Pub Date : 2003-10-14DOI: 10.1109/ISEMC.2003.1236675
L. Carmody, V. Ungvichian
In this paper, a re-design of low power single-phase EMI filter where less than 100 /spl mu/A of leakage current as per UL 1206-1 standards will be presented. The recent current limit is more stringent for medical applications than the others. Hence there is need to revisit the EMI filter design. The two Y capacitors are the major contributors to the leakage current due to the equivalent series resistor (ESR). The three-Y capacitors are suggested for the strategy. The experimental data indicates that low leakage current is achieved and the filter provides an average of 67 dB insertion loss in the 150 kHz to 30 MHz band. Mutual coupling is investigated but it does not contribute to the leakage current at low power.
{"title":"Design and measurement of /spl mu/A leakage current EMI filter","authors":"L. Carmody, V. Ungvichian","doi":"10.1109/ISEMC.2003.1236675","DOIUrl":"https://doi.org/10.1109/ISEMC.2003.1236675","url":null,"abstract":"In this paper, a re-design of low power single-phase EMI filter where less than 100 /spl mu/A of leakage current as per UL 1206-1 standards will be presented. The recent current limit is more stringent for medical applications than the others. Hence there is need to revisit the EMI filter design. The two Y capacitors are the major contributors to the leakage current due to the equivalent series resistor (ESR). The three-Y capacitors are suggested for the strategy. The experimental data indicates that low leakage current is achieved and the filter provides an average of 67 dB insertion loss in the 150 kHz to 30 MHz band. Mutual coupling is investigated but it does not contribute to the leakage current at low power.","PeriodicalId":359422,"journal":{"name":"2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126756257","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2003-10-14DOI: 10.1109/ISEMC.2003.1236574
T. Braxton
In the course of performing compliance tests against EMC standards, experience has shown that the most contentious and problematic tests are those that measure immunity. Standards, most notably the EN61000-4 series in the European Union, go to great lengths to define the procedures, structures and protocols of these tests. However, the definition of failure criteria is left to the discretion of the manufacturer. In an increasingly complex technology, a common understanding of what is and is not an acceptable response to an electromagnetic stimulus is becoming more difficult to reach. This paper proposes a test-planning procedure that has proven effective when used in a commercial-product context.
{"title":"The importance of failure-criteria definition in immunity testing","authors":"T. Braxton","doi":"10.1109/ISEMC.2003.1236574","DOIUrl":"https://doi.org/10.1109/ISEMC.2003.1236574","url":null,"abstract":"In the course of performing compliance tests against EMC standards, experience has shown that the most contentious and problematic tests are those that measure immunity. Standards, most notably the EN61000-4 series in the European Union, go to great lengths to define the procedures, structures and protocols of these tests. However, the definition of failure criteria is left to the discretion of the manufacturer. In an increasingly complex technology, a common understanding of what is and is not an acceptable response to an electromagnetic stimulus is becoming more difficult to reach. This paper proposes a test-planning procedure that has proven effective when used in a commercial-product context.","PeriodicalId":359422,"journal":{"name":"2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123487798","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2003-10-14DOI: 10.1109/ISEMC.2003.1236613
A. Drozd
Progress towards the development of standards and recommended practices for computational electromagnetics (CEM) computer modeling and simulation and code validation is discussed in this paper. This has been a topic of recent interest within the electromagnetics community. The relevant areas addressed include printed circuit board radiated and conducted emissions/immunity, system-level EMC, radar cross section (RCS) of complex structures, and the simulation of various electromagnetic environment effects (E/sup 3/) problems. In particular, there are concerns regarding the lack of well-defined methodologies to achieve code-to-code or even simulation-to-measurement validations within a consistent level of accuracy. This paper describes projects that are underway to guide the validation of CEM application models.
