First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)最新文献
Pub Date : 2001-10-21DOI: 10.1109/POLYTR.2001.973298
M. Berggren, T. Kugler, T. Remonen, D. Nilsson, Miaoxiang Chen, P. Norberg
The manufacturing, converting and ennobling processes of paper are truly large area and reel-to-reel processes. Here, we describe a project focusing on using the converting and ennobling processes of paper in order to introduce electronic functions onto the paper surface. As key active electronic materials we are using organic molecules and polymers. We develop sensor, communication and display devices on paper and the main application areas are packaging and paper display applications.
{"title":"Paper electronics and electronic paper","authors":"M. Berggren, T. Kugler, T. Remonen, D. Nilsson, Miaoxiang Chen, P. Norberg","doi":"10.1109/POLYTR.2001.973298","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973298","url":null,"abstract":"The manufacturing, converting and ennobling processes of paper are truly large area and reel-to-reel processes. Here, we describe a project focusing on using the converting and ennobling processes of paper in order to introduce electronic functions onto the paper surface. As key active electronic materials we are using organic molecules and polymers. We develop sensor, communication and display devices on paper and the main application areas are packaging and paper display applications.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130031794","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-21DOI: 10.1109/POLYTR.2001.973293
E. Suhir
The paper contains a brief review of the state-of-the-art in the stress-strain analysis (structural mechanics) of polymer coated optical glass fibers, with an emphasis on analytical ("mathematical") stress modeling. The author examines a number of practically important problems of the mechanical behavior and structural mechanics of polymer coated optical fibers, experiencing thermal, mechanical or dynamic loading. The following major topics are addressed: the mechanical behavior of polymer coated vs. metallized fibers, and the elastic stability and low temperature microbending of optical fibers.
{"title":"Structural mechanics of polymer coated optical glass fibres: review","authors":"E. Suhir","doi":"10.1109/POLYTR.2001.973293","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973293","url":null,"abstract":"The paper contains a brief review of the state-of-the-art in the stress-strain analysis (structural mechanics) of polymer coated optical glass fibers, with an emphasis on analytical (\"mathematical\") stress modeling. The author examines a number of practically important problems of the mechanical behavior and structural mechanics of polymer coated optical fibers, experiencing thermal, mechanical or dynamic loading. The following major topics are addressed: the mechanical behavior of polymer coated vs. metallized fibers, and the elastic stability and low temperature microbending of optical fibers.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"68 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117206182","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-21DOI: 10.1109/POLYTR.2001.973251
T. Suga, A. Takahashi, K. Saijo, S. Oosawa
A new fabrication technology for lamination between LCP (liquid crystalline polymer)and copper is presented. The method is based on a surface activation process prior to the clad bonding process. The fabrication conditions and the microstructure of the bonded interface as well as the mechanism of the bonding are discussed with respect to various experimental results. Some practical applications of the new clad materials in electronic packaging are also presented.
{"title":"New fabrication technology of polymer/metal lamination and its application in electronic packaging","authors":"T. Suga, A. Takahashi, K. Saijo, S. Oosawa","doi":"10.1109/POLYTR.2001.973251","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973251","url":null,"abstract":"A new fabrication technology for lamination between LCP (liquid crystalline polymer)and copper is presented. The method is based on a surface activation process prior to the clad bonding process. The fabrication conditions and the microstructure of the bonded interface as well as the mechanism of the bonding are discussed with respect to various experimental results. Some practical applications of the new clad materials in electronic packaging are also presented.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"108 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117248860","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-21DOI: 10.1109/POLYTR.2001.973276
R. Gutmann, J. Lu, Y. Kwon, J. McDonald, T. Cale
Three-dimensional (3D) ICs offer increased performance of digital lCs, heterogeneous integration for numerous applications and lower manufacturing cost for electronic and optoelectronic systems. After a discussion of alternative 3D integration technologies, our approach of using dielectric glue layers for attachment of fully processed 200mm diameter wafers (followed by top wafer thinning and inter-wafer interconnection with copper damascene patterning) is described. The wafer bonding process is highlighted, and requirements for polymeric adhesives for this application are described. Results with Flare/sup TM/, a non-fluorinated poly aryl ether, are presented in detail and serve as a baseline for alternative adhesives.
