首页 > 最新文献

Proceedings. The 16th International Conference on Microelectronics, 2004. ICM 2004.最新文献

英文 中文
MOS compact I-V modeling with variable accuracy based on genetic algorithm and simulated annealing 基于遗传算法和模拟退火的变精度MOS紧凑I-V建模
M. Taherzadeh‐Sani, A. Abbasian, B. Amelifard, A. Afzali-Kusha
In this paper, a new approach to model the I-V characteristic of MOSFETs, which considers the required accuracy of the goal model, is presented. The approach utilizes a combination of genetic algorithm and simulated annealing to determine the simplest model with a specific accuracy. While the genetic algorithm determines which terms should be used in the model, the simulated annealing determines the coefficient values related to each term in the I-V characteristic of MOSFFT model. For a desired accuracy considered here, the accuracy of the results predicted by our model are within 3.1%, for PMOS, and 1.3%, for NMOS, of the results of BSIM3v3 model with much less complexity.
本文提出了一种考虑目标模型精度要求的模拟mosfet I-V特性的新方法。该方法采用遗传算法和模拟退火相结合的方法来确定具有特定精度的最简单模型。遗传算法决定模型中应该使用哪些项,模拟退火决定MOSFFT模型中I-V特性中每个项相关的系数值。对于这里考虑的期望精度,我们的模型预测结果的精度在BSIM3v3模型结果的3.1%(对于PMOS)和1.3%(对于NMOS)内,并且复杂性要低得多。
{"title":"MOS compact I-V modeling with variable accuracy based on genetic algorithm and simulated annealing","authors":"M. Taherzadeh‐Sani, A. Abbasian, B. Amelifard, A. Afzali-Kusha","doi":"10.1109/ICM.2004.1434588","DOIUrl":"https://doi.org/10.1109/ICM.2004.1434588","url":null,"abstract":"In this paper, a new approach to model the I-V characteristic of MOSFETs, which considers the required accuracy of the goal model, is presented. The approach utilizes a combination of genetic algorithm and simulated annealing to determine the simplest model with a specific accuracy. While the genetic algorithm determines which terms should be used in the model, the simulated annealing determines the coefficient values related to each term in the I-V characteristic of MOSFFT model. For a desired accuracy considered here, the accuracy of the results predicted by our model are within 3.1%, for PMOS, and 1.3%, for NMOS, of the results of BSIM3v3 model with much less complexity.","PeriodicalId":359193,"journal":{"name":"Proceedings. The 16th International Conference on Microelectronics, 2004. ICM 2004.","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-12-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116640738","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Efficient analysis of the far field pattern of rectangular microstrip patch using the stationary phase method 用固定相位法分析矩形微带贴片的远场方向图
T. Fortaki, A. Benghalia
In this work, the influence of uniaxial anisotropy in the substrate on radiation pattern of a rectangular microstrip patch is investigated using an integral equation formulation. The proposed method for determining the Green's function leads to a concise form of this, diagonalized in the (TM,TE) representation. The stationary phase method is used for computing the far zone field. Numerical results for the effects of uniaxial anisotropy in the substrate on the radiation of the rectangular microstrip structure are presented. A comparison between the radiation of the first two fundamental modes TM/sub 10/ and TM/sub 01/ is also given.
