Pub Date : 2005-10-23DOI: 10.1109/POLYTR.2005.1596480
A. Dziedzic
This paper describes carbon/polyesterimide thick-film resistive composites. Polyesterimide (PEI) resin with high thermal durability served as an insulative matrix whereas medium structure carbon black (MSCB), blend of MSCB and graphite (G), and high structure carbon black (HSCB) have been used as an active phase. Chosen physicochemical investigations, standard electrical measurements (dependence of basic electrical properties on kind and content of conductive filler, curing method and curing temperature) as well as nonstandard electrical methods (1/f noise and voltage nonlinearity properties) and various stability tests have been used for complete description of MSCB/PEI, (MSCB+G)/PEI and HSCB/PEI thick-film resistor series.
{"title":"Physicochemical, electrical and stability properties of carbon black/polyesterimide thick-film resistors","authors":"A. Dziedzic","doi":"10.1109/POLYTR.2005.1596480","DOIUrl":"https://doi.org/10.1109/POLYTR.2005.1596480","url":null,"abstract":"This paper describes carbon/polyesterimide thick-film resistive composites. Polyesterimide (PEI) resin with high thermal durability served as an insulative matrix whereas medium structure carbon black (MSCB), blend of MSCB and graphite (G), and high structure carbon black (HSCB) have been used as an active phase. Chosen physicochemical investigations, standard electrical measurements (dependence of basic electrical properties on kind and content of conductive filler, curing method and curing temperature) as well as nonstandard electrical methods (1/f noise and voltage nonlinearity properties) and various stability tests have been used for complete description of MSCB/PEI, (MSCB+G)/PEI and HSCB/PEI thick-film resistor series.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130562200","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-23DOI: 10.1109/POLYTR.2005.1596482
K. Becker, T. Braun, M. Koch, V. Bader, R. Aschenbrenner, H. Reichl
For improved reliability of microelectronics an encapsulation of sensitive structures is crucial, this is true especially for polymer electronics, where oxygen diffusion and water vapor ingress do dramatically influence the electrical performance. For the protection of semiconducting polymers within organic LEDs a glass layer is the method of choice, providing optimized sealing except for the edge areas. Disadvantage of glass as a sealing material is its rigidity and its sensitivity against mechanical stress. For the realization of low cost applications as smart labels / RF ID tags besides barrier properties also mechanical protection is needed to ensure device functionality. This is especially true when these devices need to operate within harsh environment. Various approaches are possible to apply such barrier layers, typically CVD/PVD or spin coating are used, to yield thin, homogeneous layers of encapsulants of 1 to 5 μm thickness. For the high speed encapsulation of large areas also lamination is discussed, where multilayer films are applied using temperature and pressure, layer thickness is in the range of 5 to 30 μm. As a further technology, suited for the deposition of low viscosity liquid barrier materials, film coating processes are proposed. Focus of the technology development described is the application of homogeneous coating on large areas. Expected advantage is the contactless application at high speed on large area substrates, especially useful on substrates showing a 3D topography, as present with devices integrating heterogeneous structures as organic semiconductors (OSC), printed passives or coils.
{"title":"Film Coating - Large Area Encapsulation Process for Electronics Packaging","authors":"K. Becker, T. Braun, M. Koch, V. Bader, R. Aschenbrenner, H. Reichl","doi":"10.1109/POLYTR.2005.1596482","DOIUrl":"https://doi.org/10.1109/POLYTR.2005.1596482","url":null,"abstract":"For improved reliability of microelectronics an encapsulation of sensitive structures is crucial, this is true especially for polymer electronics, where oxygen diffusion and water vapor ingress do dramatically influence the electrical performance. For the protection of semiconducting polymers within organic LEDs a glass layer is the method of choice, providing optimized sealing except for the edge areas. Disadvantage of glass as a sealing material is its rigidity and its sensitivity against mechanical stress. For the realization of low cost applications as smart labels / RF ID tags besides barrier properties also mechanical protection is needed to ensure device functionality. This is especially true when these devices need to operate within harsh environment. Various approaches are possible to apply such barrier layers, typically CVD/PVD or spin coating are used, to yield thin, homogeneous layers of encapsulants of 1 to 5 μm thickness. For the high speed encapsulation of large areas also lamination is discussed, where multilayer films are applied using temperature and pressure, layer thickness is in the range of 5 to 30 μm. As a further technology, suited for the deposition of low viscosity liquid barrier materials, film coating processes are proposed. Focus of the technology development described is the application of homogeneous coating on large areas. Expected advantage is the contactless application at high speed on large area substrates, especially useful on substrates showing a 3D topography, as present with devices integrating heterogeneous structures as organic semiconductors (OSC), printed passives or coils.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124972790","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-23DOI: 10.1109/POLYTR.2005.1596496
Y. Ma, Y. Chan
Contactless smart cards are widely used in various applications, such as access control, transit fare payment systems, etc. In order to improve the performance and at the same time to reduce the production cost, research work on the application of new materials and the development of new processes never stops. In this study, the assembly process of contactless smart card using nonconductive adhesive film (NCF) was investigated and adjusted considering the poor performance of PET substrate used in the test in terms of its heat resistance. Pressure cooker test was then performed to further evaluate reliability performances of the card assemblies after being subjected to severe temperature and humidity conditions. The smart card assemblies underwent both mechanical and electrical characterizations during the assembly process and the reliability test. Examinations on surface morphologies and cross-sections by SEM and optical microscope were conducted to understand the failure mechanisms.
