Pub Date : 2020-09-23DOI: 10.1109/EMCEUROPE48519.2020.9245762
Katharina Scharff, H. Torun, Cheng Yang, M. Swaminathan, C. Schuster
Signal integrity is becoming an important aspect of EMC engineering of digital systems. The signal integrity performance of printed circuit board links is influenced by a large number of design choices. Bayesian Optimization is a method that can optimize a large number of parameters in a reasonable amount of time. In this work it is shown that Bayesian Optimization can be used for the optimization of interconnect models with respect to their transmission and crosstalk performance. The first example is the optimization of the transmission of a single via. The second example is a 10 by 10 via array where the optimization includes transmission and crosstalk. The results obtained with the Bayesian Optimization are compared with the results of a Genetic Algorithm and with design guidelines derived from a physical perspective.
{"title":"Bayesian Optimization for Signal Transmission Including Crosstalk in a Via Array","authors":"Katharina Scharff, H. Torun, Cheng Yang, M. Swaminathan, C. Schuster","doi":"10.1109/EMCEUROPE48519.2020.9245762","DOIUrl":"https://doi.org/10.1109/EMCEUROPE48519.2020.9245762","url":null,"abstract":"Signal integrity is becoming an important aspect of EMC engineering of digital systems. The signal integrity performance of printed circuit board links is influenced by a large number of design choices. Bayesian Optimization is a method that can optimize a large number of parameters in a reasonable amount of time. In this work it is shown that Bayesian Optimization can be used for the optimization of interconnect models with respect to their transmission and crosstalk performance. The first example is the optimization of the transmission of a single via. The second example is a 10 by 10 via array where the optimization includes transmission and crosstalk. The results obtained with the Bayesian Optimization are compared with the results of a Genetic Algorithm and with design guidelines derived from a physical perspective.","PeriodicalId":332251,"journal":{"name":"2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE","volume":"166 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131585862","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-09-23DOI: 10.1109/EMCEUROPE48519.2020.9245856
F. D. Murro, J. Ekman, Ivana Kovačević-Badstübner, U. Grossner, M. Lucido, F. Frezza, D. Romano, G. Antonini
The Partial Element Equivalent Circuit (PEEC) method is widely used to model a large variety of electrical systems ranging from interconnects to antennas and packaging. A key aspect in the development of the method is the computation of interaction integrals, namely partial inductances and coefficients of potential. In this work, a novel semi-analytical approach to the computation of the self-interaction integral over rectangular domains is proposed for the zero thickness case as it occurs in the case of the coefficients of potential and partial inductances of very thin conductors and in the surface integral equation based formulation. The proposed semi-analytical formula is verified by comparison with more standard integration schemes.
{"title":"Semi-analytical form of full-wave self-interaction integrals over rectangles","authors":"F. D. Murro, J. Ekman, Ivana Kovačević-Badstübner, U. Grossner, M. Lucido, F. Frezza, D. Romano, G. Antonini","doi":"10.1109/EMCEUROPE48519.2020.9245856","DOIUrl":"https://doi.org/10.1109/EMCEUROPE48519.2020.9245856","url":null,"abstract":"The Partial Element Equivalent Circuit (PEEC) method is widely used to model a large variety of electrical systems ranging from interconnects to antennas and packaging. A key aspect in the development of the method is the computation of interaction integrals, namely partial inductances and coefficients of potential. In this work, a novel semi-analytical approach to the computation of the self-interaction integral over rectangular domains is proposed for the zero thickness case as it occurs in the case of the coefficients of potential and partial inductances of very thin conductors and in the surface integral equation based formulation. The proposed semi-analytical formula is verified by comparison with more standard integration schemes.","PeriodicalId":332251,"journal":{"name":"2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131781755","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-09-23DOI: 10.1109/EMCEUROPE48519.2020.9245700
Teresa Tumbrägel, B. Willmann, Hanno Raabe
Electromagnetic interference (EMI) of automotive components is evaluated by testing in a test setup that emulates the vehicle environment. Nevertheless the real vehicle environment differs from the test setup. This results in a deviation of the component behavior during testing and in the target vehicle. To avoid redesign in late development stages the disturbance behavior of components must be characterized early on. A characterization can be obtained by modeling the component as a Thevenin equivalent disturbance source. A key aspect of this approach is the determination of the internal impedance of the component in active mode.
