Pub Date : 2000-10-22DOI: 10.1109/ULTSYM.2000.921533
Ching-Hsiang Cheng, E. Chow, Xuecheng Jin, S. Ergun, B. Khuri-Yakub
This paper presents a technology for high density and low parasitic capacitance electrical interconnects to arrays of Capacitive Micromachined Ultrasonic Transducers (CMUTs) on a silicon chip. Vertical wafer feedthroughs (vias) connect an array of sensors or actuators from the front side (transducer side) to the backside (packaging side) of the chip. A 20 to 1 high aspect ratio 20 /spl mu/m diameter via is achieved by using Deep Reactive Ion Etching (DRIE). Reduction of the parasitic capacitance of the polysilicon pads to the substrate can be achieved by using Metal Insulator Semiconductor (MIS) operating in the depletion region. This three-dimensional architecture allows for elegant packaging through simple flip-chip bonding of the chip's back side to a printed circuit board (PCB) or a signal processing chip.
{"title":"An efficient electrical addressing method using through-wafer vias for two-dimensional ultrasonic arrays","authors":"Ching-Hsiang Cheng, E. Chow, Xuecheng Jin, S. Ergun, B. Khuri-Yakub","doi":"10.1109/ULTSYM.2000.921533","DOIUrl":"https://doi.org/10.1109/ULTSYM.2000.921533","url":null,"abstract":"This paper presents a technology for high density and low parasitic capacitance electrical interconnects to arrays of Capacitive Micromachined Ultrasonic Transducers (CMUTs) on a silicon chip. Vertical wafer feedthroughs (vias) connect an array of sensors or actuators from the front side (transducer side) to the backside (packaging side) of the chip. A 20 to 1 high aspect ratio 20 /spl mu/m diameter via is achieved by using Deep Reactive Ion Etching (DRIE). Reduction of the parasitic capacitance of the polysilicon pads to the substrate can be achieved by using Metal Insulator Semiconductor (MIS) operating in the depletion region. This three-dimensional architecture allows for elegant packaging through simple flip-chip bonding of the chip's back side to a printed circuit board (PCB) or a signal processing chip.","PeriodicalId":350384,"journal":{"name":"2000 IEEE Ultrasonics Symposium. Proceedings. An International Symposium (Cat. No.00CH37121)","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-10-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124432088","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-10-22DOI: 10.1109/ULTSYM.2000.921530
C. Oakley, M. Zipparo
Lead-based single crystal relaxor ferroelectrics have been developed with fundamental properties that in theory should dramatically enhance the bandwidth and sensitivity-bandwidth product for ultrasound transducers. High sensitivity array elements with fractional bandwidths of over 120% have been modeled using the properties measured for single crystal resonators. Single element transducers and arrays have been built with performance that is significantly better than that for arrays built with PZT ceramic. Not all of the properties are better than PZT. The crystals usually have a low coercive field and can be depoled at relatively low temperatures. Also, there are significant challenges to using the materials effectively. These include: learning to repeatably grow large crystals with uniform properties, reducing crystal cost, improving adhesion to single crystals, and developing array processes that create the small resonators required without damaging them. This paper reviews the unique features of single crystals and reports that all of the obstacles except for cost effective growth of high quality crystals have been effectively addressed. We argue that single crystals will displace ceramics for high performance array applications. The critical questions are: when, at what development cost, to what array cost, and to what level of array performance.
