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A Counter-based Read Circuit Tolerant to Process Variation for 0.4-V Operating STT-MRAM 0.4 v STT-MRAM可耐受工艺变化的计数器读电路
Q4 Engineering Pub Date : 2016-01-01 DOI: 10.2197/ipsjtsldm.9.79
Youhei Umeki, Koji Yanagida, S. Yoshimoto, S. Izumi, M. Yoshimoto, H. Kawaguchi, K. Tsunoda, T. Sugii
The capacity of embedded memory on LSIs has kept increasing. It is important to reduce the leakage power of embedded memory for low-power LSIs. In fact, the ITRS predicts that the leakage power in embedded memory will account for 40% of all power consumption by 2024 [1]. A spin transfer torque magneto-resistance random access memory (STT-MRAM) is promising for use as non-volatile memory to reduce the leakage power. It is useful because it can function at low voltages and has a lifetime of over 1016 write cycles [2]. In addition, the STT-MRAM technology has a smaller bit cell than an SRAM. Making the STT-MRAM is suitable for use in high-density products [3–7]. The STT-MRAM uses magnetic tunnel junction (MTJ). The MTJ has two states: a parallel state and an anti-parallel state. These states mean that the magnetization direction of the MTJ’s layers are the same or different. The directions pair determines the MTJ’s magneto- resistance value. The states of MTJ can be changed by the current flowing. The MTJ resistance becomes low in the parallel state and high in the anti-parallel state. The MTJ potentially operates at less than 0.4 V [8]. In other hands, it is difficult to design peripheral circuitry for an STT-MRAM array at such a low voltage. In this paper, we propose a counter-based read circuit that functions at 0.4 V, which is tolerant of process variation and temperature fluctuation.
lsi上的嵌入式存储器容量不断增加。对于低功耗lsi来说,降低嵌入式存储器的漏功率是非常重要的。事实上,ITRS预测,到2024年,嵌入式存储器的泄漏功率将占总功耗的40%[1]。自旋转移转矩磁阻随机存取存储器(STT-MRAM)有望用作非易失性存储器,以降低泄漏功率。它很有用,因为它可以在低电压下工作,并且具有超过1016个写入周期的寿命[2]。此外,STT-MRAM技术具有比SRAM更小的位单元。制作STT-MRAM适用于高密度产品[3-7]。STT-MRAM采用磁隧道结(MTJ)。MTJ有两种状态:并行状态和反并行状态。这些状态意味着MTJ各层的磁化方向相同或不同。方向对决定了MTJ的磁阻值。电流的流动可以改变MTJ的状态。并联时MTJ电阻变低,反并联时变高。MTJ的潜在工作电压低于0.4 V[8]。另一方面,在如此低的电压下为STT-MRAM阵列设计外围电路是很困难的。在本文中,我们提出了一种基于计数器的读取电路,该电路工作在0.4 V,可以容忍工艺变化和温度波动。
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引用次数: 1
Unified HW/SW Co-Verification Methodology for High Throughput Wireless Communication System 高吞吐量无线通信系统的统一软硬件协同验证方法
Q4 Engineering Pub Date : 2016-01-01 DOI: 10.2197/ipsjtsldm.9.61
N. Sutisna, Reina Hongyo, L. Lanante, Y. Nagao, M. Kurosaki, H. Ochi
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引用次数: 0
Placement: From Wirelength to Detailed Routability 放置:从无线长度到详细的可达性
Q4 Engineering Pub Date : 2016-01-01 DOI: 10.2197/ipsjtsldm.9.2
Wing-Kai Chow, Evangeline F. Y. Young
Research on the placement problem in physical design has evolved timely in the recent few decades from traditional wirelength-driven, to routability-driven and then to detailed-routability driven. In this paper, we will focus on the interconnect and routing issues in placement, and study and survey on the development and progress of related works on this important problem.