{"title":"Black Box Approach to Active Impedance Characterization of Automotive Components","authors":"Teresa Tumbrägel, B. Willmann, Hanno Raabe","doi":"10.1109/EMCEUROPE48519.2020.9245700","DOIUrl":"https://doi.org/10.1109/EMCEUROPE48519.2020.9245700","url":null,"abstract":"Electromagnetic interference (EMI) of automotive components is evaluated by testing in a test setup that emulates the vehicle environment. Nevertheless the real vehicle environment differs from the test setup. This results in a deviation of the component behavior during testing and in the target vehicle. To avoid redesign in late development stages the disturbance behavior of components must be characterized early on. A characterization can be obtained by modeling the component as a Thevenin equivalent disturbance source. A key aspect of this approach is the determination of the internal impedance of the component in active mode.","PeriodicalId":332251,"journal":{"name":"2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131204573","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-09-23DOI: 10.1109/EMCEUROPE48519.2020.9245845
T. Sekine, S. Usuki, K. Miura
In this paper, we propose a technique which estimates statistical information of electrical properties of a transmission line that has a variability in shape by using a polynomial chaos method. A conventional Monte Carlo method requires enormous time to calculate the statistical information, since it performs a huge number of numerical analyses by stochastically changing the shapes of the transmission lines. In the proposed method, by means of a stochastic Galerkin method, which is one of the polynomial chaos methods, the statistical information can be obtained by performing the analysis only once.
{"title":"Variability Analysis of a Non-Uniform Transmission Line Using Stochastic Galerkin Method","authors":"T. Sekine, S. Usuki, K. Miura","doi":"10.1109/EMCEUROPE48519.2020.9245845","DOIUrl":"https://doi.org/10.1109/EMCEUROPE48519.2020.9245845","url":null,"abstract":"In this paper, we propose a technique which estimates statistical information of electrical properties of a transmission line that has a variability in shape by using a polynomial chaos method. A conventional Monte Carlo method requires enormous time to calculate the statistical information, since it performs a huge number of numerical analyses by stochastically changing the shapes of the transmission lines. In the proposed method, by means of a stochastic Galerkin method, which is one of the polynomial chaos methods, the statistical information can be obtained by performing the analysis only once.","PeriodicalId":332251,"journal":{"name":"2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131185482","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-09-23DOI: 10.1109/EMCEUROPE48519.2020.9245702
R. Geise, Jens Werner, A. Enders
In this contribution the authors summarize some aspects of electromagnetic field theory related to studies of electromagnetic compatibility and propose how they can be introduced in lectures in an attractive and interactive way. Simple examples with practical relevance are discussed that can serve as a motivation for students. In fact, presented fundamental field theory aspects for example with respect to the shielding of fields are commonly mistaken even at industrial working levels, so it is reasonable to anticipate this in EMC lectures.
{"title":"Field Theory and EMC - A Short Summary on Educational Aspects","authors":"R. Geise, Jens Werner, A. Enders","doi":"10.1109/EMCEUROPE48519.2020.9245702","DOIUrl":"https://doi.org/10.1109/EMCEUROPE48519.2020.9245702","url":null,"abstract":"In this contribution the authors summarize some aspects of electromagnetic field theory related to studies of electromagnetic compatibility and propose how they can be introduced in lectures in an attractive and interactive way. Simple examples with practical relevance are discussed that can serve as a motivation for students. In fact, presented fundamental field theory aspects for example with respect to the shielding of fields are commonly mistaken even at industrial working levels, so it is reasonable to anticipate this in EMC lectures.","PeriodicalId":332251,"journal":{"name":"2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133695051","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-09-23DOI: 10.1109/EMCEUROPE48519.2020.9245784
F. Bogdanov, Davit Imnadze, A. Gheonjian, I. Oganezova, I. Badzagua, D. Karkashadze, R. Jobava
This paper is devoted to the experimental validation of the 3D modeling approach for studying the shielding properties of high voltage (HV) connectors used in electric and hybrid vehicles with an arbitrary number, shape, size and location of apertures. The 3D simulation model is based on the method of moments (MoM), and novelty is in special implementation of Mitzner surface impedance boundary conditions (SIBC) for nested regions bounded by thin material sheets with apertures. This implementation implies the so-called null-field approach. Both measured and simulated results for the transfer impedance of prototype models of the HV connectors are presented and compared for various numbers and shapes of apertures.
