Pub Date : 2013-10-24DOI: 10.1109/ISAM.2013.6643477
Ying Huang, Wanhua Zhao, B. Lu
The tendency of the current Computer Numerical Control (CNC) machine tools is high speed, high precision, high reliability, intelligence, integration and openness. However, there exists contradiction between high speed and high precision. The machine tool system is so complicated that its model is difficult to be constructed, simultaneously, in order to keep precision, the model will be very complex, which will lead to the decline of the speed. The paper provides the new methodology integrating the neural network and wavelet in the time-frequency space, which make only use of the signals from systems not of the model. For this new approach, no prior knowledge is required about the statistics of sensor signal, or the behavior of systems. Therefore it can realize the on-line state estimation of machine tool. It can guarantee the accuracy, at the same time, enhance the speed. Moreover, through the simulation integrated navigation system, it was proved that the new method could effectively enhance the positioning accuracy of the integrated system. Consequently, the new methodology could extend the information fusion to CNC machine tools and other sophisticated systems.
{"title":"A novel methodology on the state estimation of the machine tools based on the multi-sensor information fusion in time-frequency space","authors":"Ying Huang, Wanhua Zhao, B. Lu","doi":"10.1109/ISAM.2013.6643477","DOIUrl":"https://doi.org/10.1109/ISAM.2013.6643477","url":null,"abstract":"The tendency of the current Computer Numerical Control (CNC) machine tools is high speed, high precision, high reliability, intelligence, integration and openness. However, there exists contradiction between high speed and high precision. The machine tool system is so complicated that its model is difficult to be constructed, simultaneously, in order to keep precision, the model will be very complex, which will lead to the decline of the speed. The paper provides the new methodology integrating the neural network and wavelet in the time-frequency space, which make only use of the signals from systems not of the model. For this new approach, no prior knowledge is required about the statistics of sensor signal, or the behavior of systems. Therefore it can realize the on-line state estimation of machine tool. It can guarantee the accuracy, at the same time, enhance the speed. Moreover, through the simulation integrated navigation system, it was proved that the new method could effectively enhance the positioning accuracy of the integrated system. Consequently, the new methodology could extend the information fusion to CNC machine tools and other sophisticated systems.","PeriodicalId":323666,"journal":{"name":"2013 IEEE International Symposium on Assembly and Manufacturing (ISAM)","volume":"710 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121999402","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-10-24DOI: 10.1109/ISAM.2013.6643461
U. Dombrowski, Tobias Wagner, C. Riechel
Changing conditions for manufacturing enterprises cause an increasing complexity in assembly processes by product customization and cost pressure. Coinstantaneous, the demographic changes exacerbate the harmonization of the different performances between employees. This causes wastage of productivityatinterfaces between process steps.The Cyber Physical Assembly System (CyPAS) extends the concept of Manufacturing Executing Systems (MES) with modular Cyber Physical Systems (CPS)to harmonize the assembly by considering the individual performance. By realizing interactive work schedules, itsupports the handling of a high level customization.
{"title":"Concpt for a Cyber Physical Assembly System","authors":"U. Dombrowski, Tobias Wagner, C. Riechel","doi":"10.1109/ISAM.2013.6643461","DOIUrl":"https://doi.org/10.1109/ISAM.2013.6643461","url":null,"abstract":"Changing conditions for manufacturing enterprises cause an increasing complexity in assembly processes by product customization and cost pressure. Coinstantaneous, the demographic changes exacerbate the harmonization of the different performances between employees. This causes wastage of productivityatinterfaces between process steps.The Cyber Physical Assembly System (CyPAS) extends the concept of Manufacturing Executing Systems (MES) with modular Cyber Physical Systems (CPS)to harmonize the assembly by considering the individual performance. By realizing interactive work schedules, itsupports the handling of a high level customization.","PeriodicalId":323666,"journal":{"name":"2013 IEEE International Symposium on Assembly and Manufacturing (ISAM)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127670020","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-10-24DOI: 10.1109/ISAM.2013.6643512
Yu Suiran, Qingyan Yang, Y. Lu
A product family is a set of similar products obtained from a common platform. Products in a product family are linked with each other by the emergent attributes (such as the commonalty). The commonality of a product family affects the production volume of sharing components, and furthermore the production volume affects the cost of manufacturing, reuse, and recycling and so on. The green design methods for a single product are not able to handle a product family, so a new systematic green product family design method needs to develop. To adapt and combine product family design and product green design is the main research idea of this paper. In this paper, product family design and green design are modified with consideration of production volume. Green modules are identified by a fuzzy clustering method A case study of a green fridge family is provided to validate our design method.
