首页 > 最新文献

2021 16th International Conference on Design & Technology of Integrated Systems in Nanoscale Era (DTIS)最新文献

英文 中文
Massive Multisite Variability-Aware Die Distribution Estimation for Analog/Mixed-Signal Circuits Test Validation 模拟/混合信号电路测试验证的大规模多站点可变感知芯片分布估计
Praise O. Farayola, Isaac Bruce, Shravan K. Chaganti, Abalhassan Sheikh, S. Ravi, Degang Chen
Massive multisite testing significantly reduces test cost and immensely increases production throughput by simultaneously screening multiple devices under test (DUTs). However, non-trivial variations in measurement from site to site are inevitable, and they often alter the actual DUTs specifications leading to yield loss (good DUTs rejected as bad) or necessitate poorer DUT specifications. These site-induced variations make it challenging to know the true silicon performance in a multisite probing environment, making statistical processing control difficult. In this paper, we propose and compare three methods to remove the variability introduced by multisite test hardware for accurate estimation of DUTs true performance distributions. The key idea is to select high confidence good test sites for parametric analysis. We demonstrate the accuracy of the proposed methods using simulation and measurement data.
通过同时筛选多个被测设备(dut),大规模多站点测试显著降低了测试成本,并极大地提高了生产吞吐量。然而,不同地点之间测量的重大变化是不可避免的,它们经常改变实际的DUT规格,导致产量损失(好的DUT被视为坏的而拒绝)或需要较差的DUT规格。这些位置引起的变化使得在多位置探测环境中了解硅的真实性能变得具有挑战性,使得统计处理控制变得困难。在本文中,我们提出并比较了三种消除多站点测试硬件引入的可变性的方法,以准确估计dut的真实性能分布。关键思想是选择高置信度好的测试点进行参数分析。我们用仿真和测量数据证明了所提出方法的准确性。
{"title":"Massive Multisite Variability-Aware Die Distribution Estimation for Analog/Mixed-Signal Circuits Test Validation","authors":"Praise O. Farayola, Isaac Bruce, Shravan K. Chaganti, Abalhassan Sheikh, S. Ravi, Degang Chen","doi":"10.1109/DTIS53253.2021.9505144","DOIUrl":"https://doi.org/10.1109/DTIS53253.2021.9505144","url":null,"abstract":"Massive multisite testing significantly reduces test cost and immensely increases production throughput by simultaneously screening multiple devices under test (DUTs). However, non-trivial variations in measurement from site to site are inevitable, and they often alter the actual DUTs specifications leading to yield loss (good DUTs rejected as bad) or necessitate poorer DUT specifications. These site-induced variations make it challenging to know the true silicon performance in a multisite probing environment, making statistical processing control difficult. In this paper, we propose and compare three methods to remove the variability introduced by multisite test hardware for accurate estimation of DUTs true performance distributions. The key idea is to select high confidence good test sites for parametric analysis. We demonstrate the accuracy of the proposed methods using simulation and measurement data.","PeriodicalId":435982,"journal":{"name":"2021 16th International Conference on Design & Technology of Integrated Systems in Nanoscale Era (DTIS)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-06-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134187144","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
RGB and 3D-Segmentation Data Combination for the Autonomous Object Manipulation in Personal Care Robotics RGB和3d分割数据组合用于个人护理机器人的自主对象操作
G. Mezzina, D. Venuto
This paper proposes the re-design of the functionalities of the personal care robot (PCR) Pepper by SoftBank Robotics. Pepper is mainly designed for verbal interaction with patients and despite the presence of two upper arms, it lacks object manipulation capabilities. In the proposed re-design, a combination of data from Pepper RGB camera and 3D depth sensor is used to identify and localize a specific pharmaceutical envelope in a dedicated repository. In this context, the semantic segmentation of the RGB image has been entrusted to a dedicated pretrained YOLOv3 object detector, while a dedicated algorithm has been realized for the hand (gripper) positioning. Basing on this 3D positional information, the PCR operates an ad-hoc designed routine to grasp the object and to scan it. Once the scanning procedure confirms that the grasping has been successfully completed and that the grasped package matches with the needed drug, the PCR must be able to safely navigate towards the user (e.g., physician, patient), delivering the drug. The proposed procedure is fully automatic, and no internet connection is needed for the nominal use case, preserving -in this way- sensitive data like home/hospital maps, patient’s data and so on. Experimental results on the here proposed object manipulation routine demonstrated a grasping success rate up to 96 %, even if the objects are not properly positioned in the dedicated repository. Finally, a proof of concept that implements a sequential pick-up, object recognition and delivery operation is also provided demonstrating real-life scenario applicability.