{"title":"Three-dimensional (3D) ICs: a technology platform for integrated systems and opportunities for new polymeric adhesives","authors":"R. Gutmann, J. Lu, Y. Kwon, J. McDonald, T. Cale","doi":"10.1109/POLYTR.2001.973276","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973276","url":null,"abstract":"Three-dimensional (3D) ICs offer increased performance of digital lCs, heterogeneous integration for numerous applications and lower manufacturing cost for electronic and optoelectronic systems. After a discussion of alternative 3D integration technologies, our approach of using dielectric glue layers for attachment of fully processed 200mm diameter wafers (followed by top wafer thinning and inter-wafer interconnection with copper damascene patterning) is described. The wafer bonding process is highlighted, and requirements for polymeric adhesives for this application are described. Results with Flare/sup TM/, a non-fluorinated poly aryl ether, are presented in detail and serve as a baseline for alternative adhesives.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121553686","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-21DOI: 10.1109/POLYTR.2001.973252
W. Meyer
Due to the progress in miniaturization of electronic and optoelectronic devices, new processing methods are needed for micro dispensing of adhesives and other polymers. Applications are found in fields like joining, marking and coating. Here, micro dispensing is defined in volume ranges of 30-500 pl (/spl sim/30-500 ng). Not only small volumes but also precision and flexibility are in high demand. For a certain range of adhesives and other polymers used especially in optoelectronic devices, microdrop provides equipment for microdispensing. The basic technique is a spin-off from inkjet-technology and profits from the flexibility and precision of this technology due to the contactless drop ejection. Also, extremely aggressive organic solvents do not cause problems for the valve-free dispensers. This makes the microdrop technology very attractive for solved polymers as used for LEP (light emitting polymer) applications. Here, the actual applications and possibilities are illustrated and the current developments for improved processing strategies are described. There are some demands on the properties of such polymers usable for micro dispensing. These are explained and the limitations are discussed.
{"title":"Micro dispensing of adhesives and other polymers","authors":"W. Meyer","doi":"10.1109/POLYTR.2001.973252","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973252","url":null,"abstract":"Due to the progress in miniaturization of electronic and optoelectronic devices, new processing methods are needed for micro dispensing of adhesives and other polymers. Applications are found in fields like joining, marking and coating. Here, micro dispensing is defined in volume ranges of 30-500 pl (/spl sim/30-500 ng). Not only small volumes but also precision and flexibility are in high demand. For a certain range of adhesives and other polymers used especially in optoelectronic devices, microdrop provides equipment for microdispensing. The basic technique is a spin-off from inkjet-technology and profits from the flexibility and precision of this technology due to the contactless drop ejection. Also, extremely aggressive organic solvents do not cause problems for the valve-free dispensers. This makes the microdrop technology very attractive for solved polymers as used for LEP (light emitting polymer) applications. Here, the actual applications and possibilities are illustrated and the current developments for improved processing strategies are described. There are some demands on the properties of such polymers usable for micro dispensing. These are explained and the limitations are discussed.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"216 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115979933","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-21DOI: 10.1109/POLYTR.2001.973306
H. Schroder, J. Bauer, F. Ebling, W. Scheel
Fraunhofer IZM has developed a packaging concept, which is based on a hybrid carrier, containing both electrical and optical interconnects: the Electrical Optical Circuit Board (EOCB). The key element is an additional optical layer with multimode waveguide structures. This layer is handled by standard PCB technology. As a result, the waveguides are completely incorporated into the circuit board. We used the hot embossing process for the first test of effective foil-structuring. After filling the core of the waveguides and sealing them with an over-cladding, the optical layer is given into the PCB process. Furthermore, waveguide structuring by photolithographic patterning is also a promising way to incorporate waveguide structures into the circuit board and is currently under test. The choice of appropriate polymer materials is a key problem when applying these techniques. They have to be compatible with the structuring and laminating processes and display excellent optical properties. We focus on recent results showing the optical characteristics of laminated polymer waveguides made by hot embossing and of waveguides made by photolithography.
