In this work we model the effects of depositing gold nanospheres of varying radii and spatial separations onto a 500nm film of silicon in an effort to couple more light into silicon through the localized surface plasmon resonance (LSPR) of the nanoparticles. To further enhance the field at the interface, we study the effect of embedding the spheres within the dielectrics air, NBK7, and titanium dioxide (TiO2). The modeling is done through finite element analysis via COMSOL over the radiation spectrum (0.4μm 1.5μm) of the sun. A positive size dependency of the light coupled into silicon and the radii of the spheres is found and analyzed. Use of dielectrics greater than air, NBK7 and TiO2, results in greater field enhancement at the silicon interface.
{"title":"Solar cell enhancement using metallic nanoparticles embedded in titanium dioxide","authors":"Max A. Burnett, K. Allen, M. Fiddy","doi":"10.1117/12.2080077","DOIUrl":"https://doi.org/10.1117/12.2080077","url":null,"abstract":"In this work we model the effects of depositing gold nanospheres of varying radii and spatial separations onto a 500nm film of silicon in an effort to couple more light into silicon through the localized surface plasmon resonance (LSPR) of the nanoparticles. To further enhance the field at the interface, we study the effect of embedding the spheres within the dielectrics air, NBK7, and titanium dioxide (TiO2). The modeling is done through finite element analysis via COMSOL over the radiation spectrum (0.4μm 1.5μm) of the sun. A positive size dependency of the light coupled into silicon and the radii of the spheres is found and analyzed. Use of dielectrics greater than air, NBK7 and TiO2, results in greater field enhancement at the silicon interface.","PeriodicalId":432115,"journal":{"name":"Photonics West - Optoelectronic Materials and Devices","volume":"73 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129622048","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
E. Gorbunova, A. Chertov, V. Peretyagin, E. A. Lastovskaia, V. Korotaev
Quality control of different coatings (colorful, paint, marker, safety, etc.) that are applied to the surface of various objects (both metallic and non-metallic) is an important problem. Also, there is a problem of dealing with counterfeit products. So it’s necessary to distinguish the fake replicas of marking from the authentic marking of producer. To solve these problems, we propose an automated apparatus for analysis and control of spectral reflection characteristics, albedo and color parameters of extended (up to 150 mm × 150 mm) flat objects. It allows constructing the color image of the object surface as well as its multispectral images in different regions of the spectrum. Herewith the color of the object surface can be calculated for various standard light sources (A, B, C, D65, E, F2, F7, F11, GE), or to any light source with a predetermined emission spectrum. The paper presents the description of working principles of the proposed apparatus as well as the results of reflection and multispectral analysis of different flat objects.
{"title":"The area of applicability of apparatus for analyzing the spectral characteristics of reflection, albedo and color parameters of flat objects","authors":"E. Gorbunova, A. Chertov, V. Peretyagin, E. A. Lastovskaia, V. Korotaev","doi":"10.1117/12.2081568","DOIUrl":"https://doi.org/10.1117/12.2081568","url":null,"abstract":"Quality control of different coatings (colorful, paint, marker, safety, etc.) that are applied to the surface of various objects (both metallic and non-metallic) is an important problem. Also, there is a problem of dealing with counterfeit products. So it’s necessary to distinguish the fake replicas of marking from the authentic marking of producer. To solve these problems, we propose an automated apparatus for analysis and control of spectral reflection characteristics, albedo and color parameters of extended (up to 150 mm × 150 mm) flat objects. It allows constructing the color image of the object surface as well as its multispectral images in different regions of the spectrum. Herewith the color of the object surface can be calculated for various standard light sources (A, B, C, D65, E, F2, F7, F11, GE), or to any light source with a predetermined emission spectrum. The paper presents the description of working principles of the proposed apparatus as well as the results of reflection and multispectral analysis of different flat objects.","PeriodicalId":432115,"journal":{"name":"Photonics West - Optoelectronic Materials and Devices","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127260559","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
A. Nikitin, J. Sheldakova, A. Kudryashov, D. Denisov, V. Karasik, A. Sakharov
In this paper we consider two approaches widely used in optical testing: Shack-Hartmann wavefront sensor and Fizeau interferometer technique. Fizeau interferometer that is widely used in optical testing can be easily transformed to a device using Shack-Hartmann wavefront sensor, the alternative technique to check optical components. We call this device Hartmannometer, and compare its features to those of Fizeau interferometer.