本文采用积分方程的方法研究了衬底单轴各向异性对矩形微带贴片辐射方向图的影响。所提出的确定格林函数的方法导致了一个简洁的形式,在(TM,TE)表示中对角化。远区场的计算采用定相法。给出了衬底单轴各向异性对矩形微带结构辐射影响的数值结果。对TM/sub 10/和TM/sub 01/的前两个基本模的辐射进行了比较。
{"title":"Efficient analysis of the far field pattern of rectangular microstrip patch using the stationary phase method","authors":"T. Fortaki, A. Benghalia","doi":"10.1109/ICM.2004.1434266","DOIUrl":"https://doi.org/10.1109/ICM.2004.1434266","url":null,"abstract":"In this work, the influence of uniaxial anisotropy in the substrate on radiation pattern of a rectangular microstrip patch is investigated using an integral equation formulation. The proposed method for determining the Green's function leads to a concise form of this, diagonalized in the (TM,TE) representation. The stationary phase method is used for computing the far zone field. Numerical results for the effects of uniaxial anisotropy in the substrate on the radiation of the rectangular microstrip structure are presented. A comparison between the radiation of the first two fundamental modes TM/sub 10/ and TM/sub 01/ is also given.","PeriodicalId":359193,"journal":{"name":"Proceedings. The 16th International Conference on Microelectronics, 2004. ICM 2004.","volume":"53 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-12-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115192745","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
System modeling for 802.15.4 RF architectures 802.15.4射频架构的系统建模
N. Dehaese, S. Bourdel
This paper presents a simple system model for the 802.15.4 new standard dedicated to low-cost SOC-RF. Nonlinearities, receiver noise, channel imperfections, phase noise of the local oscillator (LO) are considered in this model. As we used complex envelope representation for analog part, the proposed model is efficient in terms of simulation time. Simulation results of a system described by this model are also presented.
本文提出了802.15.4低成本SOC-RF新标准的简单系统模型。该模型考虑了非线性、接收机噪声、信道缺陷、本振相位噪声等因素。由于模拟部分采用复杂包络表示,因此该模型在仿真时间上是有效的。最后给出了用该模型描述的系统的仿真结果。
{"title":"System modeling for 802.15.4 RF architectures","authors":"N. Dehaese, S. Bourdel","doi":"10.1109/ICM.2004.1434714","DOIUrl":"https://doi.org/10.1109/ICM.2004.1434714","url":null,"abstract":"This paper presents a simple system model for the 802.15.4 new standard dedicated to low-cost SOC-RF. Nonlinearities, receiver noise, channel imperfections, phase noise of the local oscillator (LO) are considered in this model. As we used complex envelope representation for analog part, the proposed model is efficient in terms of simulation time. Simulation results of a system described by this model are also presented.","PeriodicalId":359193,"journal":{"name":"Proceedings. The 16th International Conference on Microelectronics, 2004. ICM 2004.","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-12-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116212557","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Dynamic mission critical network for mobile system 移动系统的动态关键任务网络
Z. Ahmed, R. Mehboob, S. A. Khan, H. Jamal
This paper proposes a hierarchical secure mobile ad hoc network architecture with mobile backbone nodes. The two challenges addressed here are the optimum connectivity and the provision of central command and control to secure mobile ad hoc network for a survivable system in the presence of malicious nodes. A GPS aware secure mobile ad hoc network architecture is presented, where mobile backbone nodes form the clusters' center and act as an authentication authority for all the cluster nodes. The mobile backbone nodes authenticate their cluster nodes by public key infrastructure and dynamically update their positions with topological changes caused by nodes' motion, nodes' failure and nodes' insertion. The motion of cluster center provides optimal connectivity with respect to line of sight, power and SNR. The scenarios that motivate this research include military applications requiring systematic and coordinated movement of troops in battlefields.