非接触式智能卡广泛应用于各种应用，如门禁、交通费用支付系统等。为了在提高性能的同时降低生产成本，对新材料应用的研究工作和新工艺的开发从未停止。本研究针对测试中使用的PET基材耐热性能较差的情况，对非接触式智能卡non - conductive adhesive film (NCF)的组装工艺进行了研究和调整。然后进行高压锅试验，进一步评估卡组件在恶劣温度和湿度条件下的可靠性性能。智能卡组件在装配过程和可靠性测试中进行了机械和电气特性测试。利用扫描电镜和光学显微镜对其表面形貌和横截面进行了检测，以了解其失效机理。
{"title":"Study on the Fabrication Process and Reliability Performance of Contactless Smart Card Using Nonconductive Film","authors":"Y. Ma, Y. Chan","doi":"10.1109/POLYTR.2005.1596496","DOIUrl":"https://doi.org/10.1109/POLYTR.2005.1596496","url":null,"abstract":"Contactless smart cards are widely used in various applications, such as access control, transit fare payment systems, etc. In order to improve the performance and at the same time to reduce the production cost, research work on the application of new materials and the development of new processes never stops. In this study, the assembly process of contactless smart card using nonconductive adhesive film (NCF) was investigated and adjusted considering the poor performance of PET substrate used in the test in terms of its heat resistance. Pressure cooker test was then performed to further evaluate reliability performances of the card assemblies after being subjected to severe temperature and humidity conditions. The smart card assemblies underwent both mechanical and electrical characterizations during the assembly process and the reliability test. Examinations on surface morphologies and cross-sections by SEM and optical microscope were conducted to understand the failure mechanisms.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"147 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121404038","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-23DOI: 10.1109/POLYTR.2005.1596484
A. Moscicki, T. Sobierajski, J. Felba, Józef Kudzia, A. Arp, Wilhelm Meyer
As current studies and analyses imply, the future of modern microelectronics solutions is utterly dependent on nanotechnology within which nano size materials are more and more frequently produced and applied. This results in the unparalleled possibility of creating new, so far impossible to manufacture products as well as application technologies. Consequently, this results in a significant increase in the possibility of miniaturization of elements of electronic systems by reducing the dimensions of its elements themselves as well as increasing the density of their compaction. Polymer composites containing silver particles of single nanometers (several atoms) may be printed with the application of the Ink-Jet method in order to obtain a line or 'points' being electricity conductors or contacts in electronic assembly. The Ink-Jet printing method utilizes the percussive effect of a piezoelectric compressing capillary element within microsecond and thus resulting in sudden 'expenditure' of the dosed composition. During the very dosing process, the dosed portion is affected by acceleration of 105g, which may cause separation of elements of various specific weights from the dosed composition. Therefore, the physically best composition has the features of a specific solution in which the filler conducting electricity (silver) has the dimensions insignificantly differing from the dimensions of the binder in which it is 'suspended'. One of the crucial technical problems is the production of silver particles separated from one another and of adequately small and repetitive at defined time dimensions.
