Pub Date : 2003-10-14DOI: 10.1109/ISEMC.2003.1236586
G. Moore
This paper presents a method for developing an effective system level EMC mitigation plan. EMC engineers responsible for compliance of large scale systems face many challenges with time to market pressures. These challenges are driven by cost, schedule and design. All can be overwhelming considering the magnitude and complexity of system level design and the many areas that should be influenced by EMC. There are many approaches to addressing EMC in a design. To be effective, an understanding of the design process and preparing an EMC plan aligned with overall design objectives will ensure value added inputs and a successful EMC compliance program. This paper proposes one of many approaches that can be taken to bring a product to market successfully from an EMC perspective.
{"title":"Development, implementation and management of a system level EMC design mitigation plan","authors":"G. Moore","doi":"10.1109/ISEMC.2003.1236586","DOIUrl":"https://doi.org/10.1109/ISEMC.2003.1236586","url":null,"abstract":"This paper presents a method for developing an effective system level EMC mitigation plan. EMC engineers responsible for compliance of large scale systems face many challenges with time to market pressures. These challenges are driven by cost, schedule and design. All can be overwhelming considering the magnitude and complexity of system level design and the many areas that should be influenced by EMC. There are many approaches to addressing EMC in a design. To be effective, an understanding of the design process and preparing an EMC plan aligned with overall design objectives will ensure value added inputs and a successful EMC compliance program. This paper proposes one of many approaches that can be taken to bring a product to market successfully from an EMC perspective.","PeriodicalId":359422,"journal":{"name":"2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)","volume":"106 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133295712","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2003-10-14DOI: 10.1109/ISEMC.2003.1236657
H. M. Kudyan
This paper reports and compares empirical outcomes of frequency-swept Shielding Effectiveness (ES) measurements for several types of metallic enclosures, performed under two extreme conditions. In one case, the test is done in an area with numerous metallic surfaces and objects, while in the other case reflecting surfaces or objects are practically nonexistent. It is demonstrated that the frequency-swept data obtained from the two cases are well correlated, and that the existence of reflecting surfaces in the test area does not appear to be a significant source of error. These outcomes suggests that the frequency-swept method offers a quick and inexpensive method of measuring the effective SE of enclosures even in the presence of reflecting surfaces, large metal objects and EM noise from other equipment.
{"title":"Sensitivity of frequency-swept shielding effectiveness measurements to reflecting surfaces and EMI noise in the test area","authors":"H. M. Kudyan","doi":"10.1109/ISEMC.2003.1236657","DOIUrl":"https://doi.org/10.1109/ISEMC.2003.1236657","url":null,"abstract":"This paper reports and compares empirical outcomes of frequency-swept Shielding Effectiveness (ES) measurements for several types of metallic enclosures, performed under two extreme conditions. In one case, the test is done in an area with numerous metallic surfaces and objects, while in the other case reflecting surfaces or objects are practically nonexistent. It is demonstrated that the frequency-swept data obtained from the two cases are well correlated, and that the existence of reflecting surfaces in the test area does not appear to be a significant source of error. These outcomes suggests that the frequency-swept method offers a quick and inexpensive method of measuring the effective SE of enclosures even in the presence of reflecting surfaces, large metal objects and EM noise from other equipment.","PeriodicalId":359422,"journal":{"name":"2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132096854","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2003-10-14DOI: 10.1109/ISEMC.2003.1236631
R. Neumayer, A. Stelzer, F. Haslinger, J. Held, F. Schinco, R. Weigel
Electromagnetic compatibility (EMC) issues are increasingly important to the automotive industry. Potential EMC problems arise from the growing use of electronic systems on the one hand and the lack of flexibility in placement or design of electronic modules on the other hand. In this paper we present a continuous EMC simulation process based on the exchange of EMC models between car manufacturer, electronic supplier and IC developer as applied to a general automotive application. The described process fundamentally influences the introduction of new technologies in automobiles by cutting the risk of EMC-failure and avoiding expensive and time-consuming redesigns.
