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Use of Flow Simulation for Design and Process Optimisation for Flip Chip Underfill 流动模拟在倒装芯片底填设计和工艺优化中的应用
R. Miessner, T. Haeussermann
A study on impact of geometry and process parameters on underfill flow has been conducted. Relevant material properties (time and temperature dependent viscosity, contact angles to relevant surfaces, surface tension) have been measured and fit into numerical models as input for CFD modelling tool. First, a simple flow test vehicle (glass slide) has been modelled and compared with flow time measurements. It can be stated that the simulation is in very good agreement with experiments. This was the prerequisite for the following modelling of a flip chip. A variation of geometry parameters (e.g. stand-off, bump pitch) as well as process parameters (e.g. dispense pattern, needle velocity) have been modelled. Additionally, the impact of these parameters has been studied experimentally. Again, modelling results are in very good agreement with experimental results. Thus, modelling of underfill flow has been established as tool for optimisation of underfill parameters and prediction of process robustness.
研究了几何形状和工艺参数对下填料流动的影响。相关的材料特性(与时间和温度相关的粘度、与相关表面的接触角、表面张力)已经被测量并拟合到数值模型中,作为CFD建模工具的输入。首先,建立了一个简单的流动测试车辆(玻璃载玻片)模型,并与流动时间测量结果进行了比较。结果表明,仿真结果与实验结果吻合较好。这是接下来倒装芯片建模的先决条件。几何参数的变化(例如,隔离,凹凸间距)以及工艺参数(例如,分配模式,针速度)已经建模。此外,还对这些参数的影响进行了实验研究。再一次,模拟结果与实验结果非常吻合。因此,建立了下填料流模型,作为优化下填料参数和预测过程鲁棒性的工具。
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引用次数: 2
Reel-to-Reel Fabrication of Integrated Circuits Based on Soluble Polymer Semiconductor 基于可溶性聚合物半导体的卷对卷集成电路制造
G. Klink, E. Hammerl, A. Drost, D. Hemmetzberger, K. Bock
Rapid progress in the field of organic semiconductors makes the vision of plastic integrated circuits reachable. Polymer electronic is expected to be a promising technology for low-cost and large-area electronic systems, which can not be addressed by traditional chip technology. Solutions of polymer or polymer based pastes offer advantages due to their easy processing possibilities which give the opportunity to coat and pattern them like a printing ink. Cost requirements of polymer electronic imply that for manufacturing also very cost-effective processes must be used. Hence reel-to-reel manufacturing with endless substrates of foil is a key technology to fulfill the challenging cost demands of cheap flexible systems. Within this work a process for manufacturing integrated circuits based on solution processed polymer semiconductors has been developed. Basis is a reel-to-reel working photolithographic patterning process for metallized foils, which is used to fabricate the basic source-drain layer with high resolution. By two subsequent lacquering and three screen printing steps polymer field effect transistors are integrated to circuits.
有机半导体领域的快速发展使塑料集成电路的愿景成为可能。聚合物电子有望成为低成本、大面积电子系统的一种有前途的技术,这是传统芯片技术无法解决的问题。聚合物或聚合物基糊状物的解决方案具有优势,因为它们易于加工,可以像印刷油墨一样涂覆和图案。聚合物电子的成本要求意味着制造过程中也必须使用非常具有成本效益的工艺。因此,采用无底箔的卷到卷制造是满足廉价柔性系统成本要求的关键技术。在这项工作中,开发了一种基于溶液加工聚合物半导体的集成电路制造工艺。Basis是一种用于金属箔的卷对卷工作光刻图案化工艺,用于制作高分辨率的基本源漏层。通过两个后续的上漆和三个丝网印刷步骤,将聚合物场效应晶体管集成到电路中。
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引用次数: 5
Thermal Modeling for System-in-a-Package Based on Embedded Chip Structure 基于嵌入式芯片结构的系统级封装热建模
Liu Chen, L. Ekstrand, J. Liu
This paper presents a thermal modeling for a new packaging concept, known as system-in-a-package, in which embedded chip technology is used. This structure fulfills the requirements for high integration and high density, while at the same time, would expect to be poor thermal performance because of the encapsulation on the chip. Thermal modeling here aims to give the first insight to characterize the thermal performance for such structure under steady and transient condition. It shows that substrates with good thermal conductivity help to keep the temperature on the chip at a reasonable level. For poorly conductive substrates, heat only conduct through copper tracks. Epoxy around the chip also plays an important role when the thermal conductivity of the substrate is good but is of less importance when the substrate has poor conductivity. The thickness of copper had large influence on the thermal resistance, while the thickness of chip does not effect at all. The thermal resistance is reduced considerably when the air velocity is increased.
