their morphological stability. Uniaxially oriented composite films were produced by a special mechanical unit. The effect of polymer matrix, LC concentration and stretching regime were studied. Finally, the suitability of this composite material for field controlled light modulation is discussed.
{"title":"Oriented LC-microdroplets in polymer matrices: prospects of application","authors":"F. Kuschel, Klaus-Uwe Badeke, C. Boeffel, M. Bauer","doi":"10.1109/POLYTR.2001.973297","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973297","url":null,"abstract":"To obtain oriented LC-polymer composites, in a first step randomly oriented (micro-) separated systems are produced by physical or chemical phase separation processes. The following step involves mechanical shearing or stretching. As a result, the composites become birefringent. Thin films of such material fabricated from nematic, cholesteric or smectic LC phases and doped with dichroic dyes are promosing for flexible displays, effective non-absorptive polarizers, polarization-sensitive light shutters, etc. In particular, we investigated the electro-optical properties of numerous PDLC (Polymer Dispersed Liquid Crystals) films constituted of micron-sized LC droplets and tested their morphological stability. Uniaxially oriented composite films were produced by a special mechanical unit. The effect of polymer matrix, LC concentration and stretching regime were studied. Finally, the suitability of this composite material for field controlled light modulation is discussed.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"52 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117267473","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-21DOI: 10.1109/POLYTR.2001.973296
G. Ballun, G. Harsányi
Conductive polymers, such as polyaniline, polypyrrole etc. have special chemochromatic properties. The redox processes in electrochemical cells are reversible and causes colour changes on the electrode covered by the polymer layer. The redox state of the polymer (with varying conductivity) can be changed either by chemical or electrical processes. The former method is used in sensor applications, the latter in actuator and display devices. The oxidised and reduced forms of polyaniline have different colour. Between the two states, its absorption spectrum changes continually from translucent to yellow, green, and blue, depending on the applied cell voltage. This voltage allows us to create low-power display devices, because the change is caused by transient processes and low current flow. The present study shows the details of these colour changes in polyaniline samples. By expanding the system with polymers with other spectra (e.g. o-phenilene-diamine with a spectrum from translucent to red) we might produce an RGB or CYM display.
{"title":"Display disquisition based on conductive polymers: the colour spectrum of the polyaniline film","authors":"G. Ballun, G. Harsányi","doi":"10.1109/POLYTR.2001.973296","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973296","url":null,"abstract":"Conductive polymers, such as polyaniline, polypyrrole etc. have special chemochromatic properties. The redox processes in electrochemical cells are reversible and causes colour changes on the electrode covered by the polymer layer. The redox state of the polymer (with varying conductivity) can be changed either by chemical or electrical processes. The former method is used in sensor applications, the latter in actuator and display devices. The oxidised and reduced forms of polyaniline have different colour. Between the two states, its absorption spectrum changes continually from translucent to yellow, green, and blue, depending on the applied cell voltage. This voltage allows us to create low-power display devices, because the change is caused by transient processes and low current flow. The present study shows the details of these colour changes in polyaniline samples. By expanding the system with polymers with other spectra (e.g. o-phenilene-diamine with a spectrum from translucent to red) we might produce an RGB or CYM display.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117140454","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-21DOI: 10.1109/POLYTR.2001.973281
O. Wittler, P. Sprafke, J. Auersperg, B. Michel, H. Reichl
Cracks inside polymeric packaging materials, which are used for protection and isolation of electronic components, can lead to failure of the whole system. In this presentation, the loading situation of cracks inside the polymer of encapsulated metal structures is analysed. The analysis is based on finite element simulations of thermally induced stresses. In a first approach, a linear elastic material model is assumed in combination with the application of linear elastic fracture concepts. The load of the crack is shown to be influenced by geometrical factors like its own initial form and length. Moreover, the occurrence of delamination in the interface between the metal and polymer can be very important, as it severely influences the crack front inside the polymer. The results of this analysis are compared to experimental observations and show good correlation. It is shown how the model can be improved by the application of a viscoelastic material model for the encapsulation material.
