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2009 IEEE International SOC Conference (SOCC)最新文献

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Generic integer linear programming formulation for 3D IC partitioning 三维集成电路分区的一般整数线性规划公式
Pub Date : 2009-09-01 DOI: 10.1109/SOCCON.2009.5398032
Wan-Yu Lee, I. Jiang, Tsung-Wan Mei
The success of 3D ICs requires novel EDA techniques. Among them, this paper focuses on 3D IC partitioning, especially at the architectural level to maximize its benefits. We first derive logical formulations for 3D IC partitioning problems and then transform the formulations into integer linear programs (ILPs). The ILPs can minimize the footprint and the usage of vertical interconnects simultaneously. Our results conducted on the GSRC benchmark show that our approach outperforms the extended multi-way partitioning method in the usage of vertical interconnects under the same footprint settings. More importantly, our approach is very flexible and can readily extend to the partitioning problems with variant objectives and constraints, and with different abstract levels, e.g., from the architectural level down to the physical level. This flexibility makes the ILP formulations superior alternatives to the 3D IC partitioning problems.
3D集成电路的成功需要新颖的EDA技术。其中,本文重点研究了三维集成电路划分,特别是在体系结构层面,以最大限度地发挥其效益。我们首先推导出三维集成电路划分问题的逻辑公式,然后将其转化为整数线性规划(ILPs)。ilp可以同时最大限度地减少占用空间和垂直互连的使用。我们在GSRC基准测试上进行的结果表明,在相同占用空间设置下使用垂直互连时,我们的方法优于扩展的多路分区方法。更重要的是,我们的方法非常灵活,可以很容易地扩展到具有不同目标和约束的划分问题,以及具有不同抽象层次的划分问题,例如,从架构层到物理层。这种灵活性使得ILP配方优于3D IC划分问题。
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引用次数: 29
Design of a 1.8V 8-bit 1GSPS cascaded-folding CMOS A/D converter based on a folder averaging technique 基于折叠平均技术的1.8V 8位1GSPS级联折叠CMOS a /D转换器设计
Pub Date : 2009-09-01 DOI: 10.1109/SOCCON.2009.5398092
Dongheon Lee, Seunghun Kim, Jooho Hwang, Junho Moon, Minkyu Song
In this paper, a CMOS analog-to-digital converter (ADC) with an 8-bit 1GSPS at 1.8V is designed. The architecture of the proposed ADC is based on a folding ADC with a cascaded-folding and an interpolation structure. A self-linearized preamplifier with source degeneration technique and a folder averaging technique for the high-performance are introduced. Further, a novel auto-switching encoder is also proposed. The chip has been fabricated with 0.18μm 1-poly 5-metal CMOS technology. The active chip area is 0.72mm2 and it consumes about 200mW at 1.8V power supply.
本文设计了一种1.8V 8位1GSPS的CMOS模数转换器(ADC)。所提出的模数转换器的结构是基于一个具有级联折叠和插值结构的折叠模数转换器。介绍了一种采用源退化技术的自线性化前置放大器和一种高性能的折叠平均技术。此外,还提出了一种新型的自动开关编码器。该芯片采用0.18μm - 1聚5金属CMOS技术制造。有源芯片面积为0.72mm2,在1.8V电源下功耗约200mW。
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引用次数: 0
Improved write margin 6T-SRAM for low supply voltage applications 改进的写入余量6T-SRAM用于低电源电压应用
Pub Date : 2009-09-01 DOI: 10.1109/SOCCON.2009.5398053
F. Moradi, D. Wisland, H. Mahmoodi, T. Cao
In this paper a new technique to increase the write margin of 6T-SRAM cell is proposed. Using this technique the area of subthreshold SRAM cell is reduced and also the Write cycle is improved significantly with a lower area overhead. In this technique, PMOS stacked network is used to evaluate the write cycle. Based on behavior of devices in 65nm for weak inversion operation, this technique is proposed to decrease area overhead of 6T-SRAM in subthreshold region.