{"title":"Hartmannometer versus Fizeau Interferometer: advantages and drawbacks","authors":"A. Nikitin, J. Sheldakova, A. Kudryashov, D. Denisov, V. Karasik, A. Sakharov","doi":"10.1117/12.2085263","DOIUrl":"https://doi.org/10.1117/12.2085263","url":null,"abstract":"In this paper we consider two approaches widely used in optical testing: Shack-Hartmann wavefront sensor and Fizeau interferometer technique. Fizeau interferometer that is widely used in optical testing can be easily transformed to a device using Shack-Hartmann wavefront sensor, the alternative technique to check optical components. We call this device Hartmannometer, and compare its features to those of Fizeau interferometer.","PeriodicalId":432115,"journal":{"name":"Photonics West - Optoelectronic Materials and Devices","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125066832","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
E. A. Lastovskaia, E. Gorbunova, A. Chertov, V. Korotaev
The relevance of noninvasive method for determining the blood sugar is caused by necessity of regular monitoring of glucose levels in diabetic patients blood. Traditional invasive method is painful, because it requires a finger pricking. Despite the active studies in the field of non-invasive medical diagnostics, to date the painless and inexpensive instrument for blood sugar control for personal use doesn't exist. It's possible to measure the concentration of glucose in the blood with help of spectrophotometry method. It consists of registering and analyzing the spectral characteristics of the radiation which missed, reflected or absorbed by the object. The authors proposed a measuring scheme for studying the spectral characteristics of the radiation, missed by earlobe. Ultra-violet, visible and near infrared spectral ranges are considered. The paper presents the description of construction and working principles of the proposed special retaining clip and results of experiment with real patient.
{"title":"Investigation of opportunities of the optical non-invasive diagnostics method for the blood sugar control","authors":"E. A. Lastovskaia, E. Gorbunova, A. Chertov, V. Korotaev","doi":"10.1117/12.2081651","DOIUrl":"https://doi.org/10.1117/12.2081651","url":null,"abstract":"The relevance of noninvasive method for determining the blood sugar is caused by necessity of regular monitoring of glucose levels in diabetic patients blood. Traditional invasive method is painful, because it requires a finger pricking. Despite the active studies in the field of non-invasive medical diagnostics, to date the painless and inexpensive instrument for blood sugar control for personal use doesn't exist. It's possible to measure the concentration of glucose in the blood with help of spectrophotometry method. It consists of registering and analyzing the spectral characteristics of the radiation which missed, reflected or absorbed by the object. The authors proposed a measuring scheme for studying the spectral characteristics of the radiation, missed by earlobe. Ultra-violet, visible and near infrared spectral ranges are considered. The paper presents the description of construction and working principles of the proposed special retaining clip and results of experiment with real patient.","PeriodicalId":432115,"journal":{"name":"Photonics West - Optoelectronic Materials and Devices","volume":"130 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133973619","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Gyungock Kim, I. Kim, Sanghoon Kim, Jiho Joo, Ki-seok Jang, Sun Ae Kim, J. Oh, Jeong Woo Park, Myung-Joon Kwack, Jaegyu Park, Hyundai Park, Gun Sik Park, Sanggi Kim
Based on either a SOI wafer or a bulk-silicon wafer, we discuss silicon photonic devices and integrations for chip-level optical interconnects. We present the low-voltage silicon PICs on a SOI wafer, where Si modulators and Ge-on-Si photodetectors are monolithically-integrated for intra-chip or inter-chip interconnects over 40 Gb/s. For future chip-level integration, the 50 Gb/s small-sized depletion-type MZ modulator with the vertically-dipped PN-depletion-junction (VDJ) is also presented. We report vertical-illumination-type Ge photodetectors on bulk-silicon wafers, with high performances up to 50 Gb/s. We present the bulk-silicon platform for practical implementation of chip-level interconnects, and the performance of the photonic transceiver silicon chip.