{"title":"A green product family design method considering the effect of production volume","authors":"Yu Suiran, Qingyan Yang, Y. Lu","doi":"10.1109/ISAM.2013.6643512","DOIUrl":"https://doi.org/10.1109/ISAM.2013.6643512","url":null,"abstract":"A product family is a set of similar products obtained from a common platform. Products in a product family are linked with each other by the emergent attributes (such as the commonalty). The commonality of a product family affects the production volume of sharing components, and furthermore the production volume affects the cost of manufacturing, reuse, and recycling and so on. The green design methods for a single product are not able to handle a product family, so a new systematic green product family design method needs to develop. To adapt and combine product family design and product green design is the main research idea of this paper. In this paper, product family design and green design are modified with consideration of production volume. Green modules are identified by a fuzzy clustering method A case study of a green fridge family is provided to validate our design method.","PeriodicalId":323666,"journal":{"name":"2013 IEEE International Symposium on Assembly and Manufacturing (ISAM)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121055279","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-10-24DOI: 10.1109/ISAM.2013.6643457
Lin Wang, Xianzhi Xiong, Hua Xu
A new high-speed and high-precision spindle system test rig has been developed for evaluating the performance of water-lubricated high-speed hybrid bearings. The hybrid bearing is consisted of four stepped recesses and two symmetric circumferential grooves. The orifice compensated hybrid bearings have been successfully used in a high-speed spindle system. The rotating speeds of the spindle system test rig range from 6,000 rpm to 30,000 rpm, which makes it possible to simulate many actual machining processes. Initial experiment has been presented to study the mechanical and thermal behaviours of the rotor-bearing system. The obtained results indicate that the temperature rise at a maximum speed up to 30,000 rpm is less than 15°C at 2.5 Mpa supply pressure, and the racial run-out tolerance is about 1μm. The test rig can be used to investigate the performance characteristics in static and dynamic conditions, especially for high rotating speeds.
{"title":"A test rig to study the performance of water-lubricated high-speed hybrid bearings","authors":"Lin Wang, Xianzhi Xiong, Hua Xu","doi":"10.1109/ISAM.2013.6643457","DOIUrl":"https://doi.org/10.1109/ISAM.2013.6643457","url":null,"abstract":"A new high-speed and high-precision spindle system test rig has been developed for evaluating the performance of water-lubricated high-speed hybrid bearings. The hybrid bearing is consisted of four stepped recesses and two symmetric circumferential grooves. The orifice compensated hybrid bearings have been successfully used in a high-speed spindle system. The rotating speeds of the spindle system test rig range from 6,000 rpm to 30,000 rpm, which makes it possible to simulate many actual machining processes. Initial experiment has been presented to study the mechanical and thermal behaviours of the rotor-bearing system. The obtained results indicate that the temperature rise at a maximum speed up to 30,000 rpm is less than 15°C at 2.5 Mpa supply pressure, and the racial run-out tolerance is about 1μm. The test rig can be used to investigate the performance characteristics in static and dynamic conditions, especially for high rotating speeds.","PeriodicalId":323666,"journal":{"name":"2013 IEEE International Symposium on Assembly and Manufacturing (ISAM)","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116957392","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-07-01DOI: 10.1109/ISAM.2013.6643478
Meihua Xiong, Jin-hua Zhang
A novel representation model of joint interface was constructed based on multi-scale surface profiles. The contact surface profiles at different loads need different-scale asperities to support, and the asperities at different scales were equivalent to groups of springs in parallel with different size and stiffness, so the joint interface was equivalent to the coupling of series-parallel springs and gaps. The multi-scale representation model was simplified according to three hypotheses, and was perfected in the finite element model of the bolted-joint member interface. In the member interface, the top contact surface was turned with a roughness of Ra=1.2 μm, and its surface profile curve was obtained and filtered by Fast Fourier Transform (FFT) filter method based on the multi-scale contact theory. The bottom contact surface was ground with a roughness of Ra=0.2 μm and was presumed to be smooth and rigid. The rougher contact surface profile was discretized to one layer of plane182 elements in place of the springs so that the local lateral displacement of rough asperities could be considered. The load transfer and contact characteristics of the multi-scale interface model were analyzed and compared with those of the literature. Results show that the multi-scale interface model can solve the macro and micro scale contact problems in the same model, and it provides a new way to improve the comprehensive performance of the member in.