{"title":"Measurement and 3D Simulation Study of Shielding Properties of HV Connectors used in Electric and Hybrid Vehicles","authors":"F. Bogdanov, Davit Imnadze, A. Gheonjian, I. Oganezova, I. Badzagua, D. Karkashadze, R. Jobava","doi":"10.1109/EMCEUROPE48519.2020.9245784","DOIUrl":"https://doi.org/10.1109/EMCEUROPE48519.2020.9245784","url":null,"abstract":"This paper is devoted to the experimental validation of the 3D modeling approach for studying the shielding properties of high voltage (HV) connectors used in electric and hybrid vehicles with an arbitrary number, shape, size and location of apertures. The 3D simulation model is based on the method of moments (MoM), and novelty is in special implementation of Mitzner surface impedance boundary conditions (SIBC) for nested regions bounded by thin material sheets with apertures. This implementation implies the so-called null-field approach. Both measured and simulated results for the transfer impedance of prototype models of the HV connectors are presented and compared for various numbers and shapes of apertures.","PeriodicalId":332251,"journal":{"name":"2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133705287","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-09-23DOI: 10.1109/EMCEUROPE48519.2020.9245750
Zhong Chen, M. Foegelle
The EM fields in a Reverberation Chamber (RC) can be described by a summation of plane waves from random angles with random phases and polarizations. In a well stirred RC, it is assumed there are sufficient number of plane waves, so the summation of the fields follows the well-known statistical distributions. Some researchers assumed a constant magnitude for the plane waves, while others assume a random distribution. Obviously the constant magnitude assumption is not physical in an actual cavity, as it would violate the conservation of energy. As a result, the model cannot simulate the Power Delay Profiles (PDP) in an actual RC. It was shown that the random distribution for the plane wave magnitude also produces unsatisfactory PDPs, and cannot match results from a Geometric Optics (GO) model. In addition, these models do not lend themselves well to simulate losses in a chamber. In this study, we propose a more physical model which is congruent with the behaviors predicted by the GO model. Monte Carlo simulation using the proposed model is then checked against the well-established statistical model in a RC.
{"title":"A Geometric Optics Congruent Monte Carlo Model for Reverberation Chambers","authors":"Zhong Chen, M. Foegelle","doi":"10.1109/EMCEUROPE48519.2020.9245750","DOIUrl":"https://doi.org/10.1109/EMCEUROPE48519.2020.9245750","url":null,"abstract":"The EM fields in a Reverberation Chamber (RC) can be described by a summation of plane waves from random angles with random phases and polarizations. In a well stirred RC, it is assumed there are sufficient number of plane waves, so the summation of the fields follows the well-known statistical distributions. Some researchers assumed a constant magnitude for the plane waves, while others assume a random distribution. Obviously the constant magnitude assumption is not physical in an actual cavity, as it would violate the conservation of energy. As a result, the model cannot simulate the Power Delay Profiles (PDP) in an actual RC. It was shown that the random distribution for the plane wave magnitude also produces unsatisfactory PDPs, and cannot match results from a Geometric Optics (GO) model. In addition, these models do not lend themselves well to simulate losses in a chamber. In this study, we propose a more physical model which is congruent with the behaviors predicted by the GO model. Monte Carlo simulation using the proposed model is then checked against the well-established statistical model in a RC.","PeriodicalId":332251,"journal":{"name":"2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE","volume":"9 20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133266836","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-09-23DOI: 10.1109/EMCEUROPE48519.2020.9245631
Han-Nien Lin, Tzu-Hao Ho, Yu-Chun Huang, Po-Ning Ko, Jia-Yu Huang, Yu-Lin Tsai, Jie-Kuan Li, Huei-Chun Hsiao, Yen-Tang Chang, Chia-Hung Su, J. Lin
This paper describes the utilization of ANSYS Designer with measurement validation to provide tool for analyzing, predicting and optimizing the EFT Burst transient noise suppression implementation and effectiveness to meet the requirement of IEC61000-4-4 [1] (EFT/B). In addition, the paper describes how electromagnetic simulations can provide chip-level immunity analysis for IEC 62215-3 [2]. The analysis of residual transient noise energy from transient noise suppressing devices can also provide significant benefits to EMS protection from chip, module, and all the way to board and system level. This study intends to provide an efficient simulation model to help electronic engineers enhancing their product design reliability.
