Pub Date : 1993-02-02DOI: 10.1109/STHERM.1993.225331
R. Nelson, T. Dolbear, K. Chen, C. Chao
An application of a novel-geometry, air-cooled, microchannel heat exchanger for electronic chips reported by C. Hilbert et al. (1990) is described. These heat exchangers, based on narrow channels and laminar flow, are scaled to cool large packets, mated to high-power pin grid arrays (PGAs) or multichip modules (MCMs), and mounted on printed circuit boards in a card cage. The heat exchanger reported fits within the package footprint and meets chip temperature specifications to 50 W. The system provides cooling for two MCM or PGA boards, each carrying eight 35-W modules using the scaled design. The modules were mounted on a printed wiring board, along with conventional components dissipating an additional 100 W. Chip temperature rises within the packages were kept to 50 degrees C above ambient. The entire card cage contained the two MCM or PGA boards and several other conventionally cooled boards. Fan placement and air flow design were conventional except for the provision of ducting above the high-power packages. The heat exchangers operate at a very low pressure loss, allowing the MCM section to be cooled with two common axial flow fans while generating acoustic noise within the range acceptable for office equipment.<>
{"title":"Application of air cooled microchannel heat exchangers to card cage systems","authors":"R. Nelson, T. Dolbear, K. Chen, C. Chao","doi":"10.1109/STHERM.1993.225331","DOIUrl":"https://doi.org/10.1109/STHERM.1993.225331","url":null,"abstract":"An application of a novel-geometry, air-cooled, microchannel heat exchanger for electronic chips reported by C. Hilbert et al. (1990) is described. These heat exchangers, based on narrow channels and laminar flow, are scaled to cool large packets, mated to high-power pin grid arrays (PGAs) or multichip modules (MCMs), and mounted on printed circuit boards in a card cage. The heat exchanger reported fits within the package footprint and meets chip temperature specifications to 50 W. The system provides cooling for two MCM or PGA boards, each carrying eight 35-W modules using the scaled design. The modules were mounted on a printed wiring board, along with conventional components dissipating an additional 100 W. Chip temperature rises within the packages were kept to 50 degrees C above ambient. The entire card cage contained the two MCM or PGA boards and several other conventionally cooled boards. Fan placement and air flow design were conventional except for the provision of ducting above the high-power packages. The heat exchangers operate at a very low pressure loss, allowing the MCM section to be cooled with two common axial flow fans while generating acoustic noise within the range acceptable for office equipment.<<ETX>>","PeriodicalId":369022,"journal":{"name":"[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-02-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124004411","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1992-09-01DOI: 10.1109/STHERM.1993.225337
J. Sweet, D. Peterson, D. Chu, B. Bainbridge, R. Gassman, C. Reber
A three-dimensional multichip module (MCM) using a silicon-on-silicon architecture has been constructed to evaluate the thermal performance of various design schemes. The module has three planes of die, each populated of four assembly test chips (ATCs). Each chip has an array of 48 temperature sensing diodes, which are used to map the temperature distribution across the chip surface. The design and construction of the module are discussed and the calibration of the diodes are reviewed. Experimental results are presented for the top surface temperature distribution with the bottom substrate connected to a heat sink. These results are compared to those from a full finite element calculation as well as to results using more approximate thermal analysis tools.<>
{"title":"Analysis and measurement of thermal resistance in a 3-dimensional silicon multichip module populated with assembly test chips","authors":"J. Sweet, D. Peterson, D. Chu, B. Bainbridge, R. Gassman, C. Reber","doi":"10.1109/STHERM.1993.225337","DOIUrl":"https://doi.org/10.1109/STHERM.1993.225337","url":null,"abstract":"A three-dimensional multichip module (MCM) using a silicon-on-silicon architecture has been constructed to evaluate the thermal performance of various design schemes. The module has three planes of die, each populated of four assembly test chips (ATCs). Each chip has an array of 48 temperature sensing diodes, which are used to map the temperature distribution across the chip surface. The design and construction of the module are discussed and the calibration of the diodes are reviewed. Experimental results are presented for the top surface temperature distribution with the bottom substrate connected to a heat sink. These results are compared to those from a full finite element calculation as well as to results using more approximate thermal analysis tools.<<ETX>>","PeriodicalId":369022,"journal":{"name":"[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116193229","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/STHERM.1993.225314
B. Siegal
A bibliography providing information on semiconductor thermal and/or temperature characteristics, measurement techniques and results, hardware applications, and other pertinent information is provided.<>
提供有关半导体热和/或温度特性、测量技术和结果、硬件应用和其他相关信息的参考书目。
{"title":"1993 cumulative bibliography of articles on semiconductor thermal and temperature testing","authors":"B. Siegal","doi":"10.1109/STHERM.1993.225314","DOIUrl":"https://doi.org/10.1109/STHERM.1993.225314","url":null,"abstract":"A bibliography providing information on semiconductor thermal and/or temperature characteristics, measurement techniques and results, hardware applications, and other pertinent information is provided.<<ETX>>","PeriodicalId":369022,"journal":{"name":"[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123635675","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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