提出了一种具有移动骨干节点的分层安全移动自组网结构。这里要解决的两个挑战是,在存在恶意节点的情况下,为可生存的系统提供最佳连接和中央命令和控制,以确保移动自组织网络的安全。提出了一种GPS感知的安全移动自组网架构,其中移动骨干节点构成集群的中心,并作为所有集群节点的认证机构。移动骨干节点通过公钥基础设施对集群节点进行身份验证,并根据节点移动、节点故障、节点插入等引起的拓扑变化动态更新节点位置。集群中心的运动在视线、功率和信噪比方面提供了最佳的连通性。激发这项研究的场景包括军事应用,需要在战场上进行系统和协调的部队运动。
{"title":"Dynamic mission critical network for mobile system","authors":"Z. Ahmed, R. Mehboob, S. A. Khan, H. Jamal","doi":"10.1109/ICM.2004.1434781","DOIUrl":"https://doi.org/10.1109/ICM.2004.1434781","url":null,"abstract":"This paper proposes a hierarchical secure mobile ad hoc network architecture with mobile backbone nodes. The two challenges addressed here are the optimum connectivity and the provision of central command and control to secure mobile ad hoc network for a survivable system in the presence of malicious nodes. A GPS aware secure mobile ad hoc network architecture is presented, where mobile backbone nodes form the clusters' center and act as an authentication authority for all the cluster nodes. The mobile backbone nodes authenticate their cluster nodes by public key infrastructure and dynamically update their positions with topological changes caused by nodes' motion, nodes' failure and nodes' insertion. The motion of cluster center provides optimal connectivity with respect to line of sight, power and SNR. The scenarios that motivate this research include military applications requiring systematic and coordinated movement of troops in battlefields.","PeriodicalId":359193,"journal":{"name":"Proceedings. The 16th International Conference on Microelectronics, 2004. ICM 2004.","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-12-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116564941","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Study of rectangular microstrip patch over ground plane with rectangular aperture in the presence of a high-permittivity dielectric layer below the aperture 研究了高介电常数介电层存在于矩形孔径地平面上的矩形微带贴片
T. Fortaki, A. Benghalia
In this communication, Galerkin's method in the Fourier transform domain is applied to the determination of the resonant frequencies of rectangular microstrip patch over ground plane with rectangular aperture when there is a high-permittivity dielectric layer below the aperture. The numerical calculations show that the results obtained for the resonant frequencies of the patches with apertures in contact with a high-permittivity dielectric layer not only substantially differ from the results without apertures, but they also appreciably differ from the results obtained with apertures in contact with air. Unlike microstrip patch resonators without apertures, the resonant frequency does not vary monotonically with increasing substrate thickness.
本文将傅里叶变换域的伽辽金方法应用于矩形孔径地平面上矩形微带贴片在孔径下存在高介电常数介电层时的谐振频率的测定。数值计算表明,有孔接触高介电常数介质层的贴片谐振频率不仅与没有孔接触的贴片有很大差异,而且与有孔接触空气的贴片的谐振频率也有很大差异。与无孔微带贴片谐振器不同,谐振频率不随衬底厚度的增加而单调变化。
{"title":"Study of rectangular microstrip patch over ground plane with rectangular aperture in the presence of a high-permittivity dielectric layer below the aperture","authors":"T. Fortaki, A. Benghalia","doi":"10.1109/ICM.2004.1434238","DOIUrl":"https://doi.org/10.1109/ICM.2004.1434238","url":null,"abstract":"In this communication, Galerkin's method in the Fourier transform domain is applied to the determination of the resonant frequencies of rectangular microstrip patch over ground plane with rectangular aperture when there is a high-permittivity dielectric layer below the aperture. The numerical calculations show that the results obtained for the resonant frequencies of the patches with apertures in contact with a high-permittivity dielectric layer not only substantially differ from the results without apertures, but they also appreciably differ from the results obtained with apertures in contact with air. Unlike microstrip patch resonators without apertures, the resonant frequency does not vary monotonically with increasing substrate thickness.","PeriodicalId":359193,"journal":{"name":"Proceedings. The 16th International Conference on Microelectronics, 2004. ICM 2004.","volume":"69 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-12-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130578165","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
STBus transaction level models using SystemC 2.0 STBus事务级模型使用SystemC 2.0
H. Boussctta, M. Abid, F. Layouni, C. Pistrito
SystemC 2.0 facilitates the development of transaction level models (TLM) that are models of the hardware system components at a high level of abstraction. System architects can quickly develop these models and be ready with an executable specification of the hardware blocks as soon as the initial functional specifications of the system are decided. In this paper, we present a SystemC 2.0 TLM of the STBus architecture developed by STMicroelectronics, oriented to SOC platform architectures, by focusing on the advantages and limits of this abstraction level. Then, we propose a solution to these limits.
