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IEEE 1995 Microwave and Millimeter-Wave. Monolithic Circuits Symposium. Digest of Papers最新文献

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Low-cost high-volume RF products: dream, anticipation, or reality? 低成本大批量射频产品:梦想、期待还是现实?
A. Pavio
The analysis of several important high-volume RF product markets, such as the TVRO business, the more mature cable TV industry, and the cellular communications industry is the focus of this work. A look at the volumes and costs of these products, as well as the RF modules comprising them, help illustrate market demands. The role of various integrated technologies in these and future products, such as wireless cable, direct digital TV and, set-top converters are also discussed. In addition, detailed cost discussions focus on the "trade-offs" between hybrid and monolithic circuits, and Si versus GaAs technology. The remainder of the analysis concentrates on the aspects of designing for low cost production and the prediction of future trends.<>
分析几个重要的高容量射频产品市场,如TVRO业务、更成熟的有线电视行业和蜂窝通信行业是本工作的重点。查看这些产品的数量和成本,以及组成它们的射频模块,有助于说明市场需求。本文还讨论了各种集成技术在这些和未来产品中的作用,如无线电缆、直接数字电视和机顶盒转换器。此外,详细的成本讨论集中在混合电路和单片电路之间的“权衡”,以及Si与GaAs技术之间的“权衡”。剩下的分析集中在低成本生产的设计和未来趋势的预测方面。
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引用次数: 1
A GaAs single balanced mixer MMIC with built-in active balun for personal communication systems 用于个人通信系统的内置有源平衡的GaAs单平衡混频器MMIC
H. Koizumi, S. Nagata, K. Tateoka, K. Kanazawa, D. Ueda
A GaAs single balanced mixer IC with built-in active baluns for IF and LO inputs has been developed. The present mixer achieved the conversion gain of 16 dB and the LO signal suppression over 30 dBc at the LO input power of 0 dBm. Owing to a novel BST (Barium Strontium Titanate) capacitor technology, the implemented mixer IC was packaged in the small 6 pin outline with the extremely small chip size of 0.6/spl times/0.65 mm/sup 2/. The IC can eliminate the LO filter of the up-conversion system for a variety of handyphone-sets in L-band.<>
开发了一种内置中频和本振输入有源平衡的GaAs单平衡混频器IC。本混频器在LO输入功率为0 dBm的情况下实现了16 dB的转换增益和30 dBc以上的LO信号抑制。由于采用了新颖的BST(钛酸钡锶)电容器技术,所实现的混频器IC封装在6引脚的小轮廓中,芯片尺寸极小,仅为0.6/spl倍/0.65 mm/sup 2/。该集成电路可以消除l波段各种手持电话上转换系统的LO滤波器。
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引用次数: 39
Internal-node waveform probing of MMIC power amplifiers MMIC功率放大器内节点波形探测
C. Wei, Y. Tkachenko, J.C.M. Hwang, K.E. Smith, A. Peake
A novel internal-node waveform probing technique has been demonstrated on a MMIC. The error of the measurement and its perturbance to circuit operation was estimated and verified to be less than 20%. Valuable insight was obtained from the variation of waveforms as a function of frequency, drive and location.<>
一种新型的内节点波形探测技术在MMIC上得到了验证。估计并验证了测量误差及其对电路运行的扰动小于20%。从波形随频率、驱动和位置的变化中获得了有价值的见解
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引用次数: 6
W-band 0.3 W PHEMT MMIC power amplifier module W波段0.3 W PHEMT MMIC功率放大器模块
S. Weinreb, E. Fischer, B. Kane, N. Byer, M. Zimmerman
A compact (1.8 by 3.0 by 3.8 cm) WR-10 waveguide amplifier module providing 310-mW power output, 20-dB gain, and 5 GHz of 1-dB bandwidth at a center frequency of 96 GHz is described. The module is comprised of 22 identical PHEMT chips, 4-way microstrip power combiners and dividers, and a 4-way waveguide power combiner.<>
描述了一种紧凑的(1.8 × 3.0 × 3.8 cm) WR-10波导放大器模块,提供310兆瓦的功率输出,20 db增益和1 db带宽的5 GHz,中心频率为96 GHz。该模块由22个相同的PHEMT芯片、4路微带功率合成器和分频器以及4路波导功率合成器组成。
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引用次数: 12
A novel monolithic HEMT harmonic mixer at Q-band 一种新型q波段单片HEMT谐波混频器
