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2016 IEEE 19th International Symposium on Design and Diagnostics of Electronic Circuits & Systems (DDECS)最新文献

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Comparison of gate-driven and bulk-driven current mirror topologies 栅极驱动和块驱动电流镜像拓扑的比较
Matej Rakus, V. Stopjaková, D. Arbet
In this paper, different topologies of gate-driven and bulk-driven current mirrors designed in 90 nm CMOS technology are presented. Since the conventional MOS transistors can work as a bulk-driven device, there is no need for any modification of the existing MOSFET structure or technology process. The bulk-driven current mirror is capable of operating at power supplies down to the threshold voltage of a standard MOS device. Bulk-driven current mirror topologies were compared to their gate-driven equivalents in terms of main properties and output characteristics. The achieved results prove that the bulk-driven design technique is very promising towards ultra low-voltage analog ICs.
本文介绍了采用90纳米CMOS技术设计的栅极驱动和块体驱动电流镜的不同拓扑结构。由于传统的MOS晶体管可以作为体积驱动器件工作,因此不需要对现有的MOSFET结构或技术过程进行任何修改。体积驱动的电流反射镜能够在低至标准MOS器件的阈值电压的电源下工作。在主要特性和输出特性方面,将块驱动的电流镜像拓扑与栅极驱动的等效拓扑进行了比较。实验结果表明,体积驱动设计技术在超低电压模拟集成电路领域具有广阔的应用前景。
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引用次数: 14
Precision human body temperature measurement based on thermistor sensor 基于热敏电阻传感器的精确人体温度测量
Paweł Narczyk, Krzysztof Siwiec, W. Pleskacz
An analog front-end, with a new temperature calibration method, for an accurate temperature measurement of a human body has been presented. The discussed AFE consists of a current reference, a precision current source, a programmable gain amplifier, a voltage source proportional to absolute temperature and on-chip temperature calibration resistor. Human body temperature can be measured in the range from +25 °C to +45 °C at the operating temperature of an IC in the range from -40 °C to +125 °C with 0.1 °C precision. The presented analog front-end consumes no more than 180 uW and was designed in UMC CMOS 130 nm technology.
提出了一种模拟前端和一种新的温度校准方法,用于人体温度的精确测量。所讨论的AFE由一个电流基准、一个精密电流源、一个可编程增益放大器、一个与绝对温度成比例的电压源和片上温度校准电阻组成。在IC工作温度为-40℃~ +125℃的情况下,人体温度的测量范围为+25℃~ +45℃,精度为0.1℃。模拟前端功耗不超过180uw,采用UMC CMOS 130nm工艺设计。
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引用次数: 25
Implementation of DBFN processor for Synthetic Aperture Radar application DBFN处理器在合成孔径雷达应用中的实现
O. Schrape, A. Koczor, P. Penkala, V. Petrovic, M. Krstic
One of the main reasons why Synthetic Aperture Radar (SAR) is an attractive solution for earth surface screening applications is its reliability independent on the weather conditions. This paper presents the implementation details of digital beamforming baseband core processor for such a SAR system. The processor chip is part of a distributed beamforming network (DBFN) of 16 baseband processors where each one processes data obtained from four 210MSPS ADC cores. Due to requirements related to space environment, the baseband is implemented in radiation-tolerant manner in order to temper single event effects (SEE). Instead of full-chip protection, the baseband processor uses only partially radhard flip-flops. This trade-off saves 25.87 % of silicon area based on gate-level synthesis results. A prototype is produced in a low-cost variant of a 0.25 μm BiCMOS process. First measurement results show an average operating current of 445.49 mA at a clock speed of 210 MHz and a 2.5 V power supply.
