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2021 16th International Conference on Design & Technology of Integrated Systems in Nanoscale Era (DTIS)最新文献

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Circuit-level evaluation of a new zero-cost transistor in an embedded non-volatile memory CMOS technology 嵌入式非易失性存储器CMOS技术中新型零成本晶体管的电路级评估
P. Devoge, H. Aziza, P. Lorenzini, F. Julien, A. Marzaki, A. Malherbe, M. Mantelli, Thomas Sardin, S. Haendler, A. Régnier, S. Niel
This work presents a new transistor architecture developed by reusing already existing fabrication process steps in an embedded non-volatile memory (eNVM) CMOS technology. The proposed transistor is derived from an existing high-voltage transistor and is free in terms of photomasks and process steps, making it ideal for low-cost products. The new transistor is fabricated then electrically characterized, showing good analog performances. A SPICE (Simulation Program with Integrated Circuit Emphasis) model of the new device is developed to assess its circuit-level performances through electrical circuit simulation. The in-circuit performances of the new device are evaluated based on different ring oscillator circuits. A comparison with the existing high-voltage transistor is carried out considering performance parameters such as the oscillating frequency to demonstrate the appeal of our new transistor.
这项工作提出了一种新的晶体管架构,通过重用嵌入式非易失性存储器(eNVM) CMOS技术中已有的制造工艺步骤来开发。所提出的晶体管源自现有的高压晶体管,并且在光罩和工艺步骤方面是免费的,使其成为低成本产品的理想选择。该新型晶体管在制备过程中表现出良好的模拟性能。开发了新器件的SPICE (Integrated Circuit Simulation Program with Integrated Circuit Emphasis)模型,通过电路仿真来评估其电路级性能。基于不同的环形振荡器电路,对新器件的在线性能进行了评估。通过与现有高压晶体管的振荡频率等性能参数的比较,证明了新型晶体管的吸引力。
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引用次数: 4
Characterization of a RISC-V System-on-Chip under Neutron Radiation 中子辐射下RISC-V片上系统的特性研究
D. Santos, Lucas Matana Luza, M. Kastriotou, C. Cazzaniga, C. Zeferino, D. Melo, L. Dilillo
Systems for harsh environments often use embedded processors for tasks that require reliability. However, harsh environments cause faulty behavior in electronics, which eventually lead to system failure. Therefore, embedded processors must use techniques to improve their reliability. In this context, this work presents the implementation and characterization of a RISC-V-based system-on-chip. We characterized our implementation by carrying out test campaigns at the ChipIr irradiation facility. This facility provides a beamline for testing electronics against neutrons, mimicking atmospheric-like environments. With this first test campaign, we identified the most critical parts of our system-on-chip and essential tips to improve the test effectiveness. In the second test campaign, we used an improved version of the system setup with higher reliability error observability features. The version embedding all the hardening techniques could correct or mitigate 98.1 % of the detected upsets under irradiation.
恶劣环境的系统通常使用嵌入式处理器来完成需要可靠性的任务。然而,恶劣的环境会导致电子设备的故障行为,最终导致系统故障。因此,嵌入式处理器必须使用技术来提高其可靠性。在这种情况下,本工作提出了基于risc - v的片上系统的实现和特性。我们通过在ChipIr辐照设施开展测试活动来描述我们的实施。该设备提供了一个束线,用于测试电子设备对中子的影响,模拟类似大气的环境。在第一次测试活动中,我们确定了片上系统的最关键部分和提高测试效率的基本技巧。在第二个测试活动中,我们使用了具有更高可靠性错误可观察性特征的系统设置的改进版本。嵌入所有硬化技术的版本可以纠正或减轻照射下检测到的98.1%的变形。
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引用次数: 5
[Title page] (标题页)
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引用次数: 0
Preliminary Defect Analysis of 8T SRAM Cells for In-Memory Computing Architectures 用于内存计算体系结构的8T SRAM单元缺陷初步分析
L. Ammoura, M. Flottes, P. Girard, A. Virazel
In-Memory-Computing (IMC) paradigm has been proposed as an alternative to overcome the memory wall faced by conventional von Neumann computing architectures. IMC architectures proposed today are built either from volatile or non-volatile basic memory cells, but a common feature is that all of them are prone to manufacturing defects in the same way as conventional memories. In this paper, we propose to analyze the behavior of an IMC 8T SRAM cell in presence of defects located in the read port of the cell. A model of a basic IMC memory array has been set up to simulate the behavior of the cell in the two modes of operation: memory mode and computing mode. Resistive short defects were injected into the read port and then analyzed. Preliminary results show that these defects can severely impact the behavior of the 8T SRAM in memory mode as well as computing mode. The final goal of this study is to develop effective test algorithms for these defects.
