首页 > 最新文献

2022 IEEE European Test Symposium (ETS)最新文献

英文 中文
Impact of Atmospheric and Space Radiation on Sensitive Electronic Devices 大气和空间辐射对敏感电子设备的影响
Pub Date : 2022-05-23 DOI: 10.1109/ETS54262.2022.9810454
Lucas Matana Luza, F. Wrobel, L. Entrena, L. Dilillo
Studying the radiation effects on electronic devices is essential for avionics and space systems. The shrinking technology nodes and increasing density of devices enhance the sensitivity of electronic systems to ionizing radiation. Due to their crucial role, memories and processors are the highest contributors to soft errors in systems, making them the best candidates for studying these effects. This work introduces the radiation environment in space and atmosphere and the main effects that the different types of ionizing particles that are present in these environments may produce on electronic devices. Furthermore, mainly focusing on Single-Event Effects (SEEs), it presents approaches and tools for modeling SEEs and their impact on memories and microprocessors. Additionally, experimental results targeting a Commercial-Off-The-Shelf self-refresh Dynamic RAM are presented. These experiments are based on radiation test campaigns in particle accelerators with neutrons and protons. Finally, an overview of issues and mitigation techniques for microprocessors is exposed.
研究辐射对电子设备的影响对航空电子和空间系统至关重要。技术节点的缩小和器件密度的增加提高了电子系统对电离辐射的敏感性。由于它们的关键作用,存储器和处理器是系统中软错误的最大贡献者,使它们成为研究这些影响的最佳候选者。本文介绍了空间和大气中的辐射环境,以及这些环境中存在的不同类型的电离粒子可能对电子设备产生的主要影响。此外,主要关注单事件效应(SEEs),它提出了建模see及其对存储器和微处理器的影响的方法和工具。此外,还介绍了针对商用现货自刷新动态RAM的实验结果。这些实验是基于中子和质子粒子加速器的辐射测试活动。最后,概述了微处理器的问题和缓解技术。
{"title":"Impact of Atmospheric and Space Radiation on Sensitive Electronic Devices","authors":"Lucas Matana Luza, F. Wrobel, L. Entrena, L. Dilillo","doi":"10.1109/ETS54262.2022.9810454","DOIUrl":"https://doi.org/10.1109/ETS54262.2022.9810454","url":null,"abstract":"Studying the radiation effects on electronic devices is essential for avionics and space systems. The shrinking technology nodes and increasing density of devices enhance the sensitivity of electronic systems to ionizing radiation. Due to their crucial role, memories and processors are the highest contributors to soft errors in systems, making them the best candidates for studying these effects. This work introduces the radiation environment in space and atmosphere and the main effects that the different types of ionizing particles that are present in these environments may produce on electronic devices. Furthermore, mainly focusing on Single-Event Effects (SEEs), it presents approaches and tools for modeling SEEs and their impact on memories and microprocessors. Additionally, experimental results targeting a Commercial-Off-The-Shelf self-refresh Dynamic RAM are presented. These experiments are based on radiation test campaigns in particle accelerators with neutrons and protons. Finally, an overview of issues and mitigation techniques for microprocessors is exposed.","PeriodicalId":334931,"journal":{"name":"2022 IEEE European Test Symposium (ETS)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121607908","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Enabling Coverage-Based Verification in Chisel 在Chisel中启用基于覆盖率的验证
Pub Date : 2022-05-23 DOI: 10.1109/ETS54262.2022.9810435
Andrew Dobis, Hans Jakob Damsgaard, Enrico Tolotto, K. Hesse, Tjark Petersen, Martin Schoeberl
Ever-increasing performance demands are pushing hardware designers towards designing domain-specific accelerators. This has created a demand for improving the overall efficiency of the hardware design and verification cycles. The design efficiency was improved with the introduction of Chisel. However, verification efficiency has yet to be tackled. One method that can increase verification efficiency is the use of various types of coverage measures. In this paper, we present our open-source, coverage-related verification tools targeting digital designs described in Chisel. Specifically, we have created a new method allowing for statement coverage at an intermediate representation of Chisel, and several methods for gathering functional coverage directly on a Chisel description.