{"title":"The multi-scale representation model of joint interface and its finite element analysis","authors":"Meihua Xiong, Jin-hua Zhang","doi":"10.1109/ISAM.2013.6643478","DOIUrl":"https://doi.org/10.1109/ISAM.2013.6643478","url":null,"abstract":"A novel representation model of joint interface was constructed based on multi-scale surface profiles. The contact surface profiles at different loads need different-scale asperities to support, and the asperities at different scales were equivalent to groups of springs in parallel with different size and stiffness, so the joint interface was equivalent to the coupling of series-parallel springs and gaps. The multi-scale representation model was simplified according to three hypotheses, and was perfected in the finite element model of the bolted-joint member interface. In the member interface, the top contact surface was turned with a roughness of Ra=1.2 μm, and its surface profile curve was obtained and filtered by Fast Fourier Transform (FFT) filter method based on the multi-scale contact theory. The bottom contact surface was ground with a roughness of Ra=0.2 μm and was presumed to be smooth and rigid. The rougher contact surface profile was discretized to one layer of plane182 elements in place of the springs so that the local lateral displacement of rough asperities could be considered. The load transfer and contact characteristics of the multi-scale interface model were analyzed and compared with those of the literature. Results show that the multi-scale interface model can solve the macro and micro scale contact problems in the same model, and it provides a new way to improve the comprehensive performance of the member in.","PeriodicalId":323666,"journal":{"name":"2013 IEEE International Symposium on Assembly and Manufacturing (ISAM)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130850270","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-07-01DOI: 10.1109/ISAM.2013.6643508
A. Camelot, C. Mascle, P. Baptiste
The aim of this research is to organize the disassembly of reusable equipments with a model for arranging maintenance tasks together. Disassembly of reusable parts for their introduction on the second-hand market is discussed. Execution zone and tasks preparation are important criteria. The proposed model is used for aircraft equipment dismantling. Utilization strategy is proposed, based on an heuristic resolution. Data acquisition can be automatically accomplished.
{"title":"Disassembly of spare parts on an EOL aircraft","authors":"A. Camelot, C. Mascle, P. Baptiste","doi":"10.1109/ISAM.2013.6643508","DOIUrl":"https://doi.org/10.1109/ISAM.2013.6643508","url":null,"abstract":"The aim of this research is to organize the disassembly of reusable equipments with a model for arranging maintenance tasks together. Disassembly of reusable parts for their introduction on the second-hand market is discussed. Execution zone and tasks preparation are important criteria. The proposed model is used for aircraft equipment dismantling. Utilization strategy is proposed, based on an heuristic resolution. Data acquisition can be automatically accomplished.","PeriodicalId":323666,"journal":{"name":"2013 IEEE International Symposium on Assembly and Manufacturing (ISAM)","volume":"160 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132686660","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-07-01DOI: 10.1109/ISAM.2013.6643502
M. Pfeffer, J. Franke
The assembly process of electronic components on three-dimensional circuit carriers increases the requirements on placement machines decisively. Decreased component packages and termination sizes require a precise placement process on 3D substrates with complex geometric structures. For characterizing the quality of this three-dimensional placement process, an evaluation methodology was developed. Therefore 3D test specimens were designed. The placement equipment, that has to be investigated, places components onto these specimens. Afterwards the component positions are analyzed by an optical coordinate measurement machine (CMM) and the placement error is calculated. This paper gives an overview of Molded Interconnect Technology (MID) and introduces the functionality of the investigated placement equipment, an automated multi axis handling unit for assembling 3D-MID. Focus is the presentation of the developed method for characterizing placement equipment used for 3D assembling of MID. Thedesign of the test specimens, the procedure of component placement and of measuring the component position areexplained. The results of characterizing the automated multi axis handling unit are shown. Influences and effects on the placement quality will be discussed. The developed method provides equipment manufacturers and users with a methodology to characterize, specify, document and verify the equipment's placement accuracy.