内存计算(IMC)范式已被提出作为克服传统冯·诺伊曼计算架构所面临的内存墙的替代方案。目前提出的IMC架构是由易失性或非易失性基本存储单元构建的,但它们都有一个共同的特点,即它们都像传统存储器一样容易产生制造缺陷。在本文中,我们建议分析imc8t SRAM单元在单元读取端口存在缺陷时的行为。建立了基本IMC存储阵列的模型,模拟了单元在存储模式和计算模式下的工作行为。将电阻性短缺陷注入读口进行分析。初步结果表明,这些缺陷会严重影响8T SRAM在存储模式和计算模式下的性能。本研究的最终目标是为这些缺陷开发有效的测试算法。
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引用次数: 3
DTIS 2021 Organizing Committee DTIS 2021组委会
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引用次数: 0
Design and Optimization of Cantilever Based RF-MEMS Shunt Switch for 5G Applications 面向5G应用的悬臂式RF-MEMS并联开关设计与优化
Heba Saleh, Rayan Bajwa, I. Tekin, M. Yapici
This work reports on the design and optimization of a low voltage shunt MEMS switch for 5G mobile applications. As opposed to clamped-clamped beams conventionally serving as RF-MEMS shunt switches, the present switch design utilizes a fixed-free cantilever beam in a shunt configuration to minimize the actuation voltage requirements. Moreover, RF performance parameters (ON-state insertion loss and OFF-state signal isolation) for the proposed switch design are optimized by means of extensive high-frequency simulations to enable the use of such devices in mm-wave regime. To critically analyze the key controlling factors affecting switch performance, a parameterized study on the geometrical parameters of the proposed topology is performed. The simulations were carried out using commercially available finite element solvers (CoventorWare® and HFSS) which validate the low-voltage operation of the reported switch with actuation voltage as low as 7.5V while maintaining the RF insertion loss and RF isolation values below -0.3dB and above -36dB, respectively, for frequencies up to 45GHz.
本工作报告了用于5G移动应用的低压并联MEMS开关的设计和优化。与传统上用作RF-MEMS分流开关的夹紧梁不同,目前的开关设计在分流配置中使用无固定悬臂梁,以最大限度地降低驱动电压要求。此外,通过广泛的高频模拟,优化了所提出的开关设计的射频性能参数(开状态插入损耗和关状态信号隔离),以使此类器件能够在毫米波状态下使用。为了严格分析影响开关性能的关键控制因素,对所提出的拓扑结构的几何参数进行了参数化研究。仿真使用商用有限元求解器(CoventorWare®和HFSS)进行,验证了所报告的开关在低至7.5V的驱动电压下的低压操作,同时保持射频插入损耗低于-0.3dB和射频隔离值高于-36dB,频率高达45GHz。
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引用次数: 2
A 270 Hz, Fine Frequency Tuning Class-C Oscillator Using Capacitive--Inductive Degeneration Technique in 130 -nm CMOS 一种采用130纳米CMOS电容—电感退化技术的270 Hz精细频率调谐c类振荡器
Sehmi Saad, F. Haddad, Aymen Ben Hammadi
This paper presents a high-resolution Class-C type voltage-controlled oscillator (VCO) with a robust start-up. The proposed oscillator achieves a minimum frequency quantification step of 270 Hz without adding any additional dithering approach. The very fine tuning is obtained through a capacitive-inductive degeneration coupling (CIDC) technique which reduces the capacitance value without appreciably affecting the intrinsic oscillator phase noise (PN). This technique also provides a negative transconductance to compensate for losses in the LC tank, resulting in high oscillation amplitude and relatively low power consumption in the oscillator core. The proposed design, implemented in 130 nm CMOS technology, achieves 45% tuning range. It exhibits a phase noise of –107 dBc/Hz @ 1-MHz offset, while it draws 5.75 mA from a supply of 1.2 V, resulting in a FoM of 165 dBc/Hz.
提出了一种具有鲁棒启动功能的高分辨率c类压控振荡器(VCO)。所提出的振荡器在不添加任何额外抖动方法的情况下实现了270 Hz的最小频率量化步长。通过电容-电感退化耦合(CIDC)技术,在不明显影响本征振荡器相位噪声(PN)的情况下,降低了电容值,获得了非常精细的调谐。该技术还提供负跨导,以补偿LC槽中的损耗,从而产生高振荡幅度和振荡器芯中相对较低的功耗。该设计采用130纳米CMOS技术,可实现45%的调谐范围。它的相位噪声为-107 dBc/Hz @ 1-MHz偏移,而它从1.2 V电源中吸取5.75 mA,导致FoM为165 dBc/Hz。
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引用次数: 2
Toward an Implementation Modeling Methodology for Designing SCA resilient Cryptographic Circuits 设计SCA弹性密码电路的实现建模方法
Gabriel Rocherolle, R. Chotin
Along with performance, one of the main concerns in cryptographer circuits implementation is Side Channel Attacks robustness. Given a cipher, many functionally equivalent circuits can be associated, with mixed performances and robustness. The work presented in this paper consists in a methodological effort to assist and qualify cipher circuits designs with a framework for a modular, sustained and iterative workflow through know-how capitalization. Simulation allows qualifying cipher hardware implementations against threats such as physical cryptanalysis. New versions are to be compared with respect to references early in design workflow, judging counter-measure efficiency or preventing security regressions.