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引用次数: 3
Detecting Arithmetic Optimization Opportunities for C Compilers by Randomly Generated Equivalent Programs 用随机生成的等效程序检测C编译器的算法优化机会
Q4 Engineering Pub Date : 2016-01-01 DOI: 10.2197/ipsjtsldm.9.21
Atsushi Hashimoto, N. Ishiura
This paper presents new methods of detecting missed arithmetic optimization opportunities for C compilers by random testing. For each iteration of random testing, two equivalent programs are generated, where the arithmetic expressions in the second program are more optimized in the C program level. By comparing the two assembly codes compiled from the two C programs, lack of optimization on either of the programs is detected. This method is further extended for detecting erroneous or insufficient optimization involving volatile variables. Two random programs differing only on the initial values for volatile variables are generated, and the resulting assembly codes are compared. Random test systems implemented based on the proposed methods have detected missed optimization opportunities on several compilers, including the latest development versions of GCC-5.0.0 and LLVM/Clang-3.6.
本文提出了一种通过随机测试来检测C编译器错过的算法优化机会的新方法。对于随机测试的每次迭代,生成两个等效程序,其中第二个程序中的算术表达式在C程序级别上得到了更好的优化。通过比较两个C程序编译的汇编代码,可以发现两个程序都缺乏优化。该方法进一步扩展用于检测涉及易失性变量的错误或不充分的优化。生成两个随机程序,仅在易失性变量的初始值上不同,并比较结果汇编代码。基于提出的方法实现的随机测试系统已经在几个编译器上检测到错过的优化机会,包括最新开发版本的GCC-5.0.0和LLVM/Clang-3.6。
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引用次数: 15
A Calibration Technique for DVMC with Delay Time Controllable Inverter 时延可控逆变器DVMC的标定技术
Q4 Engineering Pub Date : 2016-01-01 DOI: 10.2197/ipsjtsldm.9.30
Ri Cui, K. Namba
: This paper presents a novel calibration method for Delay Value Measurement Circuit (DVMC), a class of embedded time to digital converter (TDC), using a variable clock generator for accurate delay measurement. The proposed method uses a design for calibration as well as a variable clock generator. The design utilizes a delay time controllable (DTC) inverter. It also uses two OR-NAND gates which work as selectors; we reconfigure the construction of the ring oscillator (RO) in DVMC when calibrating the DTC inverter. The proposed scheme accomplishes more accurate calibration compared to the traditional calibration which only uses the variable clock generator. For example, when using a variable clock generator with the resolution of 5.2ps, the resolution of the proposed method is 0.58ps while the traditional method is 5.2ps.
本文提出了一种新的延迟值测量电路(DVMC)的校准方法,该电路是一类嵌入式时数字转换器(TDC),使用可变时钟发生器进行精确的延迟测量。该方法采用了一种校准设计和一个可变时钟发生器。该设计采用延时可控(DTC)逆变器。它还使用两个OR-NAND门作为选择器;在标定DTC逆变器时,对DVMC中环形振荡器(RO)的结构进行了重新配置。与仅使用可变时钟发生器的传统校准方法相比,该方法实现了更精确的校准。例如,当使用分辨率为5.2ps的可变时钟发生器时,本文方法的分辨率为0.58ps,而传统方法的分辨率为5.2ps。
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引用次数: 2
Size Optimization Technique for Logic Circuits that Considers BTI and Process Variations 考虑BTI和工艺变化的逻辑电路尺寸优化技术
Q4 Engineering Pub Date : 2016-01-01 DOI: 10.2197/ipsjtsldm.9.72
M. Yabuuchi, Kazutoshi Kobayashi
In this paper we outline a transistor size optimization technique for logic circuits that takes into account BTI (Bias Temperature Instability) and process variations. We demonstrate the accuracy of our results with statistical analysis. Since variations have a large impact on the scaling process, dependable circuit designs should include a quantitative analysis if they are to become more reliable in the future. In this study we used an algorithm to prove that with our technique we efficiently lowered the timing margin of the logic path by 4.4% below the margin achieved by conventional techniques. We also observed that the lifetime of the optimized circuits extended without any area overhead.