{"title":"Electrically Conductive Formulations Filled Nano Size Silver Filler for Ink-Jet Technology","authors":"A. Moscicki, T. Sobierajski, J. Felba, Józef Kudzia, A. Arp, Wilhelm Meyer","doi":"10.1109/POLYTR.2005.1596484","DOIUrl":"https://doi.org/10.1109/POLYTR.2005.1596484","url":null,"abstract":"As current studies and analyses imply, the future of modern microelectronics solutions is utterly dependent on nanotechnology within which nano size materials are more and more frequently produced and applied. This results in the unparalleled possibility of creating new, so far impossible to manufacture products as well as application technologies. Consequently, this results in a significant increase in the possibility of miniaturization of elements of electronic systems by reducing the dimensions of its elements themselves as well as increasing the density of their compaction. Polymer composites containing silver particles of single nanometers (several atoms) may be printed with the application of the Ink-Jet method in order to obtain a line or 'points' being electricity conductors or contacts in electronic assembly. The Ink-Jet printing method utilizes the percussive effect of a piezoelectric compressing capillary element within microsecond and thus resulting in sudden 'expenditure' of the dosed composition. During the very dosing process, the dosed portion is affected by acceleration of 105g, which may cause separation of elements of various specific weights from the dosed composition. Therefore, the physically best composition has the features of a specific solution in which the filler conducting electricity (silver) has the dimensions insignificantly differing from the dimensions of the binder in which it is 'suspended'. One of the crucial technical problems is the production of silver particles separated from one another and of adequately small and repetitive at defined time dimensions.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128489025","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-23DOI: 10.1109/POLYTR.2005.1596497
K. Nanbu, K. Saijo, K. Yoshida, H. Okayama, S. Ozawa, T. Suga
As future materials for flexible printed circuits (FPCs) with high performance, we have studied copper clad lamination (CCL) materials of liquid crystal polymer (LCP) on copper (Cu) foil using a new laminating process, so called, surface activated bonding (SAB) method [1-5]. In previous report, it was found that the loss of peel strength during the heat-resistance test was improved by using copper-0.02% zirconium (Cu-Zr) alloy foil and a thicker sputter of copper-45% nickel (Cu-45Ni) or nickel-20% chromium (Ni-20Cr) alloys [5]. These improved materials showed excellent interface conductivity at high frequency and etching property. In this report, we tried to produce more improved materials with different sputtering metals and investigated various characteristics of the laminated materials such as scattering parameter (S21), etching property, and dimensional stability for the FPCs. It was clarified that the sputter metal of higher nickel content alloys prevented from the interface oxidation of the Cu-Zr alloy foil/LCP film laminated materials (Cu-Zr/LCP materials) after heat-resistance test. Especially in copper-80% nickel (Cu-80Ni)or nickel-10% chromium (Ni-10Cr) alloy, the peel strength of the laminated materials kept around 500N/m even after 144 hour heating. The S21 of micro-strip line of the laminated materials showed half attenuation when comparing with that produced by the conventional heat bonding method. It is also shown that the Cu-Zr materials produced by the SAB method (SAB material) have excellent etching property and dimensional stability.
{"title":"Cu/LCP Laminated Materials for New Generation FPC","authors":"K. Nanbu, K. Saijo, K. Yoshida, H. Okayama, S. Ozawa, T. Suga","doi":"10.1109/POLYTR.2005.1596497","DOIUrl":"https://doi.org/10.1109/POLYTR.2005.1596497","url":null,"abstract":"As future materials for flexible printed circuits (FPCs) with high performance, we have studied copper clad lamination (CCL) materials of liquid crystal polymer (LCP) on copper (Cu) foil using a new laminating process, so called, surface activated bonding (SAB) method [1-5]. In previous report, it was found that the loss of peel strength during the heat-resistance test was improved by using copper-0.02% zirconium (Cu-Zr) alloy foil and a thicker sputter of copper-45% nickel (Cu-45Ni) or nickel-20% chromium (Ni-20Cr) alloys [5]. These improved materials showed excellent interface conductivity at high frequency and etching property. In this report, we tried to produce more improved materials with different sputtering metals and investigated various characteristics of the laminated materials such as scattering parameter (S21), etching property, and dimensional stability for the FPCs. It was clarified that the sputter metal of higher nickel content alloys prevented from the interface oxidation of the Cu-Zr alloy foil/LCP film laminated materials (Cu-Zr/LCP materials) after heat-resistance test. Especially in copper-80% nickel (Cu-80Ni)or nickel-10% chromium (Ni-10Cr) alloy, the peel strength of the laminated materials kept around 500N/m even after 144 hour heating. The S21 of micro-strip line of the laminated materials showed half attenuation when comparing with that produced by the conventional heat bonding method. It is also shown that the Cu-Zr materials produced by the SAB method (SAB material) have excellent etching property and dimensional stability.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"85 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133986509","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-23DOI: 10.1109/POLYTR.2005.1596479
B. Michel, R. Dudek, H. Walter
Reliability testing of polytronics components has found much attention recently, because of the growing practical importance of polytronics. There has been a growing need for a better knowledge of local materials parameters, local deformation as well stress fields. Interface crack and delamination phenomena have also moved to the focus of reliability estimations for polytronics. Creep and fatigue on the other hand can be described by means of local micro- and nanomaterials testing combined with advanced reliability and life-time concepts. The authors are going to discuss a combined experimental and simulation approach to improve the classical reliability analysis. The approach is based upon various digital image correlation (DIC) techniques, e.g. microDIC, nanoDIC and fibDIC, as well as related methods involving AFM, SEM or FIB, too.