{"title":"Single crystal piezoelectrics: a revolutionary development for transducers","authors":"C. Oakley, M. Zipparo","doi":"10.1109/ULTSYM.2000.921530","DOIUrl":"https://doi.org/10.1109/ULTSYM.2000.921530","url":null,"abstract":"Lead-based single crystal relaxor ferroelectrics have been developed with fundamental properties that in theory should dramatically enhance the bandwidth and sensitivity-bandwidth product for ultrasound transducers. High sensitivity array elements with fractional bandwidths of over 120% have been modeled using the properties measured for single crystal resonators. Single element transducers and arrays have been built with performance that is significantly better than that for arrays built with PZT ceramic. Not all of the properties are better than PZT. The crystals usually have a low coercive field and can be depoled at relatively low temperatures. Also, there are significant challenges to using the materials effectively. These include: learning to repeatably grow large crystals with uniform properties, reducing crystal cost, improving adhesion to single crystals, and developing array processes that create the small resonators required without damaging them. This paper reviews the unique features of single crystals and reports that all of the obstacles except for cost effective growth of high quality crystals have been effectively addressed. We argue that single crystals will displace ceramics for high performance array applications. The critical questions are: when, at what development cost, to what array cost, and to what level of array performance.","PeriodicalId":350384,"journal":{"name":"2000 IEEE Ultrasonics Symposium. Proceedings. An International Symposium (Cat. No.00CH37121)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-10-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124548408","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-10-22DOI: 10.1109/ULTSYM.2000.921536
N. Felix, D. Certon, L. Ratsimandresy, M. Lethiecq, F. Patat
Nowadays, ultrasound medical imaging is more and more demanding with respect to transducer performance evaluation and optimization. Conventional tools and setups are limited in the complete evaluation and characterization of ultrasound imaging transducer, for example in the analysis of cross coupling (radiating and nonradiating). A vibration measurement method for ultrasonic array transducer using laser interferometry is presented. This method allows array designers to perfectly characterize the acoustic transducer, and contributes to the advanced optimization of bandwidth, cross coupling and sensitivity of ultrasound imaging array transducers.
{"title":"1D ultrasound array: performance evaluation and characterization by laser interferometry","authors":"N. Felix, D. Certon, L. Ratsimandresy, M. Lethiecq, F. Patat","doi":"10.1109/ULTSYM.2000.921536","DOIUrl":"https://doi.org/10.1109/ULTSYM.2000.921536","url":null,"abstract":"Nowadays, ultrasound medical imaging is more and more demanding with respect to transducer performance evaluation and optimization. Conventional tools and setups are limited in the complete evaluation and characterization of ultrasound imaging transducer, for example in the analysis of cross coupling (radiating and nonradiating). A vibration measurement method for ultrasonic array transducer using laser interferometry is presented. This method allows array designers to perfectly characterize the acoustic transducer, and contributes to the advanced optimization of bandwidth, cross coupling and sensitivity of ultrasound imaging array transducers.","PeriodicalId":350384,"journal":{"name":"2000 IEEE Ultrasonics Symposium. Proceedings. An International Symposium (Cat. No.00CH37121)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-10-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114425375","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-10-22DOI: 10.1109/ULTSYM.2000.921639
K. W. Rigby, C. Chalek, B. Haider, R. Lewandowski, M. O’Donnell, L. Smith, D. Wildes
The speed of sound varies with tissue type, yet commercial ultrasound imagers assume it is constant. Sound speed variation in abdominal fat and muscle layers is widely believed to be largely responsible for poor image contrast and resolution in some patients. The simplest model of the abdominal wall assumes that it adds a spatially varying time delay to the ultrasound wavefront. We describe an adaptive imaging system consisting of a GE LOGIQ 700 imager connected to a multi-processor computer. Arrival time errors for each beamforming channel, estimated by correlating each channel signal with the beamsum signal, are used to correct the imager's transmit and receive beamforming time delays at the image frame rate. A multi-row transducer provides two dimensional sampling of wavefront arrival time errors. After beamforming time delay correction, we observe significant improvement in abdominal images of healthy male volunteers, including increased contrast of blood vessels, increased brightness of liver tissue, and improved definition of the renal capsule and splenic boundary.
{"title":"Improved in vivo abdominal image quality using real-time estimation and correction of wavefront arrival time errors","authors":"K. W. Rigby, C. Chalek, B. Haider, R. Lewandowski, M. O’Donnell, L. Smith, D. Wildes","doi":"10.1109/ULTSYM.2000.921639","DOIUrl":"https://doi.org/10.1109/ULTSYM.2000.921639","url":null,"abstract":"The speed of sound varies with tissue type, yet commercial ultrasound imagers assume it is constant. Sound speed variation in abdominal fat and muscle layers is widely believed to be largely responsible for poor image contrast and resolution in some patients. The simplest model of the abdominal wall assumes that it adds a spatially varying time delay to the ultrasound wavefront. We describe an adaptive imaging system consisting of a GE LOGIQ 700 imager connected to a multi-processor computer. Arrival time errors for each beamforming channel, estimated by correlating each channel signal with the beamsum signal, are used to correct the imager's transmit and receive beamforming time delays at the image frame rate. A multi-row transducer provides two dimensional sampling of wavefront arrival time errors. After beamforming time delay correction, we observe significant improvement in abdominal images of healthy male volunteers, including increased contrast of blood vessels, increased brightness of liver tissue, and improved definition of the renal capsule and splenic boundary.","PeriodicalId":350384,"journal":{"name":"2000 IEEE Ultrasonics Symposium. Proceedings. An International Symposium (Cat. No.00CH37121)","volume":"2015 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-10-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114730470","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-10-22DOI: 10.1109/ULTSYM.2000.922533
H. Yatsuda
The purpose of this paper is to describe diffraction effects on slanted finger interdigital transducers (SFITs). In order to analyze the diffraction effects, two methods to calculate SAW amplitude profiles radiated from an SFIT are presented. One is to calculate the electric power of the acoustic ports in the Smith's equivalent circuit for the sub-filters with different center frequencies, which were obtained by dividing SFITs into some channels. The other is to calculate the SAW intensity at an observation point using an angular spectrum method. The frequency responses of the SFIT filter with a center frequency of 40 MHz and a bandwidth of 6 MHz are calculated using the angular spectrum method. Good agreements between theoretical and experimental results are obtained.