本文提出了一种新的封装概念的热建模,称为系统级封装,其中使用了嵌入式芯片技术。这种结构满足了高集成度和高密度的要求,但由于芯片上的封装,热性能可能会很差。这里的热模拟旨在首次深入了解这种结构在稳态和瞬态条件下的热性能。结果表明,具有良好导热性的衬底有助于将芯片上的温度保持在合理的水平。对于导电性差的基板,热只能通过铜道传导。当基板导热性好时,芯片周围的环氧树脂也起重要作用,但当基板导热性差时,环氧树脂的作用就不那么重要了。铜的厚度对热阻影响较大,而芯片的厚度对热阻影响不大。当空气速度增加时,热阻大大减小。
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引用次数: 0
Conductive Adhesives containing Ag-Sn Alloys as Conductive Filler 含银锡合金导电填料的导电胶粘剂
G. Toida, Y. Shirai, N. Mizmura, M. Komagata, K. Suzuki
Ag filled isotropic conductive adhesives (ICA) have been investigated as promising altenatives for lead containing solders in surface mount technology (SMT) applications; however, one serious concern is the ionic-migration of the silver filled in the ICA, especially when used in high density interconnection assemblies. In his study, ionic-migration resistance and the contact resistance of the ICA containing Ag-Sn alloy conductive fillers were evaluated. It was found that ionic-migration resistance depended on the Ag-Sn ratio and that Ag-Sn alloys containing 25 to 75 mol% of Sn had excellent ionic-migration resistance though their contact resistance was rather high, compared with silver. For the compatibility of the ionic-migration resistance with lower contact resistance, and to understand the effect of a Sn-Bi alloy powder mixture, several additives and polymer matrixes were also studied. New ICAs including these additives and a conventional ICA (as reference) were evaluated for SMT. Chip components with Sn plated terminations for stability in both contact resistance and adhesion strength were monitored during reliability tests. From the test results, it can be concluded that the new ICA is a potential material for SMT applications. Moreover, if mount loading was not sufficient and/or mount alignment was not suitable, initial contact resistance was unstable. Therefore, we selected materials with reduction effect and we dereased the Sn ratio as low as we could. The filler content rate was also increased. As a result the loading dependence was decreased. We were sucessful in keeping contact resistance more stable while maintaining good ionic-migration resistance.
Ag填充的各向同性导电胶粘剂(ICA)已被研究为表面贴装技术(SMT)应用中含铅焊料的有前途的替代品;然而,一个严重的问题是填充在ICA中的银的离子迁移,特别是在高密度互连组件中使用时。在他的研究中,对含有银锡合金导电填料的ICA的离子迁移电阻和接触电阻进行了评估。结果表明,Ag-Sn合金的离子迁移性能与银锡比有关,锡含量为25 ~ 75 mol%的Ag-Sn合金虽然接触电阻高于银合金,但具有良好的离子迁移性能。为了研究离子迁移电阻与低接触电阻的相容性,并了解Sn-Bi合金粉末混合物的影响,还研究了几种添加剂和聚合物基质。对含有这些添加剂的新型ICA和常规ICA(作为参考)进行了SMT评价。在可靠性测试中,对镀锡端子的芯片组件的接触电阻和粘附强度进行了监测。从测试结果可以得出结论,新型ICA是一种潜在的SMT应用材料。此外,如果安装负载不够和/或安装对准不合适,初始接触电阻是不稳定的。因此,我们选择了具有还原效果的材料,并尽可能降低Sn比。填料含量也有所提高。结果表明,载荷依赖性降低。我们成功地保持了更稳定的接触电阻,同时保持了良好的离子迁移阻力。
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引用次数: 4
Overmoulding of Electronics for End of Life Recovery 电子产品报废回收的复盖成型
D. Hutt, N. Teh, F. Sarvar, D. Whalley, P. J. Palmer, P. Anderson, B. Kandasubramanian, P. Morris, S. Prosser, P. O'Brien
With the increasing use of electronic control systems in automotive applications, the environments in which they are required to operate are becoming evermore demanding. For improved functionality and to reduce the number of interconnections it is desirable to place the electronic control units (ECUs) as close as possible to the sensors and actuators they interact with, and they can increasingly be found mounted on engine, transmission and chassis components. The electronics are therefore exposed to high/low temperatures, high humidity, vibration and corrosive fluids. In order to protect the electronics and maintain reliability in safety critical areas, great lengths are taken to mount the devices in ways that will prevent the ingress of moisture, cushion shocks and dissipate heat. Potting of electrical devices with thermosetting polymers has been a commonplace method to install a protective layer over the circuit assemblies, which are often mounted in separate boxes within the vehicle. However, with the drive to reduce vehicle weight and increase recyclability, there has been much interest in the use of overmoulding with thermoplastic polymers, not only to provide protection, but to enable the electronics to be mounted into a structural component of the vehicle thereby saving space and weight and eliminating a level of packaging. While this has been shown to be a practical way forward in terms of reliability, the recyclability of the thermoplastic polymer is compromised by the intermixed electronics that are hard to separate economically.
随着电子控制系统在汽车应用中的应用越来越多,它们所需要的运行环境也变得越来越苛刻。为了改进功能并减少互连数量,希望将电子控制单元(ecu)尽可能靠近与其交互的传感器和执行器,并且越来越多地安装在发动机,变速箱和底盘组件上。因此,电子设备暴露在高/低温,高湿,振动和腐蚀性流体中。为了保护电子设备并保持安全关键区域的可靠性,我们花了很大的时间来安装设备,以防止湿气进入,缓冲冲击和散热。用热固性聚合物对电气设备进行灌封是在电路组件上安装保护层的常用方法,这些电路组件通常安装在车辆内的单独盒子中。然而,随着减少车辆重量和提高可回收性的驱动,人们对使用热塑性聚合物覆盖成型产生了很大的兴趣,不仅可以提供保护,而且可以使电子设备安装到车辆的结构部件中,从而节省空间和重量,并消除一定程度的包装。虽然这在可靠性方面已被证明是一种实用的方法,但热塑性聚合物的可回收性受到混合电子元件的影响,这些电子元件难以经济地分离。
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引用次数: 1
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Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics
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