{"title":"Reliability Testing of Polytronics Components in the Micro-Nano Region","authors":"B. Michel, R. Dudek, H. Walter","doi":"10.1109/POLYTR.2005.1596479","DOIUrl":"https://doi.org/10.1109/POLYTR.2005.1596479","url":null,"abstract":"Reliability testing of polytronics components has found much attention recently, because of the growing practical importance of polytronics. There has been a growing need for a better knowledge of local materials parameters, local deformation as well stress fields. Interface crack and delamination phenomena have also moved to the focus of reliability estimations for polytronics. Creep and fatigue on the other hand can be described by means of local micro- and nanomaterials testing combined with advanced reliability and life-time concepts. The authors are going to discuss a combined experimental and simulation approach to improve the classical reliability analysis. The approach is based upon various digital image correlation (DIC) techniques, e.g. microDIC, nanoDIC and fibDIC, as well as related methods involving AFM, SEM or FIB, too.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130990418","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-23DOI: 10.1109/POLYTR.2005.1596509
K. Maruszewski
Conventional glass preparation requires melting of precursors at high temperatures, rapid cooling and subsequent vitrification of the glassy material. This procedure highly restricts choice of substances which can be entrapped in the glass products. Basically only metal oxides and some inorganic salts can survive such drastic conditions avoiding thermal decomposition. Furthermore, the way in which conventional glass is produced makes thin films preparation extremely cumbersome and the only method of preparation of porous classical glasses requires etching or partial dissolving (e.g. Vycor® glass). On the other hand glass and glassy materials possess several useful features for e.g. optical applications such as transparency, homogeneity, mechanical sturdiness, high refractive index etc. An alternative approach to glass and glass-like materials production is offered by the sol-gel technology. The process itself is known for more than a century, but it has gained a new importance in the last two decades after pioneering results of Dislich. He and other researchers improved the chemistry of the process so much that it is now possible to obtain samples in days (or even hours — in case of thin films) rather than months (or years) like in the case of the early samples. The sol-gel technique is based on hydrolysis of liquid precursors and formation of colloidal sols. The precursors are usually organosilicates (e.g. TEOS — tetraethoxysilane) giving silicate sol-gel materials. However, the method is not restricted to the silica compounds — for example precursors based on Ti, Zr, V etc.
{"title":"Sol-gel materials for opto(electronic) applications","authors":"K. Maruszewski","doi":"10.1109/POLYTR.2005.1596509","DOIUrl":"https://doi.org/10.1109/POLYTR.2005.1596509","url":null,"abstract":"Conventional glass preparation requires melting of precursors at high temperatures, rapid cooling and subsequent vitrification of the glassy material. This procedure highly restricts choice of substances which can be entrapped in the glass products. Basically only metal oxides and some inorganic salts can survive such drastic conditions avoiding thermal decomposition. Furthermore, the way in which conventional glass is produced makes thin films preparation extremely cumbersome and the only method of preparation of porous classical glasses requires etching or partial dissolving (e.g. Vycor® glass). On the other hand glass and glassy materials possess several useful features for e.g. optical applications such as transparency, homogeneity, mechanical sturdiness, high refractive index etc. An alternative approach to glass and glass-like materials production is offered by the sol-gel technology. The process itself is known for more than a century, but it has gained a new importance in the last two decades after pioneering results of Dislich. He and other researchers improved the chemistry of the process so much that it is now possible to obtain samples in days (or even hours — in case of thin films) rather than months (or years) like in the case of the early samples. The sol-gel technique is based on hydrolysis of liquid precursors and formation of colloidal sols. The precursors are usually organosilicates (e.g. TEOS — tetraethoxysilane) giving silicate sol-gel materials. However, the method is not restricted to the silica compounds — for example precursors based on Ti, Zr, V etc.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116178466","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-23DOI: 10.1109/POLYTR.2005.1596493
J. Sidén, T. Olsson, A. Koptioug, Hans-Erik Nilsson
It becomes more and more common to print tag antennas using electrically conductive ink for mass-produced Radio Frequency IDentification (RFID) tags. Electrical properties of the ink are mostly determined by conductive (e.g. silver) particles mixed into the ink solution. Since silver is relatively expensive it is desirable to minimize the amount of ink used per antenna. This paper illustrates how the printed conductor area of the antenna can be reduced by applying a grid pattern to an existing antenna geometry and to what extent the gridding can be performed without significantly degrading of the antenna electrical properties. Two common antenna structures are used as an example. It is also shown that by slightly modifying the original antenna geometry it is possible to even further reduce the amount of used ink.