{"title":"Silicon photonic devices based on SOI/bulk-silicon platforms for chip-level optical interconnects","authors":"Gyungock Kim, I. Kim, Sanghoon Kim, Jiho Joo, Ki-seok Jang, Sun Ae Kim, J. Oh, Jeong Woo Park, Myung-Joon Kwack, Jaegyu Park, Hyundai Park, Gun Sik Park, Sanggi Kim","doi":"10.1117/12.2078493","DOIUrl":"https://doi.org/10.1117/12.2078493","url":null,"abstract":"Based on either a SOI wafer or a bulk-silicon wafer, we discuss silicon photonic devices and integrations for chip-level optical interconnects. We present the low-voltage silicon PICs on a SOI wafer, where Si modulators and Ge-on-Si photodetectors are monolithically-integrated for intra-chip or inter-chip interconnects over 40 Gb/s. For future chip-level integration, the 50 Gb/s small-sized depletion-type MZ modulator with the vertically-dipped PN-depletion-junction (VDJ) is also presented. We report vertical-illumination-type Ge photodetectors on bulk-silicon wafers, with high performances up to 50 Gb/s. We present the bulk-silicon platform for practical implementation of chip-level interconnects, and the performance of the photonic transceiver silicon chip.","PeriodicalId":432115,"journal":{"name":"Photonics West - Optoelectronic Materials and Devices","volume":"118 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127167426","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Ruichen Tao, Takehiro Hayashi, M. Kagami, S. Kobayashi, Manabu Yasukawa, Hui Yang, D. Robinson, H. Baghsiahi, F. Fernández, David R. Selviah
A stable reproducible optical standard source for measuring multimode optical fiber attenuation is required as recent round robin measurements of such fibers at several international companies and national standards organizations showed significant variation when using a source having only the encircled flux in the near field emerging from it defined. The paper presents and compares the far field modal power distributions for (i) 2 km and 3 km step-index multimode Hard Plastic Cladding Fibers, HPCF, (SI-MMF) with 200 μm silica core diameter, 0.37 numerical aperture (NA) and polymer cladding, (ii) a 10 m silica graded-index multimode fiber (GI-MMF) with 50 μm core diameter and 0.2 NA, and (ii) a near field Encircled Flux Mode Convertor or “modcon”. A free space method for measuring the far field using a Lightemitting diode (LED) centered at 850 nm wavelength with 40 nm 10 dB-bandwidth and a charge-coupled device (CCD) camera is compared with a f-theta multi-element lens based far field pattern (FFP) system. Mandrels of different diameter and different numbers of turns of the fiber around them were used to achieve an equilibrium mode distribution (EMD) for the GI-MMF. The paper defines encircled angular flux (EAF) as the fraction of the total optical power radiating from a multimode optical fiber core within a certain solid angle in the far field. The paper calculates the EAF when the solid angle increases from the far field centroid.
{"title":"Equilibrium modal power distribution measurement of step-index hard plastic cladding and graded-index silica multimode fibers","authors":"Ruichen Tao, Takehiro Hayashi, M. Kagami, S. Kobayashi, Manabu Yasukawa, Hui Yang, D. Robinson, H. Baghsiahi, F. Fernández, David R. Selviah","doi":"10.1117/12.2079355","DOIUrl":"https://doi.org/10.1117/12.2079355","url":null,"abstract":"A stable reproducible optical standard source for measuring multimode optical fiber attenuation is required as recent round robin measurements of such fibers at several international companies and national standards organizations showed significant variation when using a source having only the encircled flux in the near field emerging from it defined. The paper presents and compares the far field modal power distributions for (i) 2 km and 3 km step-index multimode Hard Plastic Cladding Fibers, HPCF, (SI-MMF) with 200 μm silica core diameter, 0.37 numerical aperture (NA) and polymer cladding, (ii) a 10 m silica graded-index multimode fiber (GI-MMF) with 50 μm core diameter and 0.2 NA, and (ii) a near field Encircled Flux Mode Convertor or “modcon”. A free space method for measuring the far field using a Lightemitting diode (LED) centered at 850 nm wavelength with 40 nm 10 dB-bandwidth and a charge-coupled device (CCD) camera is compared with a f-theta multi-element lens based far field pattern (FFP) system. Mandrels of different diameter and different numbers of turns of the fiber around them were used to achieve an equilibrium mode distribution (EMD) for the GI-MMF. The paper defines encircled angular flux (EAF) as the fraction of the total optical power radiating from a multimode optical fiber core within a certain solid angle in the far field. The paper calculates the EAF when the solid angle increases from the far field centroid.","PeriodicalId":432115,"journal":{"name":"Photonics West - Optoelectronic Materials and Devices","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124878761","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
M. Karppinen, N. Salminen, T. Korhonen, T. Alajoki, Jarno Petäjä, E. Bosman, G. Van Steenberge, J. Justice, U. Khan, B. Corbett, A. Boersma
Polymer-based integrated optics is attractive for inter-chip optical interconnection applications, for instance, for coupling photonic devices to fibers in high density packaging. In such a hybrid integration scheme, a key challenge is to achieve efficient optical coupling between the photonic chips and waveguides. With the single-mode polymer waveguides, the alignment tolerances become especially critical as compared to the typical accuracies of the patterning processes. We study novel techniques for such coupling requirements. In this paper, we present a waveguide-embedded micro-mirror structure, which can be aligned with high precision, even active alignment method is possible. The structure enables 90 degree bend coupling between a single-mode waveguide and a vertical-emitting/detecting chip, such as, a VCSEL or photodiode, which is embedded under the waveguide layer. Both the mirror structure and low-loss polymer waveguides are fabricated in a process based mainly on the direct-pattern UV nanoimprinting technology and on the use of UVcurable polymeric materials. Fabrication results of the coupling structure with waveguides are presented, and the critical alignment tolerances and manufacturability issues are discussed.