{"title":"Continuous simulation of system-level automotive EMC problems","authors":"R. Neumayer, A. Stelzer, F. Haslinger, J. Held, F. Schinco, R. Weigel","doi":"10.1109/ISEMC.2003.1236631","DOIUrl":"https://doi.org/10.1109/ISEMC.2003.1236631","url":null,"abstract":"Electromagnetic compatibility (EMC) issues are increasingly important to the automotive industry. Potential EMC problems arise from the growing use of electronic systems on the one hand and the lack of flexibility in placement or design of electronic modules on the other hand. In this paper we present a continuous EMC simulation process based on the exchange of EMC models between car manufacturer, electronic supplier and IC developer as applied to a general automotive application. The described process fundamentally influences the introduction of new technologies in automobiles by cutting the risk of EMC-failure and avoiding expensive and time-consuming redesigns.","PeriodicalId":359422,"journal":{"name":"2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133166463","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2003-10-14DOI: 10.1109/ISEMC.2003.1236724
Bruce Archambeauk, Juan Wang, Samuel Connor
Power and ground-reference plane analysis traditionally has focused on the overall printed circuit board and the resonances that result from the physical size of the parallel planes. However, from a functionality point of view, the rapid impedance switching within typical ICs require a fast response in the current to the power pins of the IC. This is a local effect, since the loop inductance associated with currents from far corners of the board will be too high to provide this rapid current response. This effort characterized the impedance to this rapid current response seen by the IC power pin as the distance to the decoupling capacitor is increased, as the number of decoupling capacitors is varied, and as the diameter of the via is varied. The closest decoupling capacitor has the greatest effect on this rapid current response and dominates the response time for the IC current. This impedance can then be used to find the amount of noise voltage created locally at the IC power pins, and which can create EMI emissions.
{"title":"Power and ground-reference plane impedance determination as decoupling capacitor distance increases","authors":"Bruce Archambeauk, Juan Wang, Samuel Connor","doi":"10.1109/ISEMC.2003.1236724","DOIUrl":"https://doi.org/10.1109/ISEMC.2003.1236724","url":null,"abstract":"Power and ground-reference plane analysis traditionally has focused on the overall printed circuit board and the resonances that result from the physical size of the parallel planes. However, from a functionality point of view, the rapid impedance switching within typical ICs require a fast response in the current to the power pins of the IC. This is a local effect, since the loop inductance associated with currents from far corners of the board will be too high to provide this rapid current response. This effort characterized the impedance to this rapid current response seen by the IC power pin as the distance to the decoupling capacitor is increased, as the number of decoupling capacitors is varied, and as the diameter of the via is varied. The closest decoupling capacitor has the greatest effect on this rapid current response and dominates the response time for the IC current. This impedance can then be used to find the amount of noise voltage created locally at the IC power pins, and which can create EMI emissions.","PeriodicalId":359422,"journal":{"name":"2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133244485","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2003-10-14DOI: 10.1109/ISEMC.2003.1236688
V. Ricchiuti, A. Orlandi, G. Antonini, A. Scogna
On the modern digital equipments, characterized by continually increasing bandwidth requirements, the electrical properties of the printed circuit board interconnections affect and limit the quality of the traveling digital signals. This impacts on the electro-magnetic compatibility (EMC) performances of the system, because corrupted signals can easily increase the emissions from the system. Specific dielectric materials with low dielectric losses must be used for board manufacturing, in order to transmit digital signals with a high frequency harmonic content on longer distances. Consequently it is important to characterize, as function of the bit rate and the rise/fall time of the transmitted signal, the attenuation and deterministic jitter due to the dielectric material building up the board. To do this, one must separate (de-embed) from the measurements the effects of the adapters, used to connect the test board at the measuring instrument. The proposed de-embedding method uses a vector network analyzer with time domain option and only two traces, laid-out on the test board, with different lengths. The technique is validated by comparing the measured values with those coming from simulations.