在本文中,我们概述了一种考虑BTI(偏置温度不稳定性)和工艺变化的逻辑电路晶体管尺寸优化技术。我们用统计分析来证明结果的准确性。由于变化对缩放过程有很大的影响,可靠的电路设计应该包括定量分析,如果它们在未来变得更可靠。在这项研究中,我们使用了一种算法来证明,通过我们的技术,我们有效地将逻辑路径的时间裕度降低了4.4%,低于传统技术所达到的裕度。我们还观察到优化电路的寿命在没有任何面积开销的情况下延长。
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引用次数: 3
A Fast Trace Aware Statistical Based Prediction Model with Burst Traffic Modeling for Contention Stall in A Priority Based MPSoC Bus 基于优先级的MPSoC总线竞争失速突发流量建模的快速跟踪感知统计预测模型
Q4 Engineering Pub Date : 2016-01-01 DOI: 10.2197/ipsjtsldm.9.37
F. Shafiq, T. Isshiki, Dongju Li, H. Kunieda
: While Multiprocessor System-On-Chips (MPSoCs) are becoming widely adopted in embedded systems, communication architecture analysis for MPSoCs becomes ever more complex. There is a growing need for faster and accurate performance estimation techniques for on-chip bus architecture. This paper presents a novel fast statis- tical based bus stall prediction model that enables estimating the e ff ects of bus-contention stall on the cycle-count of an application program on a subject MPSoC architecture. Our technique fills the gap in existing techniques for bus performance estimation, that are either not accurate enough (e.g. static techniques) or too slow to be used in iterative analysis (e.g. cycle by cycle arbitration simulation on every bus access). First we formulate a model named “single blocking model” that models blocking of a single bus request due to a single bus transfer on another bus master at a time. Furthermore we augment this model with a “burst blocking model” that models bus stall incurred due to burst bus transfers. Together these two models give us a very fast way to predict bus stalls on an MPSoC bus. It is as-sumed that each Processor in the system has a distinct fixed priority, and arbitration is based on priority. The proposed technique makes use of accumulated “workload statistics” to accurately predict the “stall cycle counts” caused due to bus contention. This eliminates the need to simulate arbitration on every bus access, resulting in substantial speed-up. Proposed technique is verified by experiments on applications such as “synthetic tra ffi c generators”, “Newton-Euler dynamic control calculation for the 6-degrees-of-freedom Stanford manipulator benchmark”, “Random sparse matrix solver for electronic circuit simulations benchmark”, “Fast Fourier Transform with 1024 inputs of complex numbers” and “SPEC95 Fpppp which is a chemical program performing multi-electron integral derivatives”. Experimental re- sults show that the proposed method delivers a speed-up factor of 1.33, 1.7, 74 and 6 against the simulation method for the four benchmark applications respectively, while average estimation error is 7% for benchmark application, “Fast Fourier Transform with 1024 inputs of complex numbers” and under 1% for other benchmarks.
随着多处理器片上系统(mpsoc)在嵌入式系统中的广泛应用,mpsoc的通信体系结构分析变得越来越复杂。对于片上总线体系结构,越来越需要更快、更准确的性能评估技术。本文提出了一种新的基于统计的总线失速预测模型,该模型能够估计总线争用失速对特定MPSoC架构下应用程序周期数的影响。我们的技术填补了现有总线性能评估技术的空白,这些技术要么不够准确(例如静态技术),要么太慢,无法用于迭代分析(例如,在每个总线访问上逐个周期仲裁模拟)。首先,我们制定了一个名为“单阻塞模型”的模型,该模型模拟了由于在另一个总线主上进行单个总线传输而导致的单个总线请求阻塞。此外,我们用“突发阻塞模型”对该模型进行了扩充,该模型对突发公交换乘引起的公交失速进行了建模。这两个模型一起为我们提供了一种非常快速的方法来预测MPSoC总线上的总线失速。假设系统中的每个处理器都有不同的固定优先级,并且仲裁是基于优先级的。所提出的技术利用累积的“工作负载统计信息”来准确预测由于总线争用而导致的“失速周期计数”。这消除了在每个总线访问上模拟仲裁的需要,从而大大提高了速度。在“合成流量发生器”、“6自由度斯坦福操纵器基准的牛顿-欧拉动态控制计算”、“电子电路模拟基准的随机稀疏矩阵求解器”、“1024个复数输入的快速傅立叶变换”和“执行多电子积分导数的化学程序SPEC95 Fpppp”等应用中进行了实验验证。实验结果表明,该方法在4种基准应用中分别比仿真方法加速系数为1.33、1.7、74和6,在“1024个复数输入的快速傅里叶变换”基准应用中平均估计误差为7%,在其他基准测试中平均估计误差小于1%。
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引用次数: 1
A Delta-Sigma ADC with Stochastic Quantization 具有随机量化的δ - σ ADC
Q4 Engineering Pub Date : 2015-08-01 DOI: 10.2197/ipsjtsldm.8.123
Yusaku Hirai, Shinya Yano, T. Matsuoka
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引用次数: 8
A 3D FPGA Architecture to Realize Simple Die Stacking 一种3D FPGA架构实现简单的芯片堆叠
Q4 Engineering Pub Date : 2015-02-01 DOI: 10.2197/ipsjtsldm.8.116
M. Amagasaki, Qian Zhao, M. Iida, M. Kuga, T. Sueyoshi
To balance between cost and performance, and to explore 3D field-programmable gate array (FPGA) with realistic 3D integration processes, we propose spatially distributed and functionally distributed types of 3D FPGA architectures. The functionally distributed architecture consists of two wafers, a logic layer and a routing layer, and is stacked by a face-down process technology. Since vertical wires pass through microbumps, no TSVs are needed. In contrast, the spatially distributed architecture is divided into multiple layers with the same structure, unlike in the functionally distributed type. This architecture can be expanded to more than two layers by stacking multiples of the same die. The goal of this paper is to elucidate the advantages and disadvantages of these two types of 3D FPGAs. According to our evaluation, when only two layers are used, the functionally distributed architecture is more effective. When higher performance is achieved by using more than two layers, the spatially distributed architecture achieves better performance.