本文提出了个人护理机器人(PCR)胡椒由软银机器人的功能重新设计。Pepper主要用于与患者进行口头交流,尽管有两条上臂,但它缺乏物体操作能力。在提出的重新设计中,使用Pepper RGB相机和3D深度传感器的数据组合来识别和定位专用存储库中的特定药物信封。在这种情况下,RGB图像的语义分割被委托给一个专门的预训练的YOLOv3对象检测器,同时实现了一个专门的手(夹具)定位算法。基于这种三维位置信息,PCR操作一个特别设计的程序来抓取物体并扫描它。一旦扫描程序确认抓取已经成功完成,并且抓取的包装与所需的药物相匹配,PCR必须能够安全地导航到用户(例如,医生,病人),递送药物。所建议的程序是全自动的,并且在名义上的用例中不需要互联网连接,以这种方式保存敏感数据,如家庭/医院地图、患者数据等。本文提出的对象操作程序的实验结果表明,即使对象没有正确定位在专用存储库中,抓取成功率也高达96%。最后,还提供了实现顺序拾取,对象识别和交付操作的概念验证,以演示现实场景的适用性。
{"title":"RGB and 3D-Segmentation Data Combination for the Autonomous Object Manipulation in Personal Care Robotics","authors":"G. Mezzina, D. Venuto","doi":"10.1109/DTIS53253.2021.9505128","DOIUrl":"https://doi.org/10.1109/DTIS53253.2021.9505128","url":null,"abstract":"This paper proposes the re-design of the functionalities of the personal care robot (PCR) Pepper by SoftBank Robotics. Pepper is mainly designed for verbal interaction with patients and despite the presence of two upper arms, it lacks object manipulation capabilities. In the proposed re-design, a combination of data from Pepper RGB camera and 3D depth sensor is used to identify and localize a specific pharmaceutical envelope in a dedicated repository. In this context, the semantic segmentation of the RGB image has been entrusted to a dedicated pretrained YOLOv3 object detector, while a dedicated algorithm has been realized for the hand (gripper) positioning. Basing on this 3D positional information, the PCR operates an ad-hoc designed routine to grasp the object and to scan it. Once the scanning procedure confirms that the grasping has been successfully completed and that the grasped package matches with the needed drug, the PCR must be able to safely navigate towards the user (e.g., physician, patient), delivering the drug. The proposed procedure is fully automatic, and no internet connection is needed for the nominal use case, preserving -in this way- sensitive data like home/hospital maps, patient’s data and so on. Experimental results on the here proposed object manipulation routine demonstrated a grasping success rate up to 96 %, even if the objects are not properly positioned in the dedicated repository. Finally, a proof of concept that implements a sequential pick-up, object recognition and delivery operation is also provided demonstrating real-life scenario applicability.","PeriodicalId":435982,"journal":{"name":"2021 16th International Conference on Design & Technology of Integrated Systems in Nanoscale Era (DTIS)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-06-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126392188","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
[Copyright notice] (版权)
{"title":"[Copyright notice]","authors":"","doi":"10.1109/dtis53253.2021.9505141","DOIUrl":"https://doi.org/10.1109/dtis53253.2021.9505141","url":null,"abstract":"","PeriodicalId":435982,"journal":{"name":"2021 16th International Conference on Design & Technology of Integrated Systems in Nanoscale Era (DTIS)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-06-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114416485","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Power Side Channel Attacks: Where Are We Standing? 功率侧信道攻击:我们站在哪里?
M. Taouil, Abdullah Aljuffri, S. Hamdioui
Side channel attacks are a serious threat to integrated circuits. They are hardly detectable and use inherent information leaked by the hardware to infer sensitive information like secret keys. Over the last ten years, numerous side channel attacks have been examined, exploring various forms of leakage channels such as time, power, electromagnetic field, photon emission, and acoustic. Among them, power side channel attacks are the most popular ones. Developing an appropriate counter-measure against such attacks requires a deep understanding of these attacks. This paper presents a study of the most popular power attacks such as differential power attack and correlation power attack and discusses the latest countermeasures in this domain and their shortcomings.