{"title":"Progress on the development of standards and recommended practices for CEM computer modeling and code validation","authors":"A. Drozd","doi":"10.1109/ISEMC.2003.1236613","DOIUrl":"https://doi.org/10.1109/ISEMC.2003.1236613","url":null,"abstract":"Progress towards the development of standards and recommended practices for computational electromagnetics (CEM) computer modeling and simulation and code validation is discussed in this paper. This has been a topic of recent interest within the electromagnetics community. The relevant areas addressed include printed circuit board radiated and conducted emissions/immunity, system-level EMC, radar cross section (RCS) of complex structures, and the simulation of various electromagnetic environment effects (E/sup 3/) problems. In particular, there are concerns regarding the lack of well-defined methodologies to achieve code-to-code or even simulation-to-measurement validations within a consistent level of accuracy. This paper describes projects that are underway to guide the validation of CEM application models.","PeriodicalId":359422,"journal":{"name":"2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123762672","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2003-10-14DOI: 10.1109/ISEMC.2003.1236593
Z. Ali Khan, C. Bunting
This paper discusses the shielding effectiveness of metallic enclosures with rectangular apertures against arbitrarily polarized oblique incident plane waves using Modal MoM according to Deshpande et al.(1999). The results show that for a given angle of incidence and polarization, the SE values are different at different points inside the enclosure. The results also show that the polarization of the incidence waves as well as the angle of incidence have a profound effect on shielding effectiveness. Also the SE values for each component of E field has to be taken into account as the normal incidence for a particular component at a location inside the enclosure may not be the worst case. The study emphasizes the need for the statistical estimation of the shielding effectiveness of the rectangular enclosures.
{"title":"Shielding effectiveness studies of rectangular enclosures with apertures against EM fields with arbitrary angles of incidence and polarizations","authors":"Z. Ali Khan, C. Bunting","doi":"10.1109/ISEMC.2003.1236593","DOIUrl":"https://doi.org/10.1109/ISEMC.2003.1236593","url":null,"abstract":"This paper discusses the shielding effectiveness of metallic enclosures with rectangular apertures against arbitrarily polarized oblique incident plane waves using Modal MoM according to Deshpande et al.(1999). The results show that for a given angle of incidence and polarization, the SE values are different at different points inside the enclosure. The results also show that the polarization of the incidence waves as well as the angle of incidence have a profound effect on shielding effectiveness. Also the SE values for each component of E field has to be taken into account as the normal incidence for a particular component at a location inside the enclosure may not be the worst case. The study emphasizes the need for the statistical estimation of the shielding effectiveness of the rectangular enclosures.","PeriodicalId":359422,"journal":{"name":"2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)","volume":" 54","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120826440","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2003-10-14DOI: 10.1109/ISEMC.2003.1236617
M. Cracraft, X. Ye, Chen Wang, S. Chandra, J. Drewniak
In electromagnetic modeling, agreement between modeling and measurements is a common goal. There are questions that define every model. What is to be modeled? How is it going to be modeled? At what scale is it to be modeled? Through sample results and discussion, this paper addresses some general and some specific elements of model veracity. Through determination, numerical models can certainly be pushed to match any measured results. However, in the end the question that this paper addresses is not necessarily "How good can this model be?" as it is "Is this model good enough?".
{"title":"Modeling issues for full-wave numerical EMI simulation","authors":"M. Cracraft, X. Ye, Chen Wang, S. Chandra, J. Drewniak","doi":"10.1109/ISEMC.2003.1236617","DOIUrl":"https://doi.org/10.1109/ISEMC.2003.1236617","url":null,"abstract":"In electromagnetic modeling, agreement between modeling and measurements is a common goal. There are questions that define every model. What is to be modeled? How is it going to be modeled? At what scale is it to be modeled? Through sample results and discussion, this paper addresses some general and some specific elements of model veracity. Through determination, numerical models can certainly be pushed to match any measured results. However, in the end the question that this paper addresses is not necessarily \"How good can this model be?\" as it is \"Is this model good enough?\".","PeriodicalId":359422,"journal":{"name":"2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)","volume":"517 ","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120879657","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2003-10-14DOI: 10.1109/ISEMC.2003.1236638
E. Suzuki, T. Miyakawa, H. Ota, K. Arai, R. Sato
We performed magnetic field sensing near a microstrip line with a new type of optical probe. Its probe head consists of a loop antenna element doubly-loaded with electro-optic crystals. It optically realizes operation of a conventional double loaded loop probe and requires no metallic cables or electrical hybrid junction. We examined probe characteristics for magnetic field detection up to 10 GHz. We confirmed that the probe can detect magnetic fields near a microstrip line with high accuracy up to the gigahertz range and can suppress influence of electric fields.