除了性能之外,加密电路实现的主要关注点之一是侧信道攻击的鲁棒性。给定一个密码,可以将许多功能等效的电路关联起来,这些电路具有不同的性能和鲁棒性。工作提出了包括方法论的努力帮助和限定密码电路设计与模块化的框架,持续通过知识资本化和迭代的工作流。仿真允许针对威胁(如物理密码分析)验证密码硬件实现。在设计工作流程的早期,将新版本与参考进行比较,判断对策效率或防止安全回归。
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引用次数: 0
RGB and 3D-Segmentation Data Combination for the Autonomous Object Manipulation in Personal Care Robotics RGB和3d分割数据组合用于个人护理机器人的自主对象操作
G. Mezzina, D. Venuto
This paper proposes the re-design of the functionalities of the personal care robot (PCR) Pepper by SoftBank Robotics. Pepper is mainly designed for verbal interaction with patients and despite the presence of two upper arms, it lacks object manipulation capabilities. In the proposed re-design, a combination of data from Pepper RGB camera and 3D depth sensor is used to identify and localize a specific pharmaceutical envelope in a dedicated repository. In this context, the semantic segmentation of the RGB image has been entrusted to a dedicated pretrained YOLOv3 object detector, while a dedicated algorithm has been realized for the hand (gripper) positioning. Basing on this 3D positional information, the PCR operates an ad-hoc designed routine to grasp the object and to scan it. Once the scanning procedure confirms that the grasping has been successfully completed and that the grasped package matches with the needed drug, the PCR must be able to safely navigate towards the user (e.g., physician, patient), delivering the drug. The proposed procedure is fully automatic, and no internet connection is needed for the nominal use case, preserving -in this way- sensitive data like home/hospital maps, patient’s data and so on. Experimental results on the here proposed object manipulation routine demonstrated a grasping success rate up to 96 %, even if the objects are not properly positioned in the dedicated repository. Finally, a proof of concept that implements a sequential pick-up, object recognition and delivery operation is also provided demonstrating real-life scenario applicability.
本文提出了个人护理机器人(PCR)胡椒由软银机器人的功能重新设计。Pepper主要用于与患者进行口头交流,尽管有两条上臂,但它缺乏物体操作能力。在提出的重新设计中,使用Pepper RGB相机和3D深度传感器的数据组合来识别和定位专用存储库中的特定药物信封。在这种情况下,RGB图像的语义分割被委托给一个专门的预训练的YOLOv3对象检测器,同时实现了一个专门的手(夹具)定位算法。基于这种三维位置信息,PCR操作一个特别设计的程序来抓取物体并扫描它。一旦扫描程序确认抓取已经成功完成,并且抓取的包装与所需的药物相匹配,PCR必须能够安全地导航到用户(例如,医生,病人),递送药物。所建议的程序是全自动的,并且在名义上的用例中不需要互联网连接,以这种方式保存敏感数据,如家庭/医院地图、患者数据等。本文提出的对象操作程序的实验结果表明,即使对象没有正确定位在专用存储库中,抓取成功率也高达96%。最后,还提供了实现顺序拾取,对象识别和交付操作的概念验证,以演示现实场景的适用性。
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引用次数: 1
Massive Multisite Variability-Aware Die Distribution Estimation for Analog/Mixed-Signal Circuits Test Validation 模拟/混合信号电路测试验证的大规模多站点可变感知芯片分布估计
Praise O. Farayola, Isaac Bruce, Shravan K. Chaganti, Abalhassan Sheikh, S. Ravi, Degang Chen
Massive multisite testing significantly reduces test cost and immensely increases production throughput by simultaneously screening multiple devices under test (DUTs). However, non-trivial variations in measurement from site to site are inevitable, and they often alter the actual DUTs specifications leading to yield loss (good DUTs rejected as bad) or necessitate poorer DUT specifications. These site-induced variations make it challenging to know the true silicon performance in a multisite probing environment, making statistical processing control difficult. In this paper, we propose and compare three methods to remove the variability introduced by multisite test hardware for accurate estimation of DUTs true performance distributions. The key idea is to select high confidence good test sites for parametric analysis. We demonstrate the accuracy of the proposed methods using simulation and measurement data.
通过同时筛选多个被测设备(dut),大规模多站点测试显著降低了测试成本,并极大地提高了生产吞吐量。然而,不同地点之间测量的重大变化是不可避免的,它们经常改变实际的DUT规格,导致产量损失(好的DUT被视为坏的而拒绝)或需要较差的DUT规格。这些位置引起的变化使得在多位置探测环境中了解硅的真实性能变得具有挑战性,使得统计处理控制变得困难。在本文中,我们提出并比较了三种消除多站点测试硬件引入的可变性的方法,以准确估计dut的真实性能分布。关键思想是选择高置信度好的测试点进行参数分析。我们用仿真和测量数据证明了所提出方法的准确性。
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引用次数: 5
期刊
2021 16th International Conference on Design & Technology of Integrated Systems in Nanoscale Era (DTIS)
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