{"title":"Fracture mechanical analysis of cracks in polymer encapsulated metal structures","authors":"O. Wittler, P. Sprafke, J. Auersperg, B. Michel, H. Reichl","doi":"10.1109/POLYTR.2001.973281","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973281","url":null,"abstract":"Cracks inside polymeric packaging materials, which are used for protection and isolation of electronic components, can lead to failure of the whole system. In this presentation, the loading situation of cracks inside the polymer of encapsulated metal structures is analysed. The analysis is based on finite element simulations of thermally induced stresses. In a first approach, a linear elastic material model is assumed in combination with the application of linear elastic fracture concepts. The load of the crack is shown to be influenced by geometrical factors like its own initial form and length. Moreover, the occurrence of delamination in the interface between the metal and polymer can be very important, as it severely influences the crack front inside the polymer. The results of this analysis are compared to experimental observations and show good correlation. It is shown how the model can be improved by the application of a viscoelastic material model for the encapsulation material.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115306206","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-21DOI: 10.1109/POLYTR.2001.973288
M. Bauer, J. Bauer
As uses for semiconductor devices and microsystems tend to increase, there is a growing demand for resin formulations useful in the manufacture of adhesives, underfills, encapsulants and the like. Resin compositions comprising cyanate ester and epoxy resins have been demonstrated to be useful as die attach adhesives, underfills and encapsulants. While the performance characteristics for such resin compositions are adequate for many applications, there is a continuing need to improve their manufacturing performance, especially. Critical problems to be solved are a too short pot life (less than 8 hours) and a too long cure schedule (e.g. 175/spl deg/C for more than 1hour). We encapsulated small particles (size in the range of 10 /spl mu/m) of effective hardeners to make them insoluble and non-reactive when mixed with the resin at room temperature. In this way, mixtures of the commercial liquid cyanate ester Primaset LeCy (Lonza AG) with encapsulated hardeners reach pot lifes of more than 3 months, whereas the cyanate ester gels and becomes solid within 30 minutes at room temperature, if the neat hardener is used instead of the capsules. At a certain elevated temperature, which mainly depends on the structure of the hardener, the capsules open and the curing reaction starts immediately. Curing temperatures and times as well as properties of the resulting thermosets depend on the structure and reactivity of the hardener and of the resin used, where a broad variety of combinations can be designed. Low-temperature systems with cure times less than 5 minutes at 80/spl deg/C reach glass temperatures of about 140/spl deg/C, whereas a glass temperature of 220/spl deg/C after 10 seconds cure can be achieved with another combination. The developed snap-cure resin systems can be easily mixed with a lot of common additives such as minerals, tougheners, metallic powders and others to cover a wide range of performance characteristics for use as adhesives, underfills, encapsulants and the like.
{"title":"New snap cure materials","authors":"M. Bauer, J. Bauer","doi":"10.1109/POLYTR.2001.973288","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973288","url":null,"abstract":"As uses for semiconductor devices and microsystems tend to increase, there is a growing demand for resin formulations useful in the manufacture of adhesives, underfills, encapsulants and the like. Resin compositions comprising cyanate ester and epoxy resins have been demonstrated to be useful as die attach adhesives, underfills and encapsulants. While the performance characteristics for such resin compositions are adequate for many applications, there is a continuing need to improve their manufacturing performance, especially. Critical problems to be solved are a too short pot life (less than 8 hours) and a too long cure schedule (e.g. 175/spl deg/C for more than 1hour). We encapsulated small particles (size in the range of 10 /spl mu/m) of effective hardeners to make them insoluble and non-reactive when mixed with the resin at room temperature. In this way, mixtures of the commercial liquid cyanate ester Primaset LeCy (Lonza AG) with encapsulated hardeners reach pot lifes of more than 3 months, whereas the cyanate ester gels and becomes solid within 30 minutes at room temperature, if the neat hardener is used instead of the capsules. At a certain elevated temperature, which mainly depends on the structure of the hardener, the capsules open and the curing reaction starts immediately. Curing temperatures and times as well as properties of the resulting thermosets depend on the structure and reactivity of the hardener and of the resin used, where a broad variety of combinations can be designed. Low-temperature systems with cure times less than 5 minutes at 80/spl deg/C reach glass temperatures of about 140/spl deg/C, whereas a glass temperature of 220/spl deg/C after 10 seconds cure can be achieved with another combination. The developed snap-cure resin systems can be easily mixed with a lot of common additives such as minerals, tougheners, metallic powders and others to cover a wide range of performance characteristics for use as adhesives, underfills, encapsulants and the like.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"2014 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131293287","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-21DOI: 10.1109/POLYTR.2001.973277
A. Battermann, B. Gunther, H. Schafer
In this work a new type of isotropically conductive adhesive (ICA) for 3-D MID applications is presented. An extremely low value of ionic impurity content in the ICA is realised by using a cycloaliphatic epoxy resin (CAE). Together with a new developed thermal initiator the CAE will be cured by UV-rays and heat below 100/spl deg/C. To reach better mechanical behaviour, porous silver nanopowders (SNP) as conductive filler material, instead of conventional silver flakes, are introduced. In this way a considerable reduction of metal filler content is achieved at still acceptably low values of the electrical resistivity. It is shown that the curing regime and the mechanical properties are improved considerably, when using SNP/CAE composites as compared to ICA's based on epoxies with silver flakes. Therefore this new ICA is particularly suited for bonding substrates and components, which differ strongly with respect to their coefficient of thermal expansion.