SystemC 2.0促进了事务级模型(TLM)的开发,这些模型是硬件系统组件在高层次抽象上的模型。系统架构师可以快速开发这些模型,并在确定系统的初始功能规范后,立即准备好硬件块的可执行规范。本文提出了意法半导体公司开发的一种面向SOC平台架构的STBus体系结构的SystemC 2.0 TLM,着重分析了该抽象层的优点和局限性。然后,我们提出了一个解决这些限制的方法。
{"title":"STBus transaction level models using SystemC 2.0","authors":"H. Boussctta, M. Abid, F. Layouni, C. Pistrito","doi":"10.1109/ICM.2004.1434583","DOIUrl":"https://doi.org/10.1109/ICM.2004.1434583","url":null,"abstract":"SystemC 2.0 facilitates the development of transaction level models (TLM) that are models of the hardware system components at a high level of abstraction. System architects can quickly develop these models and be ready with an executable specification of the hardware blocks as soon as the initial functional specifications of the system are decided. In this paper, we present a SystemC 2.0 TLM of the STBus architecture developed by STMicroelectronics, oriented to SOC platform architectures, by focusing on the advantages and limits of this abstraction level. Then, we propose a solution to these limits.","PeriodicalId":359193,"journal":{"name":"Proceedings. The 16th International Conference on Microelectronics, 2004. ICM 2004.","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-12-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130602576","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Benchmarking of on-chip interconnection networks 片上互连网络的基准测试
D. Wiklund, S. Sathe, D. Liu
More complex on-chip interconnection structures such as networks on chip emerge today. As the number of interconnect architectures rises there is a need to do an impartial evaluation of the performance of the interconnect structure. This is important for both the designer of the interconnect as well as for the system designer in order to achieve best performance vs. cost tradeoff. The work presented in this paper describes a method to specify, execute, and evaluate benchmarks for on-chip interconnects. The benchmarking method uses formal traffic specifications together with architecture independent constraints to form the benchmark specification. This specification is adapted to the simulation flow available for the interconnect and simulated to get the wanted results. The benchmark method is evaluated using two related examples where throughput is the main focus in the results. These examples show the applicability of the method.
现在出现了更复杂的片上互连结构,如片上网络。随着互连结构数量的增加,有必要对互连结构的性能进行公正的评估。这对于互连设计人员和系统设计人员都很重要,以便实现最佳性能与成本之间的权衡。本文提出的工作描述了一种方法来指定,执行和评估片上互连的基准。基准测试方法使用正式的流量规范和与体系结构无关的约束来形成基准规范。本规范适用于可用于互连的仿真流程,并进行仿真以获得所需的结果。使用两个相关的示例来评估基准测试方法,其中吞吐量是结果中的主要关注点。这些例子表明了该方法的适用性。
{"title":"Benchmarking of on-chip interconnection networks","authors":"D. Wiklund, S. Sathe, D. Liu","doi":"10.1109/ICM.2004.1434742","DOIUrl":"https://doi.org/10.1109/ICM.2004.1434742","url":null,"abstract":"More complex on-chip interconnection structures such as networks on chip emerge today. As the number of interconnect architectures rises there is a need to do an impartial evaluation of the performance of the interconnect structure. This is important for both the designer of the interconnect as well as for the system designer in order to achieve best performance vs. cost tradeoff. The work presented in this paper describes a method to specify, execute, and evaluate benchmarks for on-chip interconnects. The benchmarking method uses formal traffic specifications together with architecture independent constraints to form the benchmark specification. This specification is adapted to the simulation flow available for the interconnect and simulated to get the wanted results. The benchmark method is evaluated using two related examples where throughput is the main focus in the results. These examples show the applicability of the method.","PeriodicalId":359193,"journal":{"name":"Proceedings. The 16th International Conference on Microelectronics, 2004. ICM 2004.","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-12-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123909070","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Study of nitrogen doped silicon films used for p/sup +/ polysilicon gates p/sup +/多晶硅栅极用氮掺杂硅膜的研究
S. Bouridah, F. Mansour, R. Mahamdi, P. Temple-Boyer
The effects of thermal annealing conditions, and nitrogen tenor on the properties of nitrogen doped silicon films (NIDOS) deposited by low-pressure chemical vapor deposition (LPCVD) at low temperature (480/spl deg/C) from a mixture of disilane and ammonia are investigated. Two series of samples have been studied: boron doped NIDOS films and NIDOS films. The resistivity measurements and the scanning electron microscopy observations showed respectively, a conducting behavior and a polycrystalline structure of films at high temperature. The electrical characterization highlighted the improvement of NIDOS conductivity when the nitrogen content increases. Fourier transform spectrometry measurements revealed that nitrogen combines with the boron to form a B-N complex for boron doped NIDOS films. This complex is responsible of the increase of the resistivity values of boron doped NIDOS films when the nitrogen tenor increases. Results showed a good correlation between the electrical and the structural properties.