{"title":"Diffraction in slanted finger SAW filters","authors":"H. Yatsuda","doi":"10.1109/ULTSYM.2000.922533","DOIUrl":"https://doi.org/10.1109/ULTSYM.2000.922533","url":null,"abstract":"The purpose of this paper is to describe diffraction effects on slanted finger interdigital transducers (SFITs). In order to analyze the diffraction effects, two methods to calculate SAW amplitude profiles radiated from an SFIT are presented. One is to calculate the electric power of the acoustic ports in the Smith's equivalent circuit for the sub-filters with different center frequencies, which were obtained by dividing SFITs into some channels. The other is to calculate the SAW intensity at an observation point using an angular spectrum method. The frequency responses of the SFIT filter with a center frequency of 40 MHz and a bandwidth of 6 MHz are calculated using the angular spectrum method. Good agreements between theoretical and experimental results are obtained.","PeriodicalId":350384,"journal":{"name":"2000 IEEE Ultrasonics Symposium. Proceedings. An International Symposium (Cat. No.00CH37121)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-10-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116920482","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-10-22DOI: 10.1109/ULTSYM.2000.922586
C. Zhang, J. Vetelino
A variety of quartz thickness shear mode (TSM) resonant sensors with different electrode configurations have been designed, fabricated and tested in liquids for probing the electrical property changes. The resonance frequency of the sensors was found to have more than an order of magnitude increase in sensitivity over the standard AT cut quartz resonant sensor. The increase in sensitivity is due to the ability of the sensors to detect changes in the electrical properties in the liquid.
{"title":"Novel electrode configurations of bulk acoustic wave resonators for liquid sensing applications","authors":"C. Zhang, J. Vetelino","doi":"10.1109/ULTSYM.2000.922586","DOIUrl":"https://doi.org/10.1109/ULTSYM.2000.922586","url":null,"abstract":"A variety of quartz thickness shear mode (TSM) resonant sensors with different electrode configurations have been designed, fabricated and tested in liquids for probing the electrical property changes. The resonance frequency of the sensors was found to have more than an order of magnitude increase in sensitivity over the standard AT cut quartz resonant sensor. The increase in sensitivity is due to the ability of the sensors to detect changes in the electrical properties in the liquid.","PeriodicalId":350384,"journal":{"name":"2000 IEEE Ultrasonics Symposium. Proceedings. An International Symposium (Cat. No.00CH37121)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-10-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117159229","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-10-22DOI: 10.1109/ULTSYM.2000.922601
J. K. Poulsen, E. Chérin, T. van der Steen, F. Foster
A series of field experiments has been conducted in order to characterize the ultrasonic field produced by a high frequency PVDF transducer. Field measurements using a small spot size hydrophone shows a linear amplitude increase of the second harmonic pressure from a planar transducer due to nonlinear propagation of acoustic waves in water. Strong evidence is given, that the second harmonic component is produced almost entirely by wave propagation in the medium and not by nonlinearities of the transducer. Furthermore, field measurements using a focused transducer and 20 MHz transmit frequency shows the generation of pressure peaks of the second harmonic at places where there are zeros of the fundamental component.