{"title":"Polymer optical interconnects for PCB","authors":"H. Schroder, J. Bauer, F. Ebling, W. Scheel","doi":"10.1109/POLYTR.2001.973306","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973306","url":null,"abstract":"Fraunhofer IZM has developed a packaging concept, which is based on a hybrid carrier, containing both electrical and optical interconnects: the Electrical Optical Circuit Board (EOCB). The key element is an additional optical layer with multimode waveguide structures. This layer is handled by standard PCB technology. As a result, the waveguides are completely incorporated into the circuit board. We used the hot embossing process for the first test of effective foil-structuring. After filling the core of the waveguides and sealing them with an over-cladding, the optical layer is given into the PCB process. Furthermore, waveguide structuring by photolithographic patterning is also a promising way to incorporate waveguide structures into the circuit board and is currently under test. The choice of appropriate polymer materials is a key problem when applying these techniques. They have to be compatible with the structuring and laminating processes and display excellent optical properties. We focus on recent results showing the optical characteristics of laminated polymer waveguides made by hot embossing and of waveguides made by photolithography.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129380927","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-21DOI: 10.1109/POLYTR.2001.973294
C. Dreyer, M. Bauer, J. Bauer, N. Keil, H. Yao, C. Zawadzki
In optical network technology, not only is glass fibre required, but also a broad range of optical components, such as optical switches, multiplexers, demultiplexers, splitters, combiners and optical attenuators usually produced in silica technology. Polymeric materials are becoming more interesting for these applications, since they promise lower power consumption in optical switches and a reduction of production costs compared to silica. Polycyanurate ester resins are a relatively new class of high-performance polymers with outstanding properties, for example high thermal stability, low optical loss, low dielectric constant, good adhesion and exceptional mechanical properties. This paper focuses on the optical properties of such materials in the wavelength-region around 1550 nm. The results lead the way to optimisation for use in integrated optics and for the production of embedded waveguides and devices.
{"title":"Polycyanurate ester resins with low loss for use in integrated optics","authors":"C. Dreyer, M. Bauer, J. Bauer, N. Keil, H. Yao, C. Zawadzki","doi":"10.1109/POLYTR.2001.973294","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973294","url":null,"abstract":"In optical network technology, not only is glass fibre required, but also a broad range of optical components, such as optical switches, multiplexers, demultiplexers, splitters, combiners and optical attenuators usually produced in silica technology. Polymeric materials are becoming more interesting for these applications, since they promise lower power consumption in optical switches and a reduction of production costs compared to silica. Polycyanurate ester resins are a relatively new class of high-performance polymers with outstanding properties, for example high thermal stability, low optical loss, low dielectric constant, good adhesion and exceptional mechanical properties. This paper focuses on the optical properties of such materials in the wavelength-region around 1550 nm. The results lead the way to optimisation for use in integrated optics and for the production of embedded waveguides and devices.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"73 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116134589","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-21DOI: 10.1109/POLYTR.2001.973258
J. Morris, F. Anderssohn, S. Kudtarkar, E. Loos
ICA reliability continues to be a source of concern for widespread practical implementations in commercial products. In addition, there is still much to be understood in the basic principles of how such materials function. This paper includes contributions in both areas, in further understanding of ICA size effects, in the interpretation of the beneficial effects of vacuum treatments before curing, with additional drop test data, and with critical comments on common electrical test techniques.
{"title":"Reliability studies of an isotropic electrically conductive adhesive","authors":"J. Morris, F. Anderssohn, S. Kudtarkar, E. Loos","doi":"10.1109/POLYTR.2001.973258","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973258","url":null,"abstract":"ICA reliability continues to be a source of concern for widespread practical implementations in commercial products. In addition, there is still much to be understood in the basic principles of how such materials function. This paper includes contributions in both areas, in further understanding of ICA size effects, in the interpretation of the beneficial effects of vacuum treatments before curing, with additional drop test data, and with critical comments on common electrical test techniques.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127139853","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-21DOI: 10.1109/POLYTR.2001.973285
P. Palm, J. Maattanen, Y. de Maquille, A. Picault, J. Vanfleteren, B. Vandecasteele
This paper presents the latest results from the reliability tests of high density flip chip on flex application using anisotropically conductive adhesives. Four different types of flexible substrates and two different types of anisotropically conductive adhesives were selected. Both paste and film type anisotropically conductive adhesives were used. Two different test devices were used. The contact areas were 50/spl times/50 /spl mu/m and 50/spl times/90 /spl mu/m. The effective pitch was 80 /spl mu/m in both samples and the number of contacts was 200. The matrix of both anisotropically conductive adhesives was epoxy based and the conductive particles in film type were isolated soft metal-coated polymer particles and in paste type isolated silver particles. The contact resistance was measured with a four-point method and the series resistance with a daisy chain method. The reliability of the flip chip interconnections was tested in thermal cycling tests. Cross section samples were made to analyze the possible failure mechanism of failed contacts.