{"title":"UV-Curable conductive adhesives for 3-D MID application","authors":"A. Battermann, B. Gunther, H. Schafer","doi":"10.1109/POLYTR.2001.973277","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973277","url":null,"abstract":"In this work a new type of isotropically conductive adhesive (ICA) for 3-D MID applications is presented. An extremely low value of ionic impurity content in the ICA is realised by using a cycloaliphatic epoxy resin (CAE). Together with a new developed thermal initiator the CAE will be cured by UV-rays and heat below 100/spl deg/C. To reach better mechanical behaviour, porous silver nanopowders (SNP) as conductive filler material, instead of conventional silver flakes, are introduced. In this way a considerable reduction of metal filler content is achieved at still acceptably low values of the electrical resistivity. It is shown that the curing regime and the mechanical properties are improved considerably, when using SNP/CAE composites as compared to ICA's based on epoxies with silver flakes. Therefore this new ICA is particularly suited for bonding substrates and components, which differ strongly with respect to their coefficient of thermal expansion.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122057885","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-21DOI: 10.1109/POLYTR.2001.973284
T. Waris, R. Tuominen, J. Kivilahti
A panel-sized fabrication process for integrated module boards (IMB) is introduced. The IMB technology enables very high density solderless integration of active and passive components inside rigid or flexible organic substrates. With these interconnection structures signal distances are minimized and high performance electrical Cu-to-Cu or Cu-to-Ni/Au contacts are achieved. IMB is an environmentally friendly technology that is based on photoimagible polymers and additive or semi-additive plating processes. To meet the requirements of mass production, the panel-sized process has been developed. The first signal layer is fabricated subtractively. Metallizations of microvias and the second signal layer are realized with an additive process. Active components are automatically assembled and embedded inside drilled troughholes and electrically contacted with a special technique. Photodefinable epoxy-based build-up layers are produced subsequently. Inductors and capacitors are integrated into the smart card modules. Reliability of the modules has been evaluated by mechanical and electrical test methods and the results are presented.
{"title":"Panel-sized integrated module board manufacturing","authors":"T. Waris, R. Tuominen, J. Kivilahti","doi":"10.1109/POLYTR.2001.973284","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973284","url":null,"abstract":"A panel-sized fabrication process for integrated module boards (IMB) is introduced. The IMB technology enables very high density solderless integration of active and passive components inside rigid or flexible organic substrates. With these interconnection structures signal distances are minimized and high performance electrical Cu-to-Cu or Cu-to-Ni/Au contacts are achieved. IMB is an environmentally friendly technology that is based on photoimagible polymers and additive or semi-additive plating processes. To meet the requirements of mass production, the panel-sized process has been developed. The first signal layer is fabricated subtractively. Metallizations of microvias and the second signal layer are realized with an additive process. Active components are automatically assembled and embedded inside drilled troughholes and electrically contacted with a special technique. Photodefinable epoxy-based build-up layers are produced subsequently. Inductors and capacitors are integrated into the smart card modules. Reliability of the modules has been evaluated by mechanical and electrical test methods and the results are presented.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116826839","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)
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