{"title":"EFT Transient Noise Model and Protection Analysis from Chip to System Level on Power Distribution","authors":"Han-Nien Lin, Tzu-Hao Ho, Yu-Chun Huang, Po-Ning Ko, Jia-Yu Huang, Yu-Lin Tsai, Jie-Kuan Li, Huei-Chun Hsiao, Yen-Tang Chang, Chia-Hung Su, J. Lin","doi":"10.1109/EMCEUROPE48519.2020.9245631","DOIUrl":"https://doi.org/10.1109/EMCEUROPE48519.2020.9245631","url":null,"abstract":"This paper describes the utilization of ANSYS Designer with measurement validation to provide tool for analyzing, predicting and optimizing the EFT Burst transient noise suppression implementation and effectiveness to meet the requirement of IEC61000-4-4 [1] (EFT/B). In addition, the paper describes how electromagnetic simulations can provide chip-level immunity analysis for IEC 62215-3 [2]. The analysis of residual transient noise energy from transient noise suppressing devices can also provide significant benefits to EMS protection from chip, module, and all the way to board and system level. This study intends to provide an efficient simulation model to help electronic engineers enhancing their product design reliability.","PeriodicalId":332251,"journal":{"name":"2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132150588","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-09-23DOI: 10.1109/EMCEUROPE48519.2020.9245646
V. Karakaşlı, Qiwei Ye, G. Griepentrog, Junsheng Wei
In some of the adjustable speed drive (ASD) common-mode (CM) prediction models, the high-frequency (HF) motor model needs additional features, for instance, the mutual inductance between phases and the symmetry of single-phase concerning the beginning and ending points. In this paper, a universal HF delta- and star-connected three-phase motor model is presented. The three-phase HF motor model is acquired from CM and differential mode (DM) equivalent circuits, which are extracted from CM and DM measurements of the motor. The obtained three-phase HF induction motor model can be connected as a star and delta configuration in the simulation. The proposed model allows identification with good accuracy up to 200MHz. The method is verified with two induction machines, which have 3kW and 11kW rated powers.
{"title":"A Parameterization of 6-Port High-Frequency Delta- and Star-Connected Induction Motor Model","authors":"V. Karakaşlı, Qiwei Ye, G. Griepentrog, Junsheng Wei","doi":"10.1109/EMCEUROPE48519.2020.9245646","DOIUrl":"https://doi.org/10.1109/EMCEUROPE48519.2020.9245646","url":null,"abstract":"In some of the adjustable speed drive (ASD) common-mode (CM) prediction models, the high-frequency (HF) motor model needs additional features, for instance, the mutual inductance between phases and the symmetry of single-phase concerning the beginning and ending points. In this paper, a universal HF delta- and star-connected three-phase motor model is presented. The three-phase HF motor model is acquired from CM and differential mode (DM) equivalent circuits, which are extracted from CM and DM measurements of the motor. The obtained three-phase HF induction motor model can be connected as a star and delta configuration in the simulation. The proposed model allows identification with good accuracy up to 200MHz. The method is verified with two induction machines, which have 3kW and 11kW rated powers.","PeriodicalId":332251,"journal":{"name":"2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE","volume":"14 3","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132154762","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-09-23DOI: 10.1109/EMCEUROPE48519.2020.9245875
Akihito Kobayashi, T. Owada, C. Miyazaki
This paper describes a new inductance cancellation scheme, named Bilateral Magnetic Coupling (BMC), for performance improvement of surface mount shunt capacitor filters on a PCB. A filter structure to which the BMC is applied is designed to place input/output paths parallel to the shunt path from a power supply line to a ground plane. Magnetic couplings between the input/output paths and the shunt path are utilized to reduce parasitic inductance of the shunt path. To clarify effectiveness of the BMC in actual use conditions, filters are implemented to an IC Power Supply Line on a PCB under operating conditions. As a result, the BMC scheme improves filter performance by 7.4 dB in the wide frequency band, and reduces voltage fluctuation by 37%.
{"title":"Evaluation of Surface Mount Shunt Capacitor Filters Using Bilateral Magnetic Coupling Implemented to IC Power Supply Line on PCB","authors":"Akihito Kobayashi, T. Owada, C. Miyazaki","doi":"10.1109/EMCEUROPE48519.2020.9245875","DOIUrl":"https://doi.org/10.1109/EMCEUROPE48519.2020.9245875","url":null,"abstract":"This paper describes a new inductance cancellation scheme, named Bilateral Magnetic Coupling (BMC), for performance improvement of surface mount shunt capacitor filters on a PCB. A filter structure to which the BMC is applied is designed to place input/output paths parallel to the shunt path from a power supply line to a ground plane. Magnetic couplings between the input/output paths and the shunt path are utilized to reduce parasitic inductance of the shunt path. To clarify effectiveness of the BMC in actual use conditions, filters are implemented to an IC Power Supply Line on a PCB under operating conditions. As a result, the BMC scheme improves filter performance by 7.4 dB in the wide frequency band, and reduces voltage fluctuation by 37%.","PeriodicalId":332251,"journal":{"name":"2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE","volume":"96 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132256578","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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