{"title":"Characterization of interconnections performances for high speed digital boards: a frequency/time domain approach","authors":"V. Ricchiuti, A. Orlandi, G. Antonini, A. Scogna","doi":"10.1109/ISEMC.2003.1236688","DOIUrl":"https://doi.org/10.1109/ISEMC.2003.1236688","url":null,"abstract":"On the modern digital equipments, characterized by continually increasing bandwidth requirements, the electrical properties of the printed circuit board interconnections affect and limit the quality of the traveling digital signals. This impacts on the electro-magnetic compatibility (EMC) performances of the system, because corrupted signals can easily increase the emissions from the system. Specific dielectric materials with low dielectric losses must be used for board manufacturing, in order to transmit digital signals with a high frequency harmonic content on longer distances. Consequently it is important to characterize, as function of the bit rate and the rise/fall time of the transmitted signal, the attenuation and deterministic jitter due to the dielectric material building up the board. To do this, one must separate (de-embed) from the measurements the effects of the adapters, used to connect the test board at the measuring instrument. The proposed de-embedding method uses a vector network analyzer with time domain option and only two traces, laid-out on the test board, with different lengths. The technique is validated by comparing the measured values with those coming from simulations.","PeriodicalId":359422,"journal":{"name":"2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116583934","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2003-10-14DOI: 10.1109/ISEMC.2003.1236718
P. Leuchtmann, C. Bruns, R. Vahldieck
In this paper, we present three-dimensional full-wave simulations of the electromagnetic fields inside a medium-sized reverberation chamber. For the simulation, a method of moments based numerical approach was employed in the frequency domain. A short synopsis of the computational challenges particular for reverberation chambers is described and a detailed overview on the modeling procedure of the chamber is given. The electric and magnetic fields inside the chamber as well as the current density on the walls, the stirrer, and the antennas are computed and visualized. Different excitations of the chamber are simulated and parameters such as the rotational stirrer position or the influence of small geometric details are investigated. For the purpose of validation, extensive measurements inside a real reverberation chamber were taken and compared against the simulated results.
{"title":"Broadband method of moment simulation and measurement of a medium-sized reverberation chamber","authors":"P. Leuchtmann, C. Bruns, R. Vahldieck","doi":"10.1109/ISEMC.2003.1236718","DOIUrl":"https://doi.org/10.1109/ISEMC.2003.1236718","url":null,"abstract":"In this paper, we present three-dimensional full-wave simulations of the electromagnetic fields inside a medium-sized reverberation chamber. For the simulation, a method of moments based numerical approach was employed in the frequency domain. A short synopsis of the computational challenges particular for reverberation chambers is described and a detailed overview on the modeling procedure of the chamber is given. The electric and magnetic fields inside the chamber as well as the current density on the walls, the stirrer, and the antennas are computed and visualized. Different excitations of the chamber are simulated and parameters such as the rotational stirrer position or the influence of small geometric details are investigated. For the purpose of validation, extensive measurements inside a real reverberation chamber were taken and compared against the simulated results.","PeriodicalId":359422,"journal":{"name":"2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123479697","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2003-10-14DOI: 10.1109/ISEMC.2003.1236567
M. Mardiguian, P. Bertelli, J. Raimbourg
For measuring intense, pulsed electromagnetic fields in confined areas, a need existed for H-field probes with bandwidths up to 3GHz. This paper first presents the design and construction of small, precision Moebius loops, capable of measuring short field pulses with sub-nanosecond rise time. Then, the design, construction details and calibration of a slotted coaxial test line are described, for a precise characterization of these H-field probes.