R. Katz, S. Maas, A. Sharma, D. Smith
A novel Q-band monolithic harmonic mixer has been designed and fabricated using the 0.15 /spl mu/m pseudomorphic InGaAs-GaAs HEMT process for the first time. This high performance mixer is capable of downconverting a Q-band RF signal with the 12th, 14th or 16th harmonic of a S-band LO signal to produce a signal suitable for a phase locked loop. This compact mixer consists of antiparallel HEMT Schottky diodes with a lumped element IF and LO diplexer and a RF band-pass filter. Measured data shows agreement between simulations and measurements. Total chip size is 1.0 mm/spl times/2.5 mm.<>
首次采用0.15 /spl μ m假晶InGaAs-GaAs HEMT工艺设计并制作了一种新型q波段单片谐波混频器。这款高性能混频器能够将q波段RF信号与s波段LO信号的12、14或16次谐波进行下变频,从而产生适合锁相环的信号。这个紧凑的混频器由反平行的HEMT肖特基二极管与集总元件中频和低通双工器和射频带通滤波器组成。实测数据与模拟结果一致。总芯片尺寸为1.0 mm/spl倍/2.5 mm
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引用次数: 11
Hydrogen degradation of GaAs MMICs and hydrogen evolution in the hermetic package GaAs mmic的氢降解及密闭封装中的氢演化
Y. Saito, R. Griese, J. Kessler, R. Kono, J. Fang
An investigation of hydrogen degradation of GaAs MMICs (MESFET, PHEMT and HBT) was conducted to determine the threshold hydrogen concentration for spacecraft application. The maximum hydrogen in the hermetic package is found to be 0.6 torr (based on 10 year mission at ambient temperature of 125/spl deg/C). Hydrogen evolution in hermetic package is also studied to determine the source of hydrogen and to minimize its level in the package. Both studies demonstrate the high reliability of hermetic A40 (Al/Si) and Kovar (Fe/Ni/Co) packages for spacecraft applications.<>
研究了MESFET、PHEMT和HBT三种GaAs mmic材料的氢降解特性,确定了用于航天器的阈值氢浓度。密封封装中的最大氢被发现为0.6 torr(基于环境温度为125/spl℃的10年任务)。研究了密闭容器内氢气的演化过程,以确定氢气的来源,并尽量减少氢气在密闭容器内的含量。两项研究都证明了密封式A40 (Al/Si)和Kovar (Fe/Ni/Co)封装在航天器应用中的高可靠性。
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引用次数: 14
High-sensitivity W-band MMIC radiometer modules 高灵敏度w波段MMIC辐射计模块
B. Kane, S. Weinreb, E. Fischer, N. Byer
Multichip monolithic-integrated circuit modules that provide low-noise amplification, bandpass filtering, square-law detection, and DC amplification of a broadband millimeter-wave signal are described. The module is compact (4.50 cm/sup 3/) and lightweight (37 g), has low power consumption (80-130 mW), and is well-suited for use in focal-plane arrays to provide passive imaging of millimeter-wave thermal radiation. The theoretical gain requirement, radiometer construction, and measured results are reported.<>
描述了提供低噪声放大、带通滤波、平方律检测和宽带毫米波信号直流放大的多芯片单片集成电路模块。该模块结构紧凑(4.50 cm/sup /),重量轻(37 g),功耗低(80-130 mW),非常适合用于焦平面阵列,提供毫米波热辐射的被动成像。报告了理论增益要求、辐射计结构和测量结果。
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引用次数: 19
A high performance transceiver chipset for millimeter-wave commercial digital communication systems 用于毫米波商用数字通信系统的高性能收发器芯片组
A.K. Sharma, D.M. Smith, M. Aust, R.H. Katz, J. Yonaki, R.B. Womack, M.D. Bindenbender
A high performance Q-band monolithic HEMT transceiver chipset has been developed for millimeter-wave commercial digital radio systems. This highly compact transceiver chipset consists of low noise amplifier, power amplifier with detector, voltage controlled oscillator with buffer amplifier, mixer and harmonic mixer. The chipset has demonstrated high yield making it suitable for high volume commercial applications.<>
为毫米波商用数字无线电系统开发了一种高性能q波段单片HEMT收发芯片。这个高度紧凑的收发芯片由低噪声放大器、带检测器的功率放大器、带缓冲放大器的压控振荡器、混频器和谐波混频器组成。该芯片组已显示出高产量,适合大批量商业应用。
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引用次数: 7
Intelligent transportation systems 智能交通系统
W. Fink