{"title":"Reliability of different flex materials in high density flip chip on flex applications","authors":"P. Palm, J. Maattanen, Y. de Maquille, A. Picault, J. Vanfleteren, B. Vandecasteele","doi":"10.1109/POLYTR.2001.973285","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973285","url":null,"abstract":"This paper presents the latest results from the reliability tests of high density flip chip on flex application using anisotropically conductive adhesives. Four different types of flexible substrates and two different types of anisotropically conductive adhesives were selected. Both paste and film type anisotropically conductive adhesives were used. Two different test devices were used. The contact areas were 50/spl times/50 /spl mu/m and 50/spl times/90 /spl mu/m. The effective pitch was 80 /spl mu/m in both samples and the number of contacts was 200. The matrix of both anisotropically conductive adhesives was epoxy based and the conductive particles in film type were isolated soft metal-coated polymer particles and in paste type isolated silver particles. The contact resistance was measured with a four-point method and the series resistance with a daisy chain method. The reliability of the flip chip interconnections was tested in thermal cycling tests. Cross section samples were made to analyze the possible failure mechanism of failed contacts.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128596466","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-21DOI: 10.1109/POLYTR.2001.973280
M. Vuorela, J. Kivilahti
Summary form only given. Tin and bismuth are metallurgically compatible because they are unable to form intermetallics with each other. When in contact with each other, i.e. in a local chemical equilibrium, the melting point of the Sn/Bi interface is 139/spl deg/C. During the bonding procedure above 139/spl deg/C tin and bismuth atoms dissolve very fast into the liquid until local equilibrium has been reached. Between Sn-coated pads or bumps, Bi particles form small lentils, the volumes of which depend on the particle size and the bonding temperature. When the temperature is decreased the liquid lentils solidify and bond locally the mating pads together inside the adhesive. The procedure for the SnPb/Bi system is quite similar. Basically, the only difference is that the local melting of the SnPb/Bi interface is initiated at about 93 /spl deg/C. The bonding process of Sn-bumped chips on Sn-coated substrates with different adhesives being filled with Bi particles is also presented. The solder joints formed at different bonding temperatures and with different pressure settings are examined with optical and scanning electron microscopy as well as with energy dispersive spectroscopy.
{"title":"Evaluation of bismuth as a filler material for anisotropically conductive adhesive","authors":"M. Vuorela, J. Kivilahti","doi":"10.1109/POLYTR.2001.973280","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973280","url":null,"abstract":"Summary form only given. Tin and bismuth are metallurgically compatible because they are unable to form intermetallics with each other. When in contact with each other, i.e. in a local chemical equilibrium, the melting point of the Sn/Bi interface is 139/spl deg/C. During the bonding procedure above 139/spl deg/C tin and bismuth atoms dissolve very fast into the liquid until local equilibrium has been reached. Between Sn-coated pads or bumps, Bi particles form small lentils, the volumes of which depend on the particle size and the bonding temperature. When the temperature is decreased the liquid lentils solidify and bond locally the mating pads together inside the adhesive. The procedure for the SnPb/Bi system is quite similar. Basically, the only difference is that the local melting of the SnPb/Bi interface is initiated at about 93 /spl deg/C. The bonding process of Sn-bumped chips on Sn-coated substrates with different adhesives being filled with Bi particles is also presented. The solder joints formed at different bonding temperatures and with different pressure settings are examined with optical and scanning electron microscopy as well as with energy dispersive spectroscopy.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125385874","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：