侧信道攻击是集成电路面临的严重威胁。它们很难被检测到,并利用硬件泄露的固有信息来推断密钥等敏感信息。在过去的十年里,人们研究了许多侧通道攻击,探索了各种形式的泄漏通道,如时间、功率、电磁场、光子发射和声学。其中,功率侧信道攻击最为常见。针对此类攻击制定适当的对策需要对这些攻击有深入的了解。本文对差分功率攻击和相关功率攻击等最常见的功率攻击进行了研究,并讨论了该领域的最新对策及其不足。
{"title":"Power Side Channel Attacks: Where Are We Standing?","authors":"M. Taouil, Abdullah Aljuffri, S. Hamdioui","doi":"10.1109/DTIS53253.2021.9505075","DOIUrl":"https://doi.org/10.1109/DTIS53253.2021.9505075","url":null,"abstract":"Side channel attacks are a serious threat to integrated circuits. They are hardly detectable and use inherent information leaked by the hardware to infer sensitive information like secret keys. Over the last ten years, numerous side channel attacks have been examined, exploring various forms of leakage channels such as time, power, electromagnetic field, photon emission, and acoustic. Among them, power side channel attacks are the most popular ones. Developing an appropriate counter-measure against such attacks requires a deep understanding of these attacks. This paper presents a study of the most popular power attacks such as differential power attack and correlation power attack and discusses the latest countermeasures in this domain and their shortcomings.","PeriodicalId":435982,"journal":{"name":"2021 16th International Conference on Design & Technology of Integrated Systems in Nanoscale Era (DTIS)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-06-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122442167","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Design Space Exploration Applied to Security 设计空间探索在安全领域的应用
Antoine Linarès, D. Hély, F. Lhermet, G. D. Natale
Software Hardening against memory safety exploits can be achieved from the silicon, up to the software, with both compilers and operating systems features. Unfortunately, due to the growing evolution of attacks, security architects have no guarantees, at an early stage of the development, that defenses will match the security needs and overcome the targeted threats. In addition, after product release, it is difficult to evaluate the architecture performance against new threats. This paper presents a dynamic analysis technique that allows the evaluation of the security profile of a given architecture during design exploration. The method is designed to highlight and quantify the security threats covered by the countermeasures embedded at any level of a given architecture. The provided results will help for protection evaluation, classification, and architecture choices. The method comes with a tool that implements this approach and has been applied to several architectures. This tool helps to classify architecture along with its alternatives thanks to metrics.
通过编译器和操作系统功能,可以从芯片到软件实现针对内存安全漏洞的软件加固。不幸的是,由于攻击的不断演变,在开发的早期阶段,安全架构师无法保证防御能够满足安全需求并克服目标威胁。此外,在产品发布后,很难评估体系结构对新威胁的性能。本文提出了一种动态分析技术,该技术允许在设计探索期间评估给定体系结构的安全概况。该方法旨在突出和量化嵌入在给定体系结构的任何级别的对策所涵盖的安全威胁。所提供的结果将有助于保护评估、分类和体系结构选择。该方法附带了实现该方法的工具,并已应用于多个体系结构。由于度量,该工具有助于对体系结构及其替代方案进行分类。
{"title":"Design Space Exploration Applied to Security","authors":"Antoine Linarès, D. Hély, F. Lhermet, G. D. Natale","doi":"10.1109/DTIS53253.2021.9505151","DOIUrl":"https://doi.org/10.1109/DTIS53253.2021.9505151","url":null,"abstract":"Software Hardening against memory safety exploits can be achieved from the silicon, up to the software, with both compilers and operating systems features. Unfortunately, due to the growing evolution of attacks, security architects have no guarantees, at an early stage of the development, that defenses will match the security needs and overcome the targeted threats. In addition, after product release, it is difficult to evaluate the architecture performance against new threats. This paper presents a dynamic analysis technique that allows the evaluation of the security profile of a given architecture during design exploration. The method is designed to highlight and quantify the security threats covered by the countermeasures embedded at any level of a given architecture. The provided results will help for protection evaluation, classification, and architecture choices. The method comes with a tool that implements this approach and has been applied to several architectures. This tool helps to classify architecture along with its alternatives thanks to metrics.","PeriodicalId":435982,"journal":{"name":"2021 16th International Conference on Design & Technology of Integrated Systems in Nanoscale Era (DTIS)","volume":"15 12","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-06-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"113935117","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A 1.2V On-chip Output-capacitor-less Low Dropout Regulator based on Flipped Voltage Follower in 45nm CMOS Technology 基于45nm CMOS技术翻转电压跟随器的1.2V片上无输出差稳压器