Summary form only given. Intelligent Transportation Systems (ITS) represent an expanding international market. "Intelligent" is synonymous with the application of technology to the movement of goods and people. The largest potential market is services and products which includes systems for passenger vehicles. In the year 2000 and beyond, electronic systems will be integral to the operation, safety and control of the vehicle including collision warning and avoidance, emergency communications, vision enhancement, etc. Eventually, many driving functions will be "automated"-the extent of automation will be determined by user acceptance including cost. The vehicle market will be a significant user of monolithic circuits. Preliminary data is presented on the market categories and potential volume. The presentation places emphasis on showing illustrative examples of ITS system deployment and market projections.<>
只提供摘要形式。智能交通系统(ITS)代表着一个不断扩大的国际市场。“智能”是将技术应用于货物和人员流动的代名词。最大的潜在市场是服务和产品,其中包括乘用车系统。在2000年及以后,电子系统将成为车辆的操作、安全和控制的组成部分,包括碰撞警告和避免、紧急通讯、增强视力等。最终,许多驾驶功能将实现“自动化”——自动化程度将取决于用户的接受程度,包括成本。汽车市场将是单片电路的重要用户。初步数据提出了市场类别和潜在的数量。该报告强调展示ITS系统部署和市场预测的说明性示例。
{"title":"Intelligent transportation systems","authors":"W. Fink","doi":"10.1109/MCS.1995.471004","DOIUrl":"https://doi.org/10.1109/MCS.1995.471004","url":null,"abstract":"Summary form only given. Intelligent Transportation Systems (ITS) represent an expanding international market. \"Intelligent\" is synonymous with the application of technology to the movement of goods and people. The largest potential market is services and products which includes systems for passenger vehicles. In the year 2000 and beyond, electronic systems will be integral to the operation, safety and control of the vehicle including collision warning and avoidance, emergency communications, vision enhancement, etc. Eventually, many driving functions will be \"automated\"-the extent of automation will be determined by user acceptance including cost. The vehicle market will be a significant user of monolithic circuits. Preliminary data is presented on the market categories and potential volume. The presentation places emphasis on showing illustrative examples of ITS system deployment and market projections.<<ETX>>","PeriodicalId":325779,"journal":{"name":"IEEE 1995 Microwave and Millimeter-Wave. Monolithic Circuits Symposium. Digest of Papers","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117248828","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Coplanar waveguide based, dielectric coated flip chip monolithic microwave integrated circuit, a paradigm shift in MMIC technology 基于共面波导,介质涂层倒装芯片单片微波集成电路,在MMIC技术范式的转变
C. Wen, W. D. Wong, C. Pao, J.L. Snopkowski, D. Ingram
The status of a coplanar waveguide based, novel dielectric coated, mechanically rugged, flip-chip, monolithic microwave integrated circuit (MMIC) technology will be described. This technology is ideal for low-cost, multi-chip transmit/receive (T/R) module applications. Equivalent circuit and thermal models, and the fabrication procedure of flip-chip MMICs featuring T-shaped plated silver thermal bumps will be presented along with test results obtained on components designed using these circuit element models.<>
本文将描述一种基于共面波导、新型介质涂层、机械坚固、倒装芯片、单片微波集成电路(MMIC)技术的现状。该技术是低成本、多芯片收发(T/R)模块应用的理想选择。等效电路和热模型,以及具有t形镀银热凸起的倒装芯片mmic的制造过程,以及使用这些电路元件模型设计的组件的测试结果。
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引用次数: 6
期刊
IEEE 1995 Microwave and Millimeter-Wave. Monolithic Circuits Symposium. Digest of Papers
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