{"title":"Optical coupling structure made by imprinting between single-mode polymer waveguide and embedded VCSEL","authors":"M. Karppinen, N. Salminen, T. Korhonen, T. Alajoki, Jarno Petäjä, E. Bosman, G. Van Steenberge, J. Justice, U. Khan, B. Corbett, A. Boersma","doi":"10.1117/12.2082935","DOIUrl":"https://doi.org/10.1117/12.2082935","url":null,"abstract":"Polymer-based integrated optics is attractive for inter-chip optical interconnection applications, for instance, for coupling photonic devices to fibers in high density packaging. In such a hybrid integration scheme, a key challenge is to achieve efficient optical coupling between the photonic chips and waveguides. With the single-mode polymer waveguides, the alignment tolerances become especially critical as compared to the typical accuracies of the patterning processes. We study novel techniques for such coupling requirements. In this paper, we present a waveguide-embedded micro-mirror structure, which can be aligned with high precision, even active alignment method is possible. The structure enables 90 degree bend coupling between a single-mode waveguide and a vertical-emitting/detecting chip, such as, a VCSEL or photodiode, which is embedded under the waveguide layer. Both the mirror structure and low-loss polymer waveguides are fabricated in a process based mainly on the direct-pattern UV nanoimprinting technology and on the use of UVcurable polymeric materials. Fabrication results of the coupling structure with waveguides are presented, and the critical alignment tolerances and manufacturability issues are discussed.","PeriodicalId":432115,"journal":{"name":"Photonics West - Optoelectronic Materials and Devices","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121970893","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
S. Chuang, D. Schoellner, A. Ugolini, J. Wakjira, G. Wolf, P. Gandhi, A. Persaud
As the implementation of parallel optics continues to evolve, development of a universal coupling interface between VCSEL/PD arrays and the corresponding photonic turn connector is necessary. A newly developed monolithic mechanical-optical interface efficiently couples optical transmit/receive arrays to the accompanying fiber optic connector. This paper describes the optical model behind the coupling interface and validates the model using empirical measurements. Optical modeling will address how the interface is adaptable to the broad range of VCSEL/PD optical parameters from commercially available VCSEL hardware manufacturers; the optical model will illustrate coupling efficiencies versus launch specifications. Theoretical modeling will examine system sensitivity through Monte Carlo simulations and provide alignment tolerance requirements. Empirical results will be presented to validate the optical model predictions and subsequent system performance. Functionality will be demonstrated through optical loss and coupling efficiency measurements. System metrics will include characterizations such as eye diagram results and link loss measurements.
{"title":"Theoretical and empirical qualification of a mechanical-optical interface for parallel optics links","authors":"S. Chuang, D. Schoellner, A. Ugolini, J. Wakjira, G. Wolf, P. Gandhi, A. Persaud","doi":"10.1117/12.2077615","DOIUrl":"https://doi.org/10.1117/12.2077615","url":null,"abstract":"As the implementation of parallel optics continues to evolve, development of a universal coupling interface between VCSEL/PD arrays and the corresponding photonic turn connector is necessary. A newly developed monolithic mechanical-optical interface efficiently couples optical transmit/receive arrays to the accompanying fiber optic connector. This paper describes the optical model behind the coupling interface and validates the model using empirical measurements. Optical modeling will address how the interface is adaptable to the broad range of VCSEL/PD optical parameters from commercially available VCSEL hardware manufacturers; the optical model will illustrate coupling efficiencies versus launch specifications. Theoretical modeling will examine system sensitivity through Monte Carlo simulations and provide alignment tolerance requirements. Empirical results will be presented to validate the optical model predictions and subsequent system performance. Functionality will be demonstrated through optical loss and coupling efficiency measurements. System metrics will include characterizations such as eye diagram results and link loss measurements.","PeriodicalId":432115,"journal":{"name":"Photonics West - Optoelectronic Materials and Devices","volume":"2017 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127550277","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Data communication over Polymer Optical Fibers using Wavelength Division Multiplexing, offer high extension capabilities for the overall data rates. Here, a de/multiplexer as a key component was developed im PMMAusing an optical grating placed on an aspheric mirror by injection molding. A demonstrator is fabricated by directly machining it in the PMMA material by means of diamond turning technique. The paper presents the results of the different simulations followed by the development steps and the measurements done with the first demonstrator accompanied by the first BER measurements using a 4 channel WDM transmission The record 8.26 Gb/s data transmission based on the offline-processed discrete multitone modulation technique has been demonstrated over 100-m SI-POF at a bit-error ratio of 10-3.