不断增长的性能需求正在推动硬件设计人员设计特定领域的加速器。这就产生了提高硬件设计和验证周期的整体效率的需求。凿子的引入提高了设计效率。然而,核查效率问题尚未得到解决。可以提高验证效率的一种方法是使用各种类型的覆盖度量。在本文中,我们提出了我们的开源,覆盖相关的验证工具,针对凿子中描述的数字设计。具体来说,我们已经创建了一个新方法,允许在Chisel的中间表示上覆盖语句,以及几个直接在Chisel描述上收集功能覆盖的方法。
{"title":"Enabling Coverage-Based Verification in Chisel","authors":"Andrew Dobis, Hans Jakob Damsgaard, Enrico Tolotto, K. Hesse, Tjark Petersen, Martin Schoeberl","doi":"10.1109/ETS54262.2022.9810435","DOIUrl":"https://doi.org/10.1109/ETS54262.2022.9810435","url":null,"abstract":"Ever-increasing performance demands are pushing hardware designers towards designing domain-specific accelerators. This has created a demand for improving the overall efficiency of the hardware design and verification cycles. The design efficiency was improved with the introduction of Chisel. However, verification efficiency has yet to be tackled. One method that can increase verification efficiency is the use of various types of coverage measures. In this paper, we present our open-source, coverage-related verification tools targeting digital designs described in Chisel. Specifically, we have created a new method allowing for statement coverage at an intermediate representation of Chisel, and several methods for gathering functional coverage directly on a Chisel description.","PeriodicalId":334931,"journal":{"name":"2022 IEEE European Test Symposium (ETS)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121738274","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Test, Reliability and Functional Safety Trends for Automotive System-on-Chip 汽车片上系统的测试、可靠性和功能安全趋势
Pub Date : 2022-05-23 DOI: 10.1109/ETS54262.2022.9810388
F. Angione, D. Appello, J. Aribido, J. Athavale, N. Bellarmino, P. Bernardi, R. Cantoro, C. De Sio, T. Foscale, G. Gavarini, J. Guerrero, M. Huch, G. Iaria, T. Kilian, R. Mariani, R. Martone, A. Ruospo, E. Sanchez, Ulf Schlichtmann, Giovanni Squillero, M. Reorda, L. Sterpone, V. Tancorre, R. Ugioli
This paper encompasses three contributions by industry professionals and university researchers. The contributions describe different trends in automotive products, including both manufacturing test and run-time reliability strategies. The subjects considered in this session deal with critical factors, from optimizing the final test before shipment to market to in-field reliability during operative life.
这篇论文包含了行业专业人士和大学研究人员的三个贡献。这些文章描述了汽车产品的不同趋势,包括制造测试和运行时可靠性策略。本次会议考虑的主题涉及关键因素,从出货前的最终测试优化到使用寿命期间的现场可靠性。
{"title":"Test, Reliability and Functional Safety Trends for Automotive System-on-Chip","authors":"F. Angione, D. Appello, J. Aribido, J. Athavale, N. Bellarmino, P. Bernardi, R. Cantoro, C. De Sio, T. Foscale, G. Gavarini, J. Guerrero, M. Huch, G. Iaria, T. Kilian, R. Mariani, R. Martone, A. Ruospo, E. Sanchez, Ulf Schlichtmann, Giovanni Squillero, M. Reorda, L. Sterpone, V. Tancorre, R. Ugioli","doi":"10.1109/ETS54262.2022.9810388","DOIUrl":"https://doi.org/10.1109/ETS54262.2022.9810388","url":null,"abstract":"This paper encompasses three contributions by industry professionals and university researchers. The contributions describe different trends in automotive products, including both manufacturing test and run-time reliability strategies. The subjects considered in this session deal with critical factors, from optimizing the final test before shipment to market to in-field reliability during operative life.","PeriodicalId":334931,"journal":{"name":"2022 IEEE European Test Symposium (ETS)","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116889738","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
ETS 2022 Panel Discussion ETS 2022小组讨论
Pub Date : 2022-05-23 DOI: 10.1109/ets54262.2022.9810365
{"title":"ETS 2022 Panel Discussion","authors":"","doi":"10.1109/ets54262.2022.9810365","DOIUrl":"https://doi.org/10.1109/ets54262.2022.9810365","url":null,"abstract":"","PeriodicalId":334931,"journal":{"name":"2022 IEEE European Test Symposium (ETS)","volume":"60 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123041380","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Evaluating Security of New Locking SIB-based Architectures 评估新的基于sib的锁定体系结构的安全性
Pub Date : 2022-05-23 DOI: 10.1109/ETS54262.2022.9810460
Yogendra Sao, Anjum Riaz, Satyadev Ahlawat, Subidh Ali
The IEEE Std 1687 (IJT AG) provides enhanced access to the on-chip test instruments, which are included on the chip for test, post-silicon debug, in field maintenance, and diagnosis purposes. Although the on-chip instruments access provides data and features explicitly for test and debug, these features are misused by the malicious user to access sensitive data such as encryption keys, Chip-IDs, etc. Hence, it is desired to limit the access to sensitive on-chip instruments via IJT AG network. One of the various schemes proposed to mitigate the vulnerability of the IJT AG network is to use a secure access protocol, which is based on LSIB, Chip-ID, and licensed access software.In this paper, the detailed security analysis is performed on IJT AG, it is shown that the secure access protocol technique is vulnerable to differential analysis attack. It can be used to break the secure communication between the board and the licensed access software and thus, the sensitive on-chip test instruments can be accessed illegitimately. It is shown that our proposed algorithm can recover the template used for secure communication within a fraction of a second.