研究了低温下(480/spl℃)用低压化学气相沉积法(LPCVD)从二硅烷和氨的混合物中制备氮掺杂硅膜(NIDOS)的退火条件和氮次对薄膜性能的影响。研究了两类样品:硼掺杂NIDOS薄膜和NIDOS薄膜。电阻率测量和扫描电镜观察分别表明薄膜在高温下具有导电行为和多晶结构。电学表征表明,随着氮含量的增加,NIDOS的电导率有所提高。傅里叶变换光谱测量表明,氮与硼结合形成硼掺杂NIDOS薄膜的B-N配合物。该配合物是导致硼掺杂NIDOS薄膜的电阻率随氮次的增加而增加的原因。结果表明,电学性能与结构性能之间存在良好的相关性。
{"title":"Study of nitrogen doped silicon films used for p/sup +/ polysilicon gates","authors":"S. Bouridah, F. Mansour, R. Mahamdi, P. Temple-Boyer","doi":"10.1109/ICM.2004.1434729","DOIUrl":"https://doi.org/10.1109/ICM.2004.1434729","url":null,"abstract":"The effects of thermal annealing conditions, and nitrogen tenor on the properties of nitrogen doped silicon films (NIDOS) deposited by low-pressure chemical vapor deposition (LPCVD) at low temperature (480/spl deg/C) from a mixture of disilane and ammonia are investigated. Two series of samples have been studied: boron doped NIDOS films and NIDOS films. The resistivity measurements and the scanning electron microscopy observations showed respectively, a conducting behavior and a polycrystalline structure of films at high temperature. The electrical characterization highlighted the improvement of NIDOS conductivity when the nitrogen content increases. Fourier transform spectrometry measurements revealed that nitrogen combines with the boron to form a B-N complex for boron doped NIDOS films. This complex is responsible of the increase of the resistivity values of boron doped NIDOS films when the nitrogen tenor increases. Results showed a good correlation between the electrical and the structural properties.","PeriodicalId":359193,"journal":{"name":"Proceedings. The 16th International Conference on Microelectronics, 2004. ICM 2004.","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-12-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123959231","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Poly (vinyl-alcohol) films for microphotonics 微光子学用聚乙烯醇薄膜
P. Obreja, D. Cristea, E. Budianu, R. Gavrila, M. Kusko, V. Kuncser
This paper presents experimental results concerning the influence of additives from a solution of the PVA on the optical properties of the polymer. The refractive index of the poly (vinyl-alcohol) was modified through the addition of inorganic materials and showed values between 1.5 and 2 depending on the compositions and the curing conditions of the polymer. The transmittance indicated values above 80%. The additives we used were metal oxides/inorganic salts. The composition and the deposition processes were optimized to allow a better control of the optical parameters (refractive index, transmittance), to reduce the processing temperatures and to improve photosensitivity. PVA with these new light-sensitive compositions can be easily spin coated onto variety of semiconductor substrate and directly patterned. A process was developed for channel waveguides fabrication.