{"title":"Design & characterization of a coaxial cell for miniature H-field loops calibration","authors":"M. Mardiguian, P. Bertelli, J. Raimbourg","doi":"10.1109/ISEMC.2003.1236567","DOIUrl":"https://doi.org/10.1109/ISEMC.2003.1236567","url":null,"abstract":"For measuring intense, pulsed electromagnetic fields in confined areas, a need existed for H-field probes with bandwidths up to 3GHz. This paper first presents the design and construction of small, precision Moebius loops, capable of measuring short field pulses with sub-nanosecond rise time. Then, the design, construction details and calibration of a slotted coaxial test line are described, for a precise characterization of these H-field probes.","PeriodicalId":359422,"journal":{"name":"2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)","volume":"125 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121028236","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2003-10-14DOI: 10.1109/ISEMC.2003.1236621
K. Awai, D. Aizawa, K. Taira, K. Sawaya
A measurement technique by using equally spaced dipole sensors is presented to estimate undesired electromagnetic source location emitted from electronic equipment in a short time. A compensation method for array element pattern is also proposed. Experimental values of the difference of the amplitude and phase between the received voltage of each array element and that of a single sensor placed at the same position of each array element of array sensor are obtained for the cases of 3-element and 5-element array sensors with the array spacing of 0.5 wavelength and 1 wavelength. It is also shown that the received voltage after compensation using experimental data agrees with the received voltage by scanning a single sensor within 0.4 dB in amplitude and 2.4 degrees in phase.
{"title":"Experimental study on compensation of element pattern in array sensor","authors":"K. Awai, D. Aizawa, K. Taira, K. Sawaya","doi":"10.1109/ISEMC.2003.1236621","DOIUrl":"https://doi.org/10.1109/ISEMC.2003.1236621","url":null,"abstract":"A measurement technique by using equally spaced dipole sensors is presented to estimate undesired electromagnetic source location emitted from electronic equipment in a short time. A compensation method for array element pattern is also proposed. Experimental values of the difference of the amplitude and phase between the received voltage of each array element and that of a single sensor placed at the same position of each array element of array sensor are obtained for the cases of 3-element and 5-element array sensors with the array spacing of 0.5 wavelength and 1 wavelength. It is also shown that the received voltage after compensation using experimental data agrees with the received voltage by scanning a single sensor within 0.4 dB in amplitude and 2.4 degrees in phase.","PeriodicalId":359422,"journal":{"name":"2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123320253","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2003-10-14DOI: 10.1109/ISEMC.2003.1236624
M. Miyakawa, N. Komiyama, N. Ishii
An efficient way of permittivity value estimation in a model-based standing wave method used for measuring a construction material has been investigated. Accuracy of the estimation is slightly improved by using a thin and long piece of material, but essential solution may be given by using a material sample whose size is fully large as compared to the measuring wavelength.
{"title":"Quick search for a permittivity value in model-based standing wave method used for construction material measurement","authors":"M. Miyakawa, N. Komiyama, N. Ishii","doi":"10.1109/ISEMC.2003.1236624","DOIUrl":"https://doi.org/10.1109/ISEMC.2003.1236624","url":null,"abstract":"An efficient way of permittivity value estimation in a model-based standing wave method used for measuring a construction material has been investigated. Accuracy of the estimation is slightly improved by using a thin and long piece of material, but essential solution may be given by using a material sample whose size is fully large as compared to the measuring wavelength.","PeriodicalId":359422,"journal":{"name":"2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124132713","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2003-10-14DOI: 10.1109/ISEMC.2003.1236559
T. Hubing
Some of the worst printed circuit board design choices are made by engineers who are trying to comply with a list of EMC design guidelines. Nevertheless, a short list of design guidelines can be helpful at times. This paper reviews some of the more general EMC design guidelines for printed circuit board layout.
{"title":"PCB EMC design guidelines: a brief annotated list","authors":"T. Hubing","doi":"10.1109/ISEMC.2003.1236559","DOIUrl":"https://doi.org/10.1109/ISEMC.2003.1236559","url":null,"abstract":"Some of the worst printed circuit board design choices are made by engineers who are trying to comply with a list of EMC design guidelines. Nevertheless, a short list of design guidelines can be helpful at times. This paper reviews some of the more general EMC design guidelines for printed circuit board layout.","PeriodicalId":359422,"journal":{"name":"2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123135413","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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