Silver pastes are widely used in semiconductor metallization processes, with silver powder accounting for the highest proportion of the paste components. The morphology and particle size of silver powder are key factors influencing sintering activity. Therefore, in this study, ascorbic acid and hydroquinone were respectively used as reducing agents to synthesize spherical silver particles with different particle sizes and surface characteristics via the liquid-phase reduction method. The effects of particle size and dispersants on sintering activity were systematically investigated. Multiple characterization techniques including Scanning Electron Microscopy (SEM), X-ray Diffraction (XRD), and Fourier Transform Infrared Spectroscopy (FTIR) were employed to deeply analyze the sintering mechanism of silver particles. The results show that smaller particle sizes can enhance sintering activity. Secondly, when hydroquinone is used as the reducing agent, the Ag2O formed during low-temperature sintering undergoes a formation-decomposition process that accelerates neck formation and densification, benefiting the subsequent high-temperature sintering. In addition, with BTA as the dispersant, its nitrogen atoms coordinate with silver particles to form Ag-N coordination bonds, thereby generating a surface film on the silver particles. This film effectively suppresses particle aggregation and can decompose at relatively low temperatures, promoting the early exposure of silver surfaces, which facilitates early sintering neck growth and the formation of a denser sintered network, thereby significantly enhancing the electrical performance of the silver paste.
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