合成孔径雷达(SAR)在地球表面筛选应用中具有吸引力的主要原因之一是其不受天气条件影响的可靠性。本文给出了数字波束形成基带核心处理器的实现细节。处理器芯片是由16个基带处理器组成的分布式波束形成网络(DBFN)的一部分,其中每个处理器处理从四个210MSPS ADC内核获得的数据。由于空间环境的要求,基带采用耐辐射方式实现,以缓和单事件效应(SEE)。基带处理器只使用部分硬触发器,而不是全芯片保护。基于栅极级合成结果,这种折衷节省了25.87%的硅面积。在0.25 μm BiCMOS工艺的低成本变体中生产了原型。第一次测量结果显示,在时钟速度为210 MHz和2.5 V电源下,平均工作电流为445.49 mA。
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引用次数: 4
A fault injection platform for the analysis of soft error effects in FPGA soft processors FPGA软处理器软误差效应分析的故障注入平台
Aitzan Sari, M. Psarakis
Soft processors in SRAM-based FPGAs are gaining acceptance as enabling technology for building embedded systems in several market domains, even for critical applications such as space, transportation and medical devices. However, due to the high vulnerability of SRAM-based FPGAs to single-event upsets (SEUs), which is expected to be aggravated in the future, as FPGA devices are moving aggressively to the nanometer regime, the hardening of soft processors against soft errors will become a major design issue especially for critical applications. Most SEU mitigation approaches proposed in the past are based on the triplication or duplication techniques, thus imposing significant area and performance overheads. A more detailed analysis of the soft error sensitivity of FPGA soft processor and their faulty behavior will enable the development of efficient, low-cost hardening techniques. To this end, we present a fault injection platform based on an open-source CAD framework (RapidSmith) for the analysis of soft error effects in Xilinx FPGA soft processors. Our platform supports the estimation of soft error sensitivity per configuration bit/frame, processor component and benchmark. An on-chip microcontroller is used to inject and correct soft errors in the configuration memory and monitor target processor behavior. It includes a custom peripheral to monitor and record specific processor signals (e.g. exception signals, performance counters) which may manifest the effects of soft errors. The proposed platform is demonstrated through an extensive fault injection campaign in the Leon3 soft processor. The novelty of the framework is it's availability as open-source fault-injection tool designed to target soft processors and the introduction of fault identification by using performance counter.
基于sram的fpga中的软处理器正在获得认可,作为在多个市场领域构建嵌入式系统的使能技术,甚至适用于空间,运输和医疗设备等关键应用。然而,由于基于sram的FPGA对单事件干扰(seu)的高度脆弱性,预计在未来会加剧,因为FPGA器件正在积极地向纳米方向发展,软处理器针对软错误的硬化将成为一个主要的设计问题,特别是对于关键应用。过去提出的大多数SEU缓解方法都是基于复制或复制技术,因此带来了巨大的面积和性能开销。更详细地分析FPGA软处理器的软误差敏感性及其故障行为将有助于开发高效、低成本的硬化技术。为此,我们提出了一个基于开源CAD框架(RapidSmith)的故障注入平台,用于分析Xilinx FPGA软处理器中的软误差效应。我们的平台支持每个配置位/帧、处理器组件和基准的软错误灵敏度估计。片上微控制器用于注入和纠正配置存储器中的软错误,并监视目标处理器的行为。它包括一个自定义外设,用于监视和记录可能显示软错误影响的特定处理器信号(例如异常信号,性能计数器)。通过在Leon3软处理器中进行广泛的故障注入活动来演示所提出的平台。该框架的新颖之处在于它可以作为针对软处理器设计的开源故障注入工具,并通过使用性能计数器引入故障识别。
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引用次数: 10
Low-voltage bulk-driven variable gain amplifier in 130 nm CMOS technology 130nm CMOS技术的低压体驱动可变增益放大器
D. Arbet, M. Kovác, L. Nagy, V. Stopjaková, J. Brenkus
In this paper, a variable gain amplifier designed in 130 nm CMOS technology is presented. The proposed amplifier is based on the bulk-driven approach, which brings a possibility to operate with low supply voltage (i.e. 0.6 V). Since the supply voltage of only 0.6 V is used for the amplifier to operate, there is no latchup risk that usually represents the main drawback of the bulk-driven approach. As an input stage, bulk driven transistors are used, which makes possible to operate in the rail-to-rail input voltage range. Achieved simulation results indicate that gain of the proposed VGA can be varied in a wide range, which together with the low supply voltage feature make the proposed amplifier useful for low-voltage and low-power applications.
本文介绍了一种采用130 nm CMOS技术设计的可变增益放大器。所提出的放大器基于批量驱动方法,这带来了在低电源电压(即0.6 V)下工作的可能性。由于仅使用0.6 V的电源电压用于放大器工作,因此没有锁存风险,这通常代表了批量驱动方法的主要缺点。作为输入级,使用了体驱动晶体管,这使得在轨到轨输入电压范围内工作成为可能。仿真结果表明,所提出的VGA增益可以在很大范围内变化,加上低电源电压的特点,使所提出的放大器适用于低电压和低功耗的应用。
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引用次数: 11
期刊
2016 IEEE 19th International Symposium on Design and Diagnostics of Electronic Circuits & Systems (DDECS)
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