{"title":"Characterizing the placement accuracy of a handling unit used for assembling 3D circuit carriers","authors":"M. Pfeffer, J. Franke","doi":"10.1109/ISAM.2013.6643502","DOIUrl":"https://doi.org/10.1109/ISAM.2013.6643502","url":null,"abstract":"The assembly process of electronic components on three-dimensional circuit carriers increases the requirements on placement machines decisively. Decreased component packages and termination sizes require a precise placement process on 3D substrates with complex geometric structures. For characterizing the quality of this three-dimensional placement process, an evaluation methodology was developed. Therefore 3D test specimens were designed. The placement equipment, that has to be investigated, places components onto these specimens. Afterwards the component positions are analyzed by an optical coordinate measurement machine (CMM) and the placement error is calculated. This paper gives an overview of Molded Interconnect Technology (MID) and introduces the functionality of the investigated placement equipment, an automated multi axis handling unit for assembling 3D-MID. Focus is the presentation of the developed method for characterizing placement equipment used for 3D assembling of MID. Thedesign of the test specimens, the procedure of component placement and of measuring the component position areexplained. The results of characterizing the automated multi axis handling unit are shown. Influences and effects on the placement quality will be discussed. The developed method provides equipment manufacturers and users with a methodology to characterize, specify, document and verify the equipment's placement accuracy.","PeriodicalId":323666,"journal":{"name":"2013 IEEE International Symposium on Assembly and Manufacturing (ISAM)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124369104","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-07-01DOI: 10.1109/ISAM.2013.6643499
Jianning Ma, Dinghua Zhang, Baohai Wu, M. Luo
Presented in this paper is a method to generate interference free toolpaths for four-axis electrical discharge rough milling of blisk. Initial toolpaths are generated for the blisk with initial tool orientation. Interference detection is then carried out between the electrode and workpiece, optimized tool orientation is selected for location where interference exists. As for locations where interference free tool orientation doesn't exist due to narrow space of the blisk channel, effective toolpath correction method is carried out by adjusting the location of the electrode and regenerating the toolpath. Application result shows that the no interference will occur and the tool orientation deviation is small, thereby demonstrating the feasibility of the presented approach.
{"title":"Toolpath generation for four-axis electrical discharge rough milling of blisk","authors":"Jianning Ma, Dinghua Zhang, Baohai Wu, M. Luo","doi":"10.1109/ISAM.2013.6643499","DOIUrl":"https://doi.org/10.1109/ISAM.2013.6643499","url":null,"abstract":"Presented in this paper is a method to generate interference free toolpaths for four-axis electrical discharge rough milling of blisk. Initial toolpaths are generated for the blisk with initial tool orientation. Interference detection is then carried out between the electrode and workpiece, optimized tool orientation is selected for location where interference exists. As for locations where interference free tool orientation doesn't exist due to narrow space of the blisk channel, effective toolpath correction method is carried out by adjusting the location of the electrode and regenerating the toolpath. Application result shows that the no interference will occur and the tool orientation deviation is small, thereby demonstrating the feasibility of the presented approach.","PeriodicalId":323666,"journal":{"name":"2013 IEEE International Symposium on Assembly and Manufacturing (ISAM)","volume":"102 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133222413","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-06-26DOI: 10.1007/978-3-642-39223-8_11
P. Barattini, C. Morand, I. Almajai, N. Robertson, J. Hopgood, P. Ferrara, M. Bonasso, C. Strassmair, M. Rottenbacher, M. Stähr, R. Neumann, M. Tornari, A. Rovetta, M. Plasch, H. Bauer, J. Capco, C. Woegerer, A. Pichler
{"title":"Towards tailor made robot co workers based on a plug&produce framework","authors":"P. Barattini, C. Morand, I. Almajai, N. Robertson, J. Hopgood, P. Ferrara, M. Bonasso, C. Strassmair, M. Rottenbacher, M. Stähr, R. Neumann, M. Tornari, A. Rovetta, M. Plasch, H. Bauer, J. Capco, C. Woegerer, A. Pichler","doi":"10.1007/978-3-642-39223-8_11","DOIUrl":"https://doi.org/10.1007/978-3-642-39223-8_11","url":null,"abstract":"","PeriodicalId":323666,"journal":{"name":"2013 IEEE International Symposium on Assembly and Manufacturing (ISAM)","volume":"198 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-06-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123221523","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/imtc.2007.378974
The document that should appear here is not currently available. IEEE Xplore is working to obtain a replacement PDF. That PDF will be posted as soon as it is available. We regret any inconvenience in the meantime.
{"title":"PDF Not Yet Available In IEEE Xplore","authors":"","doi":"10.1109/imtc.2007.378974","DOIUrl":"https://doi.org/10.1109/imtc.2007.378974","url":null,"abstract":"The document that should appear here is not currently available. IEEE Xplore is working to obtain a replacement PDF. That PDF will be posted as soon as it is available. We regret any inconvenience in the meantime.","PeriodicalId":323666,"journal":{"name":"2013 IEEE International Symposium on Assembly and Manufacturing (ISAM)","volume":"199 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114191945","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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