IEEE标准1687 (IJT AG)提供了对片上测试仪器的增强访问,这些仪器包含在芯片上,用于测试,硅后调试,现场维护和诊断目的。尽管片上仪器访问明确地为测试和调试提供了数据和功能,但恶意用户会滥用这些功能来访问敏感数据,如加密密钥、芯片id等。因此,希望通过IJT AG网络限制对敏感片上仪器的访问。为了减轻IJT AG网络的脆弱性,提出的各种方案之一是使用基于LSIB、Chip-ID和许可访问软件的安全访问协议。本文对IJT AG进行了详细的安全分析,表明安全访问协议技术容易受到差分分析攻击。它可以破坏电路板与授权接入软件之间的安全通信,从而使敏感的片上测试仪器被非法访问。结果表明,该算法可以在几分之一秒内恢复用于安全通信的模板。
{"title":"Evaluating Security of New Locking SIB-based Architectures","authors":"Yogendra Sao, Anjum Riaz, Satyadev Ahlawat, Subidh Ali","doi":"10.1109/ETS54262.2022.9810460","DOIUrl":"https://doi.org/10.1109/ETS54262.2022.9810460","url":null,"abstract":"The IEEE Std 1687 (IJT AG) provides enhanced access to the on-chip test instruments, which are included on the chip for test, post-silicon debug, in field maintenance, and diagnosis purposes. Although the on-chip instruments access provides data and features explicitly for test and debug, these features are misused by the malicious user to access sensitive data such as encryption keys, Chip-IDs, etc. Hence, it is desired to limit the access to sensitive on-chip instruments via IJT AG network. One of the various schemes proposed to mitigate the vulnerability of the IJT AG network is to use a secure access protocol, which is based on LSIB, Chip-ID, and licensed access software.In this paper, the detailed security analysis is performed on IJT AG, it is shown that the secure access protocol technique is vulnerable to differential analysis attack. It can be used to break the secure communication between the board and the licensed access software and thus, the sensitive on-chip test instruments can be accessed illegitimately. It is shown that our proposed algorithm can recover the template used for secure communication within a fraction of a second.","PeriodicalId":334931,"journal":{"name":"2022 IEEE European Test Symposium (ETS)","volume":"112 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115857131","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
SiGe BiCMOS Technology with Advanced Integration Solutions for for mm-wave and THz Applications SiGe BiCMOS技术与先进的集成解决方案,适用于毫米波和太赫兹应用
Pub Date : 2022-05-23 DOI: 10.1109/ets54262.2022.9810371
{"title":"SiGe BiCMOS Technology with Advanced Integration Solutions for for mm-wave and THz Applications","authors":"","doi":"10.1109/ets54262.2022.9810371","DOIUrl":"https://doi.org/10.1109/ets54262.2022.9810371","url":null,"abstract":"","PeriodicalId":334931,"journal":{"name":"2022 IEEE European Test Symposium (ETS)","volume":"53 2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130299899","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Novel Design For Test (DFT) Concept to Check the Spectral Mask Compliance Defined in the IEEE Std. 802.15.6-2012 of Wireless-Body-Area-Network (WBAN) IC-Devices 基于新型测试设计(DFT)概念的无线体域网络(WBAN)集成设备频谱掩码符合性检验(IEEE标准802.15.6-2012
Pub Date : 2022-05-23 DOI: 10.1109/ETS54262.2022.9810455
A. Oleszczuk, Mohamed Thouabtia, Martin Allinger, Jürgen Röber, R. Weigel
In this paper, we introduce a novel design for test (DFT) concept to check the compliance of wireless-body-area-network devices for medical applications with the spectral mask for IR-UWB and FM-UWB defined in chapter 9.13 of the IEEE Std. 802.15.6-2012. The design enables a fast and repeatable IC-production test solution for medium to high volume testing, which is independent of the tester type and does not need any extra circuitry on a test board / device interface board.