为了平衡成本和性能,并探索具有现实3D集成过程的3D现场可编程门阵列(FPGA),我们提出了空间分布和功能分布类型的3D FPGA架构。功能分布式架构由逻辑层和路由层两个晶圆组成,并采用面朝下的工艺技术堆叠。由于垂直电线穿过微凸起,所以不需要tsv。而空间分布式的建筑则不同于功能分布式的建筑,它被划分为多层,结构相同。这种架构可以通过堆叠多个相同的骰子扩展到两层以上。本文的目的是阐明这两种类型的三维fpga的优缺点。根据我们的评估,当只使用两层时,功能分布式架构更有效。当使用两层以上的层可以获得更高的性能时,空间分布式架构可以获得更好的性能。
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引用次数: 1
High-level Synthesis for Low-power Design 低功耗设计的高水平综合
Q4 Engineering Pub Date : 2015-02-01 DOI: 10.2197/ipsjtsldm.8.12
Zhiru Zhang, Deming Chen, Steve Dai, K. Campbell
Power and energy efficiency have emerged as first-order design constraints across the computing spectrum from handheld devices to warehouse-sized datacenters. As the number of transistors continues to scale, effectively managing design complexity under stringent power constraints has become an imminent challenge of the IC industry. The manual process of power optimization in RTL design has been increasingly difficult, if not already unsustainable. Complexity scaling dictates that this process must be automated with robust analysis and synthesis algorithms at a higher level of abstraction. Along this line, high-level synthesis (HLS) is a promising technology to improve design productivity and enable new opportunities for power optimization for higher design quality. By allowing early access to the system architecture, high-level decisions during HLS can have a significant impact on the power and energy efficiency of the synthesized design. In this paper, we will discuss the recent research development of using HLS to effectively explore a multi-dimensional design space and derive low-power implementations. We provide an in-depth coverage of HLS low-power optimization techniques and synthesis algorithms proposed in the last decade. We will also describe the key power optimization challenges facing HLS today and outline potential opportunities in tackling these challenges.
从手持设备到仓库大小的数据中心,功率和能源效率已经成为整个计算领域的一级设计约束。随着晶体管数量的不断扩大,在严格的功率限制下有效地管理设计复杂性已成为集成电路行业迫在眉睫的挑战。RTL设计中功率优化的手动过程已经变得越来越困难,如果不是已经不可持续的话。复杂性缩放决定了这个过程必须在更高的抽象层次上使用健壮的分析和合成算法来自动化。沿着这条路线,高级综合(HLS)是一种很有前途的技术,可以提高设计生产力,并为更高设计质量的功率优化提供新的机会。通过允许早期访问系统架构,HLS期间的高级决策可以对综合设计的功率和能源效率产生重大影响。在本文中,我们将讨论使用HLS来有效探索多维设计空间并获得低功耗实现的最新研究进展。我们提供了近十年来提出的HLS低功耗优化技术和综合算法的深入报道。我们还将描述HLS目前面临的主要电源优化挑战,并概述解决这些挑战的潜在机会。
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引用次数: 22
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IPSJ Transactions on System LSI Design Methodology
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