Antaryami Panigrahi, Agile Mathew
A low dropout regulator(LDO) based on flipped voltage follower (FVF) assisted by a voltage combiner is presented in this work. This LDO offers stable regulation over wide range of load capacitances starting from 10pF to 50nF, without depending upon on-chip or off-chip load capacitance. It also offers extended the load regulation operation from 200µA to 50mA. This enhancement is achieved by incorporating a a voltage combiner stage, small feed-forward capacitor (CF) and compensation circuitry. For improving stability, Miller’s Compensation with a nulling resistor is implemented using 75pF capacitor, 4.5kΩ resistor. In addition, a slew rate enhancement circuit is applied to reduce the voltage undershoot during sharp load current transitions down to 200mV at 100pF. The designed LDO is verified with simulation in 45-nm CMOS process. For an input voltage of a 1.2V and output voltage of 1.08V, the simulated worst case undershoot and overshoot are respectively 115 mV and 74 mV, respectively, for load transient of 200µA to 50mA within edge times of 10 nSec. The quiescent current is 25uA. The simulated PSR is -42 dB over the band of 10-1kHz, -20dB at 1MHz over 200uA-50mA of load currents.
提出了一种基于翻转电压从动器(FVF)并辅以电压合成器的低差稳压器(LDO)。该LDO在从10pF到50nF的宽负载电容范围内提供稳定的调节,而不依赖于片内或片外负载电容。它还提供扩展负载调节操作从200µA到50mA。这种增强是通过结合电压组合级,小型前馈电容器(CF)和补偿电路来实现的。为了提高稳定性,米勒补偿与零电阻是实现使用75pF电容器,4.5kΩ电阻。此外,还采用了一个压转率增强电路,将负载电流急剧转换时的电压欠冲降低到100pF时的200mV。设计的LDO在45纳米CMOS工艺中进行了仿真验证。当输入电压为1.2V,输出电压为1.08V时,在200µa ~ 50mA的负载暂态边缘时间为10 nSec的情况下,模拟的最坏欠调和过调分别为115 mV和74 mV。静态电流为25uA。仿真的PSR在10-1kHz频段为-42 dB,在200uA-50mA负载电流下,在1MHz频段为-20dB。
{"title":"A 1.2V On-chip Output-capacitor-less Low Dropout Regulator based on Flipped Voltage Follower in 45nm CMOS Technology","authors":"Antaryami Panigrahi, Agile Mathew","doi":"10.1109/DTIS53253.2021.9525422","DOIUrl":"https://doi.org/10.1109/DTIS53253.2021.9525422","url":null,"abstract":"A low dropout regulator(LDO) based on flipped voltage follower (FVF) assisted by a voltage combiner is presented in this work. This LDO offers stable regulation over wide range of load capacitances starting from 10pF to 50nF, without depending upon on-chip or off-chip load capacitance. It also offers extended the load regulation operation from 200µA to 50mA. This enhancement is achieved by incorporating a a voltage combiner stage, small feed-forward capacitor (CF) and compensation circuitry. For improving stability, Miller’s Compensation with a nulling resistor is implemented using 75pF capacitor, 4.5kΩ resistor. In addition, a slew rate enhancement circuit is applied to reduce the voltage undershoot during sharp load current transitions down to 200mV at 100pF. The designed LDO is verified with simulation in 45-nm CMOS process. For an input voltage of a 1.2V and output voltage of 1.08V, the simulated worst case undershoot and overshoot are respectively 115 mV and 74 mV, respectively, for load transient of 200µA to 50mA within edge times of 10 nSec. The quiescent current is 25uA. The simulated PSR is -42 dB over the band of 10-1kHz, -20dB at 1MHz over 200uA-50mA of load currents.","PeriodicalId":435982,"journal":{"name":"2021 16th International Conference on Design & Technology of Integrated Systems in Nanoscale Era (DTIS)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-06-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134453501","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
DTIS 2021 Foreword