在本文中,我们引入了一种新的测试设计(DFT)概念,以检查医疗应用的无线体域网络设备是否符合IEEE标准802.15.6-2012第9.13章中定义的IR-UWB和FM-UWB的频谱掩码。该设计为中大批量测试提供了快速、可重复的ic生产测试解决方案,与测试仪类型无关,不需要在测试板/设备接口板上安装任何额外的电路。
{"title":"Novel Design For Test (DFT) Concept to Check the Spectral Mask Compliance Defined in the IEEE Std. 802.15.6-2012 of Wireless-Body-Area-Network (WBAN) IC-Devices","authors":"A. Oleszczuk, Mohamed Thouabtia, Martin Allinger, Jürgen Röber, R. Weigel","doi":"10.1109/ETS54262.2022.9810455","DOIUrl":"https://doi.org/10.1109/ETS54262.2022.9810455","url":null,"abstract":"In this paper, we introduce a novel design for test (DFT) concept to check the compliance of wireless-body-area-network devices for medical applications with the spectral mask for IR-UWB and FM-UWB defined in chapter 9.13 of the IEEE Std. 802.15.6-2012. The design enables a fast and repeatable IC-production test solution for medium to high volume testing, which is independent of the tester type and does not need any extra circuitry on a test board / device interface board.","PeriodicalId":334931,"journal":{"name":"2022 IEEE European Test Symposium (ETS)","volume":"53 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129917124","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
ETS 2022 Blank Page ETS 2022空白页
Pub Date : 2022-05-23 DOI: 10.1109/ets54262.2022.9810359
{"title":"ETS 2022 Blank Page","authors":"","doi":"10.1109/ets54262.2022.9810359","DOIUrl":"https://doi.org/10.1109/ets54262.2022.9810359","url":null,"abstract":"","PeriodicalId":334931,"journal":{"name":"2022 IEEE European Test Symposium (ETS)","volume":"159 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123167302","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Novel Collaborative SSD Test Case Clustering Method Associating I/O Workload and Function Coverage 一种将I/O工作负载与功能覆盖相关联的新型协作SSD测试用例聚类方法
Pub Date : 2022-05-23 DOI: 10.1109/ETS54262.2022.9810424
Gyohun Jeong, Sangmin Kim, Hye-Rin Kim, S. Lee
In this paper, we propose a TC clustering method that simultaneously considers two data groups: the I/O workload and the function coverage for a higher level of firmware testing. Subsequently, we introduce an application model that predicts the function coverage using only the I/O workload of the TCs from the above method.
在本文中,我们提出了一种TC聚类方法,该方法同时考虑两个数据组:I/O工作负载和用于更高级别固件测试的功能覆盖。随后,我们引入一个应用程序模型,该模型仅使用上述方法中tc的I/O工作负载来预测功能覆盖率。
{"title":"A Novel Collaborative SSD Test Case Clustering Method Associating I/O Workload and Function Coverage","authors":"Gyohun Jeong, Sangmin Kim, Hye-Rin Kim, S. Lee","doi":"10.1109/ETS54262.2022.9810424","DOIUrl":"https://doi.org/10.1109/ETS54262.2022.9810424","url":null,"abstract":"In this paper, we propose a TC clustering method that simultaneously considers two data groups: the I/O workload and the function coverage for a higher level of firmware testing. Subsequently, we introduce an application model that predicts the function coverage using only the I/O workload of the TCs from the above method.","PeriodicalId":334931,"journal":{"name":"2022 IEEE European Test Symposium (ETS)","volume":"379 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124729969","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
On-Line Reliability Estimation of Ring Oscillator PUF 环形振荡器PUF在线可靠性评估
Pub Date : 2022-05-23 DOI: 10.1109/ETS54262.2022.9810418
Sergio Vinagrero Gutierrez, G. D. Natale, E. Vatajelu
In this paper we propose an on-line test methodology for RO-PUF reliability which enables high accuracy in the results since it is not based on predictive simplified models of the device variability and noise, but on actual technological electrical models and high versatility since it is not based on measurements extracted from a single technology.
在本文中,我们提出了一种RO-PUF可靠性的在线测试方法,该方法使结果具有高精度,因为它不是基于设备可变性和噪声的预测简化模型,而是基于实际的技术电气模型和高通用性,因为它不是基于从单一技术中提取的测量。
{"title":"On-Line Reliability Estimation of Ring Oscillator PUF","authors":"Sergio Vinagrero Gutierrez, G. D. Natale, E. Vatajelu","doi":"10.1109/ETS54262.2022.9810418","DOIUrl":"https://doi.org/10.1109/ETS54262.2022.9810418","url":null,"abstract":"In this paper we propose an on-line test methodology for RO-PUF reliability which enables high accuracy in the results since it is not based on predictive simplified models of the device variability and noise, but on actual technological electrical models and high versatility since it is not based on measurements extracted from a single technology.","PeriodicalId":334931,"journal":{"name":"2022 IEEE European Test Symposium (ETS)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123823998","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
期刊
2022 IEEE European Test Symposium (ETS)
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1