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2004 Electrical Overstress/Electrostatic Discharge Symposium最新文献

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Multilevel Transmission Line Pulse (MTLP) tester 多级传输线脉冲(MTLP)测试仪
Pub Date : 1900-01-01 DOI: 10.1109/EOSESD.2004.5272592
T. Daenen, S. Thijs, M. Natarajan, V. Vassilev, V. De Heyn, G. Groeseneken
A novel TLP testing approach, multilevel TLP (MTLP), is described, which can yield accurate and comprehensive snapback IV measurements unlike in the conventional TLP testing methodology with different system impedances. The experimental validity of the MTLP methodology and setup are demonstrated with measurement results from different snapback devices.
本文介绍了一种新型的TLP测试方法——多级TLP (MTLP),与传统的不同系统阻抗的TLP测试方法不同,它可以产生准确、全面的回吸IV测量结果。MTLP方法和设置的实验有效性通过不同的回带器件的测量结果得到验证。
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引用次数: 13
Advanced modelling and parameter extraction of the MOSFET ESD breakdown triggering in the 90nm CMOS node technologies 90nm CMOS节点技术中MOSFET ESD击穿触发的先进建模和参数提取
Pub Date : 1900-01-01 DOI: 10.1109/EOSESD.2004.5272628
V. Vassilev, M. Lorenzini, P. Jansen, G. Groeseneken, S. Thijs, M. Natarajan, M. Steyaert, H. Maes
The electro-static discharge (ESD) breakdown mechanism of 90 nm MOSFET n+/pwell devices is described in detail and modelled with a physics based equation set. The newly developed consistent parameter extraction approach allows to overcome the limitations of existing methodologies, which are not applicable for the 90 nm CMOS node device behaviour, and to calibrate precisely the snapback models. These models will help optimising the ESD robust I/O cells, which use 90 nm MOSFET devices as I/O drivers and ESD structures.
详细描述了90 nm MOSFET n+/pwell器件的静电放电击穿机理,并用基于物理的方程集建立了模型。新开发的一致参数提取方法可以克服现有方法的局限性,这些方法不适用于90纳米CMOS节点器件行为,并精确校准snapback模型。这些模型将有助于优化使用90 nm MOSFET器件作为I/O驱动器和ESD结构的ESD稳健I/O单元。
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引用次数: 4
ESD protection for a 5.5 GHz LNA in 90 nm RF CMOS — Implementation concepts, constraints and solutions 90nm RF CMOS中5.5 GHz LNA的ESD保护-实现概念、限制和解决方案
Pub Date : 1900-01-01 DOI: 10.1109/EOSESD.2004.5272635
S. Thijs, M. Natarajan, D. Linten, V. Vassilev, T. Daenen, A. Scholten, R. Degraeve, P. Wambacq, G. Groeseneken
Design and implementation of ESD protection for a 5.5 GHz Low Noise Amplifier (LNA) fabricated in a 90 nm RF CMOS technology is presented. An on-chip inductor, added as ldquoplug-and-playrdquo, is used as ESD protection for the RF pins. The consequences of design and process, as well as the limited freedom on the ESD protection implementation for all pins to be protected are presented in detail and additional improvements are suggested.
介绍了采用90 nm射频CMOS工艺制作的5.5 GHz低噪声放大器ESD保护的设计与实现。片上电感器,作为ldq即插即用,用于射频引脚的ESD保护。详细介绍了设计和工艺的后果,以及对所有要保护的引脚实施ESD保护的有限自由度,并提出了其他改进建议。
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引用次数: 14
期刊
2004 Electrical Overstress/Electrostatic Discharge Symposium
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