本文介绍了聚乙烯醇溶液中添加剂对聚合物光学性能影响的实验结果。通过添加无机材料对聚乙烯醇的折射率进行了改性,根据聚合物的组成和固化条件的不同,折射率在1.5到2之间。透光率指示值在80%以上。我们使用的添加剂是金属氧化物/无机盐。优化了组成和沉积工艺,以更好地控制光学参数(折射率,透射率),降低加工温度并提高光敏性。具有这些新型光敏成分的聚乙烯醇可以很容易地自旋涂覆在各种半导体衬底上并直接图案化。提出了一种制造通道波导的新工艺。
{"title":"Poly (vinyl-alcohol) films for microphotonics","authors":"P. Obreja, D. Cristea, E. Budianu, R. Gavrila, M. Kusko, V. Kuncser","doi":"10.1109/ICM.2004.1434756","DOIUrl":"https://doi.org/10.1109/ICM.2004.1434756","url":null,"abstract":"This paper presents experimental results concerning the influence of additives from a solution of the PVA on the optical properties of the polymer. The refractive index of the poly (vinyl-alcohol) was modified through the addition of inorganic materials and showed values between 1.5 and 2 depending on the compositions and the curing conditions of the polymer. The transmittance indicated values above 80%. The additives we used were metal oxides/inorganic salts. The composition and the deposition processes were optimized to allow a better control of the optical parameters (refractive index, transmittance), to reduce the processing temperatures and to improve photosensitivity. PVA with these new light-sensitive compositions can be easily spin coated onto variety of semiconductor substrate and directly patterned. A process was developed for channel waveguides fabrication.","PeriodicalId":359193,"journal":{"name":"Proceedings. The 16th International Conference on Microelectronics, 2004. ICM 2004.","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-12-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123443979","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Design considerations of a high frequency and low voltage clock generator 高频低压时钟发生器的设计考虑
H. Shamsi, O. Shoaei, Azadeh Zahabi, Y. Koolivand, R. Doost
A low voltage, 1.2 V, 4 GHz CMOS phase lock loop for clock generation is reported. This low voltage clock generator consists of a ring oscillator as the VCO that works from 100 MHz to 4 GHz with a maximum power consumption of 11 mW. Employing a charge pump circuit with suitable loop filter, a ripple free control voltage is provided for VCO. The total power consumption of this PLL, simulated in a 0.13 /spl mu/m CMOS technology, is about 54 mW.
报道了一种用于时钟产生的低电压、1.2 V、4 GHz CMOS锁相环。该低压时钟发生器由一个环形振荡器作为VCO组成,工作范围为100 MHz至4 GHz,最大功耗为11 mW。采用带适当环路滤波器的电荷泵电路,为压控振荡器提供无纹波控制电压。该锁相环在0.13 /spl mu/m CMOS技术下的总功耗约为54 mW。
{"title":"Design considerations of a high frequency and low voltage clock generator","authors":"H. Shamsi, O. Shoaei, Azadeh Zahabi, Y. Koolivand, R. Doost","doi":"10.1109/ICM.2004.1434602","DOIUrl":"https://doi.org/10.1109/ICM.2004.1434602","url":null,"abstract":"A low voltage, 1.2 V, 4 GHz CMOS phase lock loop for clock generation is reported. This low voltage clock generator consists of a ring oscillator as the VCO that works from 100 MHz to 4 GHz with a maximum power consumption of 11 mW. Employing a charge pump circuit with suitable loop filter, a ripple free control voltage is provided for VCO. The total power consumption of this PLL, simulated in a 0.13 /spl mu/m CMOS technology, is about 54 mW.","PeriodicalId":359193,"journal":{"name":"Proceedings. The 16th International Conference on Microelectronics, 2004. ICM 2004.","volume":"59 8","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-12-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"113973754","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
期刊
Proceedings. The 16th International Conference on Microelectronics, 2004. ICM 2004.
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1