{"title":"DTIS 2021 Foreword","authors":"","doi":"10.1109/dtis53253.2021.9505024","DOIUrl":"https://doi.org/10.1109/dtis53253.2021.9505024","url":null,"abstract":"","PeriodicalId":435982,"journal":{"name":"2021 16th International Conference on Design & Technology of Integrated Systems in Nanoscale Era (DTIS)","volume":"19 2","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-06-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120910308","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
[Title page] (标题页)
{"title":"[Title page]","authors":"","doi":"10.1109/dtis53253.2021.9505160","DOIUrl":"https://doi.org/10.1109/dtis53253.2021.9505160","url":null,"abstract":"","PeriodicalId":435982,"journal":{"name":"2021 16th International Conference on Design & Technology of Integrated Systems in Nanoscale Era (DTIS)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-06-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124565356","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Script-Based Cycle-True Verification Framework to Speed-Up Hardware and Software Co-Design of System-on-Chip exploiting RISC-V Architecture 基于脚本的周期真实性验证框架加快基于RISC-V架构的片上系统软硬件协同设计
Luca Zulberti, P. Nannipieri, L. Fanucci
The complexity of heterogenous Systems-on-Chip has overgrown in the last decades, and the effort necessary to set up a verification workflow has increased as well. The time spent on the verification phase of a design takes on average 57% of the project time, and in these years, several solutions aimed to automate that task have been developed. Some relevant works in this field automate the VLSI design flow from synthesis to Place-And-Route and Layout-Vs-Schematic design check but miss software design in the automated verification loop. Our work focuses on the early stages of the design phase, where designers take software and hardware choices to explore a larger design space. In this work, we present a flexible, Make-based framework to build up verification and design environments. It aids the development of Systems-on-Chip running RISC-V processors, automating software compilation, cycle-true simulations and post-synthesis analyses. It exploits the parallelism of the Make build tool to ensure results consistency, provide flow reproducibility, and accelerate the design space exploration using different flow recipes provided by the designer. Its modular structure allows it to perform each task with various third-party tools and makes the workflow execution chain customizable. Using the proposed framework, we show how the reduced designer effort increases design productivity. Indeed, the time needed to build up a validated development environment is consistently reduced by using few configuration properties to setup all the tools used in the workflow.
在过去的几十年里,异质系统芯片的复杂性已经过度增长,建立验证工作流所需的努力也增加了。在设计的验证阶段花费的时间平均占项目时间的57%,并且在这些年中,已经开发了一些旨在自动化该任务的解决方案。该领域的一些相关工作将VLSI设计流程从综合到布线和布图图设计检查自动化,但在自动化验证回路中遗漏了软件设计。我们的工作重点是设计阶段的早期阶段,在这个阶段,设计师选择软件和硬件来探索更大的设计空间。在这项工作中,我们提出了一个灵活的,基于make的框架来构建验证和设计环境。它有助于开发运行RISC-V处理器的片上系统,自动化软件编译,周期真实模拟和后合成分析。它利用Make构建工具的并行性来确保结果的一致性,提供流的可再现性,并使用设计者提供的不同流配方加速设计空间的探索。它的模块化结构允许它使用各种第三方工具执行每个任务,并使工作流执行链可定制。使用提出的框架,我们展示了减少设计师的工作量如何提高设计效率。实际上,通过使用少量配置属性来设置工作流中使用的所有工具,构建一个经过验证的开发环境所需的时间一直在减少。
{"title":"A Script-Based Cycle-True Verification Framework to Speed-Up Hardware and Software Co-Design of System-on-Chip exploiting RISC-V Architecture","authors":"Luca Zulberti, P. Nannipieri, L. Fanucci","doi":"10.1109/DTIS53253.2021.9505139","DOIUrl":"https://doi.org/10.1109/DTIS53253.2021.9505139","url":null,"abstract":"The complexity of heterogenous Systems-on-Chip has overgrown in the last decades, and the effort necessary to set up a verification workflow has increased as well. The time spent on the verification phase of a design takes on average 57% of the project time, and in these years, several solutions aimed to automate that task have been developed. Some relevant works in this field automate the VLSI design flow from synthesis to Place-And-Route and Layout-Vs-Schematic design check but miss software design in the automated verification loop. Our work focuses on the early stages of the design phase, where designers take software and hardware choices to explore a larger design space. In this work, we present a flexible, Make-based framework to build up verification and design environments. It aids the development of Systems-on-Chip running RISC-V