本文提出了一种提高6T-SRAM单元写入裕度的新技术。使用这种技术,亚阈值SRAM单元的面积减少,写周期也得到了显著改善,面积开销更低。在该技术中,使用PMOS堆叠网络来评估写周期。基于65nm器件的弱反转特性,提出了降低6T-SRAM在亚阈值区域的面积开销的方法。
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引用次数: 5
A low-cost SOC debug platform based on on-chip test architectures 基于片上测试架构的低成本SOC调试平台
Pub Date : 2009-09-01 DOI: 10.1109/SOCCON.2009.5398067
Kuen-Jong Lee, Si-Yuan Liang, A. Su
While the complexity of System-on-a-Chip (SoC) design keeps growing rapidly today the need for an efficient approach to catch design errors at silicon stage has become an urgent issue. In this paper we present a platform for silicon debugging that makes use of an existing test architecture and thus can provide many powerful debug features while requiring very low extra overhead. It supports multi-core debugging for general purpose cores in an SOC chip with the capabilities of on-line tracing, hardware breakpoint insertion and cycle-based stepping. An automatic design tool is also developed to cooperate with the debug platform. Together users can easily control debug operations and examine trace results to efficiently identify the root cause of failures in the silicon.
随着片上系统(SoC)设计的复杂性不断快速增长,需要一种有效的方法来捕获硅阶段的设计错误已成为一个紧迫的问题。在本文中,我们提出了一个硅调试平台,它利用现有的测试架构,因此可以提供许多强大的调试功能,同时需要非常低的额外开销。它支持SOC芯片中通用内核的多核调试,具有在线跟踪,硬件断点插入和基于周期的步进功能。为配合调试平台,开发了自动设计工具。用户可以轻松地控制调试操作并检查跟踪结果,以有效地识别芯片故障的根本原因。
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引用次数: 18
A fully digital power supply noise thermometer 全数字电源噪声温度计
Pub Date : 2009-09-01 DOI: 10.1109/SOCCON.2009.5398066
M. Graziano, M. Vittori
Power Supply Noise (PSN) is one of the main concerns in scaled technology circuits, both if performance reliability must be assured and if power supply is to be dynamically reduced for dissipation regulation. In this paper we propose a new system for digitally sensing Power Supply and Ground levels that can be both transferred to the output for verification purposes and used by a control block within the circuit under test (CUT) for the activation of power aware policies. The sensor system shows very low overhead in terms of power and area, and works at the nominal CUT frequency. It allows to change on-site the Power Supply and Ground ranges to be sensed and, after a fine tuning, can be arranged for a process variation aware measures. This sensor is fully digital and standard cell based and can be used for every type of architecture on a systematic basis for PSN measure as scan chains are for fault verification. It thus represents a change of paradigm in the way in which PSN measure systems are thought nowadays.
电源噪声(PSN)是规模技术电路中主要关注的问题之一,无论是在保证性能可靠性的情况下,还是在动态减小电源以调节功耗的情况下。在本文中,我们提出了一种用于数字传感电源和地电平的新系统,该系统既可以转移到输出以进行验证,也可以由被测电路(CUT)中的控制块用于激活功率感知策略。传感器系统在功率和面积方面显示出非常低的开销,并在标称CUT频率下工作。它允许改变现场的电源和接地范围被检测,经过微调,可以安排一个过程变化的感知措施。该传感器是完全数字化的,基于标准单元,可用于PSN测量的系统基础上的每种类型的架构,因为扫描链用于故障验证。因此,它代表了一种范式的变化,在其中的PSN测量系统被认为现在的方式。
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引用次数: 4
A high-level compilation toolchain for heterogeneous systems 异构系统的高级编译工具链
Pub Date : 2009-09-01 DOI: 10.1109/SOCCON.2009.5398108
W. Luk, J. Coutinho, T. Todman, Y. Lam, W. Osborne, Kong Woei Susanto, Qiang Liu, W. Wong
This paper describes Harmonic, a toolchain that targets multiprocessor heterogeneous systems comprising different types of processing elements such as general-purposed processors (GPPs), digital signal processors (DSP), and field-programmable gate arrays (FPGAs) from a high-level C program. The main goal of Harmonic is to improve an application by partitioning and optimising each part of the program, and selecting the most appropriate processing element in the system to execute each part. The core tools include a task transformation engine, a mapping selector, a data representation optimiser, and a hardware synthesiser. We also use the C language with source-annotations as intermediate representation for the toolchain, making it easier for users to understand and to control the compilation process.