{"title":"Polymeric demultiplexer component for wavelength division multiplex communication systems using polymer fibers","authors":"U. Fischer, S. Höll, M. Haupt, M. Joncic","doi":"10.1117/12.2077471","DOIUrl":"https://doi.org/10.1117/12.2077471","url":null,"abstract":"Data communication over Polymer Optical Fibers using Wavelength Division Multiplexing, offer high extension capabilities for the overall data rates. Here, a de/multiplexer as a key component was developed im PMMAusing an optical grating placed on an aspheric mirror by injection molding. A demonstrator is fabricated by directly machining it in the PMMA material by means of diamond turning technique. The paper presents the results of the different simulations followed by the development steps and the measurements done with the first demonstrator accompanied by the first BER measurements using a 4 channel WDM transmission The record 8.26 Gb/s data transmission based on the offline-processed discrete multitone modulation technique has been demonstrated over 100-m SI-POF at a bit-error ratio of 10-3.","PeriodicalId":432115,"journal":{"name":"Photonics West - Optoelectronic Materials and Devices","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116233125","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
R. Pitwon, Kai Wang, M. Immonen, Jinhua Wu, L. Zhu, H. Yan, A. Worrall
Widespread adoption of optical circuit boards will herald substantial performance, environmental and cost benefits for the data communications industry. Though optical circuit board technology has advanced considerably over the past decade, commercial maturity will be gated by the availability of conformity standards to forge future quality assurance procedures. One important prerequisite to this is a reliable test and measurement definition system, which is agnostic to the type of waveguide system under test and therefore can be applied to different optical circuit board technologies as well as being adaptable to future variants. A serious and common problem with the measurement of optical waveguide systems has been lack of proper definition of the measurement conditions for a given test regime, and consequently strong inconsistencies ensue in the results of measurements by different parties on the same test sample. We report on the development of a new measurement identification standard to force testers to capture sufficient information about the measurement conditions for a given optical circuit board such as to ensure consistency of measurement results within an acceptable margin. Furthermore we demonstrate how the application of the measurement identification system can bring about a dramatic improvement in results consistency, by comparative evaluation of the results on multimode polymer waveguide based optical circuit test boards from a large selection of testing organisations.
{"title":"International standardisation of optical circuit board measurement and fabrication procedures","authors":"R. Pitwon, Kai Wang, M. Immonen, Jinhua Wu, L. Zhu, H. Yan, A. Worrall","doi":"10.1117/12.2077654","DOIUrl":"https://doi.org/10.1117/12.2077654","url":null,"abstract":"Widespread adoption of optical circuit boards will herald substantial performance, environmental and cost benefits for the data communications industry. Though optical circuit board technology has advanced considerably over the past decade, commercial maturity will be gated by the availability of conformity standards to forge future quality assurance procedures. One important prerequisite to this is a reliable test and measurement definition system, which is agnostic to the type of waveguide system under test and therefore can be applied to different optical circuit board technologies as well as being adaptable to future variants. A serious and common problem with the measurement of optical waveguide systems has been lack of proper definition of the measurement conditions for a given test regime, and consequently strong inconsistencies ensue in the results of measurements by different parties on the same test sample. We report on the development of a new measurement identification standard to force testers to capture sufficient information about the measurement conditions for a given optical circuit board such as to ensure consistency of measurement results within an acceptable margin. Furthermore we demonstrate how the application of the measurement identification system can bring about a dramatic improvement in results consistency, by comparative evaluation of the results on multimode polymer waveguide based optical circuit test boards from a large selection of testing organisations.","PeriodicalId":432115,"journal":{"name":"Photonics West - Optoelectronic Materials and Devices","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116263953","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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