{"title":"Optical magnetic field sensing with a loop antenna element doubly-loaded with electro-optic crystals","authors":"E. Suzuki, T. Miyakawa, H. Ota, K. Arai, R. Sato","doi":"10.1109/ISEMC.2003.1236638","DOIUrl":"https://doi.org/10.1109/ISEMC.2003.1236638","url":null,"abstract":"We performed magnetic field sensing near a microstrip line with a new type of optical probe. Its probe head consists of a loop antenna element doubly-loaded with electro-optic crystals. It optically realizes operation of a conventional double loaded loop probe and requires no metallic cables or electrical hybrid junction. We examined probe characteristics for magnetic field detection up to 10 GHz. We confirmed that the probe can detect magnetic fields near a microstrip line with high accuracy up to the gigahertz range and can suppress influence of electric fields.","PeriodicalId":359422,"journal":{"name":"2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)","volume":"212 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133914899","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2003-10-14DOI: 10.1109/ISEMC.2003.1236553
T. Hubing
This tutorial paper reviews the basic mechanisms by which signal voltages and currents on a printed circuit board produce unintentional radiated emissions.
本教程回顾了印刷电路板上的信号电压和电流产生无意辐射的基本机制。
{"title":"Printed circuit board EMI source mechanisms","authors":"T. Hubing","doi":"10.1109/ISEMC.2003.1236553","DOIUrl":"https://doi.org/10.1109/ISEMC.2003.1236553","url":null,"abstract":"This tutorial paper reviews the basic mechanisms by which signal voltages and currents on a printed circuit board produce unintentional radiated emissions.","PeriodicalId":359422,"journal":{"name":"2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132675624","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2003-10-14DOI: 10.1109/ISEMC.2003.1236686
E. Blankenship, M. Chase
Radiated emission measurements are usually performed in a facility that meets the Normalized Site Attenuation (NSA) requirements of standards such as CISPR 22 and ANSI C63.4. These standards allow alternative sites such as a fully anechoic room (FAR) for preliminary measurements before final measurements are taken in an open area test site (OATS). The NSA requirements for both these test environments are evaluated in the absence of necessary accessories, such as the table on which test samples must be supported. Additionally, the standards offer only vague guidance on the materials and construction methods used to build the test accessories. We believe this allows uncertainty to enter the measurement environment that is uncharacterized. This paper reports on measurements of these effects at 2, 10 and 18 GHz, and highlights additional facility and antenna interactions and table materials and shapes vis-a-vis their impacts upon measured electric fields. The paper reviews briefly our proposed technique for measuring the far-field signal perturbations that result from inserting test accessories into the common environments encountered in measuring ITE products using the standard noted above.
{"title":"Radiated emission field perturbations due to accessories used in the FAR environment at 2, 10 & 18 GHz","authors":"E. Blankenship, M. Chase","doi":"10.1109/ISEMC.2003.1236686","DOIUrl":"https://doi.org/10.1109/ISEMC.2003.1236686","url":null,"abstract":"Radiated emission measurements are usually performed in a facility that meets the Normalized Site Attenuation (NSA) requirements of standards such as CISPR 22 and ANSI C63.4. These standards allow alternative sites such as a fully anechoic room (FAR) for preliminary measurements before final measurements are taken in an open area test site (OATS). The NSA requirements for both these test environments are evaluated in the absence of necessary accessories, such as the table on which test samples must be supported. Additionally, the standards offer only vague guidance on the materials and construction methods used to build the test accessories. We believe this allows uncertainty to enter the measurement environment that is uncharacterized. This paper reports on measurements of these effects at 2, 10 and 18 GHz, and highlights additional facility and antenna interactions and table materials and shapes vis-a-vis their impacts upon measured electric fields. The paper reviews briefly our proposed technique for measuring the far-field signal perturbations that result from inserting test accessories into the common environments encountered in measuring ITE products using the standard noted above.","PeriodicalId":359422,"journal":{"name":"2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)","volume":"300 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132763476","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2003-10-14DOI: 10.1109/ISEMC.2003.1236703
T. Tamada, N. Ishii, M. Miyakawa
The standing wave method for the spherical wave incidence has been developed to estimate the complex permittivity of construction materials. In this paper, the behavior of spherically standing wave in front of the construction materials has been theoretically analyzed by the use of the spectral domain approach. As a result, the relationship between the complex permittivity and the reflection coefficient at the front surface of the grounded materials is derived, when a spherical wave is irradiated toward the material. This relationship can be expanded for all types of the incident wave including the plane wave incidence. A number of the numerical models for the composite materials have been so simulated by means of the FDTD technique as to check the validity of the relationship.