{"title":"Origin of second harmonic component from high frequency ultrasound","authors":"J. K. Poulsen, E. Chérin, T. van der Steen, F. Foster","doi":"10.1109/ULTSYM.2000.922601","DOIUrl":"https://doi.org/10.1109/ULTSYM.2000.922601","url":null,"abstract":"A series of field experiments has been conducted in order to characterize the ultrasonic field produced by a high frequency PVDF transducer. Field measurements using a small spot size hydrophone shows a linear amplitude increase of the second harmonic pressure from a planar transducer due to nonlinear propagation of acoustic waves in water. Strong evidence is given, that the second harmonic component is produced almost entirely by wave propagation in the medium and not by nonlinearities of the transducer. Furthermore, field measurements using a focused transducer and 20 MHz transmit frequency shows the generation of pressure peaks of the second harmonic at places where there are zeros of the fundamental component.","PeriodicalId":350384,"journal":{"name":"2000 IEEE Ultrasonics Symposium. Proceedings. An International Symposium (Cat. No.00CH37121)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-10-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117340131","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-10-22DOI: 10.1109/ULTSYM.2000.921631
K. Ranganathan, W. Walker
The Translating Apertures Algorithm (TAA) is a novel method for imaging angular scatter. This paper presents analysis of the TAA using k-space theory, and simulations performed using a simulation tool, PSF. The effective depth of field of the TAA is calculated by analyzing the correlation coefficients between the two acquisition aperture geometries. A correction method is proposed to correct for phase differences in the different system geometries involved, and various commonly used aperture configurations are analyzed for their effect on the TAA.
{"title":"Analysis of C- and D-weighted imaging using the translating apertures algorithm","authors":"K. Ranganathan, W. Walker","doi":"10.1109/ULTSYM.2000.921631","DOIUrl":"https://doi.org/10.1109/ULTSYM.2000.921631","url":null,"abstract":"The Translating Apertures Algorithm (TAA) is a novel method for imaging angular scatter. This paper presents analysis of the TAA using k-space theory, and simulations performed using a simulation tool, PSF. The effective depth of field of the TAA is calculated by analyzing the correlation coefficients between the two acquisition aperture geometries. A correction method is proposed to correct for phase differences in the different system geometries involved, and various commonly used aperture configurations are analyzed for their effect on the TAA.","PeriodicalId":350384,"journal":{"name":"2000 IEEE Ultrasonics Symposium. Proceedings. An International Symposium (Cat. No.00CH37121)","volume":"126 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-10-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116348185","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-10-22DOI: 10.1109/ULTSYM.2000.922658
M. Schafer
Ultrasonic inspection of solid wood and lumber has been investigated for over 20 years, with limited commercial impact. Potential applications run from logs to finished boards, with the goal of either characterizing internal defects (knots, splits, rot), or assessing overall strength. This paper reviews recent efforts to apply ultrasound technology to the Forest Products industry.
{"title":"Ultrasound for defect detection and grading in wood and lumber","authors":"M. Schafer","doi":"10.1109/ULTSYM.2000.922658","DOIUrl":"https://doi.org/10.1109/ULTSYM.2000.922658","url":null,"abstract":"Ultrasonic inspection of solid wood and lumber has been investigated for over 20 years, with limited commercial impact. Potential applications run from logs to finished boards, with the goal of either characterizing internal defects (knots, splits, rot), or assessing overall strength. This paper reviews recent efforts to apply ultrasound technology to the Forest Products industry.","PeriodicalId":350384,"journal":{"name":"2000 IEEE Ultrasonics Symposium. Proceedings. An International Symposium (Cat. No.00CH37121)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-10-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116456822","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-10-22DOI: 10.1109/ULTSYM.2000.921526
S. Ballandras, P.F. Edoa, F. Langrognet, W. Steichen, G. Pierre
Calculation of mutual admittance for the estimation of cross-coupling effects is presented. Example of application is shown for a periodic test-structure which has been built using ultrasound micromachining. Comparison between experiments and theoretical predictions is reported and discussed.
{"title":"Prediction and measurement of cross-talk effects in a periodic linear array built using ultrasound micromachining","authors":"S. Ballandras, P.F. Edoa, F. Langrognet, W. Steichen, G. Pierre","doi":"10.1109/ULTSYM.2000.921526","DOIUrl":"https://doi.org/10.1109/ULTSYM.2000.921526","url":null,"abstract":"Calculation of mutual admittance for the estimation of cross-coupling effects is presented. Example of application is shown for a periodic test-structure which has been built using ultrasound micromachining. Comparison between experiments and theoretical predictions is reported and discussed.","PeriodicalId":350384,"journal":{"name":"2000 IEEE Ultrasonics Symposium. Proceedings. An International Symposium (Cat. No.00CH37121)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-10-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123544202","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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