processors, automating software compilation, cycle-true simulations and post-synthesis analyses. It exploits the parallelism of the Make build tool to ensure results consistency, provide flow reproducibility, and accelerate the design space exploration using different flow recipes provided by the designer. Its modular structure allows it to perform each task with various third-party tools and makes the workflow execution chain customizable. Using the proposed framework, we show how the reduced designer effort increases design productivity. Indeed, the time needed to build up a validated development environment is consistently reduced by using few configuration properties to setup all the tools used in the workflow.","PeriodicalId":435982,"journal":{"name":"2021 16th International Conference on Design & Technology of Integrated Systems in Nanoscale Era (DTIS)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-06-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124417282","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Technology Impact on Neutron-Induced Effects in SDRAMs: A Comparative Study 技术对dram中中子诱导效应的影响:比较研究
Lucas Matana Luza, D. Söderström, André Martins Pio de Mattos, E. Bezerra, C. Cazzaniga, M. Kastriotou, C. Poivey, L. Dilillo
This study analyses the response of synchronous dynamic random access memories to neutron irradiation. Three different generations of the same device with different node sizes (63, 72, and 110 nm) were characterized under an atmospheric-like neutron spectrum at the ChipIr beamline in the Rutherford Appleton Laboratories, UK. The memories were tested with a reduced refresh rate to expose more single-event upsets and under similar conditions provided by a board specifically developed for this type of study in test facilities. The board has also been designed to be used as a nanosatellite payload in order to perform similar tests. The neutron-induced failures were studied and characterized, presenting the occurrence of single-bit upsets and stuck bits. The cross sections for each type of event and technology node show that the 110 nm model is more sensitive to neutron-induced single-event effects than the other models.
研究了同步动态随机存取存储器对中子辐照的响应。在英国Rutherford Appleton实验室的ChipIr光束线上,对具有不同节点尺寸(63,72和110 nm)的三代相同器件进行了类大气中子谱的表征。这些记忆在较低的刷新率下进行测试,以暴露更多的单一事件干扰,并在测试设施中由专门为此类研究开发的电路板提供的类似条件下进行测试。该板还被设计为纳米卫星有效载荷,以便进行类似的测试。对中子诱发的失效进行了研究和表征,出现了单钻头镦钻和卡钻现象。每种类型事件和技术节点的横截面表明,110 nm模型对中子诱导的单事件效应比其他模型更敏感。
{"title":"Technology Impact on Neutron-Induced Effects in SDRAMs: A Comparative Study","authors":"Lucas Matana Luza, D. Söderström, André Martins Pio de Mattos, E. Bezerra, C. Cazzaniga, M. Kastriotou, C. Poivey, L. Dilillo","doi":"10.1109/DTIS53253.2021.9505143","DOIUrl":"https://doi.org/10.1109/DTIS53253.2021.9505143","url":null,"abstract":"This study analyses the response of synchronous dynamic random access memories to neutron irradiation. Three different generations of the same device with different node sizes (63, 72, and 110 nm) were characterized under an atmospheric-like neutron spectrum at the ChipIr beamline in the Rutherford Appleton Laboratories, UK. The memories were tested with a reduced refresh rate to expose more single-event upsets and under similar conditions provided by a board specifically developed for this type of study in test facilities. The board has also been designed to be used as a nanosatellite payload in order to perform similar tests. The neutron-induced failures were studied and characterized, presenting the occurrence of single-bit upsets and stuck bits. The cross sections for each type of event and technology node show that the 110 nm model is more sensitive to neutron-induced single-event effects than the other models.","PeriodicalId":435982,"journal":{"name":"2021 16th International Conference on Design & Technology of Integrated Systems in Nanoscale Era (DTIS)","volume":"62 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-06-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126801769","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
期刊
2021 16th International Conference on Design & Technology of Integrated Systems in Nanoscale Era (DTIS)
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1