{"title":"Analysis on the standing wave method in free space using spectral domain approach","authors":"T. Tamada, N. Ishii, M. Miyakawa","doi":"10.1109/ISEMC.2003.1236703","DOIUrl":"https://doi.org/10.1109/ISEMC.2003.1236703","url":null,"abstract":"The standing wave method for the spherical wave incidence has been developed to estimate the complex permittivity of construction materials. In this paper, the behavior of spherically standing wave in front of the construction materials has been theoretically analyzed by the use of the spectral domain approach. As a result, the relationship between the complex permittivity and the reflection coefficient at the front surface of the grounded materials is derived, when a spherical wave is irradiated toward the material. This relationship can be expanded for all types of the incident wave including the plane wave incidence. A number of the numerical models for the composite materials have been so simulated by means of the FDTD technique as to check the validity of the relationship.","PeriodicalId":359422,"journal":{"name":"2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134468692","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2003-10-14DOI: 10.1109/ISEMC.2003.1236598
B. Deutschmann, G. Winkler, R. Jungreithmair
In today's high speed designs we often have to deal with clock rates in the GHz range and rise and fall times in the order of a few pico seconds. At these speeds it can no longer be assumed that a design is immune to parasitic effects. A lot of problems originate from high speed signals as they cause high electromagnetic emissions. These high emissions may lead to serious degradations to the electromagnetic compatibility of an electronic system. In this paper, the reduction of the electromagnetic emissions by skewing CMOS output driver is described. This technique is explained in detail and it is shown how skewing can be used to reduce ground bounce as well as the ringing of an integrated circuit. Using the TEM-cell method (IEC 61967-2), the radiated electromagnetic emissions of an EMC test chip was measured. It is shown that preventing the output drivers from switching simultaneously reduces the radiated electromagnetic emission. As most of the electronic systems designers are interested in the reduction of the electromagnetic emission of their designs it is also shown how this technique can be used to reduce the emission of an electronic system. For this purpose an EMC test printed circuit board was designed and the effects of skewing on its electromagnetic emission are described.
{"title":"Effects of skewing output driver switching on the electromagnetic emission","authors":"B. Deutschmann, G. Winkler, R. Jungreithmair","doi":"10.1109/ISEMC.2003.1236598","DOIUrl":"https://doi.org/10.1109/ISEMC.2003.1236598","url":null,"abstract":"In today's high speed designs we often have to deal with clock rates in the GHz range and rise and fall times in the order of a few pico seconds. At these speeds it can no longer be assumed that a design is immune to parasitic effects. A lot of problems originate from high speed signals as they cause high electromagnetic emissions. These high emissions may lead to serious degradations to the electromagnetic compatibility of an electronic system. In this paper, the reduction of the electromagnetic emissions by skewing CMOS output driver is described. This technique is explained in detail and it is shown how skewing can be used to reduce ground bounce as well as the ringing of an integrated circuit. Using the TEM-cell method (IEC 61967-2), the radiated electromagnetic emissions of an EMC test chip was measured. It is shown that preventing the output drivers from switching simultaneously reduces the radiated electromagnetic emission. As most of the electronic systems designers are interested in the reduction of the electromagnetic emission of their designs it is also shown how this technique can be used to reduce the emission of an electronic system. For this purpose an EMC test printed circuit board was designed and the effects of skewing on its electromagnetic emission are described.","PeriodicalId":359422,"journal":{"name":"2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)","volume":"212 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134338516","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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