{"title":"Reduced Amount of Conductive Ink with Gridded Printed Antennas","authors":"J. Sidén, T. Olsson, A. Koptioug, Hans-Erik Nilsson","doi":"10.1109/POLYTR.2005.1596493","DOIUrl":"https://doi.org/10.1109/POLYTR.2005.1596493","url":null,"abstract":"It becomes more and more common to print tag antennas using electrically conductive ink for mass-produced Radio Frequency IDentification (RFID) tags. Electrical properties of the ink are mostly determined by conductive (e.g. silver) particles mixed into the ink solution. Since silver is relatively expensive it is desirable to minimize the amount of ink used per antenna. This paper illustrates how the printed conductor area of the antenna can be reduced by applying a grid pattern to an existing antenna geometry and to what extent the gridding can be performed without significantly degrading of the antenna electrical properties. Two common antenna structures are used as an example. It is also shown that by slightly modifying the original antenna geometry it is possible to even further reduce the amount of used ink.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"220 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116491344","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-23DOI: 10.1109/POLYTR.2005.1596519
Z. Porada
An optoelectronic logical gate NAND composed of thin film photoconductive (PC) and electroluminescent (EL) elements. In the system was supplied with sinusoidal voltage with equal values of amplitude and frequency. The input signals were two rectangular light pulses, illuminating the respective photoconductive elements, and the output signal was the luminance of the electro-luminescent cell. The process of natural aging, which caused changes in parameters of PC elements, influenced also the changes in characteristics of the system composed of these elements. For EL element subjected to aging in normal conditions without applied voltage, the luminance of the light was lower by about 20% than for element immediately after their preparation. A variation of the parameters of PC and EL elements by the aging process caused then a decrease of the signal on the output of NAND gate and also an increase in the lag of the output signal in relation to the input signal.
{"title":"The effect of aging process on the parameters of a thin film optoelectronic NAND logical gate","authors":"Z. Porada","doi":"10.1109/POLYTR.2005.1596519","DOIUrl":"https://doi.org/10.1109/POLYTR.2005.1596519","url":null,"abstract":"An optoelectronic logical gate NAND composed of thin film photoconductive (PC) and electroluminescent (EL) elements. In the system was supplied with sinusoidal voltage with equal values of amplitude and frequency. The input signals were two rectangular light pulses, illuminating the respective photoconductive elements, and the output signal was the luminance of the electro-luminescent cell. The process of natural aging, which caused changes in parameters of PC elements, influenced also the changes in characteristics of the system composed of these elements. For EL element subjected to aging in normal conditions without applied voltage, the luminance of the light was lower by about 20% than for element immediately after their preparation. A variation of the parameters of PC and EL elements by the aging process caused then a decrease of the signal on the output of NAND gate and also an increase in the lag of the output signal in relation to the input signal.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"84 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126206163","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-23DOI: 10.1109/POLYTR.2005.1596516
H. Qiu, R. Meixner, H. Goebel, W. Klix, R. Stenzel
The paper describes a simple method for simulating organic field-effect transistors. In contrast to so far developed models, which require modifications of the source code of the simulator, we propose a model which uses a gate voltage dependent charge carrier mobility. This approach can be implemented in conventional drift-diffusion device simulator. The verification of this method was performed with "bottom contact"(BOC) polymer field-effect transistors and the device simulator "SIMBA" [1]. The simulation results are in good agreement with the measurements.
{"title":"A simple method to simulate polymer field-effect transistors","authors":"H. Qiu, R. Meixner, H. Goebel, W. Klix, R. Stenzel","doi":"10.1109/POLYTR.2005.1596516","DOIUrl":"https://doi.org/10.1109/POLYTR.2005.1596516","url":null,"abstract":"The paper describes a simple method for simulating organic field-effect transistors. In contrast to so far developed models, which require modifications of the source code of the simulator, we propose a model which uses a gate voltage dependent charge carrier mobility. This approach can be implemented in conventional drift-diffusion device simulator. The verification of this method was performed with \"bottom contact\"(BOC) polymer field-effect transistors and the device simulator \"SIMBA\" [1]. The simulation results are in good agreement with the measurements.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116743213","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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