本文描述了Harmonic,一个针对多处理器异构系统的工具链,该系统包括来自高级C程序的不同类型的处理元素,如通用处理器(GPPs),数字信号处理器(DSP)和现场可编程门阵列(fpga)。Harmonic的主要目标是通过划分和优化程序的每个部分,并在系统中选择最合适的处理元素来执行每个部分来改进应用程序。核心工具包括任务转换引擎、映射选择器、数据表示优化器和硬件合成器。我们还使用带有源代码注释的C语言作为工具链的中间表示,使用户更容易理解和控制编译过程。
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引用次数: 40
Tuning SoCs using the global dynamic critical path 使用全局动态关键路径调优soc
Pub Date : 2009-09-01 DOI: 10.1109/SOCCON.2009.5398007
Hari Kannan, M. Budiu, John D. Davis, Girish Venkataramani
We propose using a profiling-based technique (Dynamic Critical Path) to guide SoC optimization. Optimizing SoCs composed of many modules involves exploring a large space of possible configurations (exponential in the number of component modules). We present this optimization technique applied to a Globally Asynchronous Locally Synchronous (GALS) RTL design. Furthermore, we investigate the loss of precision when abstract versions of hardware modules are used for the critical path computation. Using the critical path provides very fast convergence towards optimal or near-optimal solutions when analyzing large configuration spaces by optimizing the design for composite optimization metrics, such as energy-delay.
我们建议使用基于分析的技术(动态关键路径)来指导SoC优化。优化由许多模块组成的soc需要探索大量可能的配置空间(组件模块数量呈指数级增长)。我们提出了一种应用于全局异步局部同步RTL设计的优化技术。此外,我们还研究了使用抽象版本的硬件模块进行关键路径计算时的精度损失。通过优化组合优化指标(如能量延迟)的设计,在分析大型配置空间时,使用关键路径可以非常快速地收敛到最优或接近最优的解决方案。
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引用次数: 2
Pixel-Parallel SPIHT for frame memory compression 用于帧内存压缩的像素并行SPIHT
Pub Date : 2009-09-01 DOI: 10.1109/SOCCON.2009.5398002
Yongseok Jin, Hyuk-Jae Lee
This paper proposes a novel frame memory compression algorithm, called Pixel-Parallel SPIHT (PPS) that processes image data in parallel to increase the encoding throughput. The throughput of a PPS coder is an average of 4.48 bits per cycle which is 48.7 times larger than that of No List SPIHT.
本文提出了一种新的帧存储压缩算法——像素并行SPIHT (PPS),该算法对图像数据进行并行处理以提高编码吞吐量。PPS编码器的吞吐量平均为每周期4.48位,是无列表SPIHT的48.7倍。
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引用次数: 3
Neuro inspired reconfigurable architecture for hardware/software co-design 神经启发的可重构架构,用于硬件/软件协同设计
Pub Date : 2009-09-01 DOI: 10.1109/SOCCON.2009.5398039
A. Ghani, L. McDaid, A. Belatreche, Waqar Ahmed
In neuro-inspired computing, cortical columns or microcircuits appear to be the basic unit of computation for recognition related tasks. This paper proposes an integrated framework for an efficient implementation of a cortical column on reconfigurable platform (FPGAs). A novel hardware/software co-design implementation strategy is devised and the functionality is tested in the context of speech recognition application. An overall accuracy of 98% was achieved with the fixed-point hardware/software co-design technique in comparison to the 100% with the floating-point software implementation.
在受神经启发的计算中,皮质柱或微电路似乎是识别相关任务的基本计算单位。本文提出了一种在可重构平台(fpga)上高效实现皮质柱的集成框架。设计了一种新的软硬件协同设计实现策略,并在语音识别应用的背景下对其功能进行了测试。与浮点软件实现的100%相比,定点硬件/软件协同设计技术的总体精度达到98%。
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引用次数: 2
RF-MEMS resonator design for parameter characterization RF-MEMS谐振器的参数表征设计
Pub Date : 2009-09-01 DOI: 10.1109/SOCCON.2009.5398037
Ambarish Roy, B. Barber, K. Prasad
A unique methodology involving Bulk Acoustic Wave (BAW) Solidly Mounted Resonators (SMRs) is presented in this paper which can be used to extract precise materials information that is vital to designing high performance RF filters. The novel approach allows simultaneous extraction of multiple parameters for multiple materials. Changes in materials properties over temperature can also be extracted.
本文提出了一种涉及体声波(BAW)固体安装谐振器(SMRs)的独特方法,该方法可用于提取精确的材料信息,这对于设计高性能射频滤波器至关重要。这种新方法可以同时提取多种材料的多个参数。材料性质在温度上的变化也可以提取出来。
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引用次数: 2
期刊
2009 